JP2005217051A - Complex sheet, laminated part, and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a complex sheet capable of satisfying needs for decreasing insulating layer thickness and for increasing wiring conductor layer thickness simultaneously, of simplifying and shortening the conductor layer process, and of suppressing the occurrence of dispersion of thickness due to difference in conductor layer dimensions and areas; to provide a method for manufacturing the same; and to provide a laminated part and its manufacturing method. <P>SOLUTION: The complex sheet A comprises a photosetting ceramic layer 1a comprising a complex material containing at least a ceramic powder and a photosetting resin, and a conductor pattern layer 3a containing at least a metal powder and an organic binder and formed penetrating through a part of the photosetting ceramic layer 1a. The conductor pattern layer 3a and the photosetting ceramic layer 1a are similar in thickness to each other. The dimension of the conductor pattern layer 3a is measured on one main surface and on the other main surface, where the quotient obtained by dividing the larger dimension 3a-L by the shorter dimension 3a-S is ≤1.25. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a ceramic laminated part used in a mobile communication device or the like, a composite sheet suitable for a laminated substrate, a laminated part using the same, and a method for manufacturing the same.

  In recent years, electronic devices are becoming smaller and lighter and more portable, and circuit blocks used for such electronic devices are also becoming smaller and more complex, and the density and size of laminated parts such as ceramic multilayer substrates are increasing. It is being advanced.

Conventional ceramic multilayer substrates are usually manufactured by a manufacturing method called a green sheet method. In this green sheet method, a green sheet is prepared by a doctor blade method or the like using a slurry containing ceramic powder as an insulating layer, and then the NC sheet or NC die is placed on the green sheet at a position to be a via hole conductor. A plurality of green sheets produced in the same manner after forming a through hole, printing a wiring pattern on the inside and surface using a conductor paste, filling the through hole with a conductor paste to form a via-hole conductor Is a manufacturing method in which the laminate is simultaneously fired. (Patent Document 1)
Even in this green sheet method, in response to the demand for higher precision and higher density, the insulation layer thickness between the insulation layers of the insulation layer is reduced, and the loss and resistance of the interconnection conductor layer are reduced. In order to realize the value, it is required to increase the thickness of the wiring conductor layer.

  In addition, in a conventional manufacturing method such as the green sheet method, a wiring conductor layer is formed when it is attempted to satisfy two requirements of the insulating layer thickness reduction and the wiring conductor layer thickness increase at the same time. A step corresponding to the thickness of the wiring conductor layer inevitably occurs between the portion and the portion not formed.

  Due to this step, stacking faults (delamination) may occur, or even if the step is filled by forcibly pressing, there is a problem that a partial density difference occurs in the insulating layer, causing deformation after firing. However, there is a limit to satisfy both the reduction in thickness and the increase in thickness of the wiring conductor layer at the same time.

  In addition, in order to form a vertical conductor such as a via conductor, a drilling process for forming a through hole by punching the green sheet is indispensable, and an additional process for the printing process for forming the wiring conductor layer It was.

In order to suppress such a step due to the thickness of the wiring conductor layer, Patent Document 2 proposes a method of forming a circuit pattern with a conductor paste by a gravure printing method on a green sheet formed on a carrier film. ing. In addition, the conductor paste filled in the intaglio groove is transferred to a rubber roller after being transferred to a rubber roller (Patent Document 3), or the conductor paste is filled into the groove formed in the intaglio, dried, and reduced by drying. There has been proposed a method (Patent Document 4) in which a conductor is transferred after repeating the step of replenishing the volume which has been performed several times.
Japanese Patent Application Laid-Open No. 11-066951 Special announcement 1-36996 Japanese Patent No. 2819770 Japanese Patent No. 3173439

  However, in the conventional green sheet method described in the above-mentioned Patent Document 1, the conductor cross-sectional shape cannot be formed in a rectangle because screen printing is performed for the formation of the conductor pattern, so that the cross-sectional area becomes small and the resistance increases. was there. Further, in the screen printing, since the wiring conductor is formed on the green sheet by the screen printing method, there is a problem that the pattern cannot be formed with the same thickness due to the difference in the area and shape of the wiring pattern. Further, in the case of the screen printing method as a method for forming the conductor, when forming fine wiring of line / space = 50 μm / 50 μm or less, disconnection occurs due to short circuit due to pattern bleeding, shading during printing, etc. There was a problem of affecting the electrical characteristics.

  In addition, according to the method described in Patent Document 2, since a gravure plate is used, a conductive pattern cannot be formed thick. In addition, there is a problem that the number of processes increases because the transfer is once performed on the offset roll. Further, in the method described in the above-mentioned document 3, the number of steps is increased because the circuit is formed once again after another circuit is formed on another film or the like. On the other hand, in the method described in Patent Document 4, since the volume of the conductor is reduced during filling and drying of the conductor, filling and drying must be performed many times. Therefore, there is a problem that causes transfer failure and the like.

  In the present invention, for example, even when a fine wiring having a line / space = 50 μm / 50 μm or less is formed, a short circuit due to pattern bleeding or a disconnection due to shading at the time of printing does not occur, and the insulating layer is thinned. It is an object of the present invention to provide a composite sheet that can satisfy the increase in thickness of a conductor layer and a method for manufacturing a laminated part that can easily form an arbitrary three-dimensional circuit pattern having no connection and high connection reliability.

  In the composite sheet of the present invention, a conductor pattern layer containing at least a metal powder and an organic binder is formed on a part of a photocurable ceramic layer made of a composite material containing at least a ceramic powder and a photocured resin. A composite sheet formed through a cured ceramic layer, wherein the conductor pattern layer and the photo-cured ceramic layer have substantially the same thickness, and the dimension on one main surface of the conductor pattern layer and the other The ratio of the dimension of the main surface is obtained by dividing the larger dimension by the smaller dimension to 1.25 or less.

  Moreover, as for the composite sheet of this invention, it is desirable that the thickness of the said photocurable ceramic layer and the said conductor pattern layer is 10-50 micrometers, and the thickness difference is 10 micrometers or less.

  The composite sheet is preferably provided on a light transmissive carrier film.

  The multilayer component of the present invention is a multilayer component in which a wiring layer is formed through a portion of a plurality of insulating layers containing at least a ceramic material, the insulating layer and the wiring layer Are substantially the same thickness, and the value obtained by dividing the dimension of the major surface of the wiring layer and the dimension of the other principal surface by the smaller dimension is 1.25 or less. Features.

  In the laminated component of the present invention, it is desirable that the wiring layers are stacked in the thickness direction and a vertical conductor is formed.

In addition, the method for producing the composite sheet of the present invention includes:
(A) filling the intaglio with a conductive paste comprising at least conductive powder and resin;
(B) transferring the conductive paste filled in the intaglio to the light transmissive carrier film surface to form a light non-transmissive conductive pattern;
(C) On the carrier film on which the conductor pattern layer is formed, a photocuring slurry containing at least a photocurable monomer and ceramic powder is applied to a thickness equal to or greater than the thickness of the conductor pattern layer, and photocuring ceramic. Forming a layer;
(D) irradiating light from the back surface of the carrier film and photocuring the photocurable ceramic layer in a region other than the conductor pattern layer;
(E) A composite sheet composed of a photocurable ceramic layer and a conductive pattern layer is prepared by applying a developer and solubilizing and removing the non-photocured portion including the surface of the conductive pattern layer of the photocurable ceramic layer. Process,
It is characterized by comprising.

  Further, the method for producing a composite sheet according to the present invention includes filling a conductor paste in the groove of the intaglio when filling the conductor with the intaglio, and indenting the conductor so that the conductor paste remains on a portion other than the groove portion of the intaglio. It is desirable to apply on top.

  In the method for producing a composite sheet of the present invention, it is desirable to remove the conductive paste applied on the portion other than the groove portion of the intaglio after drying.

  Moreover, as for the manufacturing method of the composite sheet of this invention, it is desirable that the intaglio is a thing which groove-processed the resin film by laser processing.

  In the method for producing a composite sheet of the present invention, it is desirable that the intaglio plate is obtained by grooving a photoresist film by photolithography.

  Moreover, it is desirable that the method for producing a composite sheet of the present invention is such that an intaglio pattern is formed on a metal sheet by a plating method.

  Moreover, as for the manufacturing method of the composite sheet of this invention, it is desirable that the thickness of the said photocurable ceramic layer and a conductor pattern layer is 50 micrometers or less.

Moreover, the manufacturing method of the composite sheet of this invention is the above-mentioned (e) process,
(F) It is desirable to comprise the process of peeling the said conductor pattern layer and a photocurable ceramic layer from the said carrier film.

Furthermore, the manufacturing method of the laminated component of the present invention includes (g) a step of laminating a plurality of composite sheets produced by the composite sheet manufacturing method of the present invention described above to form a laminate having an arbitrary number of layers. ,
And (h) firing the laminate.

  According to the composite sheet of the present invention, since the conductor pattern layer and the photocurable ceramic layer have substantially the same thickness, the step of the composite sheet can be reduced, and the conductor pattern layer is made thicker and photocured. The ceramic layer can be made thinner, and the larger of the dimensions of the conductor pattern layer on one main surface of the composite sheet and the conductor pattern layer on the other main surface can be achieved. By setting the ratio obtained by dividing the smaller value to 1.25 or less, the cross-sectional area of the conductor pattern layer is increased, so that the resistance of the wiring layer obtained by firing the conductor pattern layer can be reduced.

  Moreover, since the composite sheet of this invention can control the thickness photocured when exposing a photocurable ceramic layer by aiming at the thickness of the photocurable ceramic layer and conductor pattern layer of a composite sheet to 10 micrometers-50 micrometers as aimed. The difference in thickness between the photo-curing ceramic layer and the conductor pattern layer can be reduced. In particular, by setting the thickness to 10 μm or less, delamination due to a step between the dielectric film and the conductor pattern can be eliminated when the laminated body is manufactured.

  Further, by providing the composite sheet of the present invention on a light transmissive carrier film, in forming the light curable ceramic layer, using the printed conductor pattern layer as a mask, coating the entire surface of the light curable ceramic layer, and the carrier Since the photo-curing ceramic layer can be formed by full exposure from the back side of the film, it is not necessary to separately prepare a mask or the like to cure the photo-curing ceramic layer. A composite sheet composed of a ceramic layer and a conductor pattern layer can be produced.

  In the laminated component of the present invention, since the insulating layer and the wiring layer have substantially the same thickness, the insulating layer can be made thinner and the wiring layer can be made thicker at the same time. In addition, delamination between a plurality of insulating layers can be suppressed. In addition, the value obtained by dividing the dimension of the larger main surface by the dimension of the smaller main surface of one main surface and the other main surface of the wiring layer is set to 1.25 or less. Since the cross-sectional area of the layer can be increased, a laminated component having a low-resistance wiring layer is obtained.

  In the laminated component of the present invention, a three-dimensional wiring circuit can be formed in the laminated component by forming the vertical conductors by stacking the wiring layers in the thickness direction, and has a high-density wiring circuit. It becomes a laminated part.

  According to the method for producing a composite sheet of the present invention, the conductor pattern layers are all formed in a flat surface, and in particular, via conductors that are conventionally formed by filling a through hole with a conductor paste are used for producing the composite sheet of the present invention. Thus, it is possible to prevent the occurrence of defective filling.

  Moreover, in forming the photo-curing ceramic layer to be the insulating layer, the photo-curing ceramic layer is formed by applying the entire surface of the photo-curing ceramic layer and exposing the entire surface of the carrier film using the printed conductor pattern layer itself as a mask. Since it can be formed into a predetermined shape, there is no need to separately prepare an expensive mask or the like for curing the photo-curing ceramic layer, and the photo-curing ceramic layer and the conductor pattern layer are easily and inexpensively formed. A composite sheet can be produced. In addition, by forming the conductor paste using the intaglio, the depth of the groove can be freely controlled and the shape of the intaglio groove can be arbitrarily controlled. In particular, the rectangular conductor pattern layer is easily formed. be able to. Compared to the formation of the conductor pattern layer by printing, etc., the depth of the groove can be controlled with extremely high accuracy, so the thickness of the conductor pattern layer can be controlled with high accuracy, and the conductor pattern of the composite sheet can be controlled. The step between the layer and the light-hardened ceramic layer can be remarkably reduced.

  In addition, when the conductor paste is filled into the groove portion of the intaglio, the conductor paste is completely filled in the groove portion even if shrinkage occurs when the conductor is dried by applying the conductor paste to other portions than the groove portion. Drying only needs to be performed once, and the number of processes can be reduced.

  Further, if the conductor paste applied to the portion other than the groove portion of the intaglio is dried before being removed, the adhesion between the surface of the intaglio and the conductor is deteriorated, and the conductor can be easily removed from the intaglio. When the wiring layer is transferred and formed from the concave pattern, the conductor paste is dry, so it can be easily transferred from the concave plate. For example, a fine pattern of line / space = 50/50 μm can be formed. Even when formed, it is possible to form a highly accurate wiring layer without bleeding of the wiring layer.

  Moreover, when the groove part of an intaglio is formed with a laser, arbitrary patterns can be formed easily. Moreover, since the groove shape of the intaglio can be formed in a substantially rectangular shape, the cross-sectional shape of the formed conductor pattern layer can be formed in a substantially rectangular shape, and the cross-sectional area of the wiring layer obtained by firing the conductive pattern layer becomes large. The conductor resistance can be lowered. Further, since the depth of the groove can be freely and accurately controlled, the thickness of any conductor pattern layer can be kept constant, and the step between the conductor pattern layer of the composite sheet and the photo-curing ceramic layer can be eliminated.

  Further, the intaglio groove can be formed by photolithography. Formation by photolithography can form an arbitrary pattern in a short time. Further, since the groove shape of the intaglio can be formed in a substantially rectangular shape, the cross-sectional shape of the formed conductor pattern layer can be formed in a substantially rectangular shape, so that the cross-sectional area of the wiring layer obtained by firing the conductor pattern layer is large. Thus, the conductor resistance can be lowered.

  Further, the intaglio groove can be formed by using a plating method, and an arbitrary pattern can be formed in a short time. Further, since the groove shape of the intaglio can be made substantially rectangular, the cross-sectional shape of the formed wiring layer becomes substantially rectangular, the cross-sectional area becomes large, and the conductor resistance can be lowered. Moreover, since the depth of the groove can be freely controlled by forming the concave groove by the above method, the thickness of an arbitrary pattern can be kept constant, and the conductive pattern layer and the photo-curing ceramic layer of the composite sheet can be kept constant. Steps can be eliminated.

  Moreover, according to the manufacturing method of the composite sheet of this invention, the difference of the thickness of a photocurable ceramic layer and a conductor pattern layer is made small by forming the thickness of a photocurable ceramic layer and a conductor pattern layer into 50 micrometers or less. be able to.

  Also, after forming a conductor pattern layer and a light-curing ceramic layer on a light-transmitting carrier film to form a composite sheet, the carrier film is peeled off from the composite sheet and removed, making it suitable for the production of laminated parts A composite sheet can be obtained.

  In addition, according to the method for manufacturing a laminated part of the present invention, a predetermined number of the composite sheets described above are formed, and after laminating them in a batch or sequentially, an arbitrary three-dimensional circuit is laminated. It can be easily formed in a part.

  At this time, since the conductor pattern is substantially rectangular, the contact area between the via holes and between the via hole and the wiring pattern is increased, and the resistance of the conductor is reduced and the connection reliability is increased.

  In addition, when a composite sheet is laminated, there is no level difference corresponding to the thickness of the wiring layer, and the dent at the interface between the wiring layer and the insulator layer is small, resulting in delamination and excessive pressure. There is no problem of deformation, etc., and it is possible to easily reduce the thickness of the insulating layer between the wiring layers and increase the thickness of the wiring layer. Furthermore, with fine wiring of line / space = 50 μm / 50 μm or less Even if it exists, it can be formed with high accuracy without bleeding or disconnection.

  For example, as shown in FIG. 1A, the composite sheet of the present invention contains at least a metal powder and an organic binder in a part of a photo-curing ceramic layer 1a containing at least a ceramic powder and a photo-cured resin. The conductive pattern layer 3a is formed so as to penetrate through the light-curing ceramic layer 1a. The conductor pattern layer 3a and the light-curing ceramic layer 1a have substantially the same thickness, and the composite sheet A is as if one sheet It's like a sheet.

  And as shown in FIG.1 (b), the dimension 3a-S of the main surface of a larger dimension was remove | divided by the dimension 3a-S of the smaller main surface among the main surfaces of the conductor pattern layer 3a. It is important that the dimensional ratio L / S is 1.25 or less. By setting the dimensional ratio to 1.25 or less, the cross-sectional shape of the conductor pattern layer 3a becomes substantially rectangular, and the cross-sectional area of the wiring layer obtained by firing the conductor pattern layer 3a becomes large. A laminated substrate having the same can be manufactured.

  Moreover, since the contact area between the conductor pattern layers 3a can be increased between the composite sheets by further reducing the dimensional ratio to 1.15 or less, particularly 1.05 or less, the composite sheet A is fired. Thus, the reliability of the laminated component obtained can be improved.

  It should be noted that the dimensional ratio of such a composite sheet A is substantially the same even after firing, and it goes without saying that the same effect can be achieved in the dimensional ratio of the laminated parts.

  Further, in this composite sheet A, it is desirable that the thickness of each of the photo-curing ceramic layer 1a and the conductor pattern layer 3a is formed by a thin layer of 50 μm or less, particularly 40 μm or less, more preferably 30 μm or less. By setting the thickness difference between the ceramic layer 1a and the conductor pattern layer 3a to 10% or less of the thickness of the conductor pattern layer 3a, further 5% or less, or the thickness difference to 5 μm or less, further 3 μm or less, the conductor pattern layer 3a itself The step with the ceramic layer 1a due to the thickness can be substantially suppressed.

  Then, by laminating a plurality of the composite sheets A and firing them, for example, a laminated component 20 of the present invention as shown in FIG. 2 can be obtained.

  The laminated component 20 includes an insulating layer 1 obtained by firing the photocurable ceramic layer 1a, and a wiring layer 3 formed by firing the conductor pattern layer 3a formed through the insulating layer 1. It has.

  Unlike the conventional via-hole conductor, the wiring layer 3 obtained by firing the conductor pattern layer 3a forms the planar circuit B by extending the insulating layer 1 in the planar direction. Further, for example, the vertical circuit C can be formed by stacking the wiring layers 3 in the thickness direction.

  According to the present invention, in order to form a desired circuit, the composite sheet A is laminated by 10 to 300 layers, particularly 30 to 200 layers, more preferably about 40 to 100 layers, and fired. A ceramic multilayer circuit board can be formed.

  Below, the manufacturing method of the composite sheet A of this invention and the laminated component 20 is demonstrated.

  In producing the composite sheet A, first, in order to form the photo-curing ceramic layer 1a, a photo-curing slurry containing at least a photo-curable monomer and ceramic powder is prepared. In preparing the slurry, desirably, the ceramic powder is prepared by mixing a photocurable monomer, a photopolymerization initiator, an organic binder, a plasticizer, and an organic solvent, and kneading them with a ball mill.

  Examples of the photocuring component include a photocurable monomer and a photopolymerization initiator.

  As the photocurable monomer, it is desirable that the monomer is excellent in thermal decomposability in order to cope with a low-temperature and short-time baking process. In addition, the photo-curable monomer needs to be photopolymerized by exposure after application and drying of the slip material, and can form free radicals and chain-growth addition polymerization, and has a secondary or tertiary carbon. Preferred examples include alkyl acrylates such as butyl acrylate having at least one polymerizable ethylene group, and alkyl methacrylates corresponding thereto. In addition, polyethylene glycol diacrylates such as tetraethylene glycol diacrylate and methacrylates corresponding thereto are also effective. Examples of the photopolymerization initiator include benzophenones and acyloin ester compounds.

  In addition, the organic binder is desired to have good thermal decomposability like the photo-curable monomer, and at the same time, it determines the viscosity of the slip, so it is necessary to consider the wettability with the solid content. is there. According to the present invention, an ethylenically unsaturated compound having a carboxyl group and an alcoholic hydroxyl group such as an acrylic acid or methacrylic acid polymer is preferred.

  Examples of the organic solvent include at least one selected from the group consisting of ethyl carbitol acetate, butyl cellosolve, and 3 methoxybutyl acetate.

  The content of each component is 5 to 20 parts by mass of a photocurable monomer and a photopolymerization initiator, 10 to 40 parts by mass of an organic binder, 1 to 5 parts by mass of a plasticizer, and an organic solvent per 100 parts by mass of the ceramic powder. A ratio of 50 to 100 parts by mass is appropriate.

In the multilayer component of the present invention, the ceramic component that becomes the insulating layer 1 includes (1) ceramic powder having a firing temperature of 1100 ° C. or higher, mainly composed of Al ₂ O ₃ , AlN, Si ₃ N ₄ , and SiC. (2) Ceramic powder fired at 1100 ° C. or less, particularly 1050 ° C. or less, comprising a mixture of metal oxides containing at least SiO ₂ and an alkaline earth metal oxide such as BaO, CaO, SrO, MgO, (3 ) At least one selected from the group of low-temperature sinterable ceramic materials which are fired at 1100 ° C. or less, particularly 1050 ° C. or less, consisting of glass powder or a mixture of glass powder and ceramic filler powder is suitably selected.

As the mixture of (2) and the glass composition of (3) used, SiO ₂ —BaO—Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ systems, SiO ₂ —Al ₂ O ₃ —alkali metal oxide systems, and compositions in which alkali metal oxides, ZnO, PbO, Pb, ZrO ₂ , TiO _2, etc. are blended with these systems. Examples of the ceramic filler in (3) include at least one selected from the group consisting of Al ₂ O ₃ , SiO ₂ , forsterite, cordierite, mullite, AlN, Si ₃ N ₄ , SiC, MgTiO ₃ , and CaTiO _3. The glass is preferably mixed at a rate of 20 to 80% by mass with respect to the glass.

  On the other hand, the conductor pattern layer is variously combined according to the firing temperature of the ceramic material. For example, when the ceramic material is (1), the conductor is mainly composed of at least one selected from the group consisting of tungsten, molybdenum, and manganese. Materials are preferably used. Moreover, it is good also as a mixture with copper etc. for resistance reduction.

  When the ceramic material is (2), a conductor material mainly composed of at least one selected from the group consisting of copper, silver, gold, and aluminum is preferably used.

  The conductor material preferably contains a component constituting the ceramic material when co-firing with the ceramic material.

  Next, the composite sheet A is formed by the following steps using the photocuring slurry and the conductive paste.

  First, as shown in FIG. 3 (a), for example, a groove 5 having a predetermined pattern is formed on a resin film such as polyimide by using, for example, a laser beam, and the intaglio 7 is produced.

  Next, as shown in FIG. 3 (b), the conductor paste 9 is filled into the grooves 5. At this time, the conductor paste 9 is filled in the grooves 5, and the conductor paste 9 is applied and dried by a squeegee or the like so as to cover the intaglio 7 with the paste.

  Next, as shown in FIG. 3C, after the conductor paste 9 is dried, the excess conductor paste 9 on the intaglio is scraped off with a squeegee, a metal plate, etc., thereby leaving the conductor paste 9 only in the groove 5. .

  Next, as shown in FIG. 3D, the groove 5 side is brought into contact with the carrier film 10, temperature and pressure are applied, and the conductor paste 9 filled in the groove 5 is transferred to the carrier film 10.

  Thus, as shown in FIG. 4E, a conductive pattern layer 3a made of a conductive paste 9 made of at least a metal and a resin is formed on a light transmissive carrier film 10 made of a resin film or the like.

  Next, as shown in FIG. 4 (f), the photocuring slurry is applied to a thickness equal to or larger than the thickness of the conductor pattern layer 3a by, for example, a doctor blade method, and applied to the entire surface with a predetermined thickness, and photocured. The ceramic layer 1a is formed. Further, the photo-curing ceramic layer 1a is dried to be in a state as shown in FIG. 4 (g) where a convex shape is formed at a portion overlapping the conductor pattern layer 3a.

  And it exposes from the back surface of the carrier film 10, for example using an ultrahigh pressure mercury lamp as a light source. By this exposure, the photo-curing ceramic layer 1a in a region other than the formation of the conductor pattern layer 3a is photo-cured. In this exposure step, the photocuring ceramic layer 1a is subjected to a photopolymerization reaction from the back surface to a certain thickness depending on the amount of light irradiated on the photocuring ceramic layer 1a in the region of the conductor pattern layer 3a, thereby forming an insolubilized portion. Since the conductor pattern layer 3a does not transmit ultraviolet rays, the photo-curing ceramic layer 1a formed on the conductor pattern layer 3a becomes a solubilized portion where a photo-polymerization reaction of a photo-curable monomer does not occur. Further, the exposure amount at this time is desirably adjusted so that the thickness of the insolubilized portion is substantially the same as the thickness of the conductor pattern layer 3a.

  Thereafter, the entire photocurable ceramic layer 1a is developed. The development treatment is to remove the solubilized portion of the photo-curing ceramic layer 1a with a developer. Specifically, for example, spray development, washing, and drying are performed using a triethanolamine aqueous solution as the developer. By this treatment, as shown in FIG. 4 (h), a composite sheet A in which the conductor pattern layer 3a and the photo-curing ceramic layer 1a are integrated with substantially the same thickness is formed on the carrier film 10.

  In addition, the composite sheet A simple substance as shown in FIG.4 (i) can be obtained by peeling the composite sheet A from the carrier film 10. FIG.

  Next, a method for manufacturing a laminated component such as the ceramic multilayer circuit board of FIG. 1 using this composite sheet A will be described. First, according to FIGS. 2 (a) to 4 (i), photocuring is performed. A plurality of composite sheets A1 to A14 on which the ceramic layer 1a and the conductor pattern layer 3a having a predetermined pattern are formed are produced.

  Then, as shown in FIG. 5 (j), a laminated body 13 as shown in FIG. 5 (k) is produced by aligning and pressing these composite sheets A1 to A14 together while aligning them. . In addition, it is desirable to perform the pressure bonding while applying a temperature higher than the glass transition point of the organic binder in the composite sheet A. Further, an organic adhesive may be applied between the composite sheets A and pressure bonded.

  In addition, when laminating all at once, the carrier film 10 may be peeled off and laminated, but considering the handling of the lowermost surface and the uppermost surface during crimping, only the lowermost surface and the uppermost surface are removed from the carrier film 10. Without peeling, as shown in FIG. 5 (j), the laminated body 13 as shown in FIG. 5 (k) can be formed by peeling the carrier film 10 after laminating and press-bonding.

  Then, by firing this laminated body 13 at a predetermined temperature, a laminated component in which a three-dimensional wiring circuit is formed by the wiring layer 3 as shown in FIG. 2 can be formed. In the firing, the organic binder and the photocurable monomer contained in the laminate 13 are eliminated in the debuying process, and the ceramic powder used in an inert atmosphere such as nitrogen in the firing process and It is desirable that the conductor material be fired at a temperature at which it can be sufficiently fired to be densified to a relative density of 95% or more.

  Further, as another method for manufacturing the laminated component, as shown in FIG. 6A, other composite sheets A21 and A22 with the carrier film 10 attached thereto are produced. Then, as shown in FIG. 6B, the other composite sheet A22 formed on the surface of the carrier film 10 is inverted and laminated and bonded to the surface of the composite sheet A21 formed on the surface of the carrier film 10. 6C, the carrier film 10 on the composite sheet A22 side is peeled off.

  Next, as shown in FIG. 6D, the composite sheet A23 similarly formed on the surface of the carrier film 10 is reversed and laminated and pressure-bonded to the surface of the composite sheet A22, so that the carrier on the composite sheet A23 side is obtained. The film 10 is peeled off. By repeating this step as necessary, the composite sheet A laminate 13 having a desired number of layers can be formed as shown in FIG. Thereafter, this laminated body 13 is fired in the same manner as described above to produce a laminated component.

  For the multi-layered substrate thus manufactured, if necessary, surface treatment includes further printing / baking of a thick film resistance film or a thick film protective film on the substrate surface, a plating process, and further an IC chip. A ceramic circuit board can be manufactured by bonding the electronic component 4.

  Further, the wiring conductor layer 3 on the surface may be printed and dried on the surface of the fired laminated body and baked in a predetermined atmosphere.

  Furthermore, the surface wiring conductor layer 3 formed on the surface of the ceramic multilayer circuit board 1 and the surface of the terminal electrode are plated with a plating layer of nickel, gold or the like with a thickness of 1 to 3 μm in order to improve wettability with solder. Formed with.

  First, an excimer laser was used for a polyimide film (thickness 150 μm), and groove processing was performed to produce an intaglio. At this time, the processing conditions were changed to change the groove depth and groove taper. After filling a conductor paste in which 5 parts by mass of a binder is added to 100 parts by mass of Ag prepared in advance in these intaglio grooves, the conductor paste other than the grooves is removed using skiing, An intaglio was transferred to a PET film while heating at 40 ° C. to form a conductor pattern layer that was a planar circuit B having a thickness of 5 to 60 μm, a minimum line width of 25 μm, and a vertical circuit C having a diameter of 100 μm.

  On this, the photocuring slurry was applied and dried by a doctor blade method, and a photocuring ceramic layer was formed so that the thickness after drying in a place where no conductor pattern layer was present was 10 to 80 μm.

  The photocuring slurry contains 100 parts by mass of ceramic raw material powder, 8 parts by mass of photocurable monomer (polyoxyethylated trimethylolpropane triacrylate), 35 parts by mass of an organic binder (alkyl methacrylate), and a plasticizer. It was prepared by mixing 3 parts by mass with an organic solvent (ethyl carbitol acetate) and kneading with a ball mill.

The ceramic raw material powder is 10 parts by mass in terms of B ₂ O ₃ and 5 parts in terms of LiCO ₃ with respect to 100 parts by mass of the main component represented by 0.95 mol MgTiO ₃ -0.05 mol CaTiO _3. What added the mass part was used.

Next, the entire surface was exposed from the back surface side of the carrier film to the back surface of the photocurable ceramic layer for 2 seconds using an ultrahigh pressure mercury lamp (illuminance 30 mW / cm ² ) as a light source. Then, spray development was performed for 30 seconds using a triethanolamine aqueous solution having a dilution concentration of 2.5% as a developer. Thereafter, the substrate was washed with pure water and then dried.

  Thus, in the completed photo-cured ceramic layer, the solubilized portion on the electrode layer is removed by development to expose the conductor pattern layer. As a result, the conductor pattern layer having a thickness of 5 to 60 μm and the light having a thickness of 5 to 60 μm are exposed. A composite sheet integrated with the hardened ceramic layer could be produced.

  The carrier film was peeled off from the composite sheet produced as described above, and lamination was performed while aligning in order.

  In the lamination, a sample in which 50 layers were laminated together and a sample in which 70 layers were successively laminated were prepared.

  A constraining sheet having a thickness of 250 μm made of a composition of 90% by mass of ceramic powder mainly composed of alumina having an average particle size of 2 μm and 10% by mass of glass powder having an average particle size of 5 μm was prepared. And this restraint sheet | seat was arrange | positioned on the uppermost surface and the lowermost surface of the said laminated body, and it pressed for 5 minutes with the press pressure of 1 ton and the temperature of 60 degreeC using the press, and crimped | bonded the laminated body.

Thereafter, the binder removal treatment was performed in the atmosphere at 300 ° C. for 4 hours, followed by baking in the atmosphere at 900 ° C. for 6 hours. Thereafter, the restraint sheet was removed by spraying Al ₂ O ₃ abrasive grains together with air at a pressure of 0.2 MPa to produce a laminated part.

Then, cut the produced laminated part, enlarge the cross-sectional shape of the wiring layer 150 times with a measuring microscope, measure the dimensions of both main surfaces of the wiring layer, and remove the larger dimension with the smaller dimension. The dimensional ratio was measured. The sample was formed so that the width of the major surface of the measured wiring layer was 100 μm.

  Sample No. with a dimensional ratio exceeding 1.25 outside the scope of the present invention. In Nos. 5 and 14, the shape of the wiring layer was substantially trapezoidal, resulting in increased resistance and poor conduction.

  On the other hand, in the multilayer component of the present invention, neither resistance deterioration nor conduction failure occurred, and the multilayer component was excellent in reliability.

It is an example of the present invention. (A) It is sectional drawing of a composite sheet, (b) The principal part enlarged view of a composite sheet. It is sectional drawing of the laminated component of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the method to manufacture the laminated component of this invention. It is process drawing for demonstrating the other method of manufacturing the laminated component of this invention.

Explanation of symbols

A ... Composite sheet 1 ... Insulating layer 1a ... Photo-curing ceramic layer 3 ... Wiring layer 3a ... Conductor pattern layer 3a-L ... The larger dimension 3a-S of the conductor pattern layer ... Small dimension 7 of conductor pattern layer ... Intaglio 9 ... Conductor paste 10 ... Resin film, carrier film 13 ... Laminated body 20 ... Laminated component

Claims (14)

A conductor pattern layer containing at least a metal powder and an organic binder passes through the photocurable ceramic layer in a part of a photocurable ceramic layer made of a composite material containing at least a ceramic powder and a photocured resin. In the composite sheet formed, the conductor pattern layer and the photo-curing ceramic layer have substantially the same thickness, and the dimension of one principal surface of the conductor pattern layer and the dimension of the other principal surface A composite sheet characterized in that a value obtained by dividing the smaller dimension by the smaller dimension is 1.25 or less. 2. The composite sheet according to claim 1, wherein the thickness of the light-curing ceramic layer and the conductive pattern layer is 10 to 50 μm, and the difference in thickness is 10 μm or less. 3. The composite sheet according to claim 1, wherein the composite sheet is provided on a carrier film capable of transmitting light. At least part of the plurality of insulating layers containing a ceramic material is a laminated part in which a wiring layer is formed through the insulating layer, and the insulating layer and the wiring layer have substantially the same thickness, A laminated part characterized in that a value obtained by dividing the dimension of the main surface of the wiring layer and the dimension of the other main surface by the smaller one and the larger one is 1.25 or less. The laminated component according to claim 4, wherein a vertical conductor is formed by stacking the wiring layers in a thickness direction. (A) filling the intaglio with a conductive paste comprising at least conductive powder and resin;
(B) transferring the conductive paste filled in the intaglio to the light transmissive carrier film surface to form a light non-transmissive conductive pattern;
(C) On the carrier film on which the conductor pattern layer is formed, a photocuring slurry containing at least a photocurable monomer and ceramic powder is applied to a thickness equal to or greater than the thickness of the conductor pattern layer, and photocuring ceramic. Forming a layer;
(D) irradiating light from the back surface of the carrier film and photocuring the photocurable ceramic layer in a region other than the conductor pattern layer;
(E) A composite sheet composed of a photocurable ceramic layer and a conductive pattern layer is prepared by applying a developer and solubilizing and removing the non-photocured portion including the surface of the conductive pattern layer of the photocurable ceramic layer. Process,
A method for producing a composite sheet, comprising: In the step (a), the conductor paste is filled on the intaglio so that the conductor paste is filled in the grooves of the intaglio and the conductor paste remains on portions other than the grooves of the intaglio. Item 7. A method for producing a composite sheet according to Item 6. 8. The method for producing a composite sheet according to claim 7, wherein the conductor paste applied on a portion other than the groove portion of the intaglio is dried and then removed. The method for producing a composite sheet according to any one of claims 6 to 8, wherein the intaglio in the step (a) is obtained by grooving a resin film by laser processing. The method for producing a composite sheet according to any one of claims 6 to 9, wherein the intaglio in the step (a) is obtained by groove-growing a photoresist film by photolithography. The method for producing a composite sheet according to any one of claims 6 to 10, wherein the intaglio pattern in the step (a) is formed on a metal sheet by a plating method. The method for producing a composite sheet according to any one of claims 6 to 11, wherein the thickness of the photo-curing ceramic layer and the conductive pattern layer is 50 µm or less. After the step (e),
(F) The manufacturing method of the composite sheet in any one of Claims 6 thru | or 12 which comprises the process of peeling the said conductor pattern layer and a photocurable ceramic layer from the said carrier film. (G) a step of laminating a plurality of composite sheets produced by the method for producing a composite sheet according to any one of claims 6 to 13 to form a laminate having an arbitrary number of layers;
(H) firing the laminate;
A method for producing a laminated part, comprising:

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