JP2000012989A - Aggregate substrate and unit substrate formed by splitting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aggregate substrate, wherein all electrodes are electrically connected at an aggregate substrate level and the wiring unnecessary for terminal electrodes through which high-frequency current flows is not connected after the aggregate substrate is split into unit substrates. SOLUTION: A plurality of unit regions 21 are horizontally connected with each other to construct a multiple substrate 20, and the unit region 21 has terminal electrodes 22a and 22b on one main surface 21a, and wiring 24a for plating is formed so as to extend to the adjacent unit region 21 and back across the boundary between a unit region 21 and the adjacent unit region 21 and connect one terminal electrode 22b to the adjacent terminal electrode 22b on the same unit region 21. At an aggregate substrate level, this allows all electrodes to be electrolytically plated, and at a unit substrate level formed by splitting the aggregate substrate into the unit regions, this allows high-frequency terminal electrodes to be prevented from deteriorating in high-frequency characteristics.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collective substrate and a unit substrate obtained by dividing the collective substrate.

[0002]

2. Description of the Related Art FIGS. 6 and 7 show a conventional collective substrate. 6 shows one main surface of the collective substrate, and FIG. 7 shows the other main surface of the collective substrate.

In FIG. 6 and FIG. 7, a collective substrate 1 is constituted by connecting a plurality of unit regions 2 made of an insulator vertically and horizontally in a plane with a dividing line 3 as a boundary. Terminal electrodes 4 are provided on four sides of one main surface 2a of the unit region 2 and the unit region 2
The connection electrode 5 and the auxiliary electrode 6 are provided on the four sides of the other main surface 2b.
Are formed respectively. The terminal electrode 4 and the auxiliary electrode 6 and the terminal electrode 4 and the auxiliary electrode 6 formed in another unit area 2 adjacent to each other are connected at the boundary between the two unit areas 2 to be integrally formed with the terminal electrode pair 7 and An auxiliary electrode pair 8 is formed. In each unit region 2, the terminal electrode 4 and the connection electrode 5 are connected via a through hole 9. Further, the terminal electrode 4 and the auxiliary electrode 6 are connected via a through hole 10 formed on the dividing line 3 which is a boundary between two adjacent unit regions 2.

[0004] Incidentally, in the collective substrate, electrolytic plating is often performed as necessary to increase the thickness of the electrode. In a unit substrate obtained by dividing an aggregate substrate into unit regions, each terminal electrode needs to be electrically insulated from each other, but as an aggregate substrate, the terminal electrode is electrically connected to another terminal electrode adjacent thereto. If it is not connected, the portion becomes a so-called electric floating island, and there is a problem that it becomes difficult to perform electrolytic plating on the entire electrode of the collective substrate.

Therefore, in the collective substrate 1, one terminal electrode pair 7 is formed between two or more unit regions 2 adjacent to each other.
Is formed on the terminal electrode 4 forming another terminal electrode pair 7 from the terminal electrode 4 forming the terminal line 4 so as to cross the dividing line 3 which is a boundary between the unit regions 2. as a result,
All the terminal electrode pairs 7 are electrically connected by the wiring 11 for plating, so that there is no electric floating island, and the entire electrode can be electroplated. In addition, since the plating wiring 11 is cut at a stage where the collective substrate 1 is divided into unit regions 2 to form a unit substrate, each terminal electrode is electrically independent in the unit substrate.

[0006]

However, in the above-mentioned collective substrate 1, in a state where each unit region 2 is divided into a unit substrate, a part of the plating wiring 11 is connected to all the terminal electrodes 4. It will remain as it is. Here, when a high-frequency signal flows through the terminal electrode 4, a part of the remaining plating wiring 11 becomes an open stub and functions as a reactance component connected in parallel to the terminal electrode 4. There is a problem that it causes a mismatch and makes it difficult to design impedance matching when mounting an electronic device configured using a unit substrate as a mounting substrate on a printed circuit board.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and all the electrodes are electrically connected in a collective substrate state, and furthermore, after being divided into unit substrates, a high-frequency terminal electrode flows. The present invention provides a collective substrate and a unit substrate obtained by dividing the collective substrate in which unnecessary wiring is not connected and high frequency characteristics are not degraded.

[0008]

In order to achieve the above-mentioned object, an aggregate substrate according to the present invention comprises: a plurality of unit regions connected in a plane; A plurality of terminal electrodes, the plurality of terminal electrodes being connected to the plurality of terminal electrodes formed in another unit area adjacent to each other to form a plurality of terminal electrode pairs; The pair is connected to each other via a plating wire formed across the boundary between the unit regions, and the plating wire forms the terminal electrode pair.
The terminal is connected to only one of the terminal electrodes.

Further, in the collective substrate according to the present invention, the plating wiring may extend from one terminal electrode formed in one unit region at least once across a boundary between the unit regions to form the same unit wiring. It is characterized by being connected to another adjacent terminal electrode formed in a region.

[0010] Also, in the collective substrate according to the present invention, the plating wiring may be formed from one of the terminal electrodes formed in one of the unit regions, to another of the unit units adjacent to each other across a boundary between the unit regions. The terminal electrodes formed in the regions are alternately connected between the unit regions.

Further, a unit substrate according to the present invention is characterized in that the above-mentioned aggregate substrate is divided into unit regions.

With this configuration, in the collective substrate of the present invention, all the electrodes are electrically connected,
Electroplating becomes possible.

Further, the unit substrate of the present invention may have a high-frequency terminal electrode to which unnecessary wiring is not connected.

[0014]

FIG. 1 shows an embodiment of a collective substrate according to the present invention. Here, FIG. 1 shows one principal surface of the collective substrate. In FIG. 1, the same or equivalent parts as those in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted. Note that the other main surface of the collective substrate is the same as that of FIG. 7 except for the collective substrate and the unit region, and thus the description is omitted here.

In FIG. 1, a plurality of terminal electrodes 22a or terminal electrodes 22b of the same type are formed for each side at the ends of four sides of one main surface 21a of a unit region 21 constituting the collective substrate 20. ing. Then, another adjacent unit area 21 has a dividing line 3 which is a boundary between the unit areas 21.
A different type of terminal electrode is formed to face each other with the. That is, the terminal electrode 22 corresponds to the terminal electrode 22a.
b is, conversely, the terminal electrode 22a corresponding to the terminal electrode 22b.
Are formed. The terminal electrodes 22a and 22b formed on the two adjacent unit regions 21 with the boundary between the unit regions 21 interposed therebetween are connected at the boundary between the two unit regions 21 to form a terminal electrode pair 23. Is composed.

Here, between two terminal electrode pairs 23 formed adjacently in the same unit region 21, the plating wiring 24a is connected to the terminal electrode 2 of one terminal electrode pair 23.
2b, once traverses the dividing line 3 which is the boundary between the unit areas 21, reaches another adjacent unit area 21, and again crosses the boundary between the unit areas 21 again to return to the original unit area 21 to be adjacent. Connected to the terminal electrode 22 b of the terminal electrode pair 23.

Further, between one terminal electrode pair 23 and another terminal electrode pair 23 formed on another side of the unit region 21, a plating wiring 24 b is connected with the terminal electrode of the one terminal electrode pair 23. A terminal electrode 22b of another terminal electrode pair 23 is connected at least once across a boundary between the unit region 21 and the terminal electrode 22b. Therefore, the wirings 24a and 24b for plating are not connected to the terminal electrode 22a forming the terminal electrode pair 23.

By configuring the collective substrate 20 in this manner, in the state of the collective substrate 20, all the electrodes are electrically connected by the plating wirings 24a and 24b, so that floating islands are eliminated, and the entire electrodes can be electroplated. become. Then, in a state where each unit region 21 is divided into unit substrates, the plating wirings 24a and 24b are cut, and the terminal electrodes 22a and 22b are electrically independent.

FIG. 2 shows a unit substrate 25 of the present invention which is divided and taken out from the collective substrate 20 for each unit area 21.
Is shown. In the unit substrate 25, only the terminal electrode 22a,
Alternatively, only 22b is formed on one side. The cut remaining portions of the plating wires 24a and 24b are in a state of being connected only to the terminal electrode 22b.
Nothing is connected to 2a.

As a result, in the terminal electrode 22a, a part of the remaining plating wirings 24a and 24b becomes an open stub at a high frequency as in the prior art, and
functions as a reactance component connected in parallel to
It does not cause impedance mismatch of the terminal electrode 22a. On the other hand, since a part of the plating wirings 24a and 24b is connected to the terminal electrode 22b as in the related art, the terminal electrode 22b causes impedance mismatch at high frequencies.

Therefore, by using the terminal electrode 22a as a terminal through which a high frequency flows and the terminal electrode 22b as a terminal through which a low frequency or a direct current flows, it is possible to use the plating wirings 24a, 24b in the state of the collective substrate 20. Regardless, in the unit substrate 25, it is possible to prevent the terminal electrode 22a from being affected by impedance mismatch at a high frequency. Further, in one unit substrate, terminal electrodes formed on one side can be collectively used for high frequency or low frequency and direct current.

FIG. 3 shows another embodiment of the collective substrate of the present invention. 3, the same or equivalent parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Note that the other main surface of the collective substrate is the same as that of FIG. 7 except for the collective substrate and the reference numerals of the unit regions.

In FIG. 3, the collective substrate 30 is formed by stacking two insulator layers. A plurality of terminal electrodes 32a or 32b of the same type are formed for each side at the ends of the four sides of the one main surface 31a of the unit region 31 forming the collective substrate 30. Further, another type of terminal electrode is formed in another adjacent unit area 31 so as to face the division line 3 which is a boundary between the unit areas 31. That is, the terminal electrode 32b is formed corresponding to the terminal electrode 32a, and conversely, the terminal electrode 32a is formed corresponding to the terminal electrode 32b. Two adjacent unit areas 3
1, the terminal electrodes 32a and 32b formed with the boundary between the unit regions 31 interposed therebetween have two unit regions 3
The terminal electrode pairs 33 are connected and integrated at the boundary between the two.

Here, one end of the plating wiring 34a is connected to the terminal electrode 32b of one terminal electrode pair 33, and the other end is connected between two terminal electrode pairs 33 formed adjacently in the same unit region 31. Once crosses the boundary between the unit areas 31 and reaches another adjacent unit area 31. The wiring 34b for plating is located between two insulator layers (inner layer).
And one end thereof is connected to the terminal electrode 32b of the other terminal electrode pair 33 through the through hole 35, and the other end thereof crosses the boundary between the unit regions 31 once and is connected to another adjacent unit region 31. Has reached. Then, the wiring for plating 34
The other end of “a” and the other end of the plating wiring 34 b are connected via a through-hole 35 in another adjacent unit area 31.

Between one terminal electrode pair 33 and another terminal electrode pair 33 formed on another side of the unit region 31, a terminal electrode 32b of the two terminal electrode pairs 33 is provided with two insulators. The plating wiring 34c formed in the inner layer of the layer is connected to the plating wiring 34c via two through holes 35 provided at both ends thereof. Then, the plating wiring 34c is formed in the unit area 3
It is formed at least once across the boundary between the two.
Therefore, the wirings 34a, 34b, and 34c for plating are not connected to the other terminal electrode 32a that forms the terminal electrode pair 33.

By configuring the collective substrate 30 in this way, in the state of the collective substrate 30, all the electrodes are electrically connected to the plating wirings 34a, 34b, 34c by the through holes 35, and the floating island is eliminated. The entire electric field plating becomes possible.

FIG. 4 shows a state of the divided portion after dividing the collective substrate 30 into the unit regions 31 to form the unit substrate 36. 4 (a) is a partially transparent perspective view of the terminal electrode 32b, and FIG. 4 (b) is a terminal electrode 32a.
It is a partially transparent perspective view of the part of FIG. As described above, in the state of being divided into the unit substrates 36, the plating wirings 34a,
34b and 34c are cut, and the respective terminal electrodes 32a and 32b are cut.
Are electrically independent. As a result, in the unit substrate 36 of the present invention which is divided and taken out from the collective substrate 30,
The remaining portions of the plating wirings 34a, 34b, 34c that are cut remain connected only to the terminal electrode 32b,
Nothing is connected to a. As a result, the unit substrate 36
In this case, the same operation and effect as those of the unit substrate 25 of FIG. 2 can be obtained.

FIG. 5 shows still another embodiment of the collective substrate of the present invention. 5, the same or equivalent parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. In addition,
The other main surface of the collective substrate is the same as that of FIG. 7 except for the reference numerals of the collective substrate and the unit area, and thus the description is omitted here.

In FIG. 5, a plurality of terminal electrodes 42a and terminal electrodes 42b are alternately formed at the ends of four sides of one main surface 41a of the unit region 41 constituting the collective substrate 40. Then, in another adjacent unit area 41,
Another type of terminal electrode is formed to face the division line 3 which is a boundary between the unit regions 41 and face each other. That is, the terminal electrode 42b is formed corresponding to the terminal electrode 42a, and conversely, the terminal electrode 42a is formed corresponding to the terminal electrode 42b.
The terminal electrode 42a and the terminal electrode 42b formed in the two adjacent unit regions 41 are connected at the boundary of the two unit regions 41 and integrally form a terminal electrode pair 43.

Here, between two terminal electrode pairs 43 formed adjacent to each other in the same unit region 41, the plating wiring 44a is moved from the terminal electrode 42b forming one terminal electrode pair 43 to the unit region 42b. Once across the boundary between 41, in another adjacent unit area 41, it is connected to a terminal electrode 42b forming another adjacent terminal electrode pair 43.

In the case between one terminal electrode pair 43 and another terminal electrode pair 43 formed on another side of the unit region 41, the plating wiring 44b is connected to one terminal electrode pair 4
The terminal electrode 42b of another terminal electrode pair 43 crosses at least once the boundary between the unit electrode 41 and the terminal electrode 42b of the third terminal electrode 42b.
It is connected to the. Therefore, the other terminal electrodes 43a constituting the terminal electrode pair 43 are provided with the plating wirings 44a,
4b is not connected.

By configuring the collective substrate 40 in this manner, in the state of the collective substrate 40, all the electrodes are electrically connected by the plating wirings 44a and 44b, and no floating islands are present, and the entire electrodes can be subjected to electrolytic plating. become. Then, in a state where each unit area 41 is divided into unit substrates, the plating wires 44a and 44b are cut, and the terminal electrodes 42a and 42b are electrically independent.
As a result, in the unit substrate of the present invention divided and taken out from the collective substrate 40, the plating wirings 44a, 44
The remaining portion b is connected only to the terminal electrode 42b and remains, and nothing is connected to the terminal electrode 42a. As a result, in the unit substrate obtained by dividing the collective substrate 40, the same operation and effect as those of the unit substrate 25 in FIG. 2 can be obtained. Further, in one unit substrate, the terminal electrodes formed on one side can be alternately used for high frequency or low frequency and direct current.

In each of the above-mentioned collective substrates, the terminal electrodes formed on each side of one unit region may be formed by arranging terminal electrodes of the same type, such as collective substrates 20 and 30, or collective substrate 40. Although different types of terminal electrodes such as were alternately arranged, this is not limited to either one. For example, for two opposing sides, terminal electrodes of the same type are arranged and orthogonal to this. The remaining two opposite
For one side, different types of terminal electrodes may be alternately arranged. Further, the arrangement of the two terminal electrodes may be mixed and used on one side.

In each of the above embodiments, the terminal electrode to which the plating wiring is not connected is used for high frequency. However, it may be used for low frequency or DC.

Further, the material of the collective substrate is not limited to a special material, but may be any material such as ceramics or resin.

[0036]

According to the present invention, a plurality of unit regions each having a plurality of terminal electrodes are planarly connected to one main surface to form an aggregate substrate. Here, each terminal electrode is connected to a plurality of terminal electrodes formed in another unit area adjacent to each other to form a plurality of terminal electrode pairs, and the plurality of terminal electrode pairs cross a boundary between the unit areas. Are connected to each other via the plating wiring formed as described above. Moreover, the plating wiring is connected to only one of the two terminal electrodes constituting the terminal electrode pair. Therefore, the terminal electrode to which the plating wiring is not connected is used for high frequency, and the terminal electrode to which the plating wiring is connected is used for low frequency or direct current.

By forming the terminal electrodes and the wiring for plating in this manner, all the electrodes are electrically connected in the state of the collective substrate, so that the electrolytic plating of the electrodes is facilitated. In addition, in a state where the substrate is divided into unit substrates for each unit area, it is possible to prevent a part of the plating wiring from being connected to the terminal electrode through which the high-frequency signal flows and causing impedance mismatch.

Further, the plating wiring is returned from one terminal electrode formed in one unit area to the original unit area via another adjacent unit area across the boundary between the unit areas, and It is connected to another adjacent terminal electrode formed in the same unit area. With this configuration, terminal electrodes formed on one side of one unit substrate can be collectively used for high frequency or low frequency and direct current.

Further, the wiring for plating is alternately connected from one terminal electrode formed in one unit region to a terminal electrode formed in another adjacent unit region. With this configuration, the terminal electrodes formed on one side of one unit substrate can be alternately used for high frequency or low frequency and direct current.

[Brief description of the drawings]

FIG. 1 is a plan view showing one principal surface of an embodiment of a collective substrate of the present invention.

FIG. 2 is a perspective view showing a unit substrate obtained by dividing the collective substrate of FIG.

FIG. 3 is a plan view showing one principal surface of another embodiment of the collective substrate of the present invention.

4 is a partially transparent perspective view showing a terminal electrode portion of a unit substrate obtained by dividing the collective substrate of FIG. 3;

FIG. 5 is a plan view showing one principal surface of still another embodiment of the collective substrate of the present invention.

FIG. 6 is a plan view showing one main surface of a conventional collective substrate.

FIG. 7 is a plan view showing the other main surface of the conventional collective substrate.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 3 ... Dividing line 5 ... Connection electrode 6 ... Auxiliary electrode 8 ... Auxiliary electrode pair 9, 10, 35 ... Through hole 20, 30, 40 ... Assembly board 21, 31, 41 ... Unit area 21a, 31a, 41a ... One main surface 21b, 31b: the other main surface 22a, 22b, 32a, 32b, 42a, 42b: terminal electrode 23, 33, 43: terminal electrode pair 24a, 24b, 34a, 34b, 34c, 44a, 4
4b: wiring for plating 25, 36: unit board

Claims (4)

[Claims] 1. A collective substrate formed by connecting a plurality of unit regions in a plane, wherein the unit region has a plurality of terminal electrodes on one main surface, and the plurality of terminal electrodes are adjacent to another unit region. A plurality of terminal electrode pairs connected to each other with the plurality of terminal electrodes formed on the substrate to form a plurality of terminal electrode pairs, wherein the plurality of terminal electrode pairs are formed by plating wiring formed across a boundary between the unit regions. Wherein the plating wiring is connected to only one of the two terminal electrodes constituting the terminal electrode pair. 2. The wiring for plating crosses a boundary between the unit regions at least once from one terminal electrode formed in one unit region and is adjacent to the terminal electrode formed in the same unit region. The collective substrate according to claim 1, wherein the collective substrate is connected to another one of the terminal electrodes. 3. The terminal formed on one of the terminal electrodes formed in one of the unit regions, the terminal being formed in another adjacent unit region across the boundary between the unit regions. The collective substrate according to claim 1, wherein the collective substrate is connected to electrodes alternately between the unit regions. 4. A unit substrate, wherein the collective substrate according to claim 1 is divided for each unit region.