JPH02134890A - Circuit element mounting board - Google Patents
Circuit element mounting boardInfo
- Publication number
- JPH02134890A JPH02134890A JP28937588A JP28937588A JPH02134890A JP H02134890 A JPH02134890 A JP H02134890A JP 28937588 A JP28937588 A JP 28937588A JP 28937588 A JP28937588 A JP 28937588A JP H02134890 A JPH02134890 A JP H02134890A
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit element
- mounting
- electrode
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、フレキシブルディスク装置などの回路素子
実装基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit element mounting board such as a flexible disk device.
従来のこの種の回路素子を実装した基板を第９図に示し
、その詳細について説明する。A conventional board on which this type of circuit element is mounted is shown in FIG. 9, and its details will be explained.
第９図は、ＩＯの面実装方式を表している。（１）はフ
レキシブルディスク装置などの電子部品を搭載するプリ
ント基板であり、その表面には部品を半田付けするため
の電極（２）が施されている。また。FIG. 9 shows an IO surface mounting method. (1) is a printed circuit board on which electronic components such as a flexible disk device are mounted, and electrodes (2) for soldering the components are provided on the surface thereof. Also.
（３）は面実装式ＩＣであシ、ＩＣからは上記電極（２
）とＩＣ内部に電気信号を伝えるためのリード線（５）
が出されている。(3) is a surface-mounted IC, and the above electrode (2) is connected to the IC from the IC.
) and lead wires (5) for transmitting electrical signals inside the IC.
is being served.
次に、方法について説明する。Next, the method will be explained.
プリント基板ｔ１）の表面上にある電極（２）には、あ
らかじめクリーム状の半田（４）が付着されている。Cream-like solder (4) is attached in advance to the electrode (2) on the surface of the printed circuit board t1).
面実装式ＩＣ！（３）はリード線（５）を、プリント基
板（１）の電極（２）に合わせ、接着剤などでプリント
基板＋１１の表面に固定する。装着終了後、プリント基
板（１）を加熱し、クリーム状の半田（４）を溶融させ
ることによシ半田付けが行なわれる。Surface mount IC! (3) Align the lead wire (5) with the electrode (2) of the printed circuit board (1) and fix it to the surface of the printed circuit board +11 with adhesive or the like. After the mounting is completed, soldering is performed by heating the printed circuit board (1) and melting the creamy solder (4).
従来の回路素子実装基板は以上のように構成されている
ので１回路素子が実装された部分の実装基板の高さはプ
リント基板の厚さと工Ｃ部品などの回路素子の高さで決
まってしまい、フレキシブルディスク装置など、構造上
、プリント基板に実装されるＩＣなどの回路素子の高さ
に制限があシ。Conventional circuit element mounting boards are constructed as described above, so the height of the mounting board where one circuit element is mounted is determined by the thickness of the printed circuit board and the height of circuit elements such as engineering C components. Due to the structure of devices such as , flexible disk devices, etc., there are restrictions on the height of circuit elements such as ICs mounted on printed circuit boards.
その高さの制限を越えるＩＣなどの回路素子を実装する
場合は、フレキシブルディスク装置などの装置の構造の
変更をしたシ、ＩＣなどの回路素子の実装場所の移動を
したり９部品の配置が制限されるので、フレキシブルデ
ィスク装置などの小型化、薄型化ができないなどの問題
点があった。If you want to mount a circuit element such as an IC that exceeds the height limit, you may need to change the structure of the device such as a flexible disk drive, move the mounting location of the IC or other circuit element, or change the arrangement of the 9 parts. Because of the limitations, there were problems such as making it impossible to make flexible disk devices smaller and thinner.
この発明は上記のような問題点を解消するためになされ
たもので２回路素子が実装される部分の高さを低くする
ことができ、装置が小型化、薄型化できる回路素子実装
基板を得ることを目的とする。This invention was made to solve the above-mentioned problems, and provides a circuit element mounting board that can reduce the height of the part on which two circuit elements are mounted, thereby making the device smaller and thinner. The purpose is to
この発明に係る回路素子実装基板は、プリント基板の回
路素子の実装場所に基板切取部を設け。In the circuit element mounting board according to the present invention, a board cutout is provided at a mounting location of the circuit element on the printed circuit board.
そこに回路素子の少なくとも一部の胴部を配置し。A body of at least a portion of the circuit element is disposed therein.
基板切取部の近傍に設けられたプリント基板上の電極と
回路素子の電極線を接合するようにしたものである。The electrodes on the printed circuit board provided near the cut-out portion of the circuit board are connected to the electrode wires of the circuit elements.
この発明における回路素子実装基板は、プリント基板の
基板切取部に回路素子を実装することにより１部品高さ
が基板の厚みに吸収され９回路素子の取シ付は部分の高
さを低くすることができる。In the circuit element mounting board according to the present invention, the height of one component is absorbed by the thickness of the board by mounting the circuit element on the cutout part of the printed circuit board, and the height of the part is lowered by mounting the nine circuit elements. Can be done.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、（１）は７レキシプルデイスク装置の
電子部品を搭載するプリント基板であ９１面実装用ＩＣ
（３）を従来の向きとは、上下反対の方向に実装するだ
めの基板切取加工が施されている。In Figure 1, (1) is a printed circuit board on which the electronic components of the 7-lexiple disk device are mounted, and the 91-sided mounting IC.
(3) The board is cut out so that it can be mounted in the opposite direction from the conventional orientation.
そして、切取部近傍の基板表面には１部品を半田付けす
るための成極（２）が施されている。またＩＣからは、
上記電極（２）とＩＣ内部に電気信号を伝えるためのリ
ード線（５）が出されている。Polarization (2) for soldering one component is applied to the surface of the board near the cutout. Also, from the IC,
Lead wires (5) for transmitting electrical signals between the electrodes (2) and the inside of the IC are extended.
プリント基板＋１１には１面実装用ｘｃ（３１を従来の
向きとは上下反対の方向に実装するための切取加工を施
す。この加工においてはリード線（５）の一部がプリン
ト基板＋１１の表面上の１極（２）に接触し、リード線
（５）と電極（２）が安定した半田付けができるように
する。上記プリント基板（１１の切取加工部に。The printed circuit board +11 is cut out in order to mount the xc (31) for one-sided mounting in the vertically opposite direction to the conventional direction.In this process, a part of the lead wire (5) Make contact with the upper pole (2) so that the lead wire (5) and electrode (2) can be stably soldered.
面実装用ＩＣを従来の方向とは上下反対の方向にリード
線（５）と成極（２）の位置を合せて装着する。この時
、電極（２）は、従来の実装法で接触する部分とは反対
のリード線（５ンの裏側で接触し半田付けされる。ここ
で半田付けの方法は特に定めない。The surface-mount IC is mounted in a direction vertically opposite to the conventional direction, with the lead wires (5) and polarization (2) aligned. At this time, the electrode (2) is contacted and soldered on the back side of the lead wire (5), which is opposite to the part that contacts in the conventional mounting method.The method of soldering is not particularly defined here.
なお、上記実施例では０面実装式ＩＣの実装法について
だけであったが、第２図（ａ）に示すように。In the above embodiment, only the mounting method of a zero-surface mounting type IC was described, but as shown in FIG. 2(a).
挿入実装式ＩＣ＋６１のリード線（５）を外側に約９０
”折り曲げることにより、上記実施例と同様に実装を行
えば、第２図（ｂ）に示すように、挿入実装式ＩＣにも
同様の効果を奏する。Connect the lead wire (5) of the insertion mounting type IC+61 to the outside by approximately 90
``If the mounting is carried out by bending in the same manner as in the above embodiment, the same effect can be obtained for an insertion-mount IC as shown in FIG. 2(b).
また、上記実施例では、ＩＣの場合を説明したが、コン
デンサ、抵抗、トランジスタ、ダイオード、Ｉ８工、ｖ
ｈｓ工などの他の回路素子であってもよい。In addition, in the above embodiment, the case of IC was explained, but capacitors, resistors, transistors, diodes, I8 parts, v
Other circuit elements such as HSS may also be used.
また、上記実施例では、電極はプリント基板の一方の面
にある場合を示したが、第３図、第４図。Further, in the above embodiment, the electrodes were placed on one side of the printed circuit board, but FIGS. 3 and 4.
第５図に示すように９両面にあってもよい。As shown in FIG. 5, there may be nine sides.
また、プリント基板の基板切取部は２ｇ６図に示すよう
な基板の一辺に対して凹部を形成したものでもよいし、
第１図に示すように孔としたものでもよい。また第８図
に示すように、プリント基板に設けた底のある穴でもよ
い。Further, the cutout portion of the printed circuit board may have a recess formed on one side of the board as shown in Fig. 2g6, or
It may also be a hole as shown in FIG. Alternatively, as shown in FIG. 8, it may be a hole with a bottom provided in a printed circuit board.
以上のように、この発明によれば９回路素子実装基板の
プリント基板に、基板切取部を設け、その切取部に９回
路素子の胴部を実装するようにしたため９回路素子を取
９つけた部分の基板の高さを低くすることができ、装置
の小型化、薄型化が図れるという効果がある。As described above, according to the present invention, the printed circuit board of the 9-circuit element mounting board is provided with a board cut-out part, and the bodies of the 9-circuit elements are mounted in the cut-out part, so that 9 9-circuit elements are mounted. This has the effect that the height of the partial substrate can be lowered, and the device can be made smaller and thinner.
第１図はこの発明の一実施例を示す図、第２図。
第３図、第４図、第５図、第６図、第１図、第８図はこ
の発明の他の実施例を示す図、第９図は従来の回路素子
実装基板の一実施例を示す図である。
（１）・・・プリント基板、（２ト・・電極、（３ト・
・面実装用Ｘａ。
（４）・・・はんだ、（５）・・・リード線、（６）・
・・挿入実装式１Ｃ０図中、同−符号は同一、または相
当部分を示す。FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing an embodiment of the present invention. 3, 4, 5, 6, 1, and 8 show other embodiments of the present invention, and FIG. 9 shows an embodiment of a conventional circuit element mounting board. FIG. (1)...Printed circuit board, (2 pieces...electrode, (3 pieces...
・Xa for surface mounting. (4)...Solder, (5)...Lead wire, (6)...
...Insertion mounting type 1C0 In the drawings, the same reference numerals indicate the same or equivalent parts.
Claims (1)
板切取部。 （ｃ） 基板切取部の近傍に設けられ回路素子の電極線
の端部を接合する電極。[Scope of Claims] A circuit element mounting board having the following elements: (a) a circuit element having a body and an electrode wire; (b) a board cut-out portion on which at least a part of the body of the circuit element is disposed. (c) An electrode that is provided near the substrate cutout and connects the ends of the electrode wires of the circuit element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28937588A JPH02134890A (en) | 1988-11-16 | 1988-11-16 | Circuit element mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28937588A JPH02134890A (en) | 1988-11-16 | 1988-11-16 | Circuit element mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02134890A true JPH02134890A (en) | 1990-05-23 |
Family
ID=17742396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28937588A Pending JPH02134890A (en) | 1988-11-16 | 1988-11-16 | Circuit element mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02134890A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0586069A2 (en) * | 1992-09-01 | 1994-03-09 | Samsung Electronics Co., Ltd. | Memory module and packing method |
| WO1996022671A1 (en) * | 1995-01-20 | 1996-07-25 | Minnesota Mining And Manufacturing Company | Electronic circuit structure |
| US5943216A (en) * | 1997-06-03 | 1999-08-24 | Photo Opto Electronic Technologies | Apparatus for providing a two-sided, cavity, inverted-mounted component circuit board |
| US6777798B2 (en) | 2001-02-05 | 2004-08-17 | Renesas Technology Corp. | Stacked semiconductor device structure |
| EP1701599A1 (en) * | 2005-03-10 | 2006-09-13 | Optium Care International Tech. Inc. | Circuit board for hiding electronic components |
| EP2932807A1 (en) * | 2012-12-11 | 2015-10-21 | Telefonaktiebolaget L M Ericsson (Publ) | A power module |
| DE112015007224B4 (en) | 2015-12-23 | 2022-06-30 | Intel Corporation | Reverse Mounted Gull-Wing Electronics Housing |
-
1988
- 1988-11-16 JP JP28937588A patent/JPH02134890A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0586069A2 (en) * | 1992-09-01 | 1994-03-09 | Samsung Electronics Co., Ltd. | Memory module and packing method |
| EP0586069A3 (en) * | 1992-09-01 | 1997-01-08 | Samsung Electronics Co Ltd | Memory module and packing method |
| WO1996022671A1 (en) * | 1995-01-20 | 1996-07-25 | Minnesota Mining And Manufacturing Company | Electronic circuit structure |
| US5631807A (en) * | 1995-01-20 | 1997-05-20 | Minnesota Mining And Manufacturing Company | Electronic circuit structure with aperture suspended component |
| US5689600A (en) * | 1995-01-20 | 1997-11-18 | Minnesota Mining And Manufacturing Company | Electronic circuit structure |
| US5943216A (en) * | 1997-06-03 | 1999-08-24 | Photo Opto Electronic Technologies | Apparatus for providing a two-sided, cavity, inverted-mounted component circuit board |
| US6777798B2 (en) | 2001-02-05 | 2004-08-17 | Renesas Technology Corp. | Stacked semiconductor device structure |
| EP1701599A1 (en) * | 2005-03-10 | 2006-09-13 | Optium Care International Tech. Inc. | Circuit board for hiding electronic components |
| EP2932807A1 (en) * | 2012-12-11 | 2015-10-21 | Telefonaktiebolaget L M Ericsson (Publ) | A power module |
| JP2016501449A (en) * | 2012-12-11 | 2016-01-18 | テレフオンアクチーボラゲット エル エム エリクソン（パブル） | Power module |
| US9743520B2 (en) | 2012-12-11 | 2017-08-22 | Telefonaktiebolaget Lm Ericsson (Publ) | Power module |
| DE112015007224B4 (en) | 2015-12-23 | 2022-06-30 | Intel Corporation | Reverse Mounted Gull-Wing Electronics Housing |
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