JP4738220B2 - Multiple wiring board - Google Patents

Description

  In the present invention, a plurality of wiring board regions, which are wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements, are arranged in a matrix at the center of the mother board. The present invention relates to a wiring board.

  Conventionally, for example, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements have electronic components mounted on the upper surface of a rectangular flat plate-shaped insulating substrate made of a ceramic material such as an aluminum oxide sintered body. And has a structure in which a plurality of wiring conductors made of a metal material such as tungsten are formed from the mounting portion or its periphery to the lower surface of the insulating base.

  In the wiring conductor, the electrode of the electronic component is electrically connected to the exposed surface via solder, a bonding wire or the like. In order to improve characteristics such as the wettability of the solder and the bonding property of the bonding wire, a plating layer such as nickel or gold is deposited on the surface of the wiring conductor.

  Such a wiring board is generally manufactured in the form of a so-called multi-piece wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area ceramic mother board.

  For example, as shown in FIGS. 3A and 3B, the multi-cavity wiring board has a plurality of wiring board regions 22 which are wiring boards formed in a central portion of a flat plate-like mother board 21 and are arranged in rows and columns. A frame-like dummy region 23 surrounding the wiring board region is formed on the outer peripheral portion. The dummy area 23 is provided for facilitating handling of the multi-piece wiring board.

  The plating layer (not shown) is also applied to the wiring conductor 28 in the state of the multi-piece wiring board. That is, the frame-shaped conductor 24 is formed in the dummy region 23, and the connection conductor 27 is formed from the wiring conductor 28 of each wiring board region 22 to the frame-shaped conductor 24, and the frame-shaped conductor 24 and each The wiring conductor 28 is electrically connected. Then, for example, in a nickel electrolytic plating bath, a current for plating is supplied to the frame-shaped conductor 24 from an external power source (not shown), so that the frame-shaped conductor 24 and the connection conductor 27 are interposed. A current is supplied to each wiring conductor 28, and a plating layer is deposited by electrolytic plating.

Note that the multi-wiring board is obtained by, for example, dicing cutting along the boundary 25 between the wiring board areas and the boundary between the wiring board area 22 and the dummy area 23 (not shown). It is divided into.
JP-A-2005-101164 JP 2005-72050 A

  However, in the above-described prior art multi-circuit board, since it is necessary to form a connection conductor from each wiring board region to a frame-like conductor located on the outer peripheral portion of the mother board, the connection conductor is, for example, a plurality of wirings. It is formed so as to straddle the substrate region, and the length becomes long and the number also increases. Therefore, when the wiring board region is divided into individual pieces, there is a problem that unnecessary or long connection conductors remain on each wiring board.

  That is, when unnecessary connection conductors are long or many remain on each wiring board, for example, unnecessary capacitance (floating capacitance) is greatly generated between the connection conductors and the wiring conductors. Inconveniences such as deterioration of the characteristics of the wiring board such as the transmission characteristics of the electrical signal transmitted (for example, electrical signal transmission delay) occur.

  The present invention has been completed in view of such conventional problems. The object of the present invention is to shorten the length of the connection conductor that is connected to the wiring conductor and supplies the plating current. It is an object of the present invention to provide a multiple wiring board in which defects such as deterioration of electrical characteristics in the individual wiring board due to residual are suppressed.

In the multiple wiring substrate of the present invention, a plurality of wiring substrate regions are arranged in a matrix at the center portion of the mother substrate, and a frame-shaped dummy region surrounding the wiring substrate region is provided on the outer peripheral portion. A wiring board region having a plurality of wiring conductors in which a wiring conductor having a plating layer deposited on an exposed surface is formed, wherein the mother board is along a boundary between the wiring board region and the dummy region. wherein together with the surface and the frame-shaped conductor in the interior of the dummy region is formed,捨代portion to be diced is provided along the boundary between the wiring substrate region, on the surface and inside of the該捨margin portion, the end A grid-like conductor is connected to the frame-shaped conductor, and a connection conductor is formed inside the mother board from the wiring conductor to the grid-like conductor in each wiring board region; Before And the connecting conductor and the frame-like conductor is connected through the grid-like conductor, at least one of the grid-like conductor and the frame-like conductor, a notch corresponding to the at least one corner of the wiring substrate area parts and is characterized in Rukoto to have a.

According to the multiple wiring substrate of the present invention , the frame-shaped conductor is formed on the surface and inside of the dummy region along the boundary between the wiring substrate region and the dummy region, and along the boundary between the wiring substrate regions.捨代portion to be diced is provided, on the surface and inside of the捨代portion, grid-like conductor is formed whose ends are connected to the frame-shaped conductor, toward the frame-like conductor from the wiring conductors of the wiring substrate region A connection conductor is formed inside the mother board, and the connection conductor and the frame-like conductor are connected to each other via a grid-like conductor inside the mother board, and the wiring board region is connected to at least one of the grid-like conductor and the frame-like conductor. from Rukoto that have a cutout portion corresponding to at least one corner of the electrical connection between the wiring conductor and the frame conductor of the wiring substrate area, it is via a grid-like conductor in addition to the connection conductor Can be connected conductor The length or shorter, or you can reduce the number. In addition, since at least one of the grid-like conductor and the frame-like conductor has a notch corresponding to at least one corner of the wiring board region, for example, a metal paste that becomes a grid-like conductor or a frame-like conductor is used as the wiring board. Even if bleeding occurs toward the corner of the region, the bleeding portion (bleeding portion) can be accommodated inside the notch, so dicing cut was performed with the width of the grid-like conductor or frame-like conductor. Sometimes, the outside of the width does not cause bleeding on the individual wiring board after the dicing cut. Therefore, generation of unnecessary conductors (bleeding portions) on the exposed surface of the individual wiring board is suppressed, and occurrence of an electrical short circuit on the wiring board is effectively prevented.

  In other words, if the connection conductor has a length (number) sufficient to connect between the wiring conductor and the grid-like conductor in each wiring board region, the wiring conductor and the frame-like conductor can be electrically connected. It is sufficient, and it is not necessary to form it long so as to exceed the boundary between the wiring board regions.

  Therefore, the length of the connection conductor that is connected to the wiring conductor and supplies the plating current is shortened, and it is effectively prevented that unnecessary capacitance is generated between the connection conductor and the wiring conductor. Is done. As a result, it is possible to provide a multi-piece wiring board in which problems such as deterioration of electrical characteristics in the individual wiring board due to the remaining connection conductor are suppressed.

Further, a plurality patterning wiring board of the present invention, rank child-like conductor, since it is formed on the surface of the base substrate, will mark the time of dicing can be easily diced.

Further, a plurality patterning wiring board of the present invention, at least one of case child-like conductor and the frame conductor, since it is characterized by having a cutout portion corresponding to at least one corner of the wiring substrate area, For example, even if a metal paste that becomes a grid-like conductor or a frame-like conductor bleeds toward the corner of the wiring board region, the bleed part (bleed part) can be stored inside the notch part. Therefore, when subjected to dicing the width of the grid-like conductor or a frame-like conductor, the outside in the width, in the wiring substrate after dicing cut pieces, no bleeding occurs. Therefore, generation of unnecessary conductors (bleeding portions) on the exposed surface of the individual wiring board is suppressed, and occurrence of an electrical short circuit on the wiring board is effectively prevented.

  The multiple wiring board of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 (a) is a plan view showing an example of an embodiment of a multiple wiring substrate of the present invention, and FIG. 1 (b) is a plan perspective view thereof.

  1 (a) and 1 (b), 1 is a mother board, 2 is a wiring board area, 3 is a dummy area, 4 is a frame-like conductor, 5 is an abandoned part, 6 is a grid-like conductor, and 7 is a connecting conductor. is there.

  The mother substrate 1 includes a flat aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. It consists of an electrically insulating material such as a body.

  If the mother substrate 1 is made of, for example, an aluminum oxide sintered body, a ceramic green sheet formed by processing a raw material powder such as aluminum oxide together with an organic solvent and a binder into a sheet shape is formed into a predetermined shape and size. After being processed, the plurality of layers are laminated in the thickness direction as necessary and fired at 1300 to 1600 ° C.

  In the central portion of the mother board 1, a plurality of wiring board regions 2 are arranged in a matrix. Each wiring board region 2 is an area that becomes an individual wiring board (not shown), and has a mounting portion for mounting electronic components (not shown) on an exposed surface such as a central portion of the upper surface. Yes.

  The wiring board region 2 is not limited to a square flat plate shape as shown in FIG. 1, but is a long and narrow rectangular shape, or has a concave portion in part and the bottom surface of the concave portion is a mounting portion. But it doesn't matter.

  Electronic components include optical semiconductor elements such as light receiving elements and light emitting elements and semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, pressure sensor elements, capacitive elements, resistors, etc. Is mentioned.

  A wiring conductor 8 is formed on the exposed surface of each wiring board region 2. The wiring conductor 8 is electrically connected to an electronic component (not shown) and functions as a conductive path for electrically connecting it to an external electric circuit or the like.

  By forming the wiring conductor 8 so that a part thereof is positioned on the mounting part 2a of the electronic component and the other part is positioned outside the mounting part such as the lower surface of the wiring board region 2, the conductive path is formed as described above. Can function. In this case, an electrode of an electronic component (not shown) is connected to a portion located on the mounting portion 2a of the wiring conductor 8 via a connecting material such as solder or a bonding wire. Is led out of the wiring board region 2 (individual piece of wiring board) through the wiring conductor 8.

  The wiring conductor 8 is formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum.

  For example, if the wiring conductor 8 is made of tungsten, a metal paste prepared by adding and kneading an organic solvent and a binder to tungsten powder is applied to a ceramic green sheet serving as the mother substrate 1 by a screen printing method or the like. It can form by apply | coating to a predetermined pattern by a means.

The wiring conductor 8 is coated with a plating layer (not shown) of nickel, gold, copper, palladium, tin, platinum or the like on the exposed surface.

  The plating layer is for preventing the oxidative corrosion of the wiring conductor 8, improving the properties such as the wettability of the solder with respect to the wiring conductor 8 and the bonding property of the bonding wire.

  The plating layer is formed by a plating method such as an electrolytic plating method or an electroless plating method. For example, in the case of a nickel plating layer, a watt bath containing nickel sulfate and nickel chloride as main components and containing a buffering agent such as boric acid and an additive such as a brightening agent is prepared. 40 to 65 ° C., pH 3.8 to 4.5), and then the mother board 1 on which the wiring conductor 8 is formed is immersed in the liquid. Then, a nickel plating layer is formed by supplying current to the wiring conductor 8 from an external power source (such as a rectifier) at a predetermined current density (for example, 2 to 10 A / dm 2). The time for supplying the current is appropriately adjusted according to the thickness of the plating layer to be deposited.

  A frame-like dummy region 3 surrounding a plurality of arranged wiring substrate regions 2 is provided on the outer periphery of the mother substrate 1.

  The dummy area 3 is provided in order to facilitate the handling of a plurality of dummy wiring boards.

  In addition, a frame-like conductor 4 is formed on the mother board 1 along the boundary between the wiring board area 2 and the dummy area 3, and a dicing section that is diced along the boundary between the wiring board areas 2 is used. 5 is provided, a grid-like conductor 6 whose end is connected to the frame-like conductor 4 is formed in the surplus portion 5, and a connection conductor 7 is formed from the wiring conductor 8 to the frame-like conductor 4 in each wiring board region 2. ing.

  The connection conductor 7 and the grid-like conductor 6 are conductive paths for electrically connecting the wiring conductor 8 to the frame-like conductor 4, and the frame-like conductor 4 is plated on each wiring conductor 8 of the plurality of wiring board regions 2. It is a common conductor for supplying a current for use.

  That is, a part of the frame-like conductor 4 is extended to the side surface of the mother board, and a terminal (not shown) of a plating jig is connected to this extended part (not shown) to A current for plating is supplied from a power source (not shown) to the frame-like conductor 4 through the terminals of the jig. The plating current supplied to the frame-like conductor 4 is supplied to each connecting conductor 7 via the grid-like conductor 6 and supplied to each wiring conductor 8 via the connecting conductor 7.

  The frame-like conductor 4, the lattice-like conductor 6, and the connection conductor 7 are formed of the same metal material (tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, etc.) as the wiring conductor 8.

  For example, if the frame-like conductor 4, the grid-like conductor 6, and the connecting conductor 7 are made of tungsten, a metal paste prepared by adding an organic solvent and a binder to tungsten powder and kneading the ceramic is used as the mother substrate 1. The green sheet can be formed by applying a predetermined pattern by means such as screen printing.

  Further, the surrender portion 5 is a region provided in a strip shape with a width of about the width (about 200 μm) of the dicing blade used in the dicing cut along the boundary between the wiring board regions 2. By grinding and removing the surplus portion 5 with a dicing blade, each wiring board region 2 is divided into individual wiring boards (not shown).

  Since the grid-like conductors 6 formed in the surrogate portion 5 are completely removed along with the dicing cut, they do not remain on the individual wiring board. The dicing cut is also performed at a site along the boundary between the wiring board region 2 and the dummy region 3. The frame-like conductor 4 is removed by the division along the boundary between the wiring board region 2 and the dummy region 3.

  According to the multiple wiring substrate of the present invention, the surplus portion 5 that is diced and cut along the boundary between the wiring substrate regions 2 is provided, and the end portion 5 is connected to the frame-like conductor 4 at the end portion. Since the connection conductor 7 is formed from the wiring conductor 8 of each wiring board region 2 to the frame-like conductor 4, the electrical conductor between the wiring conductor 8 of the wiring board region 2 and the frame-like conductor 4 is formed. In addition to the connection conductor 7, the general connection can be made via the grid-like conductor 6 located outside the wiring board region, and the length of the connection conductor 7 can be shortened or the number can be reduced. Can do.

  That is, if the connection conductor 7 has a length (number) sufficient to connect between the wiring conductor 8 and the grid-like conductor 6 in each wiring board region 2, the electrical connection between the wiring conductor 8 and the frame-like conductor 4 is achieved. It is sufficient for making the connection, and it is not necessary to form it long so as to exceed the boundary between the wiring board regions 2.

  For this reason, the length of the connection conductor 7 that is connected to the wiring conductor 8 and supplies the plating current is shortened, and unnecessary capacitance is greatly generated between the connection conductor 7 and the wiring conductor 8. Effectively prevented. As a result, it is possible to provide a multiple wiring substrate 10 in which problems such as deterioration of electrical characteristics in the individual wiring substrate due to the remaining connection conductor 7 are suppressed.

In such a multiple wiring substrate 10, there is a possibility that the metal paste that becomes the frame-like conductor 4 or the grid-like conductor 6 may bleed. Therefore, the frame-like conductor 4 when divided into individual pieces. to the removal of or lattice-like conductor 6 and sure real ones, as shown in FIG. 2, Ru with the following structure
.

  FIG. 2 is a plan view showing an example of another embodiment of a multiple wiring board according to the present invention. The numbers in the figure are the same as those in FIG. To do. Here, in FIG. 2, 9 indicates a notch.

  That is, for example, when a blur occurs in the grid-like conductor 6 or the frame-like conductor 4 corresponding to the corners of the wiring board region 2, the bleeding part remains on the individual wiring board after the dicing cut, for example, There is a possibility that a defect that causes an electrical short circuit with the wiring conductor 8 formed on the surface of the wiring board may occur.

  Therefore, at least one of the grid-like conductor 6 and the frame-like conductor 4 has a notch corresponding to at least one corner of the wiring board region 4, so that the grid-like conductor 6 and the frame-like conductor 4 are blurred. However, the bleed portion (the bleed portion) can be accommodated inside the cutout portion 9. For this reason, when dicing cut is performed with the width of the grid-like conductor 6 or the frame-like conductor 4, a bleeding portion does not occur on the individual wiring board after the dicing cut outside the width. Therefore, generation of unnecessary conductors (bleeding portions) on the exposed surface of the individual wiring board is suppressed, and occurrence of an electrical short circuit on the wiring board is effectively prevented.

  Preferably, the notch 9 corresponds to a corner of the wiring board region 4 at at least one intersection of the lattice conductors as shown in FIG. 2 or between the lattice conductor and the frame conductor. It is preferable to be provided corresponding to a corner of the wiring substrate region 4 at least one intersection or corresponding to a corner of at least one wiring substrate region 4 of the frame conductor. Further, the notches 9 may be provided corresponding to all the corners of the wiring board region 4.

  In the present invention, the notch portion 9 indicates a portion where the conductor portion is not formed, and is not necessarily a notch such as a hole or a recess. Note that the notches 9 need to be provided so as not to cut the grid-like conductors 9 in order to ensure conduction of current for plating.

  The notch 9 is formed on the plate for printing (plate surface) used for screen printing or the like when the metal paste that becomes the frame conductor 4 or the grid conductor 6 is printed on the ceramic green sheet. It can be formed by means such as providing a non-printing part corresponding to the shape of the sheet.

  In order to suppress generation of unnecessary capacitance, the connection conductor 7 is preferably formed from the wiring conductor 8 to the closest one of the grid conductors 6. In this case, care should be taken not to induce electrical insulation deterioration or electrical short circuit between the wiring conductors 8.

Further, the frame-shaped conductor 4 that is formed on the surface of the base substrate 1. From this, it becomes a mark at the time of dicing cut, and can be easily cut by dicing.

  The surface in this case is, for example, a surface that faces upward when a plurality of wiring boards 10 are mounted for dicing cutting, and is a surface (upper surface) that has an electronic component mounting portion. Further, it may be formed on both upper and lower surfaces.

The frame-like conductor 4 is formed not only on the surface of the mother board 1 but also inside the mother board 1 in order to shorten the length of the connecting conductor 7 as much as possible in accordance with the arrangement of the wiring conductors 8 to be connected. To do .

  Note that the lattice-like conductor 6 is also preferably formed at least on the surface of the mother board 1 in the same manner as the frame-like conductor 4. Since the grid-like conductor 6 is formed in the surplus portion 5 that is cut by dicing, it is effective as a mark at the time of dicing cut.

  The notch 9 may be not only the arc shape shown in FIG. 2 but also an elliptical shape or a square shape.

  Note that the present invention is not limited to the above embodiments, and various modifications may be made without departing from the scope of the present invention.

(A) is a top view which shows an example of embodiment of the multiple taking wiring board of this invention, (b) is the plane perspective view. These are the top views which show an example of other embodiment of the multiple pick-up wiring board of this invention. (A) is a top view which shows an example of the multiple pick-up wiring board of a prior art, (b) is the plane perspective drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area 3 ... Dummy area 4 ... Frame-shaped conductor 5 ... Discarding part 6 ... Grid-shaped conductor 7 ... · Connection conductor 8 ··· Wiring conductor 9 ··· Notch 10 · · · Multiple wiring board

Claims (1)

A plurality of wiring board regions are arranged in a matrix at the center of the mother board, and a frame-like dummy area surrounding the wiring board area is provided on the outer periphery, and a plating layer is provided on the exposed surface in the wiring board area. A plurality of wiring boards formed with wiring conductors to be attached, wherein the mother board has a frame shape on the surface and inside of the dummy area along the boundary between the wiring board area and the dummy area with conductors are formed, the wiring substrate region捨代portion which is diced along the boundary is provided between the surface and the interior of the該捨margin portion, the end portion is connected to the frame-like conductor A grid conductor is formed, and a connection conductor is formed in the mother board from the wiring conductor to the grid conductor in each wiring board region, and the connection conductor and the frame conductor in the mother board. Before Are connected via a grid-like conductor, at least one of the grid-like conductor and the frame-like conductor, and wherein the Rukoto that have a cutout portion corresponding to at least one corner of the wiring substrate area Multiple circuit board.

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