JPH05335695A - Single in-line module - Google Patents

Abstract

PURPOSE:To increase the part mounting density of an electronic device by increasing the number of connecting terminals and parts mounting area of a single in-line module without increasing the external size of a board. CONSTITUTION:Semiconductor elements are mounted on both the surface and rear of a flexible board 1 provided with connection terminals 2 and insulating members 4 are stuck between the terminals 2 and board 1. Since parts can be mounted on internal side faces of the board 1 and the terminals 2 can be electrically separated from each other on both the surface and rear of the board 1, the numbers of connection terminals and mounted parts can be doubled without increasing the external size of the board 1 from that of the conventional board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single in-line module, and more particularly to a single in-line module having a structure suitable for high density mounting on electronic devices.

[0002]

2. Description of the Related Art An example of a conventional single in-line module (hereinafter referred to as a module) is shown in FIG. Figure 5
In this module, the thickness is, for example, 1.
Components such as the semiconductor element 3 and a chip capacitor (not shown) are mounted on the front surface 5A and the back surface 5B of the 27 mm glass epoxy substrate 5. Electric signals and power are supplied to the semiconductor element 3 via connection terminals 2A and 2B provided on the front surface 5A and the back surface 5B of one side of the substrate 5. The connection terminals 2A and 2B are arranged at symmetrical positions with the substrate 5 sandwiched therebetween, and are electrically connected by the through holes 6.

[0003]

In the conventional module described above, the component mounting portion has the front surface 5A and the back surface 5 of the substrate 5.
Since it is limited to B, if the number of mounted components is increased in order to make the module highly functional, the outer dimensions of the substrate 5 must be necessarily increased. As a result, it has been difficult to satisfy the demands for downsizing and high functionality of electronic devices which have become stronger and stronger in recent years, and this has hindered the expansion of the applicable range.

The present invention has been made in view of the problems of the conventional module as described above, and it is possible to mount a large number of components on a board of the same size as compared with the conventional module. Provide a high-performance module suitable for high-density mounting, with a structure that can cope with the increase in the number of mounted components and the increase in the number of electrical signals and power supplies even if the supply of electric signals and power supply increases The purpose is to

[0005]

A single in-line module of the present invention is provided with a plurality of connection terminals along each of two opposite sides of one surface, and at least one of the one surface and the other surface. A bendable insulating flexible substrate having components mounted on three or more surfaces is bent so that the two sides correspond and the connection terminals are exposed, and the surfaces facing each other are provided with the connection terminals. Is characterized by being integrated by sandwiching an insulating member.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a 30-pin type module according to a first embodiment of the present invention before formation. FIG. 2A is a plan view after formation. Also, FIG. 2 (b)
[FIG. 3] is a cross-sectional view after formation. Referring to FIGS. 1, 2 (a) and 2 (b), the present embodiment is made as follows. First, the connection terminals 2 are formed on the two parallel sides of the flexible substrate 1. Next, the semiconductor element 3 is mounted on the front surface and the back surface of the flexible substrate 1. After that, the insulating member 4 is sandwiched on the back surface of the connection terminal portion of the flexible substrate 1 by being bent from the bent portion 7 and bonded with an adhesive. In this embodiment, the semiconductor element 3 is also mounted on the inner surface of the bent flexible substrate 1. Therefore, the mounting area is twice as large as that of the conventional module. Also, the number of connection terminals 2 can be doubled.

Next, a second embodiment of the present invention will be described. FIG. 3 is a plan view of the 30-pin type module of the second embodiment of the present invention before formation. FIG. 4A is a plan view after formation. FIG. 4B is a sectional view after formation. Referring to FIGS. 3, 4A and 4B, in the present embodiment, the connection terminals 2 are formed on two parallel sides of the flexible substrate 1, and the semiconductor element 3 is provided only on the back surface of the flexible substrate 1. Mount. After that, the insulating member 4 is sandwiched on the back surface of the connection terminal portion of the flexible substrate 1 by being bent from the bent portion 7 and bonded with an adhesive. In this embodiment, all the semiconductor elements 3 are mounted on the inner surface of the substrate, and therefore, when mounted on the electronic device, they are not short-circuited with other parts.

[0008]

As described above, according to the present invention, the connection terminals used for input / output of electric signals and power supply are provided on the front surface and the back surface of the substrate, and the front and back surfaces are electrically separated from each other. In addition, by adopting a structure in which components are mounted also on the inner surface of a substrate that is bent using a flexible substrate, it is possible to increase the number of connection terminals and the mounting area of components with the same external dimensions of the conventional substrate. Has the effect.

[Brief description of drawings]

FIG. 1 is a plan view showing a state after a component mounting process according to a first embodiment of the present invention.

FIG. 2A is a plan view after completion of the first embodiment of the present invention. Diagram (b) is a cross-sectional view of diagram (a).

FIG. 3 is a plan view showing a state after a component mounting step according to a second embodiment of the present invention.

FIG. 4A is a plan view of a second embodiment of the present invention after completion. Diagram (b) is a cross-sectional view of diagram (a).

FIG. 5 is a top view and a bottom view of an example of a conventional single in-line module.

[Explanation of symbols]

 1 flexible substrate 2, 2A, 2B connection terminal 3 semiconductor element 4 insulating member 5 substrate 5A front surface 5B back surface 6 through hole 7 bent portion

Claims (1)

[Claims] 1. A bendable device, wherein a plurality of connecting terminals are provided along each of two opposite sides of one surface, and parts are mounted on at least one surface of the one surface and the other surface. Insulating flexible substrate is bent so that the two sides correspond and the connection terminals are exposed, and the surfaces facing the portion where the connection terminals are provided are integrated by sandwiching an insulating member. A single in-line module featuring.