JP2018157050A - Mounting structure of heating components - Google Patents

Mounting structure of heating components Download PDF

Info

Publication number
JP2018157050A
JP2018157050A JP2017052161A JP2017052161A JP2018157050A JP 2018157050 A JP2018157050 A JP 2018157050A JP 2017052161 A JP2017052161 A JP 2017052161A JP 2017052161 A JP2017052161 A JP 2017052161A JP 2018157050 A JP2018157050 A JP 2018157050A
Authority
JP
Japan
Prior art keywords
circuit board
heat
heat generating
generating component
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017052161A
Other languages
Japanese (ja)
Other versions
JP6826922B2 (en
Inventor
賢一郎 一杉
Kenichiro Hitosugi
賢一郎 一杉
晃弘 村野
Akihiro Murano
晃弘 村野
輝男 鎌倉
Teruo Kamakura
輝男 鎌倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP2017052161A priority Critical patent/JP6826922B2/en
Publication of JP2018157050A publication Critical patent/JP2018157050A/en
Application granted granted Critical
Publication of JP6826922B2 publication Critical patent/JP6826922B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To make it possible to downsize a product including a mounting structure of a heating component, to suppress electrical loss to a low level, and to reduce manufacturing costs of the product.SOLUTION: The mounting structure of heating components includes: a heating component 3 having a body 31 and leads 32, 33 protruding from the body 31; and a plurality of circuit boards 4, 5 arranged at intervals in a thickness direction. The plurality of circuit boards 4, 5 are connected by the leads 32, 33.SELECTED DRAWING: Figure 1

Description

この発明は、発熱部品の実装構造に関する。   The present invention relates to a heat generating component mounting structure.

従来より、通電により発熱する発熱部品を放熱部品上に配すると共に、発熱部品を回路基板に接続した発熱部品の実装構造がある。このような実装構造では、発熱部品において生じた熱を放熱部品に逃がすことができる。
特許文献１には、放熱部品（ヒートシンク）の配置面上に、回路基板（プリント配線基板）と、回路基板に接続されて大電流が流れる複数の発熱部品（発熱性電子部品）と、回路基板を介して発熱部品に接続されて大電流を流すためのインサートモールド基板と、を配した発熱部品の実装構造が開示されている。この実装構造では、回路基板と隣り合う位置において、発熱部品の本体部、及び、インサートモールド基板とが放熱部品の配置面上に重ねて配されている。 2. Description of the Related Art Conventionally, there is a mounting structure for a heat generating component in which a heat generating component that generates heat when energized is disposed on a heat radiating component and the heat generating component is connected to a circuit board. In such a mounting structure, heat generated in the heat generating component can be released to the heat radiating component.
Patent Document 1 discloses a circuit board (printed wiring board), a plurality of heat generating parts (heat generating electronic parts) connected to the circuit board and flowing a large current on the arrangement surface of the heat radiating parts (heat sink), and a circuit board. There is disclosed a mounting structure of a heat generating component in which an insert mold substrate is connected to the heat generating component via a plug to flow a large current. In this mounting structure, at a position adjacent to the circuit board, the main body part of the heat generating component and the insert mold substrate are arranged on the arrangement surface of the heat dissipation component.

特開２００４―１０３８１６号公報JP 2004-103816 A

しかしながら、従来の実装構造では、発熱部品の数が多くなると、回路基板に形成される配線（基板配線）も多数必要となり、多数の発熱部品と共に「回路」を構成する回路基板の配線パターンが複雑になってしまう。例えば特許文献１の実装構造では、回路基板に小電流を流すための基板配線だけではなく、大電流を流すための基板配線も、多数形成されているため、回路基板における配線パターンが複雑になりやすい。その結果、放熱部品上における回路基板の占有面積が大きくなってしまい、実装構造を含む製品の小型化を阻害する、という問題がある。   However, in the conventional mounting structure, when the number of heat-generating components increases, a large number of wirings (board wiring) formed on the circuit board are required, and the wiring pattern of the circuit board that constitutes the “circuit” together with many heat-generating components is complicated. Become. For example, in the mounting structure disclosed in Patent Document 1, not only substrate wiring for flowing a small current to a circuit board but also a large number of substrate wirings for flowing a large current are formed, so that the wiring pattern on the circuit board becomes complicated. Cheap. As a result, there is a problem that the area occupied by the circuit board on the heat dissipating component is increased, which hinders downsizing of the product including the mounting structure.

上記した占有面積を小さく抑えるためには、例えば、回路基板の基板配線を細く形成することが考えられる。しかしながら、この場合には、基板配線における電気抵抗が大きくなり、基板配線による電気的な損失が大きくなるため、好ましくない。
また、基板配線を細く形成することなく、上記した占有面積を小さく抑えるためには、例えば、回路基板の層数を増やす、すなわち回路基板を多層配線基板で構成することが考えられる。しかしながら、この場合には、回路基板のうち多層化すべき領域が回路基板の一部に限られる場合に、回路基板の残部が無駄に多層化されてしまうため、実装構造を含む製品の製造コストが無駄に増加してしまう。 In order to keep the above-mentioned occupied area small, for example, it is conceivable to form the substrate wiring of the circuit board thinly. However, this is not preferable because the electrical resistance in the substrate wiring increases and the electrical loss due to the substrate wiring increases.
In order to suppress the above-mentioned occupied area without forming the substrate wiring thin, for example, it is conceivable to increase the number of layers of the circuit board, that is, to configure the circuit board with a multilayer wiring board. However, in this case, when the area to be multilayered in the circuit board is limited to a part of the circuit board, the remaining part of the circuit board is wastefully multilayered, so that the manufacturing cost of the product including the mounting structure is reduced. It will increase in vain.

本発明は、上述した事情に鑑みたものであって、製品の小型化を図ると共に、電気的な損失を低く抑えることができ、さらに、製品の製造コストを低く抑えることが可能な発熱部品の実装構造を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and it is possible to reduce the size of a product, reduce electrical loss, and further reduce the manufacturing cost of the product. An object is to provide a mounting structure.

本発明の一態様は、本体部及び本体部から突出するリードを有する発熱部品と、厚さ方向に間隔をあけて配列された複数の回路基板と、を備え、複数の前記回路基板が、前記リードによって接続された発熱部品の実装構造である。   One aspect of the present invention includes a main body portion and a heat generating component having a lead protruding from the main body portion, and a plurality of circuit boards arranged at intervals in the thickness direction. It is a mounting structure of heat-generating components connected by leads.

本発明によれば、複数の回路基板がその厚さ方向に間隔をあけて配列されると共に発熱部品のリードによって接続されるため、発熱部品の数が多くなっても、発熱部品と共に製品の回路を構成する回路基板の配線（基板配線）を、複数の回路基板に分けて形成できる。このため、発熱部品の数が多くなることで、発熱部品と共に製品の回路を構成する基板配線のパターンが複雑になっても、回路基板の占有面積を小さく抑えることができる。したがって、実装構造を含む製品の小型化を図ることができる。
また、基板配線の太さや厚さを十分に確保でき、基板配線による電気的な損失を小さく抑えることもできる。
また、多数の発熱部品と共に製品の回路を構成する基板配線を複数の回路基板に分けて形成できるため、基板配線を回路基板の一部領域に密集させても、基板配線が一つの回路基板のみに形成される場合と比較して、実装構造を含む製品の製造コストを低く抑えることができる。 According to the present invention, since a plurality of circuit boards are arranged at intervals in the thickness direction and are connected by leads of the heat generating components, even if the number of heat generating components increases, the circuit of the product together with the heat generating components. The circuit board wiring (substrate wiring) constituting the circuit board can be divided into a plurality of circuit boards. For this reason, by increasing the number of heat-generating components, the area occupied by the circuit board can be kept small even if the pattern of the substrate wiring that forms the product circuit together with the heat-generating components becomes complicated. Therefore, it is possible to reduce the size of the product including the mounting structure.
In addition, the thickness and thickness of the substrate wiring can be sufficiently secured, and electrical loss due to the substrate wiring can be suppressed to a low level.
In addition, since the substrate wiring that constitutes the product circuit together with a large number of heat generating components can be divided into a plurality of circuit boards, even if the circuit board wiring is concentrated in a partial area of the circuit board, the circuit board wiring is only one circuit board. Compared with the case where it is formed, the manufacturing cost of the product including the mounting structure can be kept low.

本発明の一実施形態に係る発熱部品の実装構造を示す斜視図である。It is a perspective view which shows the mounting structure of the heat-emitting component which concerns on one Embodiment of this invention. 図１のII−II矢視断面図である。It is II-II arrow sectional drawing of FIG. 図１の分解斜視図である。FIG. 2 is an exploded perspective view of FIG. 1. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat-emitting component which concerns on other embodiment of this invention. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat-emitting component which concerns on other embodiment of this invention. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat-emitting component which concerns on other embodiment of this invention.

〔第一実施形態〕
以下、図１−３を参照して本発明の一実施形態について説明する。
図１−３に示すように、本実施形態に係る発熱部品の実装構造は、発熱部品３と、複数の回路基板４，５と、を備える。また、本実施形態に係る発熱部品の実装構造は、ベース部１と、放熱部２と、を備える。 [First embodiment]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As illustrated in FIG. 1C, the heat generating component mounting structure according to the present embodiment includes a heat generating component 3 and a plurality of circuit boards 4 and 5. In addition, the mounting structure of the heat generating component according to the present embodiment includes a base portion 1 and a heat radiating portion 2.

ベース部１は、配置面１１を有する。配置面１１は、例えば湾曲した面に形成されてもよいが、本実施形態では平坦な面に形成されている。また、本実施形態のベース部１は板状に形成されている。ベース部１は、任意の材料によって構成されてよいが、本実施形態では、熱伝導率が高い材料（例えば銅やアルミニウムなど）によって構成されている。ベース部１は、例えば発熱部品３や回路基板４，５等を収容する筐体（ケース）を構成してもよい。   The base portion 1 has an arrangement surface 11. The arrangement surface 11 may be formed as a curved surface, for example, but is formed as a flat surface in the present embodiment. Moreover, the base part 1 of this embodiment is formed in plate shape. Although the base part 1 may be comprised with arbitrary materials, in this embodiment, it is comprised with material (for example, copper, aluminum, etc.) with high heat conductivity. The base unit 1 may constitute a housing (case) that houses the heat generating component 3, the circuit boards 4, 5, and the like, for example.

放熱部２は、ベース部１の配置面１１から突出するようにベース部１に設けられている。放熱部２は、ベース部１と同様に、熱伝導率が高い材料（例えば銅やアルミニウムなど）によって構成されている。放熱部２は、ベース部１と共にヒートシンク（放熱部２品）を構成している。本実施形態において、放熱部２はベース部１と一体に形成されている。   The heat dissipating part 2 is provided on the base part 1 so as to protrude from the arrangement surface 11 of the base part 1. The heat radiating part 2 is made of a material having high thermal conductivity (for example, copper, aluminum, etc.), like the base part 1. The heat dissipating part 2 constitutes a heat sink (two heat dissipating parts) together with the base part 1. In the present embodiment, the heat radiating portion 2 is formed integrally with the base portion 1.

放熱部２の頂面２１（放熱部２の突出方向の先端の面）には、発熱部品３が配される。放熱部２の頂面２１は、ベース部１の配置面１１に平行する平坦に形成されている。同一の放熱部２の頂面２１には、後述の発熱部品３が一つだけ配されてもよいが、本実施形態では発熱部品３が複数配される。   The heat generating component 3 is disposed on the top surface 21 of the heat radiating unit 2 (the front end surface of the heat radiating unit 2 in the protruding direction). The top surface 21 of the heat radiating part 2 is formed flat parallel to the arrangement surface 11 of the base part 1. Although only one heat generating component 3 described later may be disposed on the top surface 21 of the same heat radiating portion 2, a plurality of heat generating components 3 are disposed in the present embodiment.

図２に例示する本実施形態の放熱部２の断面形状は、放熱部２の突出方向に向けて先細りとなる台形状となっているが、例えば長方形状など任意の形状であってよい。
放熱部２は、ベース部１の厚さ方向（放熱部２の突出方向）から見た平面視で、例えばドット状（島状）などの任意の形状に形成されてよいが、本実施形態では、配置面１１に沿って一方向に延びる帯状に形成されている。 The cross-sectional shape of the heat radiating part 2 of this embodiment illustrated in FIG. 2 is a trapezoidal shape that tapers in the protruding direction of the heat radiating part 2, but may be any shape such as a rectangular shape.
The heat dissipating part 2 may be formed in an arbitrary shape such as a dot shape (island shape) in a plan view as viewed from the thickness direction of the base part 1 (the protruding direction of the heat dissipating part 2). It is formed in a strip shape extending in one direction along the arrangement surface 11.

放熱部２は、例えばベース部１の配置面１１に一つだけ設けられてもよいが、本実施形態のように複数設けられてもよい。本実施形態では、帯状に形成された二つの放熱部２が、その長手方向において平行するように、互いに間隔をあけて配されている。   For example, only one heat dissipating part 2 may be provided on the arrangement surface 11 of the base part 1, but a plurality of heat dissipating parts 2 may be provided as in the present embodiment. In the present embodiment, the two heat dissipating parts 2 formed in a belt shape are arranged at intervals from each other so as to be parallel in the longitudinal direction.

発熱部品３は、通電により発熱する部品である。発熱部品３は、回路基板４，５に電気接続されることで、回路基板４，５と共に製品の回路を構成する。本実施形態において、発熱部品３は、放熱部２の頂面２１に配されている。
発熱部品３は、本体部３１と、本体部３１から突出するリード３２，３３と、を備える。 The heat generating component 3 is a component that generates heat when energized. The heat generating component 3 constitutes a product circuit together with the circuit boards 4 and 5 by being electrically connected to the circuit boards 4 and 5. In the present embodiment, the heat generating component 3 is disposed on the top surface 21 of the heat radiating unit 2.
The heat generating component 3 includes a main body portion 31 and leads 32 and 33 protruding from the main body portion 31.

本体部３１は、通電によって主に発熱する部分であり、所定の容積を有する塊である。本体部３１は任意の形状に形成されてよいが、本実施形態では平面視長方形の板状に形成されている。
本体部３１の内部には、主な発熱源であるスイッチング素子等の半導体素子（不図示）が設けられている。半導体素子の複数の電極は、それぞれリード３２，３３に接続されている。本体部３１は、前述した放熱部２の頂面２１に配される。本体部３１は、例えば放熱部２の頂面２１に直接接触してもよいし、図１、図３に例示する放熱シート６を介して放熱部２の頂面２１に配されてもよい。 The main body 31 is a part that mainly generates heat when energized, and is a lump having a predetermined volume. The main body 31 may be formed in an arbitrary shape, but is formed in a plate shape having a rectangular shape in plan view in the present embodiment.
Inside the main body 31, a semiconductor element (not shown) such as a switching element as a main heat source is provided. The plurality of electrodes of the semiconductor element are connected to leads 32 and 33, respectively. The main body 31 is disposed on the top surface 21 of the heat dissipation unit 2 described above. For example, the main body 31 may be in direct contact with the top surface 21 of the heat radiating unit 2, or may be disposed on the top surface 21 of the heat radiating unit 2 via the heat radiating sheet 6 illustrated in FIGS. 1 and 3.

放熱シート６は、熱伝導率の高い材料で構成されるとよい。また、放熱シート６は、電気的な絶縁性を有する材料で構成されてもよい。この場合、放熱部２の頂面２１に対向する本体部３１の表面に導電性を有する部位（例えば半導体素子を搭載するダイパッド）が露出していても、発熱部品３の本体部３１と放熱部２との電気的な絶縁を確保することができる。図１−２において、本体部３１はネジ７によって放熱部２の頂面２１に押し付けられるように固定されているが、これに限ることはない。
上記したように、発熱部品３が放熱部２の頂面２１に配されていることで、発熱部品３において発生した熱を放熱部２に効率よく逃がすことができる。 The heat radiating sheet 6 may be made of a material having high thermal conductivity. Moreover, the heat dissipation sheet 6 may be made of a material having electrical insulation. In this case, even if a conductive portion (for example, a die pad on which a semiconductor element is mounted) is exposed on the surface of the main body portion 31 facing the top surface 21 of the heat radiating portion 2, the main body portion 31 and the heat radiating portion of the heat generating component 3 are exposed. 2 can be secured. In FIG. 1-2, the main body 31 is fixed so as to be pressed against the top surface 21 of the heat radiating part 2 by the screw 7, but is not limited thereto.
As described above, since the heat generating component 3 is arranged on the top surface 21 of the heat radiating unit 2, the heat generated in the heat generating component 3 can be efficiently released to the heat radiating unit 2.

発熱部品３のリード３２，３３は、本体部３１が放熱部２の頂面２１に配された状態で、本体部３１から放熱部２の頂面２１に沿う方向に突出している。リード３２，３３は、放熱部２の頂面２１に沿って放熱部２の頂面２１からはみ出す位置まで突出している。リード３２，３３は、その長手方向における中途部において折り曲げられている。これにより、リード３２，３３の突出方向の先端部は、ベース部１の厚さ方向においてベース部１の配置面１１に近づく方向に延びている。ただし、リード３２，３３の先端部は、ベース部１の配置面１１に対して電気的に絶縁されるように間隔をあけて位置している。リード３２，３３の先端部は、回路基板４，５に接続される。   The leads 32 and 33 of the heat generating component 3 protrude in a direction along the top surface 21 of the heat radiating part 2 from the main body part 31 in a state where the main body part 31 is arranged on the top surface 21 of the heat radiating part 2. The leads 32 and 33 protrude along the top surface 21 of the heat radiating portion 2 to a position protruding from the top surface 21 of the heat radiating portion 2. The leads 32 and 33 are bent at midway portions in the longitudinal direction. As a result, the leading ends of the leads 32 and 33 in the protruding direction extend in a direction approaching the arrangement surface 11 of the base portion 1 in the thickness direction of the base portion 1. However, the tip portions of the leads 32 and 33 are located at a distance so as to be electrically insulated from the arrangement surface 11 of the base portion 1. The tips of the leads 32 and 33 are connected to the circuit boards 4 and 5.

本実施形態の発熱部品３は、複数（図示例では三つ）のリード３２，３３を備える。複数のリード３２，３３は、本体部３１から同じ方向に突出している。また、複数のリード３２，３３は、本体部３１が放熱部２の頂面２１に配された状態で、放熱部２の頂面２１に沿ってリード３２，３３の突出方向に直交する方向に間隔をあけて配列されている。複数のリード３２，３３の長さは、例えば互いに異なってもよいが、本実施形態では互いに等しい。   The heat generating component 3 of this embodiment includes a plurality of (three in the illustrated example) leads 32 and 33. The plurality of leads 32 and 33 protrude from the main body 31 in the same direction. In addition, the plurality of leads 32 and 33 are arranged in a direction orthogonal to the protruding direction of the leads 32 and 33 along the top surface 21 of the heat radiating unit 2 in a state where the main body 31 is arranged on the top surface 21 of the heat radiating unit 2. Arranged at intervals. The lengths of the plurality of leads 32 and 33 may be different from each other, for example, but are equal to each other in the present embodiment.

本実施形態において、発熱部品３のリード３２，３３には、大電流が流れる大電流用リード３２と、大電流よりも小さい小電流が流れる小電流用リード３３と、がある。ここで、大電流は例えば電源電流であり、小電流は例えば信号電流である。
発熱部品３の半導体素子がＭＯＳトランジスタである場合、大電流用リード３２は、ＭＯＳトランジスタのソース電極やドレイン電極に接続されるリードである。また、小電流用リード３３は、ＭＯＳトランジスタのゲート電極に接続されるリードである。図示例の発熱部品３は、二つの大電流用リード３２と、一つの小電流用リード３３を有するが、大電流用リード、一つの小電流用リード３３の数はこれに限らない。 In the present embodiment, the leads 32 and 33 of the heat generating component 3 include a large current lead 32 through which a large current flows and a small current lead 33 through which a small current smaller than the large current flows. Here, the large current is, for example, a power supply current, and the small current is, for example, a signal current.
When the semiconductor element of the heat generating component 3 is a MOS transistor, the large current lead 32 is a lead connected to the source electrode and drain electrode of the MOS transistor. The small current lead 33 is a lead connected to the gate electrode of the MOS transistor. Although the heat generating component 3 in the illustrated example has two large current leads 32 and one small current lead 33, the number of large current leads and one small current lead 33 is not limited thereto.

同一の放熱部２の頂面２１には、一つの発熱部品３だけが配されてもよいが、本実施形態では複数の発熱部品３が配されている。複数の発熱部品３の本体部３１は、帯状に形成された同一の放熱部２の長手方向に配列されている。この状態において、複数の発熱部品３のリード３２，３３は、同一の放熱部２に対して同じ方向（放熱部２の幅方向）に突出し、同一の放熱部２の長手方向に配列されている。   Although only one heat generating component 3 may be disposed on the top surface 21 of the same heat radiating portion 2, in the present embodiment, a plurality of heat generating components 3 are disposed. The main body portions 31 of the plurality of heat generating components 3 are arranged in the longitudinal direction of the same heat radiating portion 2 formed in a band shape. In this state, the leads 32 and 33 of the plurality of heat generating components 3 protrude in the same direction (the width direction of the heat radiating unit 2) with respect to the same heat radiating unit 2 and are arranged in the longitudinal direction of the same heat radiating unit 2. .

また、本実施形態では、複数の発熱部品３が、二つの放熱部２のそれぞれに対して上記したように配されている。各放熱部２に配された発熱部品３のリード３２，３３は、互いの放熱部２に向けて延びるように本体部３１から突出している。すなわち、本実施形態において、二つの放熱部２に配された発熱部品３のリード３２，３３の先端部は、二つの放熱部２の間に位置している。   In the present embodiment, the plurality of heat generating components 3 are arranged as described above for each of the two heat radiating portions 2. The leads 32 and 33 of the heat generating component 3 arranged in each heat radiating part 2 protrude from the main body part 31 so as to extend toward the heat radiating part 2. That is, in the present embodiment, the tips of the leads 32 and 33 of the heat generating component 3 arranged in the two heat radiating portions 2 are located between the two heat radiating portions 2.

複数の回路基板４，５は、その厚さ方向に間隔をあけて配列されている。本実施形態において、複数の回路基板４，５は、放熱部２の頂面２１よりも低い位置（配置面１１側）において、放熱部２の突出方向に間隔をあけて配列されている。複数の回路基板４，５は、発熱部品３のリード３２，３３によって接続されている。具体的に、発熱部品３のリード３２，３３（特に先端部）は、各回路基板４，５を貫通した状態で、半田等によって各回路基板４，５に対して接続されている。これにより、複数の回路基板４，５は、発熱部品３のリード３２，３３によって連結されている。   The plurality of circuit boards 4 and 5 are arranged at intervals in the thickness direction. In the present embodiment, the plurality of circuit boards 4 and 5 are arranged at intervals in the protruding direction of the heat radiating unit 2 at a position lower than the top surface 21 of the heat radiating unit 2 (on the arrangement surface 11 side). The plurality of circuit boards 4 and 5 are connected by leads 32 and 33 of the heat generating component 3. Specifically, the leads 32 and 33 (particularly the front end portion) of the heat generating component 3 are connected to the circuit boards 4 and 5 by soldering or the like while penetrating the circuit boards 4 and 5. Thereby, the plurality of circuit boards 4 and 5 are connected by the leads 32 and 33 of the heat generating component 3.

放熱部２の突出方向に配列される回路基板４，５の数は、例えば三つ以上であってよいが、本実施形態では二つである。本実施形態では、第一回路基板４と第二回路基板５とが、放熱部２の突出方向と反対の方向に順番に配列されている。発熱部品３のリード３２，３３（特に先端部）は、第一回路基板４と第二回路基板５とに順番に貫通している。   The number of circuit boards 4 and 5 arranged in the protruding direction of the heat radiating unit 2 may be three or more, for example, but is two in this embodiment. In the present embodiment, the first circuit board 4 and the second circuit board 5 are arranged in order in a direction opposite to the protruding direction of the heat dissipation part 2. The leads 32 and 33 (particularly the front end portion) of the heat generating component 3 penetrate the first circuit board 4 and the second circuit board 5 in order.

本実施形態において、第一回路基板４は、平面視で、放熱部２に干渉しない大きさに形成されると共に、放熱部２に干渉しない（放熱部２と重ならない）位置に配されている。具体的に、第一回路基板４は、平面視で、二つの放熱部２の間に配することが可能な大きさに形成され、二つの放熱部２の間に配されている。   In the present embodiment, the first circuit board 4 is formed in a size that does not interfere with the heat radiating portion 2 in a plan view, and is disposed at a position that does not interfere with the heat radiating portion 2 (does not overlap with the heat radiating portion 2). . Specifically, the first circuit board 4 is formed in a size that can be disposed between the two heat radiating portions 2 in a plan view, and is disposed between the two heat radiating portions 2.

本実施形態において、第一回路基板４は、大電流が流れる大電流用配線（不図示）を有する大電流回路基板である。第一回路基板４は、例えば大電流よりも小さい小電流を流すための小電流配線を有してもよいが、本実施形態では小電流配線を有さない。
前述した発熱部品３の大電流用リード３２は、第一回路基板４の大電流用配線に半田等で接合され、大電流用配線と電気接続されている。一方、発熱部品３の小電流用リード３３は、第一回路基板４の大電流用配線に電気接続されていない。具体的に、発熱部品３の小電流用リード３３は、大電流用配線と電気的に絶縁されるように第一回路基板４に形成されたダミー配線（不図示）に半田等で接合されている。 In the present embodiment, the first circuit board 4 is a large current circuit board having a large current wiring (not shown) through which a large current flows. The first circuit board 4 may have a small current wiring for flowing a small current smaller than a large current, for example, but does not have a small current wiring in the present embodiment.
The large current lead 32 of the heat generating component 3 described above is joined to the large current wiring of the first circuit board 4 with solder or the like, and is electrically connected to the large current wiring. On the other hand, the small current lead 33 of the heat generating component 3 is not electrically connected to the large current wiring of the first circuit board 4. Specifically, the small current lead 33 of the heat generating component 3 is joined to a dummy wiring (not shown) formed on the first circuit board 4 with solder or the like so as to be electrically insulated from the large current wiring. Yes.

第二回路基板５は、前述の第一回路基板４とベース部１の配置面１１との間に配されている。本実施形態において、第二回路基板５は、平面視で、第一回路基板４よりも大きく形成されている。
また、第二回路基板５は、平面視で、放熱部２に干渉する大きさに形成されると共に、放熱部２に干渉する（放熱部２と重なる）位置に配されている。このため、第二回路基板５には、その厚さ方向に貫通して放熱部２を挿通させる挿通孔５１が形成されている。具体的には、第二回路基板５が、平面視で、ベース部１の配置面１１のうち二つの放熱部２を設けた領域及び二つの放熱部２の間の領域を含む領域よりも大きく形成されている。このため、第二回路基板５には、二つの放熱部２をそれぞれ挿通させる二つの挿通孔５１が形成されている。
平面視した第二回路基板５の大きさは、図示例の大きさに限らず、例えば図示例よりもさらに大きくてもよい。この場合、第二回路基板５のうち図示例の領域よりも外側の領域には、例えば、複数の発熱部品３、二つの回路基板４，５と共に回路を構成する各種の電子部品、電気部品が実装されていてもよい。 The second circuit board 5 is disposed between the first circuit board 4 and the arrangement surface 11 of the base portion 1 described above. In the present embodiment, the second circuit board 5 is formed larger than the first circuit board 4 in plan view.
In addition, the second circuit board 5 is formed in a size that interferes with the heat radiating unit 2 in a plan view, and is disposed at a position that interferes with the heat radiating unit 2 (overlaps with the heat radiating unit 2). For this reason, the second circuit board 5 is formed with an insertion hole 51 that penetrates in the thickness direction and allows the heat radiating portion 2 to be inserted therethrough. Specifically, the second circuit board 5 is larger in plan view than the region including the region between the two heat dissipating units 2 and the region between the two heat dissipating units 2 in the arrangement surface 11 of the base unit 1. Is formed. For this reason, two insertion holes 51 through which the two heat radiating portions 2 are respectively inserted are formed in the second circuit board 5.
The size of the second circuit board 5 in plan view is not limited to the illustrated example, and may be larger than the illustrated example, for example. In this case, in the area outside the illustrated example of the second circuit board 5, for example, various electronic parts and electric parts that constitute a circuit together with the plurality of heat generating components 3 and the two circuit boards 4 and 5 are provided. May be implemented.

本実施形態において、第二回路基板５は、第一回路基板４の大電流用配線に流れる大電流よりも小さい小電流が流れる小電流用配線（不図示）を有する小電流回路基板である。第二回路基板５は、例えば大電流を流すための大電流用配線を有してもよいが、本実施形態では、大電流用配線を有さない。
前述した発熱部品３の小電流用リード３３は、第二回路基板５の小電流用配線に半田等で接合され、小電流用配線と電気接続されている。一方、発熱部品３の大電流用リード３２は、第二回路基板５の小電流用配線に電気接続されていない。具体的に、発熱部品３の大電流用リード３２は、小電流用配線と電気的に絶縁されるように第二回路基板５に形成されたダミー配線（不図示）に半田等で接合されている。 In the present embodiment, the second circuit board 5 is a small current circuit board having a small current wiring (not shown) through which a small current smaller than a large current flowing through the large current wiring of the first circuit board 4 flows. The second circuit board 5 may have, for example, a large current wiring for flowing a large current, but in the present embodiment, there is no large current wiring.
The small current lead 33 of the heat generating component 3 described above is joined to the small current wiring of the second circuit board 5 with solder or the like, and is electrically connected to the small current wiring. On the other hand, the large current lead 32 of the heat generating component 3 is not electrically connected to the small current wiring of the second circuit board 5. Specifically, the large current lead 32 of the heat generating component 3 is joined to a dummy wiring (not shown) formed on the second circuit board 5 with solder or the like so as to be electrically insulated from the small current wiring. Yes.

本実施形態において、二つの回路基板４，５は、発熱部品３のリード３２，３３に接続されていることで、放熱部２の頂面２１に配された発熱部品３のリード３２，３３によって支持されている。これにより、第二回路基板５を、ベース部１の配置面１１に対して間隔をあけて配することができる。第二回路基板５は、例えば不図示のスペーサをベース部１と第二回路基板５との間に設けることで、ベース部１の配置面１１上に間隔をあけて配されてもよい。   In the present embodiment, the two circuit boards 4 and 5 are connected to the leads 32 and 33 of the heat generating component 3, so that the leads 32 and 33 of the heat generating component 3 disposed on the top surface 21 of the heat radiating unit 2 are used. It is supported. Thereby, the 2nd circuit board 5 can be distribute | arranged with respect to the arrangement | positioning surface 11 of the base part 1 at intervals. For example, the second circuit board 5 may be arranged on the arrangement surface 11 of the base part 1 with an interval by providing a spacer (not shown) between the base part 1 and the second circuit board 5.

本実施形態の実装構造において、複数の発熱部品３、及び、これに電気接続される二つの回路基板４，５の配線（大電流配線、小電流配線）によって構成される回路としては、例えば３相ブリッジ回路などが挙げられる。すなわち、本実施形態の実装構造は、例えば３相交流モータを駆動制御する電源装置などの製品に適用することが可能である。   In the mounting structure of the present embodiment, as a circuit configured by a plurality of heat generating components 3 and wiring (large current wiring, small current wiring) of two circuit boards 4 and 5 electrically connected thereto, for example, 3 For example, a phase bridge circuit. That is, the mounting structure of this embodiment can be applied to products such as a power supply device that drives and controls a three-phase AC motor.

次に、上記した本実施形態の実装構造の組立手順の一例について説明する。
発熱部品３の実装構造を組み立てる際には、はじめに、複数の回路基板４，５がその厚さ方向に間隔をあけて配列されるように、発熱部品３のリード３２，３３を複数の回路基板４，５に接合する。 Next, an example of an assembly procedure of the mounting structure of the above-described embodiment will be described.
When assembling the mounting structure of the heat generating component 3, first, the leads 32 and 33 of the heat generating component 3 are arranged in the plurality of circuit boards so that the plurality of circuit boards 4 and 5 are arranged at intervals in the thickness direction. Join 4 and 5.

リード３２，３３を回路基板４，５に接合する際には、はじめに、図３に示すように、複数の発熱部品３のリード３２，３３の先端部を第一回路基板４に貫通させた上で、半田等により複数の発熱部品３のリード３２，３３の先端部を第一回路基板４に接合する。複数の発熱部品３のリード３２，３３は、第一回路基板４に対して同じ方向に貫通するため、一回の半田フロー工程によって、複数の発熱部品３のリード３２，３３を第一回路基板４に一括して接合することができる。
その後、複数の発熱部品３のリード３２，３３の先端部を第二回路基板５に貫通させた上で、半田等により複数の発熱部品３のリード３２，３３の先端部を第二回路基板５に接合する。この際、複数の発熱部品３のリード３２，３３は、第一回路基板４の場合と同様に、一回の半田フロー工程によって第二回路基板５に一括して接合することができる。 When joining the leads 32 and 33 to the circuit boards 4 and 5, first, as shown in FIG. 3, the leading ends of the leads 32 and 33 of the plurality of heat generating components 3 are passed through the first circuit board 4. Then, the tips of the leads 32 and 33 of the plurality of heat generating components 3 are joined to the first circuit board 4 by soldering or the like. Since the leads 32 and 33 of the plurality of heat generating components 3 penetrate the first circuit board 4 in the same direction, the leads 32 and 33 of the plurality of heat generating components 3 are connected to the first circuit board by a single solder flow process. 4 can be joined together.
Thereafter, the tips of the leads 32 and 33 of the plurality of heat generating components 3 are passed through the second circuit board 5, and the tips of the leads 32 and 33 of the plurality of heat generating components 3 are soldered to the second circuit board 5. To join. At this time, the leads 32 and 33 of the plurality of heat generating components 3 can be collectively bonded to the second circuit board 5 by a single solder flow process as in the case of the first circuit board 4.

発熱部品３のリード３２，３３を複数の回路基板４，５に接合させた状態において、各発熱部品３の本体部３１は、複数の回路基板４，５の配列方向（回路基板の厚さ方向）において、同じ方向に向く複数の回路基板４，５の第一主面４２，５２側（特に第一回路基板４の第一主面４２側）に位置している。また、各発熱部品３の本体部３１は、回路基板４，５の厚さ方向から見た平面視で、第一回路基板４と重ならないように、かつ、第二回路基板５の挿通孔５１と重なるように位置している。   In a state where the leads 32 and 33 of the heat generating component 3 are bonded to the plurality of circuit boards 4 and 5, the main body portion 31 of each heat generating component 3 is arranged in the arrangement direction of the circuit boards 4 and 5 (the thickness direction of the circuit board). ) Are located on the first main surfaces 42 and 52 side of the plurality of circuit boards 4 and 5 facing in the same direction (particularly on the first main surface 42 side of the first circuit board 4). Further, the main body portion 31 of each heat generating component 3 does not overlap the first circuit board 4 in a plan view when viewed from the thickness direction of the circuit boards 4 and 5, and the insertion hole 51 of the second circuit board 5. It is located so as to overlap.

その後、一体に固定された複数の発熱部品３及び複数の回路基板４，５をベース部１の配置面１１上に配する。この際、ベース部１上に設けられた放熱部２を第二回路基板５の挿通孔５１に挿通させた上で、複数の発熱部品３の本体部３１を放熱部２の頂面２１に配する。複数の発熱部品３は、図１，図３に例示する放熱シート６を介して放熱部２の頂面２１に配されてもよい。
最後に、各発熱部品３の本体部３１をネジ７等によって放熱部２の頂面２１に固定することで、発熱部品３の実装構造の組立が完了する。 Thereafter, the plurality of heat generating components 3 and the plurality of circuit boards 4 and 5 fixed together are arranged on the arrangement surface 11 of the base portion 1. At this time, the heat dissipating part 2 provided on the base part 1 is inserted into the insertion hole 51 of the second circuit board 5, and the main body parts 31 of the plurality of heat generating components 3 are arranged on the top surface 21 of the heat dissipating part 2. To do. The plurality of heat generating components 3 may be disposed on the top surface 21 of the heat radiating unit 2 via the heat radiating sheet 6 illustrated in FIGS.
Finally, the assembly of the mounting structure of the heat generating component 3 is completed by fixing the main body portion 31 of each heat generating component 3 to the top surface 21 of the heat radiating portion 2 with screws 7 or the like.

以上説明したように、本実施形態の実装構造では、複数の回路基板４，５がベース部１の配置面１１上に重ねて配されている。このため、回路基板４，５に接続される発熱部品３の数が多くなっても、発熱部品３と共に製品の回路を構成する回路基板４，５の配線（基板配線）を、複数の回路基板４，５に分けて形成することができる。これにより、発熱部品３の数が多くなることで、発熱部品３と共に製品の回路を構成する基板配線のパターンが複雑になっても、ベース部１の配置面１１上における回路基板４，５の占有面積を小さく抑えることができる。
また、基板配線の太さや厚さを十分に確保でき、基板配線による電気的な損失を小さく抑えることもできる。 As described above, in the mounting structure of the present embodiment, the plurality of circuit boards 4 and 5 are arranged on the arrangement surface 11 of the base portion 1 in an overlapping manner. For this reason, even if the number of heat generating components 3 connected to the circuit boards 4 and 5 increases, the wiring (substrate wiring) of the circuit boards 4 and 5 that constitute the product circuit together with the heat generating components 3 is connected to a plurality of circuit boards. 4 and 5 can be formed. As a result, even if the number of the heat generating components 3 is increased and the pattern of the substrate wiring constituting the circuit of the product together with the heat generating components 3 is complicated, the circuit boards 4 and 5 on the arrangement surface 11 of the base portion 1 are Occupied area can be kept small.
In addition, the thickness and thickness of the substrate wiring can be sufficiently secured, and electrical loss due to the substrate wiring can be suppressed to a low level.

また、本実施形態の実装構造では、多数の発熱部品３と共に製品の回路を構成する基板配線を複数の回路基板４，５に分けて形成できる。このため、基板配線を一部領域に密集させても、基板配線が一つの回路基板のみに形成される場合と比較して、実装構造を含む製品の製造コストを低く抑えることができる。
具体的に説明すれば、例えば、発熱部品３と共に製品の回路を構成する基板配線を、一つの回路基板の一部領域に密集させる場合には、回路基板の一部領域だけではなく、他の領域も多層化する必要がある。その結果として、実装構造を含む製品の製造コストが高くなってしまう。
これに対し、本実施形態の実装構造では、発熱部品３と共に製品の回路を構成する基板配線を複数の回路基板４，５に分けて形成できる。このため、基板配線を一部領域に密集させる場合には、複数の回路基板４，５を一部領域においてのみ重ねて配すればよく、各回路基板４，５を無駄に多層化する（各回路基板４，５の層数を無駄に増やす）必要が無い。したがって、実装構造を含む製品の製造コストを低く抑えることができる。 Further, in the mounting structure of the present embodiment, the substrate wiring that constitutes the circuit of the product together with the large number of heat generating components 3 can be divided into a plurality of circuit boards 4 and 5. For this reason, even if the substrate wirings are concentrated in a part of the area, the manufacturing cost of the product including the mounting structure can be reduced as compared with the case where the substrate wirings are formed only on one circuit board.
More specifically, for example, when the substrate wiring that constitutes the circuit of the product together with the heat generating component 3 is concentrated in a partial area of one circuit board, not only the partial area of the circuit board but also other areas The area also needs to be multilayered. As a result, the manufacturing cost of the product including the mounting structure is increased.
On the other hand, in the mounting structure of the present embodiment, the substrate wiring that forms the product circuit together with the heat generating component 3 can be divided into a plurality of circuit boards 4 and 5. For this reason, when the substrate wiring is concentrated in a partial area, the plurality of circuit boards 4 and 5 need only be overlapped in the partial area, and the circuit boards 4 and 5 are wastefully multilayered (each There is no need to wastefully increase the number of layers of the circuit boards 4 and 5. Therefore, the manufacturing cost of the product including the mounting structure can be kept low.

また、本実施形態の実装構造では、発熱部品３がベース部１の配置面１１と同じ側に向く回路基板４，５の第一主面４２，５２側に配される。このため、発熱部品３、及び、発熱部品３と共に製品の回路を構成する各種の電気部品、電子部品を、回路基板４，５の第一主面４２，５２に効率よく実装できる。すなわち、各種の電気部品、電子部品を、発熱部品３と共に一回の半田フロー工程によって一つの回路基板４，５（特に第二回路基板５）に半田付けすることが可能となる。したがって、実装構造の組立を容易かつ効率よく行うことができる。   Further, in the mounting structure of the present embodiment, the heat generating component 3 is arranged on the first main surfaces 42 and 52 side of the circuit boards 4 and 5 facing the same side as the arrangement surface 11 of the base portion 1. For this reason, it is possible to efficiently mount the heat generating component 3 and various electric components and electronic components that constitute the product circuit together with the heat generating component 3 on the first main surfaces 42 and 52 of the circuit boards 4 and 5. In other words, various electrical components and electronic components can be soldered to the circuit boards 4 and 5 (particularly, the second circuit board 5) through a single solder flow process together with the heat generating component 3. Therefore, the mounting structure can be assembled easily and efficiently.

また、本実施形態の実装構造では、複数の回路基板４，５が発熱部品３のリード３２，３３によって接続されている。このため、発熱部品３を各回路基板４，５に直接電気接続することができる。本実施形態では、発熱部品３の大電流用リード３２を第一回路基板４の大電流用配線に電気接続している。また、発熱部品３の小電流用リード３３を第二回路基板５の小電流用配線に電気接続している。このため、回路基板４，５同士を別途部品によって電気接続する必要が無くなる。すなわち、実装構造を構成する部品点数を減らすことができる。また、部品点数が減ることで、実装構造を含む製品の製造コストを低く抑えることができると共に、実装構造の組立工数を減らすこともできる。   In the mounting structure of the present embodiment, the plurality of circuit boards 4 and 5 are connected by the leads 32 and 33 of the heat generating component 3. For this reason, the heat generating component 3 can be directly electrically connected to the circuit boards 4 and 5. In the present embodiment, the large current lead 32 of the heat generating component 3 is electrically connected to the large current wiring of the first circuit board 4. Further, the small current lead 33 of the heat generating component 3 is electrically connected to the small current wiring of the second circuit board 5. For this reason, it is not necessary to electrically connect the circuit boards 4 and 5 with separate components. That is, the number of parts constituting the mounting structure can be reduced. In addition, the reduction in the number of parts can reduce the manufacturing cost of the product including the mounting structure, and the assembly man-hour of the mounting structure can be reduced.

また、本実施形態の実装構造では、複数の回路基板４，５が、放熱部２の突出方向の先端（頂面２１）よりも低い位置において、放熱部２の突出方向に間隔をあけて配列されている。このため、発熱部品３の本体部３１を、回路基板４，５よりもベース部１の配置面１１から放熱部２の突出方向に離れた位置において、放熱部２の表面に配することができる。これにより、発熱部品３の実装構造を組み立てる際に、発熱部品３のリード３２，３３を複数の回路基板４，５に接合させた後に、発熱部品３の本体部３１をネジ止め等によって放熱部２に固定することができる。すなわち、発熱部品３がベース部１と回路基板４，５との間に配される場合と比較して、発熱部品３の実装構造を簡単に組み立てることができる。   In the mounting structure of the present embodiment, the plurality of circuit boards 4 and 5 are arranged at intervals in the projecting direction of the heat dissipating unit 2 at a position lower than the front end (top surface 21) of the heat dissipating unit 2 in the projecting direction. Has been. For this reason, the main body part 31 of the heat generating component 3 can be arranged on the surface of the heat radiating part 2 at a position farther from the arrangement surface 11 of the base part 1 than the circuit boards 4 and 5 in the projecting direction of the heat radiating part 2. . Thereby, when assembling the mounting structure of the heat generating component 3, after the leads 32 and 33 of the heat generating component 3 are joined to the plurality of circuit boards 4 and 5, the main body 31 of the heat generating component 3 is fixed by screwing or the like. 2 can be fixed. That is, the mounting structure of the heat generating component 3 can be easily assembled as compared with the case where the heat generating component 3 is disposed between the base portion 1 and the circuit boards 4 and 5.

また、本実施形態の実装構造では、発熱部品３の本体部３１が放熱部２の頂面２１に配される。このため、発熱部品３の実装構造を組み立てる際には、別途スペーサを用いることなく、発熱部品３の本体部３１を放熱部２の頂面２１に配するだけで、複数の回路基板４，５をベース部１の配置面１１に対して間隔をあけて配することができる。   Further, in the mounting structure of the present embodiment, the main body portion 31 of the heat generating component 3 is disposed on the top surface 21 of the heat radiating portion 2. For this reason, when assembling the mounting structure of the heat generating component 3, a plurality of circuit boards 4, 5 are simply provided by arranging the main body portion 31 of the heat generating component 3 on the top surface 21 of the heat radiating portion 2 without using a separate spacer. Can be arranged at an interval with respect to the arrangement surface 11 of the base portion 1.

さらに、本実施形態の実装構造では、第二回路基板５に、放熱部２を挿通させる挿通孔５１が形成されている。このため、第二回路基板５に対する発熱部品３の取付位置を自由に設定することができる。具体的には、発熱部品３の本体部３１が第二回路基板５の第一主面５２上に位置するように、発熱部品３を第二回路基板５に取り付けても、発熱部品３の本体部３１を放熱部２の頂面２１に配することができる。
また、第二回路基板５がベース部１の配置面１１のほぼ全体を覆うような大きさであり、放熱部２がベース部１の配置面１１の縁以外の領域（例えば中央領域）に設けられる場合であっても、発熱部品３の本体部３１を放熱部２の頂面２１に配することができる。すなわち、発熱部品３の実装構造を、ベース部１の配置面１１の縁以外の任意の領域（例えば中央領域）に設けることができる。言い換えれば、ベース部１上における実装構造のレイアウトの自由度向上を図ることができる。 Furthermore, in the mounting structure of the present embodiment, an insertion hole 51 through which the heat radiating part 2 is inserted is formed in the second circuit board 5. For this reason, the mounting position of the heat generating component 3 with respect to the second circuit board 5 can be freely set. Specifically, even if the heat generating component 3 is attached to the second circuit board 5 so that the main body portion 31 of the heat generating component 3 is positioned on the first main surface 52 of the second circuit board 5, the main body of the heat generating component 3 is used. The portion 31 can be disposed on the top surface 21 of the heat radiating portion 2.
The second circuit board 5 is sized so as to cover almost the entire arrangement surface 11 of the base portion 1, and the heat radiating portion 2 is provided in a region (for example, a central region) other than the edge of the arrangement surface 11 of the base portion 1. Even if it is the case, the main-body part 31 of the heat-emitting component 3 can be arranged on the top surface 21 of the heat radiating part 2. That is, the mounting structure of the heat generating component 3 can be provided in any region (for example, the central region) other than the edge of the arrangement surface 11 of the base portion 1. In other words, the degree of freedom in the layout of the mounting structure on the base portion 1 can be improved.

さらに、本実施形態の実装構造では、第一回路基板４が大電流用配線を有する大電流回路基板であり、第二回路基板５が小電流配線を有する小電流回路基板である。この場合には、同一の回路基板４，５に、同じ厚さや太さの配線を形成できる。具体的には、大電流回路基板には太さや厚さが大きい大電流用配線だけを形成し、小電流回路基板には太さや厚さが小さい小電流配線を形成だけを形成することができる。すなわち、異なる太さや厚さの配線を同一の回路基板４，５に形成する場合と比較して、各回路基板４，５を安価に製造できる。
また、大電流用配線と小電流配線とを、別個の回路基板４，５に形成することで、実装構造を含む製品の回路における配線同士の電磁気的な干渉を抑制し、製品の回路におけるノイズ発生を好適に抑えることができる。 Furthermore, in the mounting structure of the present embodiment, the first circuit board 4 is a large current circuit board having a large current wiring, and the second circuit board 5 is a small current circuit board having a small current wiring. In this case, wirings having the same thickness and thickness can be formed on the same circuit boards 4 and 5. Specifically, only a large current wiring having a large thickness or thickness can be formed on a large current circuit board, and only a small current wiring having a small thickness or thickness can be formed on a small current circuit board. . That is, the circuit boards 4 and 5 can be manufactured at a lower cost compared to the case where wirings having different thicknesses and thicknesses are formed on the same circuit boards 4 and 5.
Also, by forming the large current wiring and the small current wiring on separate circuit boards 4 and 5, electromagnetic interference between the wirings in the product circuit including the mounting structure can be suppressed, and noise in the product circuit can be suppressed. Generation | occurrence | production can be suppressed suitably.

また、本実施形態の実装構造によれば、平面視で、大電流回路基板である第一回路基板４が、小電流回路基板である第二回路基板５よりも小さいことで、実装構造を含む製品の製造コストを低く抑えることができる。以下、この点について説明する。
大電流回路基板に形成される大電流用配線の太さや厚さは、小電流回路基板に形成される小電流配線よりも大きいため、大電流回路基板の厚さは、小電流回路基板よりも厚くなる。回路基板４，５の厚さは厚いほど高価となるが、平面視した大電流回路基板の大きさを、小電流回路基板よりも小さくすることで、実装構造を含む製品の製造コストを低く抑えることができる。 Further, according to the mounting structure of the present embodiment, the first circuit board 4 that is a large current circuit board is smaller than the second circuit board 5 that is a small current circuit board in plan view, thereby including the mounting structure. Product manufacturing costs can be kept low. Hereinafter, this point will be described.
Since the thickness and thickness of the large current wiring formed on the large current circuit board is larger than the small current wiring formed on the small current circuit board, the thickness of the large current circuit board is larger than that of the small current circuit board. Become thicker. Although the thickness of the circuit boards 4 and 5 increases as the thickness increases, the size of the large current circuit board in plan view is made smaller than that of the small current circuit board, thereby reducing the manufacturing cost of the product including the mounting structure. be able to.

また、本実施形態の実装構造では、小電流回路基板である第二回路基板５が、ベース部１の配置面１１と大電流回路基板である第一回路基板４との間に配されている。このため、大電流回路基板の大電流配線に大電流が流れることで生じた熱が、小電流回路基板に影響することを好適に抑制できる。以下、この点について説明する。
大電流回路基板の大電流配線で生じた熱は、発熱部品３のリード３２，３３及び本体部３１を放熱経路として放熱部２に逃がすことができる。この放熱経路の途中には小電流回路基板が位置しないため、大電流回路基板の熱が小電流回路基板に伝わることを好適に抑制することができる。 In the mounting structure of the present embodiment, the second circuit board 5 that is a small current circuit board is disposed between the arrangement surface 11 of the base portion 1 and the first circuit board 4 that is a large current circuit board. . For this reason, it can suppress suitably that the heat which generate | occur | produced when the large current flows into the large current wiring of the large current circuit board affects a small current circuit board. Hereinafter, this point will be described.
The heat generated in the large current wiring of the large current circuit board can be released to the heat radiating portion 2 using the leads 32 and 33 of the heat generating component 3 and the main body portion 31 as a heat radiation path. Since the small current circuit board is not located in the middle of the heat dissipation path, it is possible to suitably suppress the heat of the large current circuit board from being transmitted to the small current circuit board.

以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲において種々の変更を加えることができる。   Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

本発明の実装構造において、放熱部２は、例えば図４−５に示すように、ベース部１と別個に形成され、ベース部１に対して着脱可能又は着脱不能に取り付けられてもよい。放熱部２をベース部１に固定する場合、その固定手法は、ネジ止めや接着など任意であってよい。
放熱部２をベース部１と別個に形成する場合には、同一種類のベース部１に対し、様々な形状や大きさを有する放熱部２を取り付けることができる。すなわち、ベース部１の汎用性が向上し、実装構造を含む製品の製造コスト削減を図ることができる。 In the mounting structure of the present invention, the heat radiating part 2 may be formed separately from the base part 1 as shown in FIG. When fixing the heat radiation part 2 to the base part 1, the fixing method may be arbitrary, such as screwing or adhesion.
When the heat radiating part 2 is formed separately from the base part 1, the heat radiating part 2 having various shapes and sizes can be attached to the same type of base part 1. That is, the versatility of the base portion 1 is improved, and the manufacturing cost of the product including the mounting structure can be reduced.

本発明の実装構造では、例えば図４に示すように、平面視した大きさが第二回路基板５よりも小さい第一回路基板４が、ベース部１の配置面１１と第二回路基板５との間に配されてもよい。また、本発明の実装構造では、例えば第一回路基板４が小電流回路基板であり、第二回路基板５が大電流回路基板であってもよい。   In the mounting structure of the present invention, for example, as shown in FIG. 4, the first circuit board 4 having a smaller size in plan view than the second circuit board 5 includes the arrangement surface 11 of the base portion 1 and the second circuit board 5. It may be arranged between. In the mounting structure of the present invention, for example, the first circuit board 4 may be a small current circuit board and the second circuit board 5 may be a large current circuit board.

本発明の実装構造では、回路基板に、放熱部を挿通させるための挿通孔が形成されなくてもよい。例えば図５に示すように、放熱部２がベース部１の配置面１１の縁領域に設けられる場合には、第二回路基板５がベース部１の配置面１１のほぼ全体を覆うような大きさであっても、第二回路基板５に挿通孔を形成することなく、第二回路基板５を放熱部２の頂面２１よりも低い位置に配したり、発熱部品３の本体部３１を放熱部２の頂面２１に配したりすることができる。   In the mounting structure of the present invention, an insertion hole for inserting the heat radiating portion may not be formed in the circuit board. For example, as shown in FIG. 5, when the heat radiating portion 2 is provided in the edge region of the arrangement surface 11 of the base portion 1, the second circuit board 5 is large enough to cover almost the entire arrangement surface 11 of the base portion 1. Even so, without forming the insertion hole in the second circuit board 5, the second circuit board 5 is arranged at a position lower than the top surface 21 of the heat radiating part 2, or the main body part 31 of the heat generating component 3 is arranged. It can be arranged on the top surface 21 of the heat dissipating part 2.

本発明の実装構造において、発熱部品の本体部は、放熱部の頂面に配されることに限らず、少なくとも放熱部の表面に配されればよい。例えば図６に示すように、発熱部品３Ａの本体部３１は、放熱部２Ａの側面２１Ａに配されてもよい。この場合、発熱部品３Ａのリード３２Ａ，３３Ａは、上記実施形態のように折り曲げられずに、本体部３１からベース部１の配置面１１に近づく方向（複数の回路基板４，５の配列方向）に真っ直ぐに延びてよい。   In the mounting structure of the present invention, the main body portion of the heat generating component is not limited to be disposed on the top surface of the heat radiating portion, but may be disposed at least on the surface of the heat radiating portion. For example, as shown in FIG. 6, the main body 31 of the heat generating component 3A may be disposed on the side surface 21A of the heat radiating part 2A. In this case, the leads 32A and 33A of the heat generating component 3A are not bent as in the above-described embodiment, and are close to the arrangement surface 11 of the base portion 1 from the main body portion 31 (arrangement direction of the plurality of circuit boards 4 and 5). It may extend straight.

本発明の実装構造において、放熱部の突出方向（回路基板の厚さ方向）に間隔をあけて配列される複数の回路基板には、複数の大電流回路基板や複数の小電流回路基板が含まれてよい。この場合、各回路基板における配線の数をさらに減らすことができ、ベース部の配置面上における回路基板の占有面積をさらに小さく抑えることができる。また、各回路基板に形成される配線の太さや厚さをさらに確保しやすくなり、配線による電気的な損失をさらに小さく抑えることもできる。   In the mounting structure of the present invention, the plurality of circuit boards arranged at intervals in the projecting direction of the heat radiating portion (the thickness direction of the circuit board) include a plurality of large current circuit boards and a plurality of small current circuit boards. It may be. In this case, the number of wirings on each circuit board can be further reduced, and the area occupied by the circuit board on the arrangement surface of the base portion can be further reduced. Further, it becomes easier to secure the thickness and thickness of the wiring formed on each circuit board, and electrical loss due to the wiring can be further reduced.

本発明の実装構造では、例えば同一の回路基板に大電流配線及び小電流配線の両方が形成されてもよい。この場合には、同一の発熱部品の全てのリードが、同一の回路基板の配線に電気接続されてもよい。また、例えば、幾つかの発熱部品のリードが一の回路基板の配線に電気接続され、残りの発熱部品のリードが他の回路基板の配線に電気接続されてもよい。   In the mounting structure of the present invention, for example, both the large current wiring and the small current wiring may be formed on the same circuit board. In this case, all the leads of the same heat generating component may be electrically connected to the wiring of the same circuit board. Further, for example, the leads of some heat generating components may be electrically connected to the wiring of one circuit board, and the leads of the remaining heat generating components may be electrically connected to the wiring of another circuit board.

本発明の実装構造では、少なくとも厚さ方向に配列された複数の回路基板が発熱部品のリードによって接続されていればよい。すなわち、本発明の実装構造は、上記実施形態のベース部や放熱部を備えなくてもよい。   In the mounting structure of the present invention, it is sufficient that at least a plurality of circuit boards arranged in the thickness direction are connected by leads of heat-generating components. That is, the mounting structure of the present invention may not include the base portion and the heat radiating portion of the above embodiment.

１ ベース部
２，２Ａ 放熱部
３，３Ａ 発熱部品
４ 第一回路基板（大電流回路基板、回路基板）
５ 第二回路基板（小電流回路基板、回路基板）
１１ 配置面
２１ 頂面（表面）
２１Ａ 側面（表面）
３１ 本体部
３２，３２Ａ 大電流用リード（リード）
３３，３３Ａ 小電流用リード（リード）
４２，５２ 第一主面
５１ 挿通孔 1 Base part 2, 2A Heat radiation part 3, 3A Heating component 4 First circuit board (high current circuit board, circuit board)
5 Second circuit board (small current circuit board, circuit board)
11 Arrangement surface 21 Top surface (surface)
21A Side (surface)
31 Main body 32, 32A Lead for large current (lead)
33, 33A Small current lead (lead)
42, 52 First main surface 51 Insertion hole

Claims (9)

本体部及び本体部から突出するリードを有する発熱部品と、厚さ方向に間隔をあけて配列された複数の回路基板と、を備え、
複数の前記回路基板が、前記リードによって接続された発熱部品の実装構造。 A heat generating component having a main body part and a lead protruding from the main body part, and a plurality of circuit boards arranged at intervals in the thickness direction,
A mounting structure of a heat generating component in which a plurality of the circuit boards are connected by the leads. 配置面を有するベース部と、前記配置面から突出するように前記ベース部に設けられた放熱部と、を備え、
前記発熱部品の本体部が、前記放熱部の表面に配され、
複数の前記回路基板が、前記放熱部の突出方向の先端よりも低い位置において、前記放熱部の突出方向に間隔をあけて配列された請求項１に記載の発熱部品の実装構造。 A base portion having an arrangement surface, and a heat dissipating portion provided on the base portion so as to protrude from the arrangement surface,
The main part of the heat generating component is arranged on the surface of the heat radiating part,
The heat generating component mounting structure according to claim 1, wherein the plurality of circuit boards are arranged at intervals in the projecting direction of the heat dissipating part at a position lower than a tip in the projecting direction of the heat dissipating part. 前記発熱部品の本体部が、前記放熱部の頂面に配された請求項２に記載の発熱部品の実装構造。   The heat generating component mounting structure according to claim 2, wherein a main body portion of the heat generating component is disposed on a top surface of the heat radiating portion. 少なくとも一つの前記回路基板に、その厚さ方向に貫通して前記放熱部を挿通させる挿通孔が形成されている請求項２又は請求項３に記載の発熱部品の実装構造。   The mounting structure for a heat-generating component according to claim 2 or 3, wherein an insertion hole is formed in at least one of the circuit boards so as to penetrate the heat dissipation portion through the thickness direction thereof. 前記放熱部は、前記ベース部と別個に形成され、前記ベース部に対して取り付けられる請求項２から請求項４のいずれか一項に記載の発熱部品の実装構造。   The heat-dissipating part mounting structure according to any one of claims 2 to 4, wherein the heat dissipating part is formed separately from the base part and attached to the base part. 複数の前記回路基板には、
大電流が流れる大電流用配線を有する大電流回路基板と、
前記大電流よりも小さい小電流が流れる小電流用配線を有する小電流回路基板と、がある請求項１から請求項４のいずれか一項に記載の発熱部品の実装構造。 The plurality of circuit boards include
A large current circuit board having a large current wiring through which a large current flows;
The heat generating component mounting structure according to claim 1, further comprising: a small current circuit board having a small current wiring through which a small current smaller than the large current flows. 前記回路基板の厚さ方向から見た平面視で、前記大電流回路基板が、前記小電流回路基板よりも小さい請求項６に記載の発熱部品の実装構造。   The heat generating component mounting structure according to claim 6, wherein the large current circuit board is smaller than the small current circuit board in a plan view as viewed from the thickness direction of the circuit board. 前記発熱部品のリードには、大電流が流れる大電流用リードと、小電流が流れる小電流用リードと、があり、
前記大電流用リードが、前記大電流回路基板の前記大電流用配線に電気接続され、
前記小電流用リードが、前記小電流回路基板の前記小電流用配線に電気接続されている請求項６又は請求項７に記載の発熱部品の実装構造。 The lead of the heat generating component includes a large current lead through which a large current flows and a small current lead through which a small current flows,
The large current lead is electrically connected to the large current wiring of the large current circuit board;
The heating component mounting structure according to claim 6 or 7, wherein the small current lead is electrically connected to the small current wiring of the small current circuit board. 配置面を有するベース部と、前記配置面から突出するように前記ベース部に設けられた放熱部と、を備え、
前記発熱部品の本体部が、前記放熱部の表面に配され、
複数の前記回路基板が、前記放熱部の突出方向の先端よりも低い位置において、前記放熱部の突出方向に間隔をあけて配列され、
複数の前記回路基板には、大電流が流れる大電流用配線を有する大電流回路基板と、前記大電流よりも小さい小電流が流れる小電流用配線を有する小電流回路基板と、があり、
前記小電流回路基板が、前記配置面と前記大電流回路基板との間に配されている請求項１から請求項８のいずれか一項に記載の発熱部品の実装構造。 A base portion having an arrangement surface, and a heat dissipating portion provided on the base portion so as to protrude from the arrangement surface,
The main part of the heat generating component is arranged on the surface of the heat radiating part,
A plurality of the circuit boards are arranged at intervals lower in the protruding direction of the heat radiating portion at a position lower than the tip in the protruding direction of the heat radiating portion,
The plurality of circuit boards include a large current circuit board having a large current wiring through which a large current flows, and a small current circuit board having a small current wiring through which a small current smaller than the large current flows,
The heating component mounting structure according to any one of claims 1 to 8, wherein the small current circuit board is disposed between the arrangement surface and the large current circuit board.
JP2017052161A 2017-03-17 2017-03-17 Mounting structure of heat generating parts Active JP6826922B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017052161A JP6826922B2 (en) 2017-03-17 2017-03-17 Mounting structure of heat generating parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017052161A JP6826922B2 (en) 2017-03-17 2017-03-17 Mounting structure of heat generating parts

Publications (2)

Publication Number Publication Date
JP2018157050A true JP2018157050A (en) 2018-10-04
JP6826922B2 JP6826922B2 (en) 2021-02-10

Family

ID=63718201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017052161A Active JP6826922B2 (en) 2017-03-17 2017-03-17 Mounting structure of heat generating parts

Country Status (1)

Country Link
JP (1) JP6826922B2 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217873U (en) * 1988-07-19 1990-02-06
JPH05251839A (en) * 1992-03-04 1993-09-28 Tokyo Electric Co Ltd Electronic part fitting device
JPH0846317A (en) * 1994-07-26 1996-02-16 Honda Motor Co Ltd Control board
JP2002271068A (en) * 2001-03-14 2002-09-20 Denso Corp Electronic device
JP2003179202A (en) * 2001-12-11 2003-06-27 Denso Corp Power circuit device for vehicle and method of manufacturing the same
JP2007281138A (en) * 2006-04-05 2007-10-25 Yazaki Corp Wiring board
DE102012204133A1 (en) * 2012-03-16 2013-09-19 Continental Automotive Gmbh Method, apparatus and system for a power circuit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217873U (en) * 1988-07-19 1990-02-06
JPH05251839A (en) * 1992-03-04 1993-09-28 Tokyo Electric Co Ltd Electronic part fitting device
JPH0846317A (en) * 1994-07-26 1996-02-16 Honda Motor Co Ltd Control board
JP2002271068A (en) * 2001-03-14 2002-09-20 Denso Corp Electronic device
JP2003179202A (en) * 2001-12-11 2003-06-27 Denso Corp Power circuit device for vehicle and method of manufacturing the same
JP2007281138A (en) * 2006-04-05 2007-10-25 Yazaki Corp Wiring board
DE102012204133A1 (en) * 2012-03-16 2013-09-19 Continental Automotive Gmbh Method, apparatus and system for a power circuit

Also Published As

Publication number Publication date
JP6826922B2 (en) 2021-02-10

Similar Documents

Publication Publication Date Title
JP6354600B2 (en) CIRCUIT COMPOSITION, ELECTRIC CONNECTION BOX, AND METHOD FOR MANUFACTURING CIRCUIT COMPOSITION
JP5106519B2 (en) Thermally conductive substrate and electronic component mounting method thereof
CN106233552B (en) circuit structure and electric connection box
JP5937315B2 (en) Light emitting diode
JP6402942B2 (en) Electrical junction box
WO2017047373A1 (en) Circuit structure and electrical connection box
JPWO2015107804A1 (en) Semiconductor module
JP6477373B2 (en) Circuit assembly and electrical junction box
JP6790902B2 (en) Electronic device
CN106256063B (en) circuit structure and electric connection box
JP6948855B2 (en) Power semiconductor device and power conversion device using it
JP5533787B2 (en) Heat dissipation device
JP6780792B2 (en) Circuit components and electrical junction boxes
JP6312527B2 (en) Electronic component mounting structure with heat sink
JP2019169638A (en) Heating component mounting structure
JP2002171087A (en) Electronic equipment
JP3104749B2 (en) Circuit device and method of manufacturing the same
WO2022064842A1 (en) Substrate unit
JP2018157050A (en) Mounting structure of heating components
JP2009017624A (en) Motor controller
JP2925475B2 (en) Heat dissipation structure of electronic device
JP5466966B2 (en) Wiring board, semiconductor device, semiconductor module, and display device
JP2008258495A (en) Heat dissipation structure of electronic component mounting circuit board
JP2019096746A (en) Electronic equipment
JP2010040569A (en) Electronic component module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191106

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200819

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201222

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210118

R150 Certificate of patent or registration of utility model

Ref document number: 6826922

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150