JPH0430785Y2 - - Google Patents
Info
- Publication number
- JPH0430785Y2 JPH0430785Y2 JP1986105439U JP10543986U JPH0430785Y2 JP H0430785 Y2 JPH0430785 Y2 JP H0430785Y2 JP 1986105439 U JP1986105439 U JP 1986105439U JP 10543986 U JP10543986 U JP 10543986U JP H0430785 Y2 JPH0430785 Y2 JP H0430785Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- terminal
- metal pieces
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、シールドケースの中に回路基板を
収納すると共に、同ケースに貫通端子を設けたモ
ジユールに関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a module in which a circuit board is housed in a shield case and a through terminal is provided in the case.
一般に、高い周波数で動作するモジユールは、
不要な輻射を防ぐため、回路基板をシールドケー
スの中に収納する必要がある。この種のモジユー
ルでは、上記回路基板に形成された電子回路を、
シールドケースに設けた貫通端子を介して外部の
回路と接続する。
In general, modules operating at high frequencies are
To prevent unnecessary radiation, the circuit board must be housed in a shield case. In this type of module, the electronic circuit formed on the circuit board is
Connect to external circuits via through-hole terminals provided in the shield case.
この具体的な構成は、一般に第５図と第６図に
示す通りである。即ち、箱型のシールドケース１
の端面等に、必要な数の細い棒状の貫通端子４，
４…を、絶縁状態または一部導通状態で貫通させ
ると共に、同ケース１の中に回路基板３を設置す
る。そして、この回路基板３に形成された端子接
続用電極５，５…にリード線６，６…の一端を半
田付けし、さらにこの他端を上記貫通端子４，４
…の端部に巻き付け、これを半田付けする。 This specific configuration is generally as shown in FIGS. 5 and 6. That is, box-shaped shield case 1
Attach the required number of thin rod-shaped through terminals 4 to the end surface of the
4 are passed through in an insulated or partially conductive state, and the circuit board 3 is installed in the case 1. One end of the lead wires 6, 6... is soldered to the terminal connection electrodes 5, 5... formed on the circuit board 3, and the other end is soldered to the terminal connection electrodes 5, 5... formed on the circuit board 3.
Wrap it around the end of ... and solder it.
しかし、上記従来のモジユールでは、次のよう
な欠点があつた。 However, the conventional module described above has the following drawbacks.
第一に、細いリード線６，６…を端子接続用電
極５，５…に半田付けし、さらにこれを貫通端子
４，４…に巻き付け、もう一度半田付けしなけれ
ばならないため、貫通端子４，４…と端子接続用
電極５，５…との接続が極めて面倒である。 First, the thin lead wires 6, 6... must be soldered to the terminal connection electrodes 5, 5..., then wrapped around the through terminals 4, 4, and soldered again. 4... and the terminal connection electrodes 5, 5... are extremely troublesome to connect.
第二に、リード線６，６…を貫通端子４，４…
の端部に巻き付けるために、端子電極４，４…の
周囲に或る程度のスペースをとつておかなければ
ならず、また、端子電極４，４…と端子接続用電
極５，５…との間に或る程度の距離をおかなけれ
ばならない。このため、モジユールの小型化が図
りにくい。 Second, connect the lead wires 6, 6... to the through terminals 4, 4...
In order to wrap around the ends of the terminal electrodes 4, 4..., it is necessary to leave a certain amount of space around the terminal electrodes 4, 4... and the terminal electrodes 4, 4... and the terminal connection electrodes 5, 5... There must be some distance between them. Therefore, it is difficult to downsize the module.
第三に、リード線６，６…の長さが、貫通端子
４，４…毎にまちまちとなつて、そのインダクタ
ンスに違いが生じやすい。このため、各貫通端子
４，４…毎、或いは各モジユール毎の回路特性に
ばらつきが生じる。 Thirdly, the lengths of the lead wires 6, 6, etc. vary depending on the through terminals 4, 4, etc., which tends to cause differences in their inductances. For this reason, variations occur in the circuit characteristics for each through terminal 4, 4, . . . or for each module.
そこで例えば、第３図や第４図に示すように、
基板１３の端子接続用電極１５，１５…から弾性
を有する金属片１６，１６…を立ち上がらせ、そ
の弾力でシールドケース１１に貫通させた貫通端
子１４，１４…に金属片１６，１６…の自由端１
７，１７…側を押し当てたものもある。 For example, as shown in Figures 3 and 4,
Elastic metal pieces 16, 16... are made to stand up from the terminal connection electrodes 15, 15... of the board 13, and the metal pieces 16, 16... are made to freely pass through the through-hole terminals 14, 14... that are penetrated through the shield case 11 by their elasticity. Edge 1
There is also one with the 7, 17... side pressed against it.
これによれば、前記従来技術の問題点を解消す
ることができる。 According to this, the problems of the prior art described above can be solved.
しかしながら、貫通端子１４，１４…に金属片
１６，１６…の自由端１７，１７…側を単に押し
当てただけのものでは、金属片１６，１６…の曲
がりの変化等により、その弾力が貫通端子１４，
１４…側に充分作用しない場合、貫通端子１４，
１４…と金属片１６，１６…の自由端１７，１７
…とが離れ、充分な電気的な接続が得られないこ
とがある。この結果、接触不良等が生じ、信頼性
に乏しいという課題があつた。
However, if the free ends 17, 17... of the metal pieces 16, 16... are simply pressed against the penetrating terminals 14, 14..., the elasticity of the metal pieces 16, 16... may be reduced due to changes in the bending of the metal pieces 16, 16... terminal 14,
14... side, if the through terminal 14,
14... and free ends 17, 17 of metal pieces 16, 16...
... may become separated and a sufficient electrical connection may not be obtained. As a result, problems such as poor contact occurred, resulting in poor reliability.
この考案は、従来の貫通端子を有するモジユー
ルにおける上記の問題点を解決するためなされた
もので、貫通端子と端子接続用電極との接続が確
実に行なわれるモジユールを提供することを目的
とする。 This invention was devised to solve the above-mentioned problems in conventional modules having through-hole terminals, and aims to provide a module in which the connection between the through-hole terminals and terminal connection electrodes can be reliably made.
この考案の構成を、図面の符号を引用しながら
説明すると、本考案によるモジユールは、シール
ドケース１１の中に回路基板１３を収納し、同ケ
ース１１に貫通させた貫通端子１４，１４…に、
回路基板１３の端子接続用電極１５，１５…を接
続したものにおいて、回路基板１３の端子接続用
電極１５，１５…から弾性を有する金属片１６，
１６…を立ち上がらせ、この自由端１７，１７…
側に貫通孔２４を形成し、該貫通孔２４に貫通端
子１４，１４…を嵌め込み、金属片１６，１６…
の弾力で前記貫通孔２４の内周面を貫通端子１
４，１４…の周面に押し当ててなることを特徴と
している。
The structure of this invention will be described with reference to the reference numerals in the drawings. The module according to the invention houses a circuit board 13 in a shield case 11, and has through-hole terminals 14, 14, . . . penetrated through the case 11.
In the circuit board 13 in which the terminal connection electrodes 15, 15... are connected, the elastic metal pieces 16,
16... stand up, and this free end 17, 17...
A through hole 24 is formed on the side, the through terminals 14, 14... are fitted into the through hole 24, and the metal pieces 16, 16...
The inner peripheral surface of the through hole 24 is pushed through the through terminal 1 by the elasticity of the through hole 24.
It is characterized in that it is pressed against the circumferential surface of 4, 14, . . . .
上記モジユールでは、金属片１６，１６…の自
由端１７に貫通孔２４を形成し、これに貫通端子
１４，１４…を嵌め込み、金属片１６，１６…の
弾力で前記貫通孔２４の内周面を貫通端子１４，
１４…の周面に押し当てているため、金属片１
６，１６…の曲がり具合いに多少のばらつきがあ
つても、金属片１６，１６…と貫通端子１４，１
４…との接触位置が貫通端子１４，１４…の長手
方向に多少ずれるだけで、確実な接続が図れる。
In the above module, the through hole 24 is formed in the free end 17 of the metal pieces 16, 16..., the through terminals 14, 14... are fitted into the through hole 24, and the inner peripheral surface of the through hole 24 is pushed by the elasticity of the metal pieces 16, 16... through the terminal 14,
Since it is pressed against the circumferential surface of 14..., metal piece 1
Even if there is some variation in the degree of bending of the metal pieces 16, 16... and the through terminals 14, 1.
A reliable connection can be achieved by only slightly shifting the contact position with the through terminals 14, 14... in the longitudinal direction of the through terminals 14, 14....
さらに、金属片１６，１６…の貫通孔２４に貫
通端子１４，１４を嵌め込み、同貫通孔２４の内
周面を貫通端子１４，１４の周面に押し当ててい
るので、貫通端子１４，１４は、前記貫通孔２４
の周面に囲まれたその全周何れの部分でも金属片
１６，１６…に接触が可能であり、確実な接続が
できる。 Further, the through terminals 14, 14 are fitted into the through holes 24 of the metal pieces 16, 16..., and the inner peripheral surfaces of the through holes 24 are pressed against the peripheral surfaces of the through terminals 14, 14, so that the through terminals 14, 14 is the through hole 24
The metal pieces 16, 16, .
次に、図面を参照しながら、この考案の実施例
と望ましい実施態様について説明する。
Next, examples and preferred embodiments of this invention will be described with reference to the drawings.
第１図で示すように、シールドケース１１は金
属製の箱形の本体２０と蓋体２１とからる。この
本体２０の端面には、複数の貫通端子１４，１４
…が一部を除いて絶縁体２２，２２…によつてシ
ールドケース１１に対して絶縁された状態で貫通
している。 As shown in FIG. 1, the shield case 11 includes a metal box-shaped main body 20 and a lid 21. As shown in FIG. A plurality of through terminals 14, 14 are provided on the end surface of the main body 20.
. . . penetrates through the shield case 11 while being insulated by the insulators 22, 22 .
一方、シールドケース１１に回路基板１３が収
納され、これが同ケース１１の本体２０の底部に
導電性接着剤等で固定されている。この回路基板
１３は、例えば、アルミナ基板や樹脂基板に回路
を印刷したもの、或いはこれらを複数枚積層して
作られたもので、上面に半導体チツプやコンデン
サ等の電子部品２３，２３…が搭載されている。
この回路基板１３の貫通端子１４，１４…に近い
端縁側に、各々貫通端子１４，１４…に対応させ
て端子接続用電極１５，１５…が設けられ、これ
から金属片１６，１６…がそれぞれ立ち上がつて
いる。 On the other hand, a circuit board 13 is housed in the shield case 11, and is fixed to the bottom of the main body 20 of the case 11 with a conductive adhesive or the like. This circuit board 13 is made by, for example, printing a circuit on an alumina board or a resin board, or by laminating a plurality of these boards, and has electronic components 23, 23, etc. such as semiconductor chips and capacitors mounted on the top surface. has been done.
Terminal connection electrodes 15, 15... are provided on the edge side of the circuit board 13 near the through terminals 14, 14... in correspondence with the penetration terminals 14, 14..., respectively, and metal pieces 16, 16... stand from these, respectively. It's rising.
この金属片１６，１６…は、例えば第２図〜第
４図で示すような形状をした弾性のある金属板か
らなり、その基端１８側が半田付、熔接等の手段
によつて、端子接続用電極１５，１５…に導電固
着されている。同金属片１６，１６…の自由端１
７側は、シールドケース１１の中の貫通端子１
４，１４…の端部に押し当てられている。 These metal pieces 16, 16... are made of elastic metal plates shaped as shown in FIGS. 2 to 4, for example, and their base ends 18 are connected to terminals by means of soldering, welding, etc. The electrodes 15, 15, . . . are conductively fixed. Free end 1 of the metal pieces 16, 16...
7 side is the through terminal 1 inside the shield case 11
4, 14... are pressed against the ends.
第２図で示した金属片１６，１６…は、側面が
ほゞＬ字形を呈した金属板からなり、その自由端
１７に貫通孔２４が開設され、同貫通孔２４に貫
通端子１４，１４…の端部が嵌合し、通されると
共に、同端子１４、１４…の周面に下から上記貫
通孔２４の周面下辺部が押し当てられている。ま
た、第４図で示した金属片１６，１６…は、自由
端１７がほゞＹ字形を呈するよう形成され、この
自由端１７の中央に凹部２４′が形成されている。
そして、この凹部２４′に上記貫通端子１４，１
４…が嵌め込まれ、その周辺に下から金属片１
６，１６…の凹部２４′の下周面が押し当てられ
ている。 The metal pieces 16, 16, . . . shown in FIG. The ends of the terminals 14, 14, . Furthermore, the metal pieces 16, 16, . . . shown in FIG. 4 are formed so that their free ends 17 are substantially Y-shaped, and a recess 24' is formed in the center of the free ends 17.
The through terminals 14, 1 are placed in this recess 24'.
4... is inserted, and around it there is a metal piece 1 from below.
The lower peripheral surfaces of the recesses 24' of 6, 16, . . . are pressed against each other.
なお、金属片１６，１６…には、その基端１８
と自由端１７との間の一個所以上に屈曲部１９を
形成するとよく、これによつて金属片１６，１６
…にいわゆるコシが与えられ、金属片１６，１６
…の弾力が貫通端子１４，１４…との接触に有効
に作用する。 Note that the metal pieces 16, 16... have their base ends 18
It is preferable to form a bent portion 19 at one or more places between the free end 17 and the metal pieces 16, 16.
... is given so-called stiffness, and the metal pieces 16, 16
The elasticity of... effectively acts on the contact with the through terminals 14, 14....
〔考案の効果〕
以上説明した通り、この考案によれば、金属片
１６，１６…の自由端１７と貫通端子１４，１４
…との確実な接続が図れ、信頼性の高い回路モジ
ユールが提供できる効果がある。[Effect of the invention] As explained above, according to this invention, the free ends 17 of the metal pieces 16, 16... and the through terminals 14, 14
It has the effect of providing a highly reliable circuit module by making a reliable connection with...
第１図は、この考案の実施例を示すシールドケ
ースの一部を切り開いた斜視図、第２図は、同実
施例の要部斜視図、第３図は、従来例を示す貫通
端子部分の要部斜視図、第４図は、他の従来例を
示す貫通端子部分の要部斜視図、第５図は、貫通
端子を有するモジユールの従来例を示すシールド
ケースの一部を切り開いた斜視図、第６図は、同
従来例の要部縦断側面図である。
１１……シールドケース、１３……回路基板、
１４……貫通端子、１５……端子接続用電極、１
６……金属片、１７……金属片の自由端、１８…
…金属片の基端、１９……金属片の屈曲部。
Fig. 1 is a partially cutaway perspective view of a shield case showing an embodiment of this invention, Fig. 2 is a perspective view of the main part of the same embodiment, and Fig. 3 is a through terminal portion showing a conventional example. FIG. 4 is a perspective view of a main part of a through terminal portion showing another conventional example, and FIG. 5 is a perspective view of a shield case partially cut away showing a conventional example of a module having a through terminal. , FIG. 6 is a vertical sectional side view of the main part of the conventional example. 11... Shield case, 13... Circuit board,
14...Through terminal, 15...Terminal connection electrode, 1
6...Metal piece, 17...Free end of metal piece, 18...
... Base end of the metal piece, 19... Bent part of the metal piece.
Claims (1)
納し、同ケース１１に貫通させた貫通端子１
４，１４…に、回路基板１３の端子接続用電極
１５，１５…を接続したモジユールにおいて、
回路基板１３の端子接続用電極１５，１５…か
ら弾性を有する金属片１６，１６…を立ち上が
らせ、この自由端１７，１７…側に貫通孔２４
を形成し、該貫通孔２４に貫通端子１４，１４
を嵌め込み、金属片１６，１６…の弾力で前記
貫通孔２４の内周面を貫通端子１４，１４の周
面に押し当ててなることを特徴とする貫通端子
を有するモジユール。 ２ 金属片１６が、その基端１８と自由端１７の
間に屈曲部１９を有する実用新案登録請求の範
囲第１項記載の貫通端子を有するモジユール。[Claims for Utility Model Registration] 1. A through terminal 1 in which a circuit board 13 is housed in a shield case 11 and penetrated through the case 11.
4, 14... in a module in which terminal connection electrodes 15, 15... of the circuit board 13 are connected,
Elastic metal pieces 16, 16... are raised from the terminal connection electrodes 15, 15... of the circuit board 13, and through holes 24 are formed on the free ends 17, 17... side.
are formed in the through hole 24, and the through terminals 14, 14 are formed in the through hole 24.
A module having a through terminal, characterized in that the inner circumferential surface of the through hole 24 is pressed against the circumferential surface of the through terminals 14, 14 by the elasticity of the metal pieces 16, 16. 2. A module having a through terminal according to claim 1, in which the metal piece 16 has a bent portion 19 between its base end 18 and free end 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105439U JPH0430785Y2 (en) | 1986-07-09 | 1986-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105439U JPH0430785Y2 (en) | 1986-07-09 | 1986-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6312162U JPS6312162U (en) | 1988-01-26 |
| JPH0430785Y2 true JPH0430785Y2 (en) | 1992-07-24 |
Family
ID=30979873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986105439U Expired JPH0430785Y2 (en) | 1986-07-09 | 1986-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430785Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317761A (en) * | 1976-07-31 | 1978-02-18 | Japan Electronic Control Syst | Apparatus for combining potentiometer contacts of air flowmeter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56165370U (en) * | 1980-05-12 | 1981-12-08 |
-
1986
- 1986-07-09 JP JP1986105439U patent/JPH0430785Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317761A (en) * | 1976-07-31 | 1978-02-18 | Japan Electronic Control Syst | Apparatus for combining potentiometer contacts of air flowmeter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6312162U (en) | 1988-01-26 |
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| JPS61183994A (en) | Printed circuit board for camera |