JPH03261192A - Connecting terminal of high frequency hybrid integrated circuit board - Google Patents
Connecting terminal of high frequency hybrid integrated circuit boardInfo
- Publication number
- JPH03261192A JPH03261192A JP2059159A JP5915990A JPH03261192A JP H03261192 A JPH03261192 A JP H03261192A JP 2059159 A JP2059159 A JP 2059159A JP 5915990 A JP5915990 A JP 5915990A JP H03261192 A JPH03261192 A JP H03261192A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- high frequency
- hybrid integrated
- frequency hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミック基板等の誘電体基板を用いた高周
波混成集積回路基板の集積回路導体部と外部回路基板の
外部回路導体部とを接続する際に用いられ、高周波集積
回路基板の内部回路と外部回路とのインピーダンス不整
合を防ぐことができる高周波混成集積回路基板の接続端
子に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention connects an integrated circuit conductor portion of a high frequency hybrid integrated circuit board using a dielectric substrate such as a ceramic substrate and an external circuit conductor portion of an external circuit board. The present invention relates to a connection terminal for a high frequency hybrid integrated circuit board, which is used in a high frequency integrated circuit board and can prevent impedance mismatch between an internal circuit and an external circuit of the high frequency integrated circuit board.
従来は、第３図示のように外部回路基板２の外部回路導
体部５に、高周波混成集積回路基板４の集積回路導体部
６を接続用導体ピン１により接続する方法が一般的に用
いられていた。しかし、このような従来の方法では高周
波混成集積回路基板４の上面にある集積回路導体部６と
外部回路基板２の下面にある外部回路導体部５を、両基
板４２に貫通穴を設けて接続用導体ビン１で接続するこ
とになる。Conventionally, a method has generally been used in which the integrated circuit conductor section 6 of the high frequency hybrid integrated circuit board 4 is connected to the external circuit conductor section 5 of the external circuit board 2 using the connecting conductor pin 1 as shown in the third diagram. Ta. However, in such a conventional method, the integrated circuit conductor part 6 on the top surface of the high frequency hybrid integrated circuit board 4 and the external circuit conductor part 5 on the bottom surface of the external circuit board 2 are connected by providing through holes in both boards 42. The connection will be made using conductor bin 1.
この接続用導体ピン１は両基板４．２のそれぞれの厚さ
の和の大きさの長さ寸法を必要とするため、この接続用
導体ビン１の持つ寄生インダクタンス威勢が高周波集積
回路基板４の内部回路と外部回路基板２の外部回路との
インピーダンス不整合を発生させるため、これによって
生ずる不具合を防ぐための新たな回路の追加が必要とな
るという課題があった。Since this connecting conductor pin 1 requires a length equal to the sum of the respective thicknesses of both boards 4.2, the parasitic inductance of this connecting conductor pin 1 is greater than that of the high frequency integrated circuit board 4. Since an impedance mismatch occurs between the internal circuit and the external circuit of the external circuit board 2, there is a problem in that a new circuit needs to be added to prevent problems caused by this.
本発明は上記の課題を解決するため第１．第２図示のよ
うに外部回路基板２の上面にある外部回路導体部５に、
高周波混成集積回路基板４の集積回路導体部６を接続す
る構造において、高周波混戒集積回路基板４に設けた側
面スルーホール導体３で接続してなる構成としたもので
ある。The present invention aims to solve the above-mentioned problems as follows. As shown in the second diagram, on the external circuit conductor portion 5 on the top surface of the external circuit board 2,
In the structure for connecting the integrated circuit conductors 6 of the high frequency hybrid integrated circuit board 4, the connection is made by side through-hole conductors 3 provided on the high frequency hybrid integrated circuit board 4.
このように、高周波混成集積回路基板４に設けられた側
面スルーホール導体３を用いて、外部回路基板２の外部
回路導体部５に高周波混成集積回路基板４の集積回路導
体部６を直接接続することにより、外部回路導体部５を
高周波混成集積回路基板４と接する側に配置できるので
、側面スルーホール導体３の長さを最短にできる。これ
により、高周波混成集積回路基板４の内部回路と外部回
路基板２の外部回路とのインピーダンス不整合を最小に
軽減できることになる。In this way, the integrated circuit conductor section 6 of the high frequency hybrid integrated circuit board 4 is directly connected to the external circuit conductor section 5 of the external circuit board 2 using the side through-hole conductor 3 provided on the high frequency hybrid integrated circuit board 4. As a result, the external circuit conductor portion 5 can be placed on the side in contact with the high frequency hybrid integrated circuit board 4, so that the length of the side surface through-hole conductor 3 can be minimized. Thereby, the impedance mismatch between the internal circuit of the high frequency hybrid integrated circuit board 4 and the external circuit of the external circuit board 2 can be reduced to a minimum.
以下図面に基づいて本発明の詳細な説明する。 The present invention will be described in detail below based on the drawings.
第１図と第２図はそれぞれ本発明の実施例の構成を示す
正面図及びその要部の斜視図で、２は外部回路基板、５
はこの基板２の表面に形成した外部回路導体部、４はセ
ラミ・ツク基板等の誘電体基板を用いた高周波混成集積
回路一基板であり、６はこの基板４の表面に形成した集
積回路導体部である。1 and 2 are a front view and a perspective view of the main parts of an embodiment of the present invention, respectively, in which 2 is an external circuit board;
is an external circuit conductor portion formed on the surface of this substrate 2, 4 is a high frequency hybrid integrated circuit board using a dielectric substrate such as a ceramic substrate, and 6 is an integrated circuit conductor formed on the surface of this substrate 4. Department.
この実施例では高周波混成集積回路基板４の製造工程で
誘電体基板の側面スルーホール導体を形成しようとする
穴の中央部を通るブレーク溝を設け、このブレーク溝を
有する穴の内側面にスルーホール導体を設け、その後ブ
レーク溝をブレークして高周波混成集積回路基板４の側
面に、側面スルーホール導体３を構成する。この側面ス
ルーホール導体３により高周波混成集積回路基板４の表
面に形成した集積回路導体部６を、外部回路基板２の表
面に形成した外部回路導体部５に接続せしめる。In this embodiment, in the manufacturing process of the high frequency hybrid integrated circuit board 4, a break groove is provided through the center of the hole in which the through hole conductor is to be formed on the side surface of the dielectric substrate, and a through hole is formed on the inner surface of the hole having the break groove. A conductor is provided, and then the break groove is broken to form a side through hole conductor 3 on the side surface of the high frequency hybrid integrated circuit board 4. The integrated circuit conductor portion 6 formed on the surface of the high frequency hybrid integrated circuit board 4 is connected to the external circuit conductor portion 5 formed on the surface of the external circuit board 2 through the side surface through-hole conductor 3 .
このように、側基板２．４の回路導体部５．６を側面ス
ルーホール導体３で直接、接続することでインピーダン
ス不整合を防止することができる。In this way, by directly connecting the circuit conductor portions 5.6 of the side substrate 2.4 through the side through-hole conductors 3, impedance mismatching can be prevented.
上述のように本発明によれば、外部回路基板２の外部回
路導体部５に、高周波混成集積回路基板４の集積回路導
体部６を接続する構造において、高周波混成集積回路基
板４に設けた側面スルーホール導体３で接続してなるの
で、高周波混成集積回路基板４の集積回路導体部６を、
外部回路基板２の外部回路導体部５に直接接続すること
ができるので、接続用導体ピン１の寄生インダクタンス
成分によるインピーダンス不整合を防止できるばかりで
なく、接続用導体ピン１を使用することなく外部回路基
板２の上面にマイクロ波混威集積回路基板４を表面実装
できるため工程が簡単になるとともに、外部回路基板２
に接続用導体ピン１を固定および電気的に接続するため
の特別な加工が不要となり、コスト低減に対しての利点
もある。As described above, according to the present invention, in the structure in which the integrated circuit conductor part 6 of the high frequency hybrid integrated circuit board 4 is connected to the external circuit conductor part 5 of the external circuit board 2, the side surface provided on the high frequency hybrid integrated circuit board 4 Since the connection is made through the through-hole conductor 3, the integrated circuit conductor portion 6 of the high frequency hybrid integrated circuit board 4 is
Since it can be directly connected to the external circuit conductor portion 5 of the external circuit board 2, it is possible to not only prevent impedance mismatch due to the parasitic inductance component of the connecting conductor pin 1, but also to connect the external circuit without using the connecting conductor pin 1. The microwave integrated circuit board 4 can be surface-mounted on the top surface of the circuit board 2, which simplifies the process and also allows for mounting the external circuit board 2.
This eliminates the need for special processing for fixing and electrically connecting the connecting conductor pin 1 to the terminal, which also has the advantage of cost reduction.
第１図と第２図はそれぞれ本発明の実施例の構成を示す
正面図及びその要部の斜視図、第３図は従来構造の一例
の構成を示す正面図である。1 and 2 are a front view and a perspective view of essential parts, respectively, showing the structure of an embodiment of the present invention, and FIG. 3 is a front view showing the structure of an example of a conventional structure.
Claims (1)
回路基板４の集積回路導体部６を接続する構造において
、高周波混成集積回路基板４に設けた側面スルーホール
導体３で接続してなる高周波混成集積回路基板の接続端
子。In a structure in which the integrated circuit conductor portion 6 of the high frequency hybrid integrated circuit board 4 is connected to the external circuit conductor portion 5 of the external circuit board 2, the high frequency Connection terminal for hybrid integrated circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2059159A JPH03261192A (en) | 1990-03-09 | 1990-03-09 | Connecting terminal of high frequency hybrid integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2059159A JPH03261192A (en) | 1990-03-09 | 1990-03-09 | Connecting terminal of high frequency hybrid integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03261192A true JPH03261192A (en) | 1991-11-21 |
Family
ID=13105309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2059159A Pending JPH03261192A (en) | 1990-03-09 | 1990-03-09 | Connecting terminal of high frequency hybrid integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03261192A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670270U (en) * | 1993-03-04 | 1994-09-30 | 太陽誘電株式会社 | Hybrid integrated circuit device |
-
1990
- 1990-03-09 JP JP2059159A patent/JPH03261192A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670270U (en) * | 1993-03-04 | 1994-09-30 | 太陽誘電株式会社 | Hybrid integrated circuit device |
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