JP2008028234A - Multiple-pattern wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple-pattern wiring board in which unwanted capacitance (stray capacitance) due to the existence of a connection conductor is small, and disadvantage such as deterioration in transmission characteristics of an electric signal is suppressed in singulated individual wiring boards. <P>SOLUTION: In the multiple-pattern wiring board 10, a plurality of wiring board regions 2 are disposed vertically and horizontally on the center of a mother board 1, a frame-like dummy region 3 surrounding the wiring board regions 2 is provided on an external peripheral portion, and each of the wiring board regions 2 has a wiring conductor 4 coated with a plating layer on an exposed surface and a connection conductor 5 for plating to be connected to the wiring conductor 4. In each of the wiring board regions 2, the connection conductor 5 is formed so that it does not overlap in plan view on a wiring conductor 4 different from the wiring conductor 4 connected to the connection conductor 5. This configuration can suppress the generation of stray capacitance due to a fact that the connection conductor 5 opposes the wiring conductor 4 with one part of the mother board 1 sandwiched, and deterioration of electric characteristics can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In the present invention, a plurality of wiring board regions, which are wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements, are arranged in a vertical and horizontal arrangement at the center of the mother board. The present invention relates to a wiring board.

  Conventionally, for example, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements have electronic components placed on the upper surface of a square plate-like insulating base made of a ceramic material such as an aluminum oxide sintered body. A mounting portion for mounting is provided, and a plurality of wiring conductors made of a metal material such as tungsten are formed from the mounting portion or its periphery to the lower surface of the insulating base.

  An electrode of an electronic component is electrically connected to the exposed surface of the wiring conductor on the mounting portion or the periphery thereof via solder, a bonding wire, or the like. Further, the portion led out to the lower surface of the wiring conductor is electrically and mechanically connected to the external electric circuit via the solder or conductive adhesive. In order to improve characteristics such as the wettability of the solder and the bonding property of the bonding wire, a plating layer such as nickel or gold is deposited on the surface of the wiring conductor.

  Such a wiring board is generally manufactured in the form of a so-called multi-piece wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area ceramic mother board.

  In the multi-chip wiring board, a plurality of wiring board areas to be the wiring board are arranged in the center of the flat mother board, and a frame-like dummy area surrounding the wiring board area is formed in the outer periphery. Has a structured. The dummy area is provided in order to facilitate handling of a plurality of wiring boards.

  The plating layer is also applied to the wiring conductor in the state of the plurality of wiring boards. In other words, a frame-shaped conductor is formed in the dummy area, and a connection conductor is formed on the surface or inner layer of the mother board from the wiring conductor of each wiring board area to the frame-shaped conductor. The wiring conductor is electrically connected. The frame-shaped conductor functions as a common conductor for electrically connecting a plurality of connecting conductors together to supply a plating current. Then, for example, in a nickel electrolytic plating bath, a current for plating is supplied to the frame-shaped conductor from an external power source, whereby a current is supplied to each wiring conductor via the frame-shaped conductor and the connecting conductor. Then, a plating layer is deposited by electrolytic plating.

Note that the multi-wiring circuit board is divided along, for example, dicing cuts or pre-formed dividing grooves along the boundary between the wiring board regions and the boundary between the wiring substrate region and the dummy region (chocolate). The circuit board is divided into individual wiring boards by, for example, breaking.
JP 2005-101164 A JP 2005-72050 A

  However, since the connection conductor is formed in each wiring board region in the conventional multi-circuit board, the connection conductor and a wiring conductor different from the wiring conductor to which the connection conductor is connected are provided. When a part of the mother board is interposed in the substrate, there are the following problems.

  That is, when the wiring board region is divided into individual pieces, unnecessary connection conductors remain on the individual wiring boards while being connected to the wiring conductors. In addition, the remaining connection conductor may be electrically independent of other wiring conductors facing each other through a part of the mother board (insulating base in the piece). In this way, unnecessary connection conductors remain, and the connection conductors and the wiring conductors that are electrically independent of the connection conductors face each other with a part of the mother board interposed therebetween. During this period, unnecessary capacitance (floating capacitance) is generated by using a part of the mother board as a dielectric, and the characteristics of the wiring board such as the transmission characteristic of the electric signal transmitted by the wiring conductor are deteriorated (for example, , Such as transmission delay of electrical signals).

  Note that the wiring conductor is electrically independent from the opposing connection conductor, for example, when the electrical connection between the frame conductor and the connection conductor is cut when the wiring conductor is divided into pieces. When the electrical connection with the connecting conductor to be disconnected is cut off, or is not originally electrically connected to the opposing connecting conductor (those that are supplied with plating current from other connecting conductors, plating For example, it is not necessary to apply a layer.

  The present invention has been completed in view of the problems of the prior art, and an object of the present invention is to reduce unnecessary electrostatic capacitance (floating capacitance) due to the presence of connection conductors, and to provide individual wiring boards. It is an object of the present invention to provide a multiple wiring board in which problems such as deterioration of transmission characteristics of electrical signals are suppressed.

  A plurality of wiring board according to the present invention has a plurality of wiring board regions arranged vertically and horizontally in the center portion of the mother board, and a frame-like dummy region surrounding the wiring board region is provided on the outer peripheral portion. A wiring board region is a plurality of wiring boards in which a wiring conductor having a plating layer deposited on an exposed surface and a connection conductor for plating connected to the wiring conductor are formed. And is formed so as not to overlap the wiring conductor.

  In the above-described configuration, the multi-layer wiring board of the present invention preferably has a marginal area formed along a boundary between the wiring board areas and a boundary between the wiring board area and the dummy area. An auxiliary conductor for connecting the plurality of connection conductors to each other is formed in the substitute region.

  According to the multiple wiring board of the present invention, the connection conductor is formed so as not to overlap the wiring conductor in plan view, and the connection conductor and the wiring conductor are prevented from facing each other through a part of the mother board. Therefore, even if unnecessary connection conductors remain in the wiring board region (individual wiring boards), a large capacitance is generated between the connection conductors and the wiring conductors by using a part of the mother board as a dielectric. This is effectively prevented. Therefore, it is possible to provide a multi-piece wiring board in which problems such as deterioration of transmission characteristics of electric signals in the individual wiring board are suppressed.

  In addition, in the multiple wiring board of the present invention, a spare area is formed along the boundary between the wiring board areas and the border between the wiring board area and the dummy area, and a plurality of connection conductors are connected to each other in the spare area. When the auxiliary conductor to be formed is formed, electrical connection between the connection conductors between the adjacent wiring board regions can be performed via the auxiliary conductor. Therefore, for example, in order to directly connect the connection conductors of the adjacent wiring board regions at the boundary between the wiring board regions, there is no need to unnecessarily route the connection conductors in the wiring board region, and the arrangement of the connection conductors The degree of freedom of position can be increased. Therefore, it becomes easier to form the connection conductor so that it does not overlap with the wiring conductor different from the wiring conductor to which the connection conductor is connected in plan view, and the individual pieces caused by the residual connection conductor. It is possible to provide a wiring board having a plurality of layers in which defects such as deterioration of electrical characteristics in the wiring board are more reliably suppressed.

  A multiple wiring board according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a plan perspective view of an example of an embodiment of a multiple wiring board according to the present invention, and FIG. 1B is a plan view seen from the opposite side of FIG. .

  1A and 1B, 1 is a mother board, 2 is a wiring board area, 3 is a dummy area, 4 is a wiring conductor, 5 is a connection conductor, and 8 is a frame-like conductor to which the connection conductor 5 is connected. And 10 indicates a wiring board.

  The mother substrate 1 is a flat aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, silicon nitride sintered body, silicon carbide sintered body, glass ceramic sintered body. It consists of an electrically insulating material such as a body.

  If the mother substrate 1 is made of, for example, an aluminum oxide sintered body, a ceramic green sheet formed by processing a raw material powder such as aluminum oxide together with an organic solvent and a binder into a sheet shape is formed into a predetermined shape and dimensions. After being processed into a plurality, it is produced by laminating a plurality in the thickness direction as needed and firing at 1300 to 1600 ° C.

  A plurality of wiring board regions 2 are arranged vertically and horizontally in the central portion of the mother board 1. In this example, a total of six wiring board regions 2 of 2 vertical × 3 horizontal are arranged in the central portion of the mother board 1. Each wiring board area 2 is an area to be an individual wiring board (not shown), and has a mounting portion 2a for mounting an electronic component (not shown) on an exposed surface such as a central portion of the upper surface. ing.

  The wiring board region 2 is not limited to a square and flat plate shape as shown in FIG. 1, but a long and narrow rectangular shape, or a concave portion or a convex portion (not shown) on a part of the upper surface or the lower surface. It is also possible to use a mounting portion on the bottom surface of the concave portion or the upper surface of the convex portion.

  The electronic components mounted on the mounting portion 2a include optical semiconductor elements such as light receiving elements and light emitting elements and semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, and pressure sensor elements. , Capacitive elements, resistors and the like.

  A wiring conductor 4 is formed on an exposed surface such as an upper surface or a lower surface of each wiring board region 2. The wiring conductor 4 is electrically connected to an electronic component and functions as a conductive path for electrically connecting it to an external electric circuit or the like.

  The wiring conductor 4 is formed so that a part thereof is positioned on the mounting part 2a of the electronic component and the other part thereof is positioned outside the mounting part 2a such as the lower surface of the wiring board region 2. It can be made to function as an electrical conduction path from an external electric circuit or the like. In this case, the electrode of the electronic component is electrically connected to the wiring conductor 4 by connecting the electrode of the electronic component to a portion located on the mounting portion 2a of the wiring conductor 4 via a connecting material such as solder or a bonding wire. Then, it is led out of the mounting portion 2a of the wiring board region 2 (individual piece of wiring board) through the wiring conductor 4. Then, a portion of the wiring conductor 4 that is led out of the mounting portion 2a of the wiring board region 2, for example, a portion that is exposed on the lower surface of the wiring substrate region 2 is electrically connected to an external electric circuit through solder, conductive adhesive, or the like. By connecting to the electronic component, the electronic component and the external electric circuit are electrically connected.

  The wiring conductor 4 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum.

  If the wiring conductor 4 is made of tungsten, for example, a metal paste prepared by adding an organic solvent and a binder to a tungsten powder and kneading the ceramic paste on a ceramic green sheet serving as the mother substrate 1 can be obtained by screen printing or the like. It can form by apply | coating to a predetermined pattern by a means.

  The wiring conductor 4 is coated with a plating layer (not shown) of nickel, gold, copper, palladium, tin, platinum or the like on the exposed surface.

  The plating layer is for preventing oxidative corrosion of the wiring conductor 4 and improving characteristics such as solder wettability to the wiring conductor 4 and bonding property of the bonding wire.

The plating layer is preferably formed by an electrolytic plating method using a plating bath such as a watt bath or a cyan gold plating bath. For example, in the case of a nickel plating layer, a watt bath containing nickel sulfate and nickel chloride as main components and containing a buffering agent such as boric acid and an additive such as a brightening agent is prepared. 40 to 65 ° C., pH 3.8 to 4.5), and then the mother board 1 on which the wiring conductor 4 is formed is immersed in a watt bath. Then, a nickel plating layer is formed by supplying current from the external power source (such as a rectifier) to the wiring conductor 4 at a predetermined current density (for example, ^{2 to} 10 A / dm ² ). The time for supplying the current is appropriately adjusted according to the thickness of the plating layer to be deposited.

  Such a plating current is supplied to the wiring conductor 4 via the connection conductor 5 connected to the wiring conductor 4.

  In this example, a frame-like dummy region 3 surrounding a plurality of wiring substrate regions 2 arranged vertically and horizontally is provided on the outer peripheral portion of the mother substrate 1, and the dummy region 3 includes, for example, a wiring substrate region 2 and a dummy A frame-shaped conductor 6 is formed along the boundary with the region 3. The frame-shaped conductor 8 functions as a common conductor for electrically connecting a plurality of connecting conductors 5 in a lump and supplying a plating current. The dummy region 3 is provided for securing a space for forming the frame-shaped conductor 8 and for facilitating the handling of the plurality of wiring boards 10.

  Then, a plating current is supplied to the wiring conductor 4 in each wiring board region 2 through the connection conductor 5 and the frame-shaped conductor 8. That is, a part of the frame-shaped conductor 8 is extended to the side surface of the mother board 1, and a terminal of a plating jig is connected to the extended portion (not shown), and the jig is supplied from an external power source such as a rectifier. A plating current is supplied to the frame-shaped conductor 8 through the terminals. The plating current supplied to the frame conductor 8 is supplied to the wiring conductor 4 via the connection conductor 5. In this case, by connecting the connection conductors 5 to each other between the wiring board regions 2, the wiring boards positioned inside the array sequentially from the outermost wiring board region 2 of the vertical and horizontal array. A current for plating is supplied to the region 2.

  The frame-shaped conductor 8 and the connection conductor 5 are formed of the same metal material (tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, etc.) as the wiring conductor 4.

  For example, if the frame-shaped conductor 8 and the connecting conductor 5 are made of tungsten, a metal paste prepared by adding an organic solvent and a binder to tungsten powder and kneading is applied to a ceramic green sheet serving as the mother substrate 1 with a screen. It can be formed by applying to a predetermined pattern by means such as a printing method.

  Further, each wiring board region 2 is separated into individual pieces by dicing cutting along the boundary between the wiring board regions 2 or by dividing (chocolate breaks) along a dividing groove formed in advance. Divided into substrates. The connection conductor 4 connected to the wiring conductor 4 remains on each of the divided wiring boards.

  In the multiple wiring board 10 of the present invention, the connection conductor 5 is formed so as not to overlap the wiring conductor 4 in plan view. The connection conductor 5 and the wiring conductor 4 are formed so as not to overlap each other in plan view, and the connection conductor 5 and the wiring conductor 4 do not face each other through a part of the mother board 1. Even if unnecessary connection conductors 5 remain on the individual wiring boards), a large capacitance is caused between the connection conductors 5 and the wiring conductors 4 by interposing a part of the mother board 1 between them as a dielectric. Is effectively prevented from occurring. Therefore, it is possible to provide a multi-wiring substrate 10 that has a small unnecessary capacitance (floating capacitance) and suppresses problems such as deterioration of electrical characteristics in the divided substrate.

  That is, even if the connection conductor 5 formed only for the purpose of forming the electrolytic plating layer on the wiring conductor 4 remains on the individual wiring board while being connected to the wiring conductor 4, it is not necessary after plating. It is possible to provide a multiple wiring substrate 10 that can obtain a highly reliable wiring substrate in which problems such as deterioration of electrical characteristics due to the connection conductor 5 are suppressed.

  The connection conductor 5 is, for example, such that the pattern of the metal paste that becomes the connection conductor 5 printed on the ceramic green sheet does not overlap with the pattern of the metal paste that becomes the wiring conductor 4 printed on another ceramic green sheet in plan view. Therefore, the wiring conductor 4 can be formed so as not to overlap with the planar view.

  Further, as shown in the plan view of FIG. 2A, in the multiple wiring substrate 10 according to the present invention, separation is performed along the boundary between the wiring substrate regions 2 and the boundary between the wiring substrate region 2 and the dummy region 3. It is preferable that the region 6 is formed, and the auxiliary region 7 that connects the plurality of connection conductors 5 to each other is formed in the surplus region 6.

  When such an auxiliary conductor 7 is formed, electrical connection between the connection conductors 5 between the adjacent wiring board regions 2 can be performed via the auxiliary conductor 7. Therefore, for example, as shown in the plan view of FIG. 2B, in order to directly connect the connection conductors 5 of the adjacent wiring board regions 2 at the boundary between the wiring board regions 2, The connection conductor does not need to be routed unnecessarily long, and the degree of freedom of the arrangement position of the connection conductor 5 can be increased. Therefore, the connection conductor 5 can be more easily formed so as not to overlap with the wiring conductor 4 different from the wiring conductor 4 to which the connection conductor 5 is connected in plan view. Thus, it is possible to provide the multi-piece wiring board 10 in which problems such as deterioration of electrical characteristics in the individual wiring board due to the above are more reliably suppressed.

  2 (a) and 2 (b) are enlarged plan views showing a part of another example of the multiple wiring substrate 10 of the present invention, and FIG. 2 (a) shows an auxiliary conductor 7 formed thereon. FIG. 2B shows a portion where the auxiliary conductor 7 is not formed. In FIG. 2, the same parts as those in FIG.

  In addition, since the auxiliary conductor 7 is formed in the removal area 6 of the multi-piece wiring board 10, when the multi-wiring board 10 is divided into pieces by a dividing method such as dicing cut, Removed. Therefore, the auxiliary conductor 7 does not remain on the individual wiring board, and no stray capacitance is generated due to the auxiliary conductor 7 in the wiring board.

  The frame-shaped conductor 8 is preferably formed on at least the surface of the mother board 1 when the mother board 1 is cut by dicing. In this case, the frame-shaped conductor 8 becomes a mark when the dicing is cut, and the dicing can be cut more easily. The surface in this case is, for example, a surface (upper surface) that faces upward when a plurality of wiring boards 10 are placed for dicing cutting and has an electronic component mounting portion 2a. Further, the frame-like conductors 8 may be formed on both the upper and lower surfaces.

  The auxiliary conductor 7 is also preferably formed at least on the surface of the mother board 1 in the same manner as the frame-shaped conductor 8. Since the auxiliary conductor 7 is formed in the abandoned region 6 to be diced, it is effective as a mark when diced.

  The present invention is not limited to the above embodiment and the following examples, and various modifications may be made without departing from the scope of the present invention. For example, the frame conductor 8 may be formed not only on the surface of the mother board 1 but also inside the mother board 1.

  Specific embodiments of the present invention will be described in detail below.

  In the present embodiment, the multi-layer wiring board is formed by forming a wiring conductor with tungsten on a flat mother board made of an aluminum oxide sintered body, and sequentially covering the exposed surface of the wiring conductor with a nickel plating layer and a gold plating layer. It is what I wore. The transmission characteristics of the wiring conductors were measured for this multi-piece wiring board and compared with the conventional multi-pitch wiring board.

  The mother substrate was a square plate having a side length of 5 cm, and a frame-like dummy region having a width of 5 mm was provided along the outer periphery. Further, the inside of the dummy area was divided into 8 × 8 areas, and each area was defined as a wiring board area. Each wiring board region has a square shape with a side length of 5 mm. A central portion of the upper surface of the wiring board region was used as a mounting portion for a semiconductor integrated circuit element as an electronic component. A plurality of wiring boards provided with this mother board were produced by the following method.

(Production method)
First, a raw material powder containing 97% by mass of aluminum oxide powder and containing silicon oxide and magnesium oxide as additives is kneaded with an organic solvent (toluene) and a binder (acrylic resin) to produce a slurry, The slurry was molded by a doctor blade method to produce a plurality of ceramic green sheets to be a mother substrate.

  Next, an organic solvent and binder equivalent to those described above are added to the tungsten powder and kneaded to produce a tungsten metal paste. This metal paste is formed on the surface of the ceramic green sheet on the wiring conductor, connection conductor and frame shape. It printed by the screen-printing method on the predetermined pattern of the conductor.

  The wiring conductor is led out from the mounting portion to the outer periphery on the upper surface of each wiring board region, and is led out from the leading end to the lower surface side through the mother board in the thickness direction in the wiring substrate region, and from the leading end on the lower surface side. It was formed in a pattern extending linearly over the outer periphery of the lower surface.

  In addition, a portion of the wiring conductor that penetrates the mother board in the thickness direction is formed with a through hole by a mechanical drilling process using a metal pin for punching at a predetermined position of the ceramic green sheet serving as the mother board. The through hole was filled with a metal paste by a screen printing method.

  Then, these ceramic green sheets are laminated and fired at about 1550 ° C. in a reducing atmosphere to complete a wiring board, and then a nickel plating layer having a thickness of about 4 to 7 μm is formed on the exposed surface of the wiring conductor. In addition, a gold plating layer having a thickness of about 1 to 1.5 μm was sequentially deposited by an electrolytic plating method, and divided into individual wiring boards to obtain a sample for measuring transmission characteristics. The nickel plating layer was deposited by a Watt bath, and the gold plating layer was deposited by a cyan gold plating bath. Prior to depositing each plating layer, a well-known pre-plating treatment such as alkali degreasing and acid treatment was applied to the wiring board. Further, the division of each wiring board region of the multi-wiring wiring board was performed by performing dicing cut along the surplus area of the mother board.

(Measurement)
For the sample (individual piece) produced by the above method, as a confirmation of the transmission characteristics, stray capacitance and impedance were measured at a site described later. The stray capacitance was measured using an impedance analyzer (Yokogawa Hewlett Packard, model name 4192A), and the impedance was measured by an impedance measuring instrument (Agilent, model name 86100A, 84754A) by the TDR method.

  The electric signal transmitted through each wiring conductor was an electric signal having a frequency band of 2.5 GHz used for mobile communication equipment, and the impedance of the wiring conductor was set to 50Ω.

  The measurement of the stray capacitance and the impedance was carried out for Examples 1 to 4 which are the multi-cavity wiring boards of the present invention and Comparative Examples 1 and 2 which are the multi-cavity wiring boards of the prior art as shown below.

(Example 1)
As shown in FIG. 3, the wiring conductor 4 is led out from the mounting portion 2a in a polygonal line pattern having a line width of 100 μm, and led out to the lower surface side of the wiring board region 2 through a via conductor (not shown). A plurality of linear patterns having a width of about 100 μm were formed from the portion to the outer periphery of the lower surface. The portion of the linear pattern functions as a pad when the individual wiring board is electrically connected to an external electric circuit board via solder or the like. FIG. 3 is an enlarged plan view showing one wiring board region 2 of the multiple wiring board of this embodiment. In FIG. 3, the same parts as those in FIG.

  The connection conductor 5 has a line width of about 150 μm, and a plurality of patterns are arranged so that one end of the corresponding wiring conductor 4 is directly in contact with one end of the corresponding wiring conductor 4 and the other end reaches the outer periphery of the wiring board region 2. Individually formed. The portions of the connecting conductor 5 that reach the outer periphery of the wiring board region 2 a are in contact with each other at the boundary of the wiring board region 2, whereby a plating current can be sequentially passed between the adjacent wiring board regions 2. it can.

  In the first embodiment, the connection conductor 5a, which is one of the connection conductors 5, is a part of the wiring conductor 4b that is different from the wiring conductor 4a to which the connection conductor 5a is connected. The distance d between them is 100 μm in a plan view, and is formed so as not to overlap in a plan view, thereby forming a wiring conductor for measurement. The wiring conductor 4b was measured for stray capacitance and impedance with the connection conductor 5a.

(Example 2)
The distance d between the connecting conductor 5a and the wiring conductor 4b different from the wiring conductor 4a to which the connecting conductor 5a is connected was set to 50 μm, and the other manufacturing was performed in the same manner as in Example 1.

(Example 3)
The distance d between the connecting conductor 5a and the wiring conductor 4b different from the wiring conductor 4a to which the connecting conductor 5a is connected was set to 50 μm, and the other manufacturing was performed in the same manner as in Example 1.

Example 4
The connecting conductor 5a and the wiring conductor 4b different from the wiring conductor 4a to which the connecting conductor 5a is connected are formed so that their outer sides are at the same position (d = 0 μm) in plan view, Except for the above, it was manufactured in the same manner as in Example 1.

(Comparative Example 1)
The wiring conductor 4a, which is different from the wiring conductor 4a to which the connecting conductor 5a is connected, is formed so as to be completely overlapped with the connecting conductor 5a in plan view.

(Comparative Example 2)
A wiring conductor 4b different from the wiring conductor 4a to which the connecting conductor 5a is connected is formed on the connecting conductor 5a so that half of the line width (about 50 μm in width) overlaps in plan view. Was prepared in the same manner as in Example 1.

Table 1 shows the measurement results of stray capacitance and impedance of Examples 1 to 4 and Comparative Examples 1 and 2.

  As shown in Table 1, in the first to fourth embodiments of the multiple wiring substrate of the present invention, the stray capacitance is suppressed to be small and impedance matching is taken, and the transmission characteristics are good.

  However, even in the case where the connection conductor 5a and the wiring conductor 4b different from the wiring conductor 4a to which the connection conductor 5a is connected do not overlap in plan view as in the fourth embodiment, the outer sides of the connection conductor 5a are the same in plan view. In the case of the position, the stray capacitance tended to increase. In consideration of accuracy in the manufacturing method (screen printing or the like), the distance d between the connecting conductor 5a and the wiring conductor 4b different from the wiring conductor 4a to which the connecting conductor 5a is connected is 1 / of the wiring conductor 4b. A width of about 2 or more (about 50 μm in the case of this embodiment) is considered desirable.

  Further, when the connection conductor 5a and the wiring conductor 4b overlap in plan view as in Comparative Examples 1 and 2, the stray capacitance in the wiring conductor 4b regardless of the overlapping range of the wiring conductor 5a and the connection conductor 4b. Is large and the transmission characteristics are low.

(A) is the plane perspective view which shows an example of embodiment of the multiple pick-up wiring board of this invention, (b) is the top view seen from the other side. (A) And (b) is a top view which expands and shows the part about the other example of embodiment of the multiple pick-up wiring board of this invention. It is a plane perspective view which expands and shows one wiring board area | region about an example of implementation of the multiple picking wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area 3 ... Dummy area 4 ... Wiring conductor 5 ... Connection conductor 6 ... Abandonment area 7 ... Auxiliary Conductor 8 ... Frame-shaped conductor
10 ... Multiple wiring board

Claims (2)

A plurality of wiring board regions are arranged vertically and horizontally in the central portion of the mother board, and a frame-like dummy region surrounding the wiring board region is provided in the outer peripheral portion, and a plating layer is provided on the exposed surface in the wiring board region. A plurality of wiring boards formed by forming a wiring conductor to be deposited and a connecting conductor for plating connected to the wiring conductor,
In the wiring board region, the connection conductor is formed so as not to overlap the wiring conductor different from the wiring conductor to which the connection conductor is connected in plan view. An ablation region is formed along a boundary between the wiring substrate regions and a boundary between the wiring substrate region and the dummy region, and an auxiliary conductor that connects the plurality of connection conductors to each other is formed in the ablation region. 2. The multiple wiring substrate according to claim 1, wherein:

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