JP3886791B2 - Manufacturing method of multilayer wiring board - Google Patents

Description

【００５４】
表１の結果によれば、酸化防止膜を施さなかった従来の配線基板（試料Ｎｏ．１）および酸化防止膜の厚みの薄い試料Ｎｏ．２では、配線回路層とセラミックの界面付近にボイドの発生が認められた。また、酸化防止膜の除去を行わずに転写を行った試料Ｎｏ．１４では抵抗値が高くなった。また、酸化防止膜の厚みの厚い試料Ｎｏ．７では酸化防止膜を溶解する際に配線層も部分的に溶解したため抵抗値が高くなった。これに対して、試料Ｎｏ．３〜６および８〜１３はボイドもなく、良好な抵抗値を示した。また、表層配線回路層においてもメッキの欠けも小さく良好なものであった。
【００５５】
【発明の効果】
以上詳述した通り、本発明の多層配線基板の製造方法によれば、金属箔からなる配線回路層の表面を酸化防止膜で被覆し、パターン加工を行い、酸化防止膜を除去した後、グリーンシートに転写あるいは、メッキ前に基板表面に露出する配線層表面の酸化防止膜を除去した後、転写することにより配線抵抗の小さいセラミック多層配線基板を作製することができる。
【図面の簡単な説明】
【図１】本発明の多層配線基板の一例を示す概略断面図である。
【図２】本発明の多層配線基板の製造方法における製造工程図である。
【図３】本発明の多層配線基板の製造方法における回路形成の工程図である。
【図４】評価用の配線回路のパターン図である。
【符号の説明】
１ 多層配線基板
２ 絶縁基板
２ａ〜２ｃ 絶縁層
３ 配線回路層
４ ビアホール導体
５ 半導体素子[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer wiring board in which a wiring circuit layer made of a metal foil is disposed inside a ceramic insulating substrate such as glass ceramic.
[0002]
[Prior art]
One of the methods of manufacturing a co-fired ceramic multilayer wiring board with internal wiring with low wiring resistance and high wiring density, through-hole processing on a green sheet, filling this hole with conductive paste, A technique is known in which a patterned metal foil is transferred to the surface of a green sheet, and a plurality of these are laminated and fired.
[0003]
Specifically, as a method for obtaining a metal foil pattern used in this method, a method of performing vapor deposition, plating or metal foil pressure bonding on the entire surface of a resin or metal carrier film and etching it into a pattern shape is a special feature. Reported in Kaihei 11-224984.
[0004]
This method of transferring a metal foil to form a circuit has advantages such as a dense circuit and low sheet resistance as compared with a conventional method in which a circuit pattern is printed by a conductive paste. is there.
[0005]
[Problems to be solved by the invention]
However, in the method reported in Japanese Patent Application Laid-Open No. 11-224984, etc., in the step of processing the pattern after forming or press-bonding the metal foil on the carrier film, for example, the etching of the metal foil by moisture or heat of the etching process. Since the surface is oxidized, when this is transferred to a green sheet and fired, voids are generated at the joint between the metal foil and the ceramic insulating layer, resulting in a problem that the bonding strength of the metal foil to the ceramic insulating layer is reduced.
[0006]
Further, the surface of the metal foil exposed on the surface of the multilayer wiring board has a problem that the surface of the metal foil is oxidized before the plating process is performed, so that the plating cannot be stably performed.
[0007]
In order to solve this problem, it is conceivable to form an antioxidant film on the surface of the metal foil, perform pattern processing, transfer this to a green sheet, laminate and fire, but in that case, in the multilayer wiring board There is a problem that the wiring resistance in the circuit increases. In particular, the contact resistance between the metal foil and the via-hole conductor increases due to the presence of the anti-oxidation film at the connection portion between the metal foil and the via-hole conductor formed in the ceramic insulating layer.
[0008]
Accordingly, the present invention provides a method for manufacturing a multilayer wiring board capable of preventing formation of an oxide film on the surface of a metal foil and reducing contact resistance with a via-hole conductor or the like when forming a circuit pattern using the metal foil. Is intended to provide.
[0009]
[Means for Solving the Problems]
As a result of repeated investigations in view of the above problems, the present inventors formed a metal foil having an antioxidant film formed on the surface of the transfer substrate on the surface in contact with the atmosphere, and this antioxidant film was still formed. By removing the anti-oxidation film on the transfer side surface before processing into a circuit pattern and transferring it to the ceramic green sheet, the connection resistance due to the anti-oxidation film can be reduced and the reliability of the circuit pattern made of metal foil As a result, the present invention has been found.
[0010]
That is, in the method for producing a multilayer wiring board according to the present invention, a metal foil having an anti-oxidation film having a thickness of 0.003 to 1 μm formed on at least the surface side in contact with the atmosphere is bonded to the surface of a predetermined transfer substrate. A step of processing the metal foil into a predetermined circuit pattern to form a wiring circuit layer, a step of producing a green sheet containing a predetermined ceramic component, and removing the antioxidant film on the surface of the wiring circuit layer And a step of pressure-bonding the surface of the wiring circuit layer from which the antioxidant film has been removed to the green sheet, then removing the transfer substrate and transferring the wiring circuit layer to the green sheet, And a step of laminating and firing a green sheet onto which the wiring circuit layer has been transferred.
[0011]
The antioxidant film is preferably made of a metal layer mainly composed of any one of Ag, Ni, Zn, Sn, Cr, Pb, and Al. Also, it is efficient to remove the antioxidant film on the surface of the metal foil by dissolution with an organic acid.
[0012]
Further, the surface of the surface wiring circuit layer of the fired multilayer wiring board is coated with a plating layer made of at least one of Cu, Ni, Au, and Ag, so that the solder wettability, the wire bonding property and the resistance to resistance are increased. A multilayer wiring board with high environmental performance can be obtained. At this time, it is desirable to cover the plating layer after removing the antioxidant film of the wiring circuit layer for the surface layer.
[0013]
The metal foil made of a copper foil having a thickness of 30 μm or less is advantageous for miniaturization of circuit patterns or for prevention of delamination.
[0014]
In particular, the present invention includes a via-hole conductor in which a through hole is formed in the green sheet before the circuit-patterned metal foil is transferred, and a conductive paste is filled in the through hole. This is effective for multilayer wiring boards.
[0015]
According to the present invention, when the surface wiring circuit layer is formed, it is desirable that an antioxidant be formed on the surface of the metal foil that contacts the transfer substrate.
[0016]
The ceramic component in the green sheet in the multilayer wiring board according to the present invention is made of a glass component or a mixture of a glass component and a ceramic filler component, so that simultaneous firing with a low-resistance metal such as copper is possible.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a multilayer wiring board of the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of the multilayer wiring board of the present invention. According to the multilayer wiring board 1 of FIG. 1, the insulating substrate 2 is composed of a laminate formed by laminating a plurality of ceramic insulating layers 2 a to 2 c, and between the insulating layers 2 a to 2 c and on the surface of the insulating substrate 2, A surface wiring circuit layer 3a and an inner wiring circuit layer 3b made of high-purity metal foil having a thickness of 30 μm or less, particularly 5 to 20 μm, are deposited. Further, each ceramic insulating layer 2a to 2c is formed with a via-hole conductor 4 having a diameter of 80 to 200 μm formed so as to penetrate the thickness direction, thereby connecting the wiring circuit layers 3a and 3b with a predetermined circuit. A network to achieve is formed. An electronic component 5 such as a semiconductor element is mounted on the surface of the wiring circuit layer 3a.
[0018]
In the present invention, the insulating substrate 2 composed of the ceramic insulating layers 2a to 2c is desirably formed of glass ceramics formed by firing a glass component or a mixture of a glass component and a ceramic filler component, It is desirable that the composition is composed of 10 to 70% by mass of the glass component and 30 to 90% by mass of the ceramic filler component. Such a glass ceramic is advantageous in that the firing temperature is as low as 800 to 1050 ° C., so that it can be co-fired with a low-resistance conductor, which will be described later, and because the dielectric constant is generally low, Transmission loss such as can be reduced.
[0019]
Here, the glass component used contains at least SiO ₂ and contains at least one of Al ₂ O ₃ , B ₂ O ₃ , ZnO, PbO, alkaline earth metal oxide, and alkali metal oxide. For example, SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system—MO system (where M represents Ca, Sr, Mg, Ba or Zn), etc. Borosilicate glass, alkali silicate glass, Ba glass, Pb glass, Bi glass and the like.
[0020]
These glass components are amorphous glass that remains amorphous even when fired, and by firing, lithium silicate, quartz, cristobalite, cordierite, mullite, anorthite, serdian, spinel, garnite, Any crystallized glass that precipitates at least one crystal of willemite, dolomite, petalite, and substituted derivatives thereof can be used.
[0021]
As the ceramic filler components, quartz, SiO ₂ or _{cristobalite, Al 2 O 3, ZrO 2} , mullite, forsterite, enstatite, spinel, magnesia, calcium zirconate, strontium silicate, calcium titanate, At least one selected from the group of barium is preferably used.
[0022]
The wiring circuit layers 3a and 3b are made of a metal foil made of a high-purity metal of 99.5% by mass or more, and particularly Cu can be used. The via-hole conductor 4 is preferably filled with a conductor made of the same component as the wiring circuit layers 3a and 3b.
[0023]
In the multilayer wiring board of the present invention, the wiring circuit layer 3a on the surface is used as a pad for mounting various electronic components 5 such as an IC chip, as a conductor film for shielding, and further as a terminal electrode connected to an external circuit. The various electronic components 5 are joined to the wiring circuit layer 3a via solder, conductive adhesive, or the like. Although not shown, if necessary, a thick film resistor film such as tantalum silicide or molybdenum silicide, a wiring protective film, or the like may be formed on the surface of the wiring board.
[0024]
According to the present invention, a method of manufacturing the above wiring board will be described with reference to FIGS. First, a ceramic composition is prepared by mixing a crystallized glass component or an amorphous glass component as described above and the ceramic filler component, and after adding an organic binder or the like to the mixture, a doctor blade method, a rolling method Then, a green sheet 11 having a thickness of about 50 to 500 μm is formed by forming into a sheet shape by a pressing method or the like (FIG. 2A).
[0025]
Then, a through hole having a diameter of 80 to 200 μm is formed in the green sheet 11 by laser, micro drill, punching or the like, and a conductor paste is filled therein to form a via hole conductor 12 (FIG. 2B). In the conductor paste, in addition to metal components such as Cu and Ag, an organic binder made of an acrylic resin and an organic solvent such as toluene, isopropyl alcohol, acetone, terpineol, and phthalic acid ester are homogeneously mixed. The organic binder is mixed in an amount of 0.5 to 15.0 parts by mass with respect to 100 parts by mass of the metal component, and the organic solvent is mixed in a ratio of 5 to 100 parts by mass with respect to 100 parts by mass of the solid component and the organic binder. It is desirable. In addition, you may add some glass components etc. in this conductor paste.
[0026]
Next, as a method of forming the wiring circuit layer 13, as shown in FIG. 3, first, a metal foil 13 made of a high-purity metal conductor having a thickness of 3 to 30 μm is prepared, and this is made of a film made of a polymer material or the like. Affixed to the surface of the transfer substrate 14. In the present invention, it is important to form the antioxidant film 15 on the surface of the metal foil 13. The thickness of the antioxidant film 15 needs to be 0.003 to 1 μm, particularly 0.01 to 0.1 μm, in order to effectively prevent oxidation. If the thickness of the antioxidant film 15 is less than 0.003 μm, the antioxidant effect is small, and if it exceeds 1 μm, it is difficult to remove the antioxidant film. Therefore, there is a problem that the sheet resistance of the metal foil is increased and the processing cost is increased. By forming such an antioxidant film, the surface of the metal foil can be prevented from being oxidized during the process of forming the wiring circuit layer.
[0027]
When the metal foil 13 is used for the surface wiring circuit layer 3a of the multilayer wiring board, the antioxidant film 15 is desirably formed on both surfaces of the metal foil 13, as shown in FIG. Then, one surface thereof is bonded to the transfer substrate 14. For the inner wiring circuit layer 3b of the multilayer wiring board, as shown in FIG. 3 (b1), an anti-oxidation film 15 is formed only on the surface side in contact with the atmosphere when bonded to the transfer substrate 14. That's fine. In the case of the inner wiring circuit layer 3b, it is only necessary to prevent oxidation only at the time of forming the circuit pattern before transfer. After transfer to the green sheet, it is immediately laminated with another green sheet between the two green sheets. This is because they are sandwiched and do not come into contact with the atmosphere.
[0028]
On the other hand, in the case of the surface wiring circuit layer 3a, since the exposed surface is in contact with the atmosphere even after the transfer, oxidation proceeds, so that an anti-oxidation film is required on both sides. It is.
[0029]
The antioxidant film 15 used in the present invention is made of a metal whose main component is one of Ag, Ni, Zn, Sn, Cr, Pb, and Al. Among these, in particular, at least one selected from the group of Ni and Zn, and at least one selected from the group of Sn and Cr can be given.
[0030]
Next, a resist 16 is deposited in a circuit pattern on the surface of the metal foil 13 formed on the surface of the transfer substrate 14 (a2) (b2), and then etching is performed with hydrochloric acid or ferric chloride to dissolve unnecessary portions. Remove. Thereafter, the resist 16 is removed and the resist remover is washed to form wiring circuit layers 17a and 17b having a mirror image circuit pattern (a3) (b3).
[0031]
Next, when the wiring circuit layers 17a and 17b produced as described above are transferred to the green sheet 11, the antioxidant film 15 existing on the surface of the wiring circuit layers 17a and 17b is removed (a4) and (b4). In order to remove the antioxidant film 15, at least one organic acid selected from the group consisting of formic acid, acetic acid, nitric acid, hydrochloric acid and sulfuric acid is applied to the surface of the wiring circuit layers 17a and 17b, or removed. By immersing the base material 14 in the organic acid solution and removing it by dissolution, the antioxidant film 15 can be easily and efficiently removed.
[0032]
Thereafter, as shown in FIGS. 2 (c1) and 2 (c2), the transfer base material 14 on which the wiring circuit layers 17a and 17b are formed is immediately aligned with the surfaces of the green sheets 11a and 11b on which the via-hole conductors 12 are formed. After the lamination and pressure bonding, the transfer substrate 14 is peeled off, whereby the wiring circuit layers 17a and 17b can be formed on the surface of the green sheet 11 in a state where the surface is not oxidized.
[0033]
Similarly, in the wiring circuit layer 17a for the surface layer of the wiring board, the antioxidant film only on the surface in contact with the green sheet 11a is removed, and the surface opposite to the side in contact with the green sheet 11a, that is, the side always in contact with the atmosphere. Can be formed on the surface of the green sheet 11a with the antioxidant film 15 remaining.
[0034]
At this time, in order to improve the transferability of the wiring circuit layer 17 made of metal foil, the surface roughness Rz of the wiring circuit layer 17 made of metal foil on the side in contact with the green sheets 11a and 11b is set to 3 to 6 μm. The adhesion of the wiring circuit layer 17 to the green sheets 11a and 11b can be improved.
[0035]
Next, a plurality of green sheets 11a and 11b produced in the same manner as described above are stacked and pressure-bonded to form a stacked body 18 (FIG. 2D). For the lamination of green sheets, a method of applying heat and pressure to the stacked green sheets and thermocompression bonding, a method of applying an adhesive composed of organic binder, plasticizer, solvent, etc. between the sheets, and thermocompression bonding are adopted. Is possible.
[0036]
Thereafter, the laminate 18 is fired. When the wiring circuit layer 17 made of a metal foil is provided, the metal foil itself is a very dense body and is not shrunk and fired like a green sheet. There is a risk that distortion occurs between the layers, and warping or cracking may occur. Therefore, in firing, it is desirable to fire while suppressing firing shrinkage in the planar direction.
[0037]
As a method of firing while suppressing shrinkage in the planar direction, for example, 1) firing while applying a pressure of 10 to 30 MPa in the lamination direction to the laminate, and 2) as shown in FIG. There is a method in which a non-sinterable ceramic sheet 19 such as alumina that does not shrink at the firing temperature is bonded to the surface of the laminate 18 or the front and back surfaces and fired. 2) is more advantageous in that no pressurizing means is required.
[0038]
The hardly sinterable ceramic sheet 19 in the method 2) is obtained by forming a slurry in which an organic binder, a plasticizer, a solvent and the like are added to a ceramic component mainly composed of a hardly sinterable ceramic material. It is done. The hardly sinterable ceramic material is specifically composed of a ceramic composition that does not become densified at a temperature of 1100 ° C. or lower. Specifically, Al ₂ O ₃ , SiO ₂ , MgO, ZrO ₂ , BN, Examples thereof include powders of at least one TiO ₂ or a compound thereof (forsterite, enstatite, etc.). In addition, as the organic binder, the plasticizer, and the solvent, the same materials as used in the glass ceramic green sheet can be used. In addition, in this hardly sinterable ceramic sheet, by adding 0.5 to 15% by volume of a glass component, the adhesion to the green sheet is increased, and the action of suppressing shrinkage is increased. It has the advantage that the generation of voids due to the diffusion of the glass component can be suppressed.
[0039]
Firing is performed in a nitrogen atmosphere at 100 to 850 ° C., particularly 400 to 750 ° C. to decompose and remove organic components in the green sheet and via-hole conductor paste, and then fired in a nitrogen atmosphere at 800 to 1100 ° C. . When an Ag conductor is used as the wiring circuit layer, the firing atmosphere can be performed in the air.
[0040]
Thereafter, the multilayer wiring board 20 shown in FIG. 2 (f) can be produced by removing the hardly sinterable ceramic sheet 19 by ultrasonic cleaning, polishing, water jet, chemical blasting, sand blasting, wet blasting and the like. .
[0041]
In the multilayer wiring board 20 thus obtained, since shrinkage during firing is suppressed only in the thickness direction by pressure or a hardly sinterable ceramic sheet, the shrinkage in the planar direction is suppressed to 0.5% or less. In addition, since the glass ceramic green sheet is uniformly and reliably bonded to the entire surface by the constraining sheet, it is possible to prevent warping or deformation due to partial peeling of the constraining sheet.
[0042]
Next, the wiring circuit layer 13b exposed on the surface of the multilayer wiring board 18 manufactured as described above is provided with Cu, Ni, etc. in order to increase the environmental resistance of the multilayer wiring board or to improve solder wettability. It is desirable to coat the plating layer 17c made of at least one of Au, Ag, and Ag. In this case, since the antioxidant film 15 is unnecessary, before the plating layer 17c is formed, By dissolving and removing the antioxidant film 15 by the same method, as shown in FIG. 2G, a multilayer wiring board 20 having a low wiring resistance can be obtained.
[0043]
Further, the antioxidant film 15 can be removed simultaneously with the removal of the hardly sinterable ceramic sheet 19.
[0044]
【Example】
Crystallized glass powder having a composition of SiO ₂ : 37% by mass, Al ₂ O ₃ : 27% by mass, CaO: 11% by mass, ZnO: 12% by mass, B ₂ O ₃ : 13% by mass and having an average particle diameter of 3 μm ( 11 parts by mass of solid isobutyl methacrylate as an organic binder with respect to 100 parts by mass of glass ceramic raw material powder consisting of 73% by mass of softening point (850 ° C.) and 27% by mass of quartz having an average particle diameter of 2 μm as ceramic filler Then, 5 parts by mass of dibutyl phthalate was added as a plasticizer, and toluene was mixed as an organic solvent for 36 hours by a ball mill to prepare a slurry. Green sheets A and B having a thickness of 0.2 mm were formed from the obtained slurry by a doctor blade method.
[0045]
Next, with respect to the copper foil having a thickness of 0.02 mm, for the inner layer, Zn, Sn, Cr, Ni having a thickness of 0.001 to 2 μm by electrolytic plating on the surface to be bonded to the green sheet. , Pb, Ag, Al, and at least one kind of antioxidant film selected from the group consisting of Zn, Sn, Cr having a thickness of 0.001 to 2 μm on both sides for the surface layer of the multilayer wiring board At least one kind of antioxidant film selected from the group consisting of Ni, Pb, Ag and Al was formed. And these copper foils were adhere | attached on the resin film, and the wiring circuit layer pattern whose wiring width is 0.2 mm was formed with the photo-etching method.
[0046]
On the other hand, 200 through holes having a diameter of 100 μm are formed in green sheet A having a thickness of 0.2 mm, and copper powder is the main component in the through holes, and 5 parts by mass of glass powder with respect to 100 parts by mass of copper powder. And the via-hole conductor 22 was formed by filling a copper paste added with 2 parts by mass of a binder. The above-described wiring circuit layer 23 for the surface layer having a wiring width of 0.2 mm was thermocompression bonded to this.
[0047]
Further, a green sheet B was prepared in the same manner as described above, and the inner wiring circuit layer 24 having a wiring width of 0.2 mm shown in FIG. 4 was transferred and formed.
[0048]
In the transfer, the antioxidant film formed on the surface of the wiring circuit layer on the surface of the resin film was dissolved and removed by applying formic acid before transferring to the green sheets A and B.
[0049]
Then, the green sheet A on which the via-hole conductor 22 and the surface wiring circuit layer 23 are formed and the green sheet B on which the inner wiring circuit layer 24 is formed are laminated and thermocompression bonded at 80 ° C. and 10 MPa to form a laminated body. did.
[0050]
Next, 12 parts by mass of isobutyl methacrylate resin as an organic binder as an organic binder with respect to 100 parts by mass of alumina powder and 7 parts by mass of dibutyl phthalate as a plasticizer are added as a green sheet. The same doctor blade method was used to form a thickness of 0.3 mm, and this was pressure laminated on both sides of the previous laminate.
[0051]
Then, after decomposing and removing the organic components (binder, plasticizer, etc.) in the laminate, heat treatment is performed at 750 ° C. for 3 hours in a nitrogen atmosphere containing water vapor to reduce the residual carbon content to 300 ppm or less. After calcination at 930 ° C. for 1 hour, wet blasting is performed to remove the non-sinterable ceramic sheet, and a pair of measuring terminals 25 are connected in series with 200 via-hole conductors 24. A wiring board 21 to be manufactured was prepared. Thereafter, the antioxidant film of the surface wiring circuit layer 23 was dissolved and removed by applying formic acid, and then a 3 μm thick Cu plating layer and a 2 μm thick Au plating layer were deposited by an electroless plating method.
[0052]
Next, the electrical resistance between the measurement terminals 25 of the wiring board was measured. In addition, the plating property of the surface wiring circuit layer was evaluated as “◯” when the plating was formed to 80% or more, and “x” when it was less than 80%. Further, the presence or absence of voids near the interface between the wiring circuit layer and the insulation was confirmed and shown in Table 1.
[0053]
[Table 1]

[0054]
According to the results in Table 1, a conventional wiring board (sample No. 1) that was not provided with the antioxidant film and a sample No. 1 with a thin antioxidant film were used. In No. 2, voids were observed near the interface between the wiring circuit layer and the ceramic. In addition, the sample No. 1 was transferred without removing the antioxidant film. In 14, the resistance value increased. In addition, Sample No. with a thick antioxidant film was used. In No. 7, the resistance value increased because the wiring layer was partially dissolved when the antioxidant film was dissolved. In contrast, sample no. 3 to 6 and 8 to 13 had no voids and exhibited good resistance values. Also, the surface wiring circuit layer was good with small lack of plating.
[0055]
【The invention's effect】
As described above in detail, according to the method for manufacturing a multilayer wiring board of the present invention, the surface of the wiring circuit layer made of metal foil is coated with an antioxidant film, patterned, removed the antioxidant film, A ceramic multilayer wiring board having a low wiring resistance can be produced by transferring to a sheet or removing the anti-oxidation film on the surface of the wiring layer exposed on the surface of the board before plating.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an example of a multilayer wiring board of the present invention.
FIG. 2 is a manufacturing process diagram in the method for manufacturing a multilayer wiring board according to the present invention.
FIG. 3 is a process diagram of circuit formation in the method for manufacturing a multilayer wiring board according to the present invention.
FIG. 4 is a pattern diagram of a wiring circuit for evaluation.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Multilayer wiring board 2 Insulating board 2a-2c Insulating layer 3 Wiring circuit layer 4 Via-hole conductor 5 Semiconductor element

Claims (9)

A process of adhering a metal foil having an anti-oxidation film with a thickness of 0.003 to 1 μm formed on the surface of a predetermined transfer substrate at least on the surface side in contact with the atmosphere, and processing the metal foil into a predetermined circuit pattern A step of forming a wiring circuit layer, a step of producing a green sheet containing a predetermined ceramic component, a step of removing the antioxidant film on the surface of the wiring circuit layer, and the antioxidant film of the wiring circuit layer After pressure-bonding the removed surface to the green sheet, removing the transfer substrate and transferring the wiring circuit layer to the green sheet; and laminating the green sheet to which the wiring circuit layer has been transferred, And a step of firing. A method for producing a multilayer wiring board. 2. The method for manufacturing a multilayer wiring board according to claim 1, wherein the antioxidant film is made of a metal layer mainly composed of any one of Ag, Ni, Zn, Sn, Cr, Pb, and Al. The method for producing a multilayer wiring board according to claim 1 or 2, wherein the antioxidant film on the surface of the metal foil is removed by dissolution with an organic acid. 2. The method according to claim 1, further comprising the step of coating a plated layer made of at least one of Cu, Ni, Au, and Ag on the surface of the wiring circuit layer exposed on the surface of the multilayer wiring board after firing. The manufacturing method of the multilayer wiring board in any one of Claim 3. 5. The multilayer wiring board according to claim 4, wherein a plating layer made of at least one of Cu, Ni, Au, and Ag is coated after removing the antioxidant film of the wiring circuit layer for the surface layer. Production method. The method for producing a multilayer wiring board according to claim 1, wherein the metal foil is made of a copper foil having a thickness of 30 μm or less. 7. The method according to claim 1, further comprising: forming a through hole in the green sheet before filling the wiring circuit layer, and filling the through hole with a conductive paste. A method for manufacturing a multilayer wiring board according to any one of the above. The method for producing a multilayer wiring board according to claim 1, wherein an antioxidant is formed on a surface of the metal foil that contacts the transfer base material. The method for producing a multilayer wiring board according to any one of claims 1 to 8, wherein the ceramic component in the green sheet comprises a glass component or a mixture of a glass component and a ceramic filler component.

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