JP2007173586A - Wiring mother board provided with a plurality of wiring patterns, and inspecting method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring mother board provided with a plurality of wiring patterns and an inspecting method therefor in which a visual check can be easily and accurately performed for mistakenly unprinted insulating coat layer and the like. <P>SOLUTION: The wiring mother board provided with the plurality of wiring patterns has, on one main surface of the mother board 10 having a plurality of wiring board regions 40 and dummy regions 50, a wire conductor 30 in the wiring board region 40 and a conductor pattern 70 in the dummy region 50. Whether or not a first insulating coat layer 60 is present in the wiring substrate region 40 can be easily judged by whether or not a plated layer is formed on the surface of the conductor pattern 70, thereby achieving the solution. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of inspecting a multi-piece wiring board used for an electronic component housing package for housing electronic parts, a hybrid integrated circuit board, and the like, and to the multi-piece wiring board.

  In general, a wiring board that is a substrate for mounting electronic components such as semiconductor elements, surface acoustic wave elements, and piezoelectric vibrators is formed by laminating a plurality of insulating layers on which wiring conductors are formed on the main surface of the laminated body. It has a structure in which an electronic component mounting portion is provided. Such a wiring board is usually as small as a few millimeters on a side, so that it is easy to handle a plurality of wiring boards, and to efficiently manufacture wiring boards and electronic devices. The circuit board is manufactured in the form of a so-called multiple wiring board in which a plurality of wiring board regions are arranged in a matrix on the mother board.

  A multi-layer wiring board is usually formed by laminating a plurality of insulating layers made of a ceramic sintered body, etc., and a rectangular wiring board region is arranged vertically and horizontally at the center and a dummy region is formed at the outer periphery. And a wiring board formed in the wiring board region. The dummy area is provided in order to facilitate handling of a plurality of wiring boards. A plurality of wiring boards are formed by dividing the plurality of wiring boards into individual wiring boards, and the electrodes of the electronic components are connected to the exposed portions of the wiring conductors of the individual wiring boards via solder or the like. The

In the production of a multiple wiring substrate, an insulating coat layer may be formed on the surface for the purpose of preventing deformation during firing. In a multiple wiring substrate having an insulating coating layer, it is preferable that it can be easily inspected whether or not the insulating coating layer is formed on the surface thereof. As such an inspection method, for example, in Patent Document 1, a predetermined character pattern is formed in a dummy region of a mother board, and an insulating coat layer is applied to the character pattern, thereby recognizing the character pattern, thereby insulating coating. A method for determining the presence or absence of a layer is described.
JP 2005-136175 A

  However, in the method described in Patent Document 1, for example, when the mother substrate is made of glass ceramics, the thickness of the insulating coating layer after firing is as thin as about 10 μm to 50 μm, and becomes transparent or translucent glass. Regardless of the presence or absence of a layer, a predetermined character code can be recognized, and as a result, it is difficult to determine the presence or absence of an insulating coat layer.

  In addition, when the identification means is not formed, it is necessary to inspect each of the wiring boards constituting the multiple wiring board by using a microscope or the like. There was a problem that productivity as a substrate was low.

  The present invention has been completed in order to solve the above-described conventional problems, and the object of the present invention is to make it possible to easily determine the presence or absence of an insulating coat layer formed on a wiring board. An object of the present invention is to provide a method for inspecting a wiring board, and further to provide a plurality of wiring boards adapted to this inspection method.

  The method for inspecting a multiple wiring board according to the present invention includes a plurality of wiring board regions and dummy regions, wherein a plurality of wiring conductors are provided in the wiring substrate region and a conductor pattern is provided in the dummy region. A method for inspecting a plurality of wiring substrates for inspecting whether or not an insulating coating layer is formed on the wiring substrate region and the conductor pattern on the wiring substrate, wherein the plurality of wiring substrates are in a plating solution. So as to form a plating layer on the surface of the wiring conductor, and then determine the presence or absence of the insulating coating layer by identifying the presence or absence of the plating layer on the conductor pattern of the dummy region. It is what.

  Further, the multiple wiring substrate of the present invention is provided with a wiring conductor in the wiring substrate region and a conductor pattern in the dummy region on one main surface of a mother board having a plurality of wiring substrate regions and a dummy region. In addition, an insulating coating layer is formed on a part of the wiring board region where the wiring conductor does not exist and the conductor pattern, and a plating layer is formed only on the surface of the wiring conductor. .

  According to the present invention, when the plating layer is formed on the conductor pattern of the dummy region manufactured on the wiring board, the conductor pattern is not covered with the insulating coating layer. It can be determined that the region also has no insulating coating layer formed. On the other hand, when the plating layer is not formed on the conductor pattern in the dummy area, it can be determined that the conductor pattern is covered with the insulating coat layer, and the insulating coat layer is also formed in the wiring board area.

  That is, in the multiple wiring substrate of the present invention, the presence / absence of the insulating coating layer in the wiring substrate region can be easily determined simply by confirming whether or not the plating layer is formed on the conductor pattern in the dummy region.

  A multiple wiring board according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram showing an example of an embodiment of a multiple wiring board according to the present invention, (a) is a plan view thereof, and (b) is taken along line Ib-Ib in (a). It is sectional drawing.

  The ceramic mother substrate 10 is formed, for example, by laminating an insulating layer made of an electrically insulating material of a rectangular flat plate-shaped glass ceramic sintered body, and each insulating layer is made of a raw material powder obtained by mixing an appropriate glass powder with a ceramic powder. In addition, an organic solvent, a binder, and the like are added and mixed to form a slurry-like ceramic slurry, and the ceramic slurry is formed into a sheet shape by using a sheet forming technique such as a doctor blade method or a calender roll method. A ceramic raw sheet) is obtained. Thereafter, the green sheet is formed into an appropriate shape by cutting or punching, and the green sheets are laminated to form a laminated body. Finally, the laminated body is fired at a temperature of about 1000 ° C. in a reducing atmosphere. It is produced by.

  In addition, although the shape of the ceramic mother board 10 is basically a quadrangular shape, each corner is rounded, or each side is not a straight line but has some irregularities. Although it may be a substantially rectangular shape, it is preferably a square or rectangular shape.

  The ceramic mother board 10 has dividing grooves 20 formed vertically and horizontally on at least one of the upper and lower main surfaces, and a plurality of rectangular wiring board regions 40 are partitioned by the dividing grooves 20 and arranged vertically and horizontally in the center. Yes. The dividing groove 20 has a function of concentrating bending stress when the ceramic mother board 10 is bent along this and the individual wiring board regions 40 are divided into the respective wiring boards. It is formed by pressing a metal blade (blade) having a predetermined cross-sectional shape against the main surface of the green sheet and allowing the blade edge to penetrate to a predetermined depth.

  Note that the method of dividing the multi-layer wiring board into the individual wiring board regions 40 is not limited to the method of previously forming the dividing grooves as described above, and other methods such as dicing may be used. Good.

  Each wiring board region 40 has a mounting portion for mounting an electronic component on its upper surface, and is made of a metal material such as tungsten, manganese, copper, silver, gold, palladium, platinum from the periphery to the lower surface of this mounting portion. A wiring conductor 30 is provided. When the wiring conductor 30 is made of, for example, copper, a metal paste obtained by adding and mixing an appropriate organic binder, a solvent, etc. to the copper powder is previously applied to the upper surface of the green sheet serving as each ceramic insulating layer of the ceramic mother substrate 10. It is formed by printing and applying a predetermined pattern by a screen printing method or the like.

  The wiring conductor 30 is electrically connected to an electronic component (not shown) mounted on the mounting portion, and functions as a conductive path that leads out this electrode to the lower surface side of each wiring board region 40. The electrical connection between the wiring conductor 30 and the electrode of the electronic component is performed via a conductive connecting material (not shown) such as a bonding wire or solder.

  In addition, an insulating coat layer (first insulating coat layer 60) is formed on a part of the wiring board region 40 where the wiring conductor 30 does not exist.

  The first insulating coat layer 60 is formed of an insulating material having the same composition as the insulating layer forming the ceramic mother substrate 10. For example, when each insulating layer is made of a glass ceramic sintered body, an organic solvent, a binder or the like is added to a raw material powder such as ceramic or glass having the same composition as that of the green sheet to be the insulating layer and kneaded into a paste. The ceramic paste produced by the above is formed by printing and applying to a part of the wiring board region 40 where the wiring conductor 30 does not exist by a screen printing method or the like.

  The purpose of the first insulating coat layer 60 is formed, for example, to suppress warpage of the wiring board region 40, that is, warpage of the ceramic mother board 10. That is, an electromagnetic shielding conductor layer (not shown) between the electronic component mounted on the wiring board region 40 and the external electric circuit is formed on the lower surface side of the ceramic mother board 10. In this case, stress is generated between the conductor paste serving as the conductor layer and the green sheet serving as the ceramic mother substrate 10 due to the shrinkage difference during firing. When the ceramic paste serving as the first insulating coat layer is printed on the upper surface side of the green sheet, a stress is generated according to the shrinkage difference between the ceramic paste and the green sheet, and the stress is generated between the upper and lower surfaces of the green sheet. Is offset, so that the warp of the ceramic mother substrate 10 is suppressed.

  The ceramic mother substrate 10 has a dummy region 50 on the outer periphery, and a conductor pattern 70 is formed in the dummy region 50.

  This conductor pattern 70 takes into account the width of the dummy region 50, the electrical influence on the adjacent wiring conductor 30, and the like. It is preferable that the mark is a geometrical mark. Furthermore, the conductor pattern 70 is formed in at least one place, preferably two or more places in the dummy region in determining the presence or absence of the insulating coat layer.

  Here, an insulating coat layer (second insulating coat layer 80) is formed on the conductor pattern 70 in order to determine the presence / absence of an insulating coat in the multiple wiring substrate according to the present invention. In this case, the shape of the second insulating coat layer 80 may be any shape and size that covers the conductor pattern 70.

  Further, the first insulating coat layer 60 and the second insulating coat layer 80 are preferably 5 to 50 μm in thickness. If the thickness is less than 5 μm, it becomes difficult to alleviate the shrinkage difference and effectively cover the conductor pattern 70, and the difference in shrinkage between the front and back sides of the wiring board causes a problem of warping or a part of the conductor pattern 70 is exposed. Thus, the plating layer may be formed, and it may be difficult to determine whether or not the first insulating coat layer 60 is formed. On the other hand, if the thickness exceeds 50 μm, the insulating coating layer itself tends to peel off.

  Here, the second insulating coat layer 80 is formed of an insulating material having the same composition as that of the insulating layer forming the ceramic mother substrate 10, similarly to the first insulating coat layer 60, and further, the first insulating coat layer 80. Designed to be printed simultaneously with layer 60.

  In order to print and form the second insulating coat layer 80 simultaneously with the first insulating coat layer 60, when the first insulating coat layer 60 is formed by printing by a screen printing method, the screen printing It is possible to use a method such as providing a pattern for forming a predetermined second insulating coat layer 80 on the plate making.

  The mother board 10 manufactured in this way is a plating layer (not shown) for preventing the oxidative corrosion of the wiring conductor 30 and improving the bonding wire bonding property and solder wettability. Covered.

  The plating layer is made of a metal material such as nickel, copper, or gold, and is formed on the wiring conductor 30 by a plating method such as an electrolytic plating method or an electroless plating method. Specifically, the electroless nickel plating mainly including a component serving as a nickel supply source such as nickel sulfate and a reducing agent such as sodium hypophosphite on the ceramic mother substrate 10 on which the wiring conductor 30 is formed. A nickel plating layer is formed by immersing in a liquid for a predetermined time. The immersion time is appropriately set according to various conditions that affect the plating rate, such as the desired plating layer thickness, the temperature and composition of the plating solution used.

  Incidentally, since the metal layer forming the plating layer is different in color tone and light reflectance (brightness) from the mother substrate, the presence or absence of the plating layer can be easily and reliably identified. In particular, if at least the outermost layer of the plating layer is formed of a gold plating layer, a change in color tone and deterioration of brightness due to oxidative corrosion of the plating layer are suppressed. Identification is easier because the contrast between the ceramic material to be formed is very large.

  Then, after plating the entire mother board 10, an electronic component (not shown) is mounted on each mounting portion, and each electrode of the electronic component is electrically connected to the wiring conductor 30 such as a bonding wire or a solder bump. Electrical connection through means. Subsequently, the electronic component is hermetically sealed with each wiring board region 40 and the lid by attaching the electronic component to the upper surface of each wiring board region 40 so as to cover the electronic component with a lid (not shown). A large number of electronic devices are arranged vertically and horizontally on the ceramic mother board 10. Thereafter, by bending the ceramic mother substrate 10 along the dividing grooves 20, a large number of electronic devices are manufactured simultaneously and collectively. Electronic components may be mounted after the ceramic mother board 10 is divided into the respective wiring board regions 40 to form individual wiring boards.

  In each electronic device formed in this way, a part of the wiring conductor 30 exposed on the lower surface of each wiring board is connected to the circuit conductor of the external electric circuit board via a connecting material such as solder. Is mounted on the external electric circuit board, and the electrodes of the electronic component are electrically connected to the external circuit conductor.

  In the present invention, the multiple wiring substrate manufactured by the above-described method is inspected as to whether or not a plating layer is formed on the second insulating coating layer 80. In addition, the following effects can be obtained in the multiple wiring substrate.

  According to the present invention, when a plating layer is formed on the conductor pattern 70 in the dummy region 50 produced on the multiple wiring substrate 10, the conductor pattern 70 is covered with the second insulating coat layer 80. Therefore, it can be determined that the first insulating coat layer 60 is not formed in the wiring board region. On the other hand, when the plating layer is not formed on the conductor pattern 70 in the dummy region 50, the conductor pattern 70 is covered with the second insulating coat layer 80, and the wiring board region 40 is also in the first insulating coat layer 60. Can be determined.

  That is, in the multiple wiring substrate X of the present invention, the first insulating coat layer 60 in the wiring substrate region 40 can be obtained by simply checking whether or not the plating layer is formed on the conductor pattern 70 in the dummy region 50. Presence / absence can be easily determined.

  It should be noted that the present invention is not limited to the examples of the above embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, although the ceramic mother board 1 is a flat plate in the above example, the ceramic mother board 1 may have a concave portion for accommodating electronic components on the upper surface.

It is the top view and sectional drawing which show an example of embodiment of the multiple pick-up wiring board of this invention.

Explanation of symbols

X ... Multiple-wiring board 10 ... Ceramic mother board 20 ... Dividing groove 30 ... Wiring conductor 40 ... Wiring board region 50 ... Dummy region 60 ... First insulation coat Layer 70 ... Conductor pattern 80 ... Second insulation coat layer

Claims (2)

A plurality of wiring board areas and dummy areas, wherein a wiring conductor is provided in the wiring board area and a conductor pattern is provided in the dummy area; A method for inspecting whether or not an insulating coating layer is formed on a plurality of wiring substrate, wherein the plurality of wiring substrates are immersed in a plating solution, and a plating layer is formed on the surface of the wiring conductor. A method for inspecting a multi-layer wiring board, comprising: forming and then determining the presence or absence of the insulating coating layer by identifying the presence or absence of a plating layer on the conductor pattern in the dummy region. On one main surface of a mother board having a plurality of wiring board areas and dummy areas, a wiring conductor is provided in the wiring board area, a conductor pattern is provided in the dummy area, and the wiring board area is free of the wiring conductor. A plurality of wiring boards in which an insulating coating layer is formed on a part of the wiring pattern and the conductor pattern, and a plating layer is formed only on the surface of the wiring conductor.

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