JP2009064867A - Assembled substrate having multiple mounting boards - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure capable of improving productivity, by decreasing the assembling man-hours with simple constitution for an assembled boards equipped with a plurality of mounting boards each having a semiconductor device and respective terminals, such as, an input terminal, a relay terminal, and an output terminal for the semiconductor device. <P>SOLUTION: The assembled substrate 10 is equipped with the plurality of mounting boards 12a, 12b, 12c, 12d and each having a semiconductor device 16 and respective terminals, such as an input terminal 18, a relay terminal 20, and an output terminal 22 for the semiconductor device has an integrated constitution, such that the plurality of mounting boards face one another, where output terminals mounted on one side of the plurality of mounting boards and output terminals mounted on the other side of the plurality of mounting boards are disposed alternately. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a collective substrate having a plurality of mounting substrates, and more particularly to a collective substrate including a plurality of mounting substrates each mounting a semiconductor element and each of an input terminal, a relay terminal, and an output terminal for the semiconductor element. Is.

  In recent years, operations required for electric devices such as motors and compressors have been advanced, and accordingly, a configuration in which the electric device is driven via an inverter device has been proposed. In such a configuration, the inverter device has an input / output terminal for the semiconductor element and a relay terminal for connecting the semiconductor element and the controller in addition to a semiconductor element such as a transistor and a controller for controlling the operation of the semiconductor element.

  In such a configuration, the input / output terminals and the like are integrally molded in a single resin case in order to make the device configuration compact (see Patent Documents 1 and 2).

  Specifically, in Patent Document 1, a large terminal for connecting the inverter element and the compressor motor and a small signal system terminal for sending a switching command signal to the inverter element are provided so as to surround the aluminum substrate. It is integrally attached to a single resin module case.

In Patent Document 2, a single resin case in which a P terminal, an N terminal, an AC terminal, and a control terminal for a semiconductor chip, which are main circuit terminals for external connection to a semiconductor chip, are provided so as to surround an insulating substrate. It is attached to the unitary molding.
JP 2002-291261 A JP 2003-133515 A

  However, in the configuration proposed in Patent Document 1, the large terminal and the small signal system terminal for the inverter element are integrally attached to the single resin module case, but the single terminal made of resin It is based on the premise that each mounting board with each terminal attached to the module case is completed, and any configuration for manufacturing a plurality of mounting boards with each terminal mounted at the same time has not been proposed. Not in. That is, in the configuration proposed in Patent Document 1, a plurality of mounting boards cannot be manufactured at a time, so there is room for improvement in terms of production efficiency. Such a situation is the same in a configuration in which each terminal is integrally attached to a single resin case provided so as to surround the insulating substrate as proposed in Patent Document 2.

  The present invention has been made in view of such circumstances, and in a collective substrate including a plurality of mounting substrates each mounting a semiconductor element and each of an input terminal, a relay terminal, and an output terminal with respect to the semiconductor element. An object of the present invention is to provide a structure that can reduce assembly man-hours and improve productivity with a simple configuration.

  In order to achieve the above object, the present invention provides a collective substrate comprising a plurality of mounting substrates each mounting a semiconductor element and each of an input terminal, a relay terminal, and an output terminal for the semiconductor element. The board has an integrated configuration in which the plurality of mounting boards are connected so as to be juxtaposed, and the output terminal mounted on one of the plurality of mounting boards and the plurality of mounting boards The first feature is that the output terminals mounted on the other of the first and second terminals are alternately arranged.

  In addition to the first feature, the present invention has a second feature that the output terminals arranged in a staggered manner have a coupling portion for coupling the output terminals.

  According to the present invention, in addition to the first or second feature, the relay terminal mounted on the other of the plurality of mounting boards is mounted on the one of the plurality of mounting boards. A third feature is that a first posture fixing unit for fixing the posture of the output terminal is provided.

  According to the fourth feature of the present invention, in addition to the third feature, the first posture fixing portion includes a plate-like portion that is provided on the relay terminal and holds the bus bar of the output terminal. To do.

  In addition to any one of the first to fourth features, the present invention has a fifth feature that the output terminal has a second posture fixing portion for fixing the posture of the output terminal. .

  According to the first feature of the present invention, the collective board has an integrated configuration in which a plurality of mounting boards are connected so as to be juxtaposed, and the output terminal is mounted on one of the plurality of mounting boards. And the output terminals mounted on the other of the plurality of mounting boards are arranged in a staggered manner so that a plurality of mounting boards having semiconductor elements and respective terminals can be simultaneously flowed to the production line. Thus, productivity can be improved with a simple configuration.

  According to the second feature of the present invention, the output terminals arranged in a staggered manner have output portions that are mounted on one of the plurality of mounting boards by having coupling portions that couple the output terminals. And the output terminal mounted on the other of the plurality of mounting boards can be mounted on the corresponding mounting boards at the same time, the mounting of the output terminals can be made more efficient, and the coupling portion is separated when the mounting boards are divided. It is possible and productivity can be improved.

  According to the third feature of the present invention, the relay terminal mounted on the other of the plurality of mounting boards is a first for fixing the posture of the output terminal mounted on one of the plurality of mounting boards. By having this posture fixing part, it is possible to reliably prevent the output terminal from falling during mounting.

  According to the fourth feature of the present invention, the first posture fixing part has a plate-like part that is provided in the relay terminal and holds the bus bar of the output terminal. In addition to preventing deformation, the output terminal can be prevented from falling down during mounting.

  According to the fifth feature of the present invention, since the output terminal has the second posture fixing portion to fix the posture of the output terminal, the output terminal can be reliably prevented from falling during mounting.

  Hereinafter, an assembly board having a plurality of mounting boards according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system.

  First, the overall configuration of the collective substrate having a plurality of mounting substrates in the present embodiment will be described in detail with reference to FIGS.

  FIG. 1 is a perspective view of a collective board having a plurality of mounting boards in the present embodiment, and shows a state in which a semiconductor element, an input terminal, a relay terminal, and an output terminal are mounted on each mounting board. FIG. 2 is a top view of the collective substrate having a plurality of mounting substrates in the present embodiment, and is a view of FIG. 1 viewed in the negative direction of the z-axis. 3 is an enlarged sectional view taken along line AA in FIG. 2, and FIG. 4 is a partially enlarged view showing a coupling portion between output terminals in FIG. 1, 3, and 4, the semiconductor elements are not shown for convenience.

  As shown in FIGS. 1 to 4, the collective substrate 10 in the present embodiment includes mounting substrates 12 a, 12 b, 12 c and 12 d, and the mounting substrate 12 b is integrally connected in the negative direction of the y-axis of the mounting substrate 12 a. The mounting substrate 12c is integrally connected in the negative direction of the x-axis of the mounting substrate 12b and adjacent thereto, and the mounting substrate 12d is integrally connected in the positive direction of the y-axis of the mounting substrate 12c. In addition, the mounting board 12a and the mounting board 12d are integrally connected and are adjacent in the x-axis direction.

  The mounting substrates 12a, 12b, 12c, and 12d each include an insulating substrate 14. Here, the mounting substrates 12a and 12b are connected and integrated by a connecting portion 14a that connects each insulating substrate 14, and the mounting substrates 12b and 12c are connected by a connecting portion 14b that connects each insulating substrate 14. The mounting substrates 12c and 12d are connected and integrated by a coupling portion 14c that connects the respective insulating substrates 14, and the mounting substrates 12d and 12a connect the respective insulating substrates 14. As a result, the mounting boards 12a, 12b, 12c and 12d are integrally connected.

  Although not shown, the insulating substrate 14 has a two-layer structure in which a resin insulating layer is formed on a metal layer such as aluminum. More specifically, a copper foil portion corresponding to a wiring portion or a pad surface is provided on the insulating layer of the insulating substrate 14, and the copper foil portion is covered with a solder resist. The insulating substrate 14 is placed on a heat radiating member made of metal or the like via a heat conductive material. A semiconductor element 16 that is a transistor such as an insulated gate bipolar transistor is mounted on the insulating substrate 14. Although not shown, the semiconductor element 16 is soldered to the surface of the copper foil portion, which is the pad surface of the insulating substrate 14, corresponding to the window portion opened in the solder resist to expose the copper foil portion on the insulating substrate 14. Glued by etc. In addition, as the heat conductive material interposed between the insulating substrate 14 and the heat dissipation member, heat conductive grease can be used, but in addition to this, liquid, gel and particulate heat conductive materials can be used, An adhesive having thermal conductivity can also be used.

  In addition to the semiconductor element 16, an input terminal 18, an output terminal 20, and a relay terminal 22 are mounted on the insulating substrate 14. Specifically, the input terminal 18 has two terminals of a P terminal and an N terminal connected to a DC input power supply through a smoothing capacitor that stabilizes the operation of the semiconductor element 16, and the output terminal 20 is It has three terminals of a U-phase terminal 20U, a V-phase terminal 20V, and a W-phase terminal 20W for three-phase alternating current output from the semiconductor element 16 and applied to a load such as a motor or a compressor. The relay terminal 22 has a plurality of terminals connected to a controller that controls the operation of the semiconductor element 16. Although the input terminal 18, the output terminal 20, and the relay terminal 22 are not illustrated, the insulating substrate 14 corresponds to the window portion opened in the solder resist so that the copper foil portion is exposed on the insulating substrate 14. In the state where the connection surface is aligned with the surface of the copper foil portion, which is the pad surface, each is bonded by solder. For convenience of explanation, a smoothing capacitor, an input power source, a load such as a motor and a compressor, and a controller are not shown.

  Here, in the present embodiment, the input terminal 18 has a structure in which a P-terminal bus bar 18 bp and an N-terminal bus bar 18 bn protrude from the resin body 18 m. Further, the U-phase terminal 20U of the output terminal 20 is provided with a bus bar 20bu protruding from the resin body 20mu, the V-phase terminal 20V is provided with a bus bar 20bv protruding from the resin body 20mv, and the W-phase terminal 20W is extended from the resin body 20mw. Each has a structure in which a bus bar 20bw projects. The relay terminal 22 has a structure in which a plurality of connection pins 22b protrude from the resin body 22m.

  That is, in such a configuration, the resin body 18m of the input terminal 18, the resin body 20mu of the U-phase terminal 20U, the resin body 20mv of the V-phase terminal 20, the resin body 20mw of the W-phase terminal 20W, and the resin body 22m of the relay terminal 22 are The input terminal 18, the U-phase terminal 20 U of the output terminal 20, the V-phase terminal 20 V and the W-phase terminal 20 W, and the relay terminal 22 are spatially separated from each other on the insulating substrate 14. It has an independent division module.

  The configuration of the mounting board 12a is the same for the mounting boards 12b, 12c, and 12d. In the collective board 10, the mounting boards 12c and 12d are arranged around the z axis with respect to the mounting boards 12a and 12b. The mounting boards 12a, 12b, 12c and 12d are adjacent to each other so as to be rotated by 180 °. Although not shown, the mounting boards 12a, 12b, 12c, and 12d on which the semiconductor element 16, the input terminal 18, the output terminal 20, and the relay terminal 22 are mounted are separated from the state of the collective board 10, respectively. The case is accommodated in a resin case, and the case is fixed to the heat dissipation member by a fastening member such as a bolt.

  As shown mainly in FIGS. 1 and 2, some of the bus bars 20bu, bv, and 20bw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminal 20 of the mounting board 12a are adjacent to each other. On the other hand, a part of each of the bus bars 20bu, bv, and 20bw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminal 20 of the mounting board 12d is placed on the mounting board 12a. Invaded.

  Specifically, between the resin main body 20mv and the bus bar 20bv at the V-phase terminal 20V of the output terminal 20 of the mounting board 12d and the resin main body 20mw and the bus bar 20bw at the W-phase terminal 20W, the output terminal 20 of the mounting board 12a. The resin main body 20mv and the bus bar 20bv at the V-phase terminal 20V enter, and the resin main body 20mu and the bus bar 20bu at the U-phase terminal 20U of the output terminal 20 of the mounting substrate 12a and between the resin main body 20mv and the bus bar 20bv at the V-phase terminal 20V. The resin main body 20mw and the bus bar 20bw at the W-phase terminal 20W of the output terminal 20 of the mounting board 12d enter, and the resin main body 20mu and the bus bar 20bu and the V-phase terminal 20V at the U-phase terminal 20U of the output terminal 20 of the mounting board 12d. Resin body 20mv and bus bar Between 20 bv, the resin main body 20 mw and the bus bar 20 bw in the W-phase terminal 20 W of the output terminal 20 of the mounting board 12 a enter, and the resin main body 20 mv and the bus bar 20 bv in the V-phase terminal 20 V of the output terminal 20 of the mounting board 12 a Between the resin main body 20mw and the bus bar 20bw in the W-phase terminal 20W, the resin main body 20mv and the bus bar 20bv in the V-phase terminal 20V of the output terminal 20 of the mounting substrate 12d are intruded.

  That is, along the negative direction of the y-axis, the resin body 20mu and the bus bar 20bu at the U-phase terminal 20U of the output terminal 20 of the mounting board 12a, and the resin body 20mw and the bus bar 20bw at the W-phase terminal 20W of the output terminal 20 of the mounting board 12d. The bus bar 20bv at the V-phase terminal 20V of the output terminal 20 of the mounting board 12a, the resin body 20mv and the bus bar 20bv at the V-phase terminal 20V of the output terminal 20 of the mounting board 12d, and the W-phase terminal 20W of the output terminal 20 of the mounting board 12a. The resin body 20mu and the bus bar 20bu at the U-phase terminal 20U of the bus bar 20bw and the output terminal 20 of the mounting board 12d are arranged so as to overlap correspondingly when viewed in the y-axis direction, that is, the output of the mounting board 12a. The terminal 20 and the output terminal 20 of the mounting substrate 12d are mutually connected. It is arranged so as to have. This configuration is the same between the output terminal 20 of the mounting board 12b and the output terminal 20 of the mounting board 12c.

  Further, the P terminal bus bar 18bp and the N terminal bus bar 18bn at the input terminal 18 of the mounting board 12a penetrate into the adjacent mounting board 12b, and the P terminal bus bar 18bp and the N terminal at the input terminal 18 of the mounting board 12c. The bus bar 18bn enters the adjacent mounting board 12d. At this time, in order to avoid the bus bar 18bp at the input terminal 18 of the mounting board 12a from interfering with the resin main body 20mu at the U-phase terminal 20U of the output terminal 20 of the adjacent mounting board 12b, a notch formed by cutting out the resin body 20mu. A portion 20mc is provided. Similarly, in order to prevent the bus bar 18bp at the input terminal 18 of the mounting board 12c from interfering with the resin main body 20mu of the U-phase terminal 20U of the output terminal 20 of the adjacent mounting board 12d, the resin body 20mu is cut out. A notch 20mc is provided. This configuration is typically shown in detail as the relationship between the bus bar 18bp at the input terminal 18 of the mounting board 12c and the notch 20mc at the U-phase terminal 20U of the output terminal 20 of the adjacent mounting board 12d. Shown in

  Furthermore, in the present embodiment, the resin main bodies 20 mu, mv, and mw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminal 20 of the mounting board 12a, and the output terminal 20 of the mounting board 12d. The resin main bodies 20mu, mv, and mw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W are connected and integrated by coupling portions 20ca, 20cb, and 20cc, respectively. Such a configuration includes the resin main bodies 20mu, mv, and mw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminal 20 of the mounting board 12b, and the U-phase terminal 20U of the output terminal 20 of the mounting board 12c, The same applies to the resin main bodies 20mu, mv, and mw in the V-phase terminal 20V and the W-phase terminal 20W. Here, the coupling portions 20ca, 20cb and 20cc of the output terminal 20 are connected to the coupling portion 14b between the insulating substrates 14 of the mounting substrates 12b and 12c and the coupling portion 14d between the insulating substrates 14 of the mounting substrates 12a and 12d in the z-axis direction. Are provided correspondingly so as to overlap with each other. In addition, this configuration is typically represented as a relationship between the resin main body 20mu at the U-phase terminal 20U of the output terminal 20 of the mounting board 12a and the resin main body 20mw at the W-phase terminal 20W of the output terminal 20 of the mounting board 12d. Details are shown in FIG. Note that the number of connecting portions 14b and connecting portions 14d is sufficient if the connection strength between the insulating substrates 14 of the mounting substrates 12b and 12c and the connection strength between the insulating substrates 14 of the mounting substrates 12a and 12d can be sufficiently secured. The number of connecting portions 20ca, 20cb and 20cc corresponding to the number of connecting portions 20ca, 20cb and 20cc may be set to be less than 3. For example, when the number of connecting portions 14b and 14d is two, the connecting portions 14b and The connecting portions 14d can be provided so as to correspond to the connecting portions 20ca and 20cc, respectively.

  Therefore, in the above configuration, the collective substrate has an integrated configuration in which a plurality of mounting substrates are connected in parallel, and an output terminal mounted on one of the plurality of mounting substrates, and a plurality of mounting substrates The output terminals mounted on the other of the mounting boards are arranged in a staggered manner, so that a plurality of mounting boards having semiconductor elements and respective terminals can be simultaneously flowed to the production line. With a simple configuration, productivity can be improved.

  Further, the output terminals arranged in a staggered manner have coupling portions that couple the output terminals, so that the output terminals mounted on one of the plurality of mounting boards and the plurality of mounting boards The output terminals mounted on the other side can be mounted on the corresponding mounting board at the same time, the mounting of the output terminals can be made more efficient, and the coupling part can be separated when the mounting board is divided, further improving productivity can do.

  Still further, the output terminals that are alternately mounted on the collective substrate are provided with cutout portions that escape the input terminals adjacent to the output terminals, thereby preventing unnecessary interference between the output terminals and the input terminals adjacent thereto. A plurality of mounting boards having each terminal can be more surely flowed to the production line at the same time.

  Next, the configuration for preventing the output terminal from falling down in the collective substrate having a plurality of mounting substrates according to the present embodiment will be described in more detail with reference to FIGS.

  FIG. 5 is a perspective view of the mounting board in the collective board of the present embodiment. FIG. 6 is a top view of the output terminal of the mounting board in the collective board of the present embodiment. The output terminal of FIG. It is the figure seen in the negative direction. FIG. 7 is a side view of the output terminal of the mounting board in the collective board of the present embodiment, and is a view taken in the direction of arrow A in FIG. FIG. 8 is a front view of the output terminal of the mounting board in the collective board according to the present embodiment, and is a view taken in the direction of arrow B in FIG.

  As shown in FIG. 5, the resin bodies 20mu, mv, and mw in the U-phase terminal 20U, V-phase terminal 20V, and W-phase terminal 20W of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12a are all. The insulating substrate 14 has a pair of flanges 20f and 20f in contact with the upper surface parallel to the xy plane. Specifically, one of the pair of flanges 20f and 20f extends in the positive direction of the y-axis from each resin body 20mu, mv, and mw while contacting the upper surface of the mounting board 14, and the other is the mounting board. 14 extends from the resin bodies 20mu, mv, and mw in the negative direction of the y-axis while being in contact with the upper surface of the output terminal 20, and the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminal 20 It functions as a posture fixing part that fixes the posture so that it does not fall down. The configuration having the pair of flanges is the same for the resin main bodies 20mu, mv, and mw in the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W of the output terminals 20 of the mounting boards 12b, 12c, and 12d. . Such a configuration is typically shown in detail in FIGS. 6 to 8 as a pair of flanges 20f and 20f provided on the resin body 20mu in the U-phase terminal 20U of the output terminal 20 of the mounting board 12a.

  Therefore, in such a configuration, the output terminal can reliably prevent the output terminal from falling during mounting by having the posture fixing portion to fix the posture of the output terminal.

  Next, with reference to FIGS. 9 to 11, a configuration for preventing the output terminal bus bar from falling over and preventing deformation of the output terminal bus bar in the collective board having a plurality of mounting boards of the present embodiment will be described with reference to FIGS. This will be described in detail.

  FIG. 9 is a perspective view showing a combination of adjacent mounting boards in the collective board of the present embodiment. FIG. 10 is a diagram mainly showing an enlarged top view of the relay terminal of the mounting board in the collective substrate of the present embodiment, and is a view of the relay terminal of FIG. 9 viewed in the negative direction of the z axis. FIG. 11 is a view mainly showing a side view of the relay terminal of the mounting board in the collective board of the present embodiment, and is a view taken in the direction of arrow C in FIG. For convenience, in FIG. 9, semiconductor elements and terminals are omitted as appropriate.

  As shown in FIGS. 9 to 11, the resin main body 22m of the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12d is the U-phase terminal 20U of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12a. Corresponding to each of the bus bars 20bu, 20bv and 20bw in the V-phase terminal 20V and the W-phase terminal 20W, there are three plate-like portions 22p. Specifically, each of the three plate-like portions 22p protrudes from the resin body 22m of the relay terminal 22 and extends in the positive direction of the x-axis, and each plate-like portion 22p further extends in the positive direction of the z-axis. A vertical plate-like portion 22s that protrudes from and extends.

  Here, the vertical plate-like portions 22s provided on each plate-like portion 22p of the relay terminal 22 of the mounting substrate 12d include the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase of the output terminal 20 of the corresponding mounting substrate 12a. The positions of the bus bars 20bu, 20bv, and 20bw in the terminal 20W are in contact with each other so that the bus bars 20bu, 20bw, and 20bw are not tilted or deformed, and the U-phase terminals 20U and V-phase are fixed. The terminal 20V and the W-phase terminal 20W function as a posture fixing unit that fixes the posture so as not to fall down. Such a configuration includes a relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12a and a U-phase terminal 20U, a V-phase terminal 20V, and a W-phase terminal of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12d. Between the bus bars 20bu, 20bv and 20bw at 20W, the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12b, and the U-phase terminal 20U of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12c, Mounted between the bus bars 20bu, 20bv, and 20bw of the V-phase terminal 20V and the W-phase terminal 20W, the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12c, and the insulating substrate 14 of the mounting substrate 12b. Output bus 20 with U-phase terminal 20U, V-phase terminal 20V and W-phase terminal 20W with bus bars 20bu, 20bv and 20bw. The same is true in.

  Therefore, in such a configuration, the relay terminal mounted on the other of the plurality of mounting boards has a posture fixing portion for fixing the posture of the output terminal mounted on one of the plurality of mounting boards. The fall of the output terminal during mounting can be reliably prevented. In particular, such a posture fixing portion has a plate-like portion that is provided on the relay terminal and holds the bus bar of the output terminal, thereby reliably preventing the bus bar from falling or deforming at the output terminal during mounting, and at the time of mounting. The output terminal can be reliably prevented from falling.

  Next, in the present embodiment, a method for obtaining individual mounting substrates by dividing the mounting substrate in a state of a collective substrate in which semiconductor elements, input terminals, output terminals, and relay terminals are mounted on an insulating substrate is further illustrated. This will be described in more detail with reference to 12 to 14.

  FIG. 12 is a perspective view of a collective substrate having a plurality of mounting boards in the present embodiment, and shows a state before the semiconductor element, the input terminal, the relay terminal, and the output terminal are mounted. FIG. 13 is a perspective view of a collective substrate having a plurality of mounting substrates in the present embodiment, and shows a state in which a semiconductor element, an input terminal, a relay terminal, and an output terminal face each other. FIG. 14 is a perspective view showing a state in which a collective substrate having a plurality of mounting substrates in the present embodiment is divided.

  First, as shown in FIG. 12, four insulating substrates 14 that are connected and integrated correspondingly by connecting portions 14a, 14b, 14c, and 14d are prepared.

  Next, as shown in FIG. 13, the semiconductor element 16, the input terminal 18, the output terminal 20, and the relay terminal 22 were prepared so as to face each other, corresponding to each of the four insulating substrates 14 connected and integrated. Thereafter, as shown in FIG. 1, the semiconductor element 16, the input terminal 18, the output terminal 20, and the relay terminal 22 are mounted on the insulating substrates 14 of the mounting substrates 12 a, 12 b, 12 c, and 12 d to collect the collective substrate 10. To complete. In the collective substrate 10 composed of the mounting substrates 12a, 12b, 12c and 12d obtained in this way, the output terminals 20 of the mounting substrates 12a and 12d are alternately arranged, and the output terminals 20 of the mounting substrates 12b and 12c are also included. Are staggered.

  Here, the semiconductor element 16, the input terminal 18, the output terminal 20, and the relay terminal 22 are jigs not shown, and the main body of the semiconductor element 16, the resin main body 18 m of the input terminal 18, and the U-phase terminal 20 U in the output terminal 20. The copper foil which is the corresponding pad surface of the insulating substrate 14 while adsorbing the resin body 20 mu of the V-phase terminal 20, the resin body 20 mw of the W-phase terminal 20 W, and the resin body 22 m of the relay terminal 22. In a state in which the connection surface is aligned with the surface of the part, each is bonded by solder, and is soldered and connected to the copper foil part which is a corresponding wiring part on the insulating substrate 14.

  At this time, the output terminals 20 of the mounting boards 12a and 12d are connected and integrated by connecting portions 20ca, 20cb and 20cc, and the output terminals 20 of the mounting boards 12a and 12d are also connected by connecting portions 20ca, 20cb and 20cc. Since they are connected and integrated, the output terminals 20 are simultaneously attracted by a single jig and mounted on the corresponding insulating substrate 14. Since each output terminal 20 of the mounting boards 12a, 12b, 12c and 12d has a pair of flanges 20f and 20f, each output terminal 20 is mounted on the corresponding insulating board 14 without falling down. Furthermore, each relay terminal 22 of the mounting boards 12a, 12b, 12c, and 12d has a vertical plate-like portion 22s that protrudes from the plate-like portion 22p and extends, so that the bus bars 20bu, 20bv of each output terminal 20 are provided. And 20 bw are mounted on the corresponding insulating substrate 14 without falling or deforming. For the sake of convenience, in FIG. 1, detailed configurations of the flange 20f and the vertical plate-like portion 22s are not shown.

  Then, after completing the collective substrate 10 composed of the mounting substrates 12a, 12b, 12c, and 12d in this way, as shown in FIG. 14, the coupling portion 14a of the insulating substrate 14 in the mounting substrates 12a, 12b, 12c, and 12d. , 14b, 14c and 14d, and the coupling portions 20ca, 20cb and 20cc of the output terminal 20 are separated correspondingly to divide the mounting boards 12a, 12b, 12c and 12d, and the semiconductor element 16, the input terminal 18 and the output terminal 20 are separated. And individual mounting boards 12a, 12b, 12c and 12d on which the relay terminals 22 are mounted, respectively.

  Here, when the mounting boards 12a, 12b, 12c, and 12d are separated, the connecting portions 14a, 14b, 14c, and 14d of each insulating substrate 14 are separated by a cutting tool that is not shown, but the coupling portion 20ca of the output terminal 20 is separated. , 20cb and 20cc are provided corresponding to the connecting portion 14b between the insulating substrates 14 of the mounting substrates 12b and 12c and the connecting portion 14d between the insulating substrates 14 of the mounting substrates 12a and 12d so as to overlap in the z-axis direction. Therefore, when disconnecting the connecting portion 14b between the insulating substrates 14 of the mounting substrates 12b and 12c and the connecting portion 14d between the insulating substrates 14 of the mounting substrates 12a and 12d, the connecting portions 20ca, 20cb and 20cc of the output terminal 20 are connected. Will be separated at the same time. Such a cutting tool is not limited to a mechanical cutting tool such as a cutter or a router, and a physical cutting tool such as a laser cutter can also be used. If the parts 14b and 14d and the coupling parts 20ca, 20cb and 20cc of the output terminal 20 are separated separately, bending cutting or the like can be employed.

  As described above, according to the configuration of the present embodiment, individual mounting boards are manufactured by simultaneously flowing a plurality of mounting boards having semiconductor elements and respective terminals to the production line while preventing collapse of components. Thus, productivity can be improved with a simple configuration.

  Next, referring to FIGS. 15 and 16 for a configuration of a modified example for preventing the output terminal bus bar from falling and deforming and preventing the output terminal from falling in the collective substrate having a plurality of mounting boards of the present embodiment. Will be described in more detail.

  FIG. 15 is a perspective view showing a combination of adjacent mounting boards in the collective board of this modification. FIG. 16 is an enlarged top view of the relay terminal of the mounting board in the collective substrate of this modification, and is a view of the relay terminal of FIG. 15 viewed in the negative direction of the z axis.

  As shown in FIGS. 15 and 16, in the configuration of the present modification, the vertical plate-like portion which is one plate-like portion in each plate-like portion 22 p of the resin main body 22 m of the relay terminal 22 in the configuration described above. The difference is that 22s is changed to a vertical plate-like portion 20t in which a slit is formed between two plate-like portions, and the remaining configuration is the same.

  Specifically, the resin main body 22m of the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12d having such a configuration is a U-phase terminal 20U of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12a. Corresponding to each of the bus bars 20bu, 20bv and 20bw in the V-phase terminal 20V and the W-phase terminal 20W, there are three plate-like portions 22p. Each of the three plate-like portions 22p protrudes from the resin main body 22m of the relay terminal 22 and extends in the positive direction of the x-axis, and each plate-like portion 22p protrudes in the positive direction of the z-axis. And a vertical plate-like portion 20t having two parallel plate-like portions extending in parallel.

  Here, the slit between the two plate-like portions of the vertical plate-like portion 20t provided in each plate-like portion 22p of the relay terminal 22 of the mounting substrate 12d has a U between the output terminals 20 of the corresponding mounting substrate 12a. The bus bars 20bu, 20bv, and 20bw at the phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W are fitted and fixed so that the bus bars 20bu, 20bv, and 20bw do not fall down or deform. In addition, the U-phase terminal 20U, the V-phase terminal 20V, and the W-phase terminal 20W function as a posture fixing unit that fixes the posture so as not to fall down. Such a configuration includes a relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12a and a U-phase terminal 20U, a V-phase terminal 20V, and a W-phase terminal of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12d. Between the bus bars 20bu, 20bv and 20bw at 20W, the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12b, and the U-phase terminal 20U of the output terminal 20 mounted on the insulating substrate 14 of the mounting substrate 12c, Mounted between the bus bars 20bu, 20bv, and 20bw of the V-phase terminal 20V and the W-phase terminal 20W, the relay terminal 22 mounted on the insulating substrate 14 of the mounting substrate 12c, and the insulating substrate 14 of the mounting substrate 12b. Output bus 20 with U-phase terminal 20U, V-phase terminal 20V and W-phase terminal 20W with bus bars 20bu, 20bv and 20bw. The same is true in.

  Therefore, in the configuration of the present modification, the relay terminal mounted on the mounting board is provided with a vertical plate-like portion that forms a slit between the two plate-like portions, so that the output terminal bus bar can be tilted or not. The deformation can be prevented more reliably, and the output terminal can be prevented from falling down during mounting.

  In the present invention, the type, arrangement, number, and the like of the members are not limited to the above-described embodiments, and the constituent elements thereof are appropriately replaced with those having the same operational effects, and the gist of the invention is not deviated. Of course, it can be appropriately changed within the range.

  As described above, in the present invention, it is possible to simultaneously flow a plurality of mounting boards each having a semiconductor element and each terminal to the production line, and the productivity can be improved with a simple configuration. An aggregate substrate can be provided, and it is expected that it can be widely applied to semiconductor devices such as an inverter device because of its general-purpose universal character.

It is a perspective view of a collective board which has a plurality of mounting boards in an embodiment of the present invention. FIG. 2 is a top view of a collective substrate having a plurality of mounting substrates in the present embodiment, and is a view of FIG. 1 viewed in the negative direction of the z axis. It is an expanded sectional view by the AA line of FIG. It is the elements on larger scale which show the coupling part between the output terminals in FIG. It is a perspective view of the mounting substrate in the collective substrate of this embodiment. FIG. 6 is a top view of an output terminal of a mounting board in the collective substrate of the present embodiment, and is a view of the output terminal of FIG. 5 viewed in the negative direction of the z axis. It is a side view of the output terminal of the mounting board | substrate in the assembly board of this embodiment, and is A arrow directional view in FIG. It is a front view of the output terminal of the mounting board | substrate in the aggregate substrate of this embodiment, and is a B arrow view in FIG. It is a perspective view which combines and shows adjacent mounting substrates in the collective substrate of this embodiment. FIG. 10 is an enlarged top view of the relay terminal of the mounting board in the collective substrate of the present embodiment, and is a view of the relay terminal of FIG. 9 viewed in the negative direction of the z axis. It is a side view of the relay terminal of the mounting board in the collective board of this embodiment, and is a C arrow line view in FIG. It is a perspective view of the collective board which has a plurality of mounting boards in this embodiment, and is a figure showing the state before a semiconductor element, an input terminal, a relay terminal, and an output terminal are mounted. It is a perspective view of the collective board which has a plurality of mounting boards in this embodiment, and is a figure showing the state where a semiconductor element, an input terminal, a relay terminal, and an output terminal were countered. It is a perspective view which shows the state which divided | segmented the aggregate substrate which has several mounting substrates in this embodiment. It is a perspective view which combines and shows adjacent mounting substrates in the collective substrate of the modification of this embodiment. FIG. 16 is an enlarged top view of a relay terminal of a mounting board in a collective board according to a modification of the embodiment, and is a view of the relay terminal of FIG. 15 as viewed in the negative direction of the z axis.

Explanation of symbols

10 ... Collective substrate 12a, 12b, 12c, 12d ... Mounting substrate 14 ... Insulating substrate 14a, 14b, 14c, 14d ... Coupling part 16 ... Semiconductor element 18 ... Input terminal 18m ... Resin body 18bp, 18bn ... Bus bar 20 ... Output terminal 20U ... U phase terminal 20V ... V phase terminal 20W ... W phase terminal 20mu, 20mv, 20mw ... Resin body 20bu, 20bv, 20bw ... Bus bar 20ca, 20cb, 20cc ... Connector 20f ... Flange 22 ... Relay Terminal 22m ... Resin body 22b ... Connection pin 22p ... Plate-like part 22s, 22t ... Vertical plate-like part

Claims (5)

In a collective substrate comprising a plurality of mounting substrates each mounting a semiconductor element and each of an input terminal, a relay terminal and an output terminal for the semiconductor element,
The collective substrate has an integrated configuration in which the plurality of mounting substrates are connected to be juxtaposed, the output terminal mounted on one of the plurality of mounting substrates, and the plurality of mounting substrates An assembly board, wherein the output terminals mounted on the other of the first and second output terminals are alternately arranged.   2. The collective substrate according to claim 1, wherein the output terminals arranged in a staggered manner include a coupling portion that couples the output terminals. 3.   The relay terminal mounted on the other of the plurality of mounting boards includes a first posture fixing portion for fixing a posture of the output terminal mounted on the one of the plurality of mounting substrates. The collective substrate according to claim 1, wherein the collective substrate is provided.   The collective substrate according to claim 3, wherein the first posture fixing portion includes a plate-like portion that is provided on the relay terminal and holds a bus bar of the output terminal.   5. The collective substrate according to claim 1, wherein the output terminal has a second posture fixing portion for fixing the posture of the output terminal. 6.

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