JP2010177320A - Multiple patterning wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring substrate capable of preventing sticking of metal components, and the like, at the time of electroless plating, while facilitating division of a mother board. <P>SOLUTION: In a multiple patterning wiring substrate 9, a plurality of wiring substrate regions 2 are arranged in the vertical and horizontal directions on a mother board 1, which is cut and divided in the thickness direction, at the boundary 2a of the wiring substrate regions 2. The multiple pattering wiring substrate 9 is provided with a linear space 5, which extends in the length direction of the border 2a of the wiring substrate regions 2 in plan view, and whose upper end and lower end of lengthwise cross section are of V-shape, respectively, inside the mother board 1 at the border 2a of the wiring substrate regions 2. Since the space 5, having the configuration, is provided inside the mother board 1 at the border 2a, cracks propagate from the upper and lower ends of the space 5 to the upper and lower surfaces of the mother board 1 at dividing, for readily dividing the mother board 1 into respective wiring substrates. Adherence of foreign substances to the inner surface of the space 5, which serves as a side surface of respective wiring substrates, is prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, a plurality of wiring board regions serving as wiring boards for mounting electronic components such as semiconductor elements and surface acoustic wave elements are arranged vertically and horizontally on a mother board, and in the thickness direction at the boundaries of the wiring board areas. The present invention relates to a multi-piece wiring board that is broken and divided into individual wiring boards.

  2. Description of the Related Art Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements are rectangular plate-shaped insulating substrates made of ceramic sintered bodies such as aluminum oxide sintered bodies and glass ceramic sintered bodies. A mounting portion for mounting an electronic component on the upper surface of the substrate, and a structure in which a plurality of wiring conductors made of a metal material such as tungsten are formed from the mounting portion or its periphery to the side surface or the lower surface of the insulating base. Yes.

  Such a wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board. The multi-cavity wiring board has, for example, a structure in which a plurality of wiring board regions serving as wiring boards are arranged in rows and columns on a flat mother board.

  In such a multi-piece wiring board, a dividing groove is provided in advance on the main surface (upper surface and lower surface) of the mother board at the boundary of the wiring board region, and a bending stress or the like is applied to the mother board in a portion where the dividing groove is provided. The mother substrate is broken by applying the above stress to divide the circuit board into individual wiring boards. The dividing groove is generally formed by cutting a cutter blade or the like along the boundary of the wiring board region in the main surface of the unfired ceramic material that becomes the mother board.

JP 2001-319991 JP 2003-273272 A JP 2007-158183 A

  However, since the multi-cavity wiring board of the above-mentioned prior art has a dividing groove formed on the main surface of the mother board, there is a possibility that foreign matter enters the dividing groove and adheres to the inner surface of the dividing groove. There was a problem. When such adhesion occurs on the inner surface of the dividing groove of the multi-cavity wiring board, that is, the side surface of the wiring board region, foreign matter remains on the side surface of the wiring board when it is divided into individual wiring boards. It becomes defective in characteristics and appearance.

  In particular, when a plating layer such as nickel or gold is applied to the exposed surface of the wiring conductor by electroless plating, the oxygen component is insufficient in the electroless plating solution inside the narrow groove. As a result, unnecessary reduction deposition (so-called decomposition of the liquid) of the metal component from the plating solution occurs, and this metal component is likely to adhere to the inner side surface of the dividing groove which is the side surface of the piece of wiring board. Such metal components adhere to the dividing grooves according to an increase in the number of wiring board regions (so-called number of arrangements) arranged on a multi-piece wiring board in order to reduce the size of the wiring board and improve productivity. Since the width of is becoming narrower, it tends to occur frequently.

  The present invention has been completed in view of such conventional problems, and an object of the present invention is a multi-piece wiring board that is broken and divided at the boundary of the wiring board region, and the mother board can be easily divided. However, an object of the present invention is to provide a multi-piece wiring board capable of preventing adhesion such as adhesion of metal components during electroless plating.

  The multi-cavity wiring board of the present invention is a multi-cavity wiring board in which a plurality of wiring board regions are arranged in rows and columns in a mother board, and are broken and divided in the thickness direction at the boundaries of the wiring board regions. Each of the upper end portion and the lower end portion in a longitudinal section in a straight line extending in the length direction of the boundary of the wiring board region in plan view is V-shaped inside the mother board at the boundary of the wiring board region. A space is provided.

  In the multi-piece wiring board of the present invention, in the above configuration, a frame-like dummy area surrounding the wiring board area is provided on the outer periphery of the mother board, and an end of the space is located in the dummy area. It is characterized by that.

  According to the multi-cavity wiring board of the present invention, the upper end and the lower end in the longitudinal section of the straight line extending in the length direction of the boundary of the wiring board region in plan view inside the mother board at the boundary of the wiring board region. Since each of these is provided with a V-shaped space, when a stress such as a bending stress is applied to the mother board at the boundary of the wiring board region at the time of division, the upper and lower ends of the V-shaped space Stress concentrates on the part, and cracks are generated toward the upper surface or the lower surface of the mother substrate, respectively. And since this crack reaches the upper surface and lower surface of the mother board and the mother board breaks in the upper and lower parts of the space, the mother board can be easily divided into individual pieces.

  Further, since this space is not exposed on the main surface (upper surface or lower surface) of the mother board, for example, a plating solution and other foreign matters at the time of electroless plating do not enter inside. Therefore, it is possible to effectively prevent foreign matters such as metal components during electroless plating from adhering to the inner surface of the space serving as the side surface of the individual wiring board. Therefore, it is possible to provide a multi-piece wiring board capable of preventing adhesion such as adhesion of a metal component during electroless plating while facilitating division of the mother board.

  Further, in the multi-cavity wiring board of the present invention, when a frame-like dummy area surrounding the wiring board area is provided on the outer periphery of the mother board and the end of the space is located in the dummy area, In order to make it easier to break the mother board at the boundary of the board area, it is easy to form the space so as to extend over the entire length of the boundary of the wiring board area, and more easily over the entire length of the boundary of the wiring board area. Can be divided.

  In this case, since the edge of the space is located in the dummy region, even if the progress direction of the crack that breaks the mother board at the edge of the space is slightly deviated from the direction that goes straight to the main surface of the mother board, Occurrence of defects such as cracks, chips and burrs in the individual wiring board due to the crack is effectively suppressed. Therefore, it is possible to provide a multi-piece wiring board that can more easily and reliably divide the pieces into wiring boards.

(A) is a perspective view which shows an example of embodiment of the multi-cavity wiring board of this invention, (b) and (c) are the cross sections in the AA line and BB line of (a), respectively. It is a perspective view for showing. (A) And (b) is a principal part expanded sectional view which shows the other example of embodiment of the multi-piece wiring board of this invention, respectively. (A) And (b) is a principal part expanded sectional view for demonstrating the suitable example of the space in the multi-cavity wiring board of this invention, respectively.

  A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a perspective view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIGS. 1B and 1C are respectively taken along line AA in FIG. , B-B line is a perspective view for showing a cross section. In FIG. 1, 1 is a mother board and 2 is a wiring board area. A plurality of wiring board regions 9 are basically formed by arranging a plurality of wiring board regions 2 vertically and horizontally on the mother board 1.

  The base substrate 1 is made of a ceramic material such as a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. A plurality of insulating layers (without reference numerals) are formed to be stacked one above the other.

  The plurality of wiring board regions 2 arranged on the mother board 1 are areas that each become an individual wiring board (not shown). When the mother board 1 is broken and divided at the boundary 2a of the wiring board region 2, a plurality of wiring boards are manufactured simultaneously and collectively.

  When an individual wiring board is used as an electronic component mounting board, an electronic component mounting portion (no symbol) is provided at the center of the upper surface of the wiring board region 2 or the like. In the example shown in FIG. 1, the mother board 1 has a flat plate shape. However, the mother board 1 has a concave portion (not shown) that accommodates an electronic component in the central portion of the upper surface of the wiring board region 2. The bottom part may be a mounting part.

  Electronic components (not shown) mounted on the mounting unit include semiconductor integrated circuit elements such as IC and LSI, and optical semiconductor elements such as LED (light emitting diode), PD (photodiode), and CCD (charge coupled device). Various electronic devices such as semiconductor devices including surface acoustic wave devices, piezoelectric devices such as surface acoustic wave devices and crystal resonators, capacitive devices, resistors, and micromachines (so-called MEMS devices) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Parts.

  The electronic component has a resin adhesive such as an epoxy resin, a polyimide resin, an acrylic resin, a silicone resin, a polyether amide resin, Au-Sn, Sn-Ag-Cu, or Sn-Cu on the mounting portion. , Sn—Pb or the like, glass or the like.

  In the example of this embodiment, a wiring conductor 3 is formed in each wiring board region 2. The wiring conductor 3 is formed so that a part thereof is exposed to the mounting portion. For example, a part of the wiring conductor 3 is electrically connected to the electronic component in the mounting portion, and a plurality of electronic components mounted on the mounting portion or an electronic component and an external electric circuit (not shown) are connected. It functions as a conductive path that is electrically connected to each other.

  The wiring conductor 3 is made of a metal material such as copper, silver, palladium, platinum, gold, tungsten, molybdenum, or manganese.

  The electrical connection between the electronic component and the wiring conductor 3 is, for example, by connecting an electrode (not shown) of the electronic component to a portion of the wiring conductor 3 exposed around the mounting portion, such as a bonding wire or solder. This can be done by connecting via a conductive connecting material (not shown).

  The surface of the wiring conductor 3 is covered with a plating layer of nickel, gold, or the like in order to ensure such characteristics as the bonding property of the bonding wire and the wettability of solder and to prevent oxidation corrosion. The coating with these plating layers is, for example, an electroless plating method in the case where a lead wire for supplying power for plating to the wiring conductor 3 is not required and the miniaturization of the individual wiring board is facilitated. It is done by.

  For example, in the case of nickel, the plating layer is deposited by electroless plating by immersing a large number of wiring boards 9 in an electroless plating solution containing a nickel (ion) component such as nickel sulfate and a reducing agent. The nickel component is reduced and precipitated with a reducing agent on the surface of the wiring conductor 3. In this case, the surface of the wiring conductor 3 has a higher catalytic activity for the nickel reduction reaction than the surface of the mother substrate 1, so that nickel is preferentially deposited on the surface of the wiring conductor 3.

  Such a mother board 1 in which a plurality of wiring board regions 2 each having wiring conductors 3 are arranged vertically and horizontally, for example, is made of an aluminum oxide sintered body as follows. be able to.

  First, a raw material powder composed mainly of aluminum oxide and added with silicon oxide, magnesium oxide, etc. is kneaded with an organic solvent and a binder and molded into a sheet by a molding method such as a doctor blade method or a lip coater method. A ceramic green sheet is prepared. Next, a metal paste such as tungsten or molybdenum is kneaded with an organic solvent and a binder to produce a metal paste. Next, the ceramic green sheet is cut into the outer dimensions of the mother board 1 and a metal paste is printed on each area to be the wiring board area 2 by a printing method such as a screen printing method with a pattern of a predetermined wiring conductor 3. If a plurality of ceramic green sheets are laminated and then fired at a firing temperature of about 1300 to 1600 ° C., a mother board 1 in which a plurality of wiring board regions 2 each having wiring conductors 3 are arranged vertically and horizontally is formed. Can be produced.

  The mother board 1 can also be manufactured by molding an unfired ceramic material into a predetermined plate shape using a mold or the like, and firing it.

  In the example of this embodiment, a dummy area 4 is provided on the outer periphery of the mother board 1 so as to surround the plurality of wiring board areas 2 arranged. The dummy area 4 is provided to facilitate handling of the multi-piece wiring board 9.

  By breaking the multi-piece wiring board 9 at the boundary 2a of the wiring board area 2 (the boundary between the wiring board areas 2 and the boundary between the wiring board area 2 and the dummy area 4), Divided into wiring boards. Then, in order to break the mother board 1, the upper end of the straight vertical section that extends in the length direction of the boundary 2a of the wiring board region 2 in a plan view inside the mother board 1 at the boundary 2a of the wiring board area 2 A space 5 in which each of the part and the lower end part is V-shaped is provided.

  In the division of the mother board 1, for example, a stress such as a bending stress is applied to the mother board 1 so as to sandwich the boundary 2 of the wiring board region 2, and the mother board 1 is broken at a portion where the space 5 is formed by the stress. It is done.

  In order to apply stress to the mother board 1 at the boundary 2 a of the wiring board region 2, for example, a pair of belts (endless belts or the like) (not shown) that face each other at the same distance as the thickness of the mother board 1. ) Between the multiple wiring boards 9 and moving the belt in one direction to apply pressure to the mother board 1 from the upper and lower belts.

  According to this multi-cavity wiring board 9, the upper end and the lower end of the straight line extending in the length direction of the boundary 2a of the wiring board region 2 in a plan view are V-shaped at the boundary 2a of the wiring board region 2. Since a certain space 5 is provided, when stress such as stress is applied to the mother board 1 along the boundary 2 a of the wiring board region 2, stress is applied to the upper and lower ends of the V-shaped space 5. Concentrate, and cracks are generated from the respective end portions toward the upper surface or the lower surface of the mother substrate 1. And since this crack reaches the upper surface and lower surface of the mother substrate 1 and the mother substrate 1 breaks in the upper and lower portions of the space 5, the mother substrate 1 can be easily divided into individual pieces.

  At this time, since the space 5 is linear and is linear along the boundary of the wiring board region 2, the generation of cracks in the wiring board region 2 is suppressed. The occurrence of defects such as cracks is suppressed.

  Moreover, since this space 5 is not exposed to the main surface (upper surface or lower surface) of the mother substrate 1, for example, a plating solution and other foreign matters at the time of electroless plating do not enter inside. Therefore, it is possible to effectively prevent foreign matters such as metal components during electroless plating from adhering to the inner surface of the space 5 which is the side surface of the individual wiring board (not shown). Therefore, it is possible to provide a multi-piece wiring substrate 9 that can prevent the adhesion of the metal component during the electroless plating while facilitating the division of the mother substrate 1.

  In order to obtain the effect of preventing the adhesion of the metal component from the electroless plating solution as described above for the space 5, it is sufficient that the space 5 is inside the mother substrate 1 (if it is not exposed to the surface), There are no particular restrictions on the distance from the upper and lower ends and the lengthwise ends to the surface of the mother board 1.

  Such a space 5 is formed by, for example, performing a punching process using a die provided with a cutting blade on the boundary 2a of the wiring board region 2 of the ceramic green sheet to be the mother board 1 to form a linear punching portion. Or it can form by providing the notch part (not shown). That is, if a plurality of ceramic green sheets are aligned and stacked such that such punched portions and cut portions are continuous in the vertical direction (the cut portions are at the top or bottom), a plurality of insulating layers are formed. The space 5 is formed inside the mother board 1 with the punched portions continuous vertically.

  Moreover, in order to make the upper end part and lower end part in a longitudinal cross-section about the space 5 into V shape, for example, about the thing which becomes the uppermost layer and the lowest layer among said punching parts which comprise the space 5, a longitudinal cross-section A V-shaped blade may be used so that a V-shaped cut portion is provided. In the example shown in FIG. 1, the upper end portion and the lower end portion of the space 5 are positioned in the uppermost layer and the lowermost insulating layer (ceramic green sheet), respectively, and the uppermost layer and the lowermost layer are halfway in the thickness direction. A V-shaped (reverse V-shaped) cut-out portion constituting 5 is provided.

  In this case, the upper end portion and the lower end portion of the space 5 may be positioned in a layer other than the uppermost layer and the lowermost layer among the insulating layers constituting the mother substrate 1, and the insulating layers other than the uppermost layer and the lowermost layer. In addition, a punched portion having a V-shaped longitudinal section may be provided so that the upper end portion and the lower end portion of the space 5 have a V shape. Such an example is advantageous for facilitating processing and lamination when, for example, the thickness of each insulating layer is as thin as about 35 μm.

  When the space 5 is provided in the mother board 1 by punching out the ceramic green sheet at the boundary 2a of the wiring board region 2 by the method as described above, the spaces 5 are arranged vertically and horizontally on the mother board 1. A layer in which the ceramic green sheet to be the mother substrate 1 is separated at each portion corresponding to the substrate region 2 is generated. Therefore, in this case, in consideration of productivity, vertical alignment accuracy, etc., the punching process for the ceramic green sheet and the process of laminating the ceramic green sheet on the other ceramic green sheet are combined ( Preferably it is done in one processing step). For this, for example, a lower ceramic green sheet is positioned and placed on a base plate for stacking, and a punching die is set on the ceramic green sheet to perform a punching process on the upper ceramic green sheet. You can do it. In this way, the upper layer ceramic green sheet subjected to the punching process (separated for each wiring board region 2) can be laminated by pressing it as it is at a predetermined position of the lower layer ceramic green sheet.

  Regarding the space 5, the tip angles of the V-shaped upper end portion and the lower end portion (the angle formed by the side surfaces of the space 5 in the longitudinal section of the space 5) are the material and thickness of the mother substrate 1 to be used, and the insulating layer 1. What is necessary is just to set suitably according to thickness, the direction which applies stress, etc.

  For example, if the mother substrate 1 is made of a glass ceramic sintered body containing about 20% by mass or more of a borosilicate glass component and containing aluminum oxide as a ceramic component, the thickness is about 0.5 mm to 2.5 mm. A tip angle of about 20 to 45 degrees is suitable. If it is this range, stress can be effectively concentrated in the V-shaped upper end part and lower end part of the space 5, and the crack generation by the stress can be facilitated.

  Specifically, with respect to the multi-piece wiring board 9 using the mother board 1 made of the glass ceramic sintered body having the above composition, the ease of division into pieces when the space 5 is provided, and the piece of wiring board The example which confirmed the presence or absence of the foreign material adhering to the side in FIG. In this example, the thickness of the mother board 1 was about 1.5 mm. Further, the dividing groove 5 has an upper end and a lower end at a position of about 0.12 mm from the upper surface and the lower surface of the mother board 1, respectively, a width of about 0.1 mm, and the length of the V-shaped portion is the upper end and the lower end. Both were about 0.2 mm, and the tip angle was about 25 degrees both vertically. In addition, the dimensions of each wiring board region 2 in plan view are about 2.5 mm × 3.5 mm, and are arranged vertically and horizontally in a matrix of 15 × 10 on the mother board 1, and wiring conductors are arranged on the surface of each wiring board area 2. 3 was formed. The multi-piece wiring board 9 was subjected to nickel plating on the wiring conductor 3 by an electroless plating method, and then divided into pieces by a method using a pair of belts facing each other as described above. However, the occurrence of burrs, chips, cracks, and the like and the occurrence of adhesion were 0 in 1500 pieces of wiring boards.

  In addition, for comparison with this specific example, the conventional multi-cavity wiring board (not shown) provided with the dividing groove on the main surface of the mother board is also provided with the dividing groove without providing the space 5. Except for the point, it was produced under the same conditions as in the above specific example, and after electroless plating, it was divided into pieces. As a result, there were no burrs, chippings, cracks, or the like in 1500 pieces of the wiring board, but spotted foreign substances adhered to the side surfaces in two pieces. This adhered foreign matter was confirmed to be nickel by wavelength dispersive X-ray spectroscopic analysis.

  Further, the space 5 is not limited to a space having a constant width at an intermediate portion in the longitudinal section as shown in FIG. 1, for example, and may have a shape as shown in FIGS. 2 (a) and 2 (b), for example. FIGS. 2A and 2B are enlarged cross-sectional views of the main part showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 2, the same parts as those in FIG.

  The example shown in FIG. 2A is an example in which the vertical cross section of the space 5 has a quadrangular shape (rhombus shape, square shape, etc.), and the diagonal line is arranged in parallel with the thickness direction of the mother substrate 1. . Such an example is suitable when it is difficult to provide the space 5 as shown in FIG. 1 such as when the thickness of the mother substrate 1 is as thin as about 0.5 mm or when the number of insulating layers is small.

  The example shown in FIG. 2B is an example in which the width of the space 5 is narrow in a part of the middle part of the longitudinal section. Thus, when the width of the space 5 is narrowed in a part of the intermediate portion, the mechanical strength of the mother board 1 is prevented from becoming too low, or the wiring conductor 3 is formed inside the mother board 1. It is effective in securing a wider space for the purpose.

  In addition, the space 5 can be seen in a plan view as long as the mother board 1 can be broken at the boundary of the wiring board area 2 while preventing cracks from entering the wiring board area 2, for example. It may be such that the width is partially changed. In this case, it is necessary to prevent the space 5 from entering the wiring board region 2 in plan view. In addition, a band-like space (not shown) is provided between the wiring board regions 2 of the mother board 1 with a certain width and used as a discard margin for breaking, so that the space 5 can be accommodated in this space. May be.

  The space 5 is preferably provided over the entire length of the boundary 2a of the wiring board region 2 so that the mother board 1 can be easily broken along the entire length of the boundary 2a of the wiring board region 2. . That is, the mother board 1 can be easily broken by stress in the vertical direction of the space 5 in the portion where the space 5 is provided, but outside the end in the length direction of the space 5, Since the mechanical strength of the mother board 1 is relatively large, it tends to be difficult to break. When a portion having a relatively large strength is broken, a large stress acts on the mother board 1 to cause breakage. Cracks, chips, burrs, etc. may occur in the cross section. On the other hand, if the space 5 is provided over the entire length of the boundary 2a of the wiring board region 2, it is possible to effectively suppress the occurrence of defects such as cracks, chips and burrs in the divided wiring board. Can do.

  When the space 5 is provided over the entire length of the boundary 2a of the wiring board area 2, if the dummy area 4 surrounding the wiring board area 2 is provided on the outer periphery of the mother board 1, the end of the space 5 is not exposed. can do.

  Further, in the multi-piece wiring board 9, a frame-like dummy area 4 surrounding the wiring board area 2 is provided on the outer periphery of the mother board 1, and the end of the space 5 is located in the dummy area 4. In order to make it easier to break the mother board 1 at the boundary 2 a of the wiring board region 2, it is easy to form the space 5 so as to extend over the entire length of the boundary 2 a of the wiring board area 2. The mother substrate 1 can be more easily divided along the entire length of the boundary 2a.

  In this case, since the end of the space 5 is located in the dummy region 4, the wiring board is somewhat slightly away from the direction in which the progress direction of the crack that breaks the mother board 1 at the end of the space 5 goes straight to the main surface of the mother board 1. Even if it shifts to the region 2 side, it is possible to effectively suppress the occurrence of defects such as cracks, chippings and burrs in the individual wiring board due to the crack. Therefore, the multi-piece wiring board 9 can be easily and surely divided into individual wiring boards.

  In this case, the width of the dummy region 4 may be set to about 1.5 to 2 times the width of the adjacent wiring board region 2, for example. If the space 5 is extended into the dummy area 4 from the end of the wiring board area 2 to a position about the width of the wiring board area 2, it is effective that cracks enter the wiring board area 2. Can be suppressed.

  When the space 5 is extended in the dummy region 4 in this way, the space 5 remains in the dummy region 4 while maintaining the shape and size of the longitudinal section at the boundary of the wiring board region 2 in consideration of productivity and the like. You can extend to

  Moreover, it is preferable that the upper end and the lower end of the space 5 are not located between the insulating layers, for example, as shown in FIG. If the upper and lower ends of the space 5 are positioned between the insulating layers as shown in FIG. 3B, for example, the upper and lower ends are divided when dividing the multi-chip wiring board 9 (mother board 1). The cracks generated in (1) may progress along the interlayer of the insulating layer having a relatively low mechanical strength, which may cause defects such as burrs, chips and cracks in the individual wiring board. FIGS. 3A and 3B are enlarged cross-sectional views of main parts for explaining a preferred example of the space 5 in the multi-piece wiring board 9 of the present invention. In FIG. 3, the same parts as those in FIG.

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area | region 2a .. Border 3 of wiring board area | region ... Wiring conductor 4 ... Dummy area | region 5 ... Space 9 ... Multi-piece wiring board

Claims (2)

A plurality of wiring board regions are arranged in a matrix on the mother board, arranged in rows and columns, and broken and divided in the thickness direction at the boundary of the wiring board region, wherein the mother board at the boundary of the wiring board region A linear space extending in the longitudinal direction of the boundary of the wiring board region in plan view is provided inside the substrate, and each of the upper end portion and the lower end portion in the longitudinal section is V-shaped. Multi-cavity wiring board. 2. The multi-piece manufacturing method according to claim 1, wherein a frame-like dummy area surrounding the wiring board area is provided on an outer periphery of the mother board, and an end of the space is located in the dummy area. Wiring board.

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