JPH0217873U - - Google Patents
Info
- Publication number
- JPH0217873U JPH0217873U JP9465388U JP9465388U JPH0217873U JP H0217873 U JPH0217873 U JP H0217873U JP 9465388 U JP9465388 U JP 9465388U JP 9465388 U JP9465388 U JP 9465388U JP H0217873 U JPH0217873 U JP H0217873U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- main printed
- sub
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図はこの考案における電気回路部品の取付
け装置の１実施例を示す側面図、第２図は第１図
の平面図、第３図、第４図および第５図はこの考
案の他の実施例を示す斜視図、第６図および第７
図は従来の取付け装置を示す側面図である。
１…取付け板、２…折曲げ部、３…ねじ、４…
ねじ、５…主プリント回路基板、６…副プリント
回路基板、７…電気回路部品、８…リード端子、
９…リード線、１０…半田、１１…切込み部、１
２…薄肉部。
Fig. 1 is a side view showing one embodiment of the electric circuit component mounting device of this invention, Fig. 2 is a plan view of Fig. 1, and Figs. Perspective views showing embodiments, FIGS. 6 and 7
The figure is a side view showing a conventional mounting device. 1... Mounting plate, 2... Bent part, 3... Screw, 4...
Screw, 5... Main printed circuit board, 6... Sub printed circuit board, 7... Electric circuit component, 8... Lead terminal,
9... Lead wire, 10... Solder, 11... Notch, 1
2...Thin wall part.
Claims (1)
回路基板６を設け、この副プリント回路基板に電
気回路部品７を電気的にハンダ付けするとともに
、上記副プリント回路基板６と上記主プリント回
路基板５とをリード線９を介してハンダ付けし、
さらに上記電気回路部品７とをリード線９を介し
てハンダ付けし、一方上記主プリント回路基板５
と別体に形成された取付け板１を上記主プリント
回路基板５に連結し、かつ上記電気回路部品７を
上記取付け板１に取付けた電気回路部品の取付け
装置。 (2) 上記副プリント回路基板６は上記主プリン
ト回路基板５の一部を切欠くことにより形成した
実用新案登録請求の範囲第１項記載の電気回路部
品の取付け装置。[Claims for Utility Model Registration] (1) A sub printed circuit board 6 is provided separately from the main printed circuit board 5, and electric circuit components 7 are electrically soldered to the sub printed circuit board, and the sub printed circuit board 6 is electrically soldered to the sub printed circuit board 5. The circuit board 6 and the main printed circuit board 5 are soldered together via lead wires 9,
Further, the electrical circuit component 7 is soldered to the main printed circuit board 5 via the lead wire 9.
A mounting device for electrical circuit components, in which a mounting plate 1 formed separately from the main printed circuit board 5 is connected to the main printed circuit board 5, and the electrical circuit component 7 is mounted on the mounting plate 1. (2) The electric circuit component mounting device according to claim 1, wherein the sub printed circuit board 6 is formed by cutting out a part of the main printed circuit board 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9465388U JPH0217873U (en) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9465388U JPH0217873U (en) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217873U true JPH0217873U (en) | 1990-02-06 |
Family
ID=31319215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9465388U Pending JPH0217873U (en) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217873U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01220001A (en) * | 1988-02-29 | 1989-09-01 | Yokogawa Electric Corp | Method for optimizing cassette layout of nc packing machine |
| JP2006139316A (en) * | 2006-02-10 | 2006-06-01 | Ushio Inc | Light source device for document reading |
| JP2018157050A (en) * | 2017-03-17 | 2018-10-04 | 新電元工業株式会社 | Mounting structure of heating components |
-
1988
- 1988-07-19 JP JP9465388U patent/JPH0217873U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01220001A (en) * | 1988-02-29 | 1989-09-01 | Yokogawa Electric Corp | Method for optimizing cassette layout of nc packing machine |
| JP2006139316A (en) * | 2006-02-10 | 2006-06-01 | Ushio Inc | Light source device for document reading |
| JP2018157050A (en) * | 2017-03-17 | 2018-10-04 | 新電元工業株式会社 | Mounting structure of heating components |
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