JPH05251839A - Electronic part fitting device - Google Patents

Abstract

PURPOSE:To make mechanical assembly possible and to make it difficult for electric contact malfunction to occur, by forming a main board part and a separated board part in a separable state, and connecting the both electrically with flexible members. CONSTITUTION:A board part is composed of a main board part 21 on which electric parts 16 other than a fixed electric part 12 are mounted, and a separated board part 22 on which the fixed electric part 12 is mounted, and the main board part 21 and the separated board part 22 are formed in a separable state. Besides, this main board part 21 and the separated board part 22 are connected electrically with flexible members 33. Consequently, it becomes possible to fit the fixed electric part 12 easily even if the fitted position of the fixed electric part 12 against another surface is shifted a little bit. Besides, it is possible to fit the fixed electric part 12 to other surfaces within the deformable range of the flexible members 33. And, even if the circuit board 17 and other surfaces move relatively by vibration, it becomes difficult for stress to be applied to the connection of the fixed electric part 12 with the circuit board 17, and it becomes possible to prevent electric connection malfunction of the fixed electric part 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component mounting apparatus for mounting a fixed electric component fixed to a substrate and another surface different from the substrate.

[0002]

2. Description of the Related Art Conventionally, for example, a structure shown in FIG. 3 has been known as an electric component mounting device of this type. This Figure 3
In the electrical component mounting device shown in FIG. 1, a transistor 12 having a terminal portion 11 is placed on a bottom surface 14 of a heat dissipation plate 13 bent and formed in a substantially L shape, and is mechanically connected and fixed by a mounting screw 15a. Has been done. Further, the bottom surface 14 of the heat sink 13 to which the transistor 12 is attached is fixed to a circuit board 17 on which other electric components 16 are mounted by a plurality of mounting screws 15b, and the side surface 18 of the heat sink 13 is provided on the side surface 18 of the board 17 or the like. Side 20 of case 19 to accommodate
Is fixed by a plurality of mounting screws 15c, and the terminal portion 11 of the transistor 12 is inserted into the mounting hole 31 of the circuit board 17 and electrically and mechanically connected.

[0003]

However, in the electric component mounting apparatus having the structure shown in FIG. 3, the heat of the transistor 12 is conducted to the case 19 through the heat radiating plate 13, so that there is a problem in heat radiating efficiency. .. In addition, heat sink 13, mounting screw 15
Since the transistor 12 is fixed to the heat sink 13 and the circuit board 17, which are two different parts, positioning is difficult, and it becomes difficult to apply mechanical assembly, which deteriorates work efficiency. , Which is a cause of cost increase.

Further, when the heat sink 13 and the circuit board 17 relatively move due to vibration or the like, there is a problem that a poor electrical connection may occur between the terminal portion 11 of the transistor 12 and the circuit board 17. is doing.

The present invention has been made in view of the above problems, and does not cause deterioration of work efficiency and increase in cost,
It is an object of the present invention to provide an electrical component mounting device that can be mechanically assembled and that is unlikely to cause poor electrical contact.

[0006]

According to another aspect of the present invention, there is provided an electrical component mounting apparatus in which an electrical connection portion provided on one surface of a fixed electrical component is connected to a substrate and the other surface of the fixed electrical component is the substrate. An electrical component mounting device fixed to different surfaces,
A main board part on which the board is mounted with at least an electric component other than the fixed electric part; and a separation board part on which the fixed electric part is mounted so as to be separable from the main board part.
A flexible member for electrically connecting the main substrate portion and the separation substrate portion is provided.

[0007]

In the electrical component mounting apparatus of the present invention, since the substrate is formed so that the separation substrate portion and the main substrate portion are separable from each other, even if the mounting position of the fixed electrical component on the other surface is slightly displaced, it is easy. Can be installed on.

Further, since the separation substrate portion on which the fixed electric component is mounted and the main substrate portion are electrically connected by the flexible member, the fixed electric component is within the deformable range of the flexible member. Can be attached to another surface, and even if the circuit board and the other surface relatively move due to vibration, stress is absorbed by the flexible member, so Stress is less likely to be applied to the connection portion, and the electrical connection failure of the fixed electric component can be prevented.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the electric component mounting apparatus of the present invention will be described below with reference to FIGS.

The parts corresponding to those of the conventional example shown in FIG.

As shown in FIG. 2, the circuit board 17 is integrally formed with a hexagonal separation substrate portion 22 which is separable by a knockout for mounting a semiconductor such as a transistor 12 as a fixed electric component. Printed wiring patterns (not shown) made of copper foil are formed on the back surfaces of the separation board portion 22 and the separation board portion 22, respectively. The main board portion 21 is separable from the separation substrate portion 22 by the cut groove 23 formed along the edge portion of the separation substrate portion 22, and the cut groove is formed in the vicinity of the side edge of the circuit board 17. Thin connection part provided in the middle of 23
It is connected to the separation substrate portion 22 at 25. Also, the main board part
The mounting holes 31 are formed in the mounting positions of the components such as the transistor 12 on the 21 and the separation substrate portion 22, respectively.
Is a mounting hole 31a for mounting the transistor 12, mounting holes 31b, 31c for mounting a jumper wire 33, which will be described later, and an electrical component 16.
It is composed of a mounting hole 31d for mounting. The transistor 12 has a substantially rectangular shape, and the transistor 12 has a mounting hole 32 for mounting on the central side surface,
A bent terminal portion 11 is provided on the bottom surface.

Then, the transistor 12 is mounted on the separation substrate portion 22 by an insert machine or manually. That is, as shown in FIG. 1, the longitudinal direction of the transistor 12 is perpendicular to the substrate 17, and
So that the transistor is located parallel to the side edge of the substrate 17.
Insert the 12 terminal portions 11 into the mounting hole portions 31a.

Further, one end of the conductive U-shaped vertical jumper wire 33, which is a flexible member, is inserted into the attachment hole portion 31b of the separation substrate portion 22, and the other end is attached to the attachment hole of the main substrate portion 21. Insert into part 31c. Then, the main board portion 21 and the separation board portion 22
Are electrically and mechanically connected with this jumper wire 33. Note that the jumper wire 33 is similarly inserted by an insert machine or manually.

Further, the main substrate portion 21 has a transistor 12
Other lead wires 34 formed on the electric component 16 such as a resistor, a capacitor, and a connecting wire are similarly mounted by an insert machine or manually.

Then, the printed wiring pattern of the copper foil on the back surface of the circuit board 17 is soldered to each of the terminal portion 11 of the transistor 12, the tip portion of the jumper wire 33 and the lead wire 34 of the electric component 16 by an automatic soldering device or the like. To do.

Further, the case 19 for accommodating the circuit board 17 is
A case recess 35 for mounting the transistor 12 is formed inward on the upper side of the case side surface 20 perpendicular to the circuit board 17, and the transistor 12 mounted on the separation substrate section 22 is provided on the inner surface side of the case recess 35. Are opposed to the inner surface side of the case recess 35, and fixed tightly with the mounting screw 15.

Then, the side edge of the main board portion 21 is connected to the case side surface 20.
In the state in which the separation substrate 22 is in close contact with, the separation substrate portion 22 is attached to the case bottom surface 37 by screwing, cutting and raising. And the connecting part
25 is separated, that is, the main board part 21 and the separation board part 22 are separated, and the jumper wire 33 is slightly loosened, and the main board part 21 is screwed to the bottom surface 37 of the case, and attached by cutting and raising. ..

Next, the operation of this embodiment will be described.

As shown in FIG. 1, since the transistor 12 does not use a heat radiating plate as in the conventional case, but is directly adhered and fixed to the case side surface 20 without a heat radiating plate to radiate heat, the heat radiating efficiency is improved.

Further, as compared with the conventional device using the heat sink, since the heat sink and the mounting member of the heat sink are not used, the number of parts is reduced as a whole, and the work efficiency is improved.
Further, the material of parts is reduced, and the manufacturing cost is reduced.

Further, as shown in FIG. 2, since the main board portion 21 and the separation board portion 22 are integrally formed, the main board portion 21 and the separation board portion 22 can be automatically connected by the jumper wire 33 and separated. The transistor 12 can be automatically mounted on the board portion 22, while the electric component 16 can be automatically mounted on the main board portion 21. Furthermore, the lead wires 34 of the electric component 16 can be soldered by an automatic soldering device, etc. The elements can be reduced and the machine can be assembled.

Then, as shown in FIG. 1, the circuit board 17
When the is mounted on the bottom surface 37 of the case, the connecting portion 25 is separated and the main substrate portion 21 and the separated substrate portion 22 are mounted in a separated state. Since the connecting portion 25 is small and thin, it can be easily separated.

Further, the main board portion 21 and the separation board portion 22 are vertical and flexible with respect to the circuit board 17.
By being connected by 33, stress concentrates on the bent portion of the jumper wire 33 when the case 19 and the transistor 12 receive an external force. The terminal portion 11 is prevented from being damaged and the transistor 12 is prevented from falling off the main substrate portion 21. Since the transistor 12 is securely fixed to the circuit board 17 in this manner, even if the transistor 12 is fixed to the case side surface 20 of the case 19 with one mounting screw 15, the transistor 12 does not fall off the circuit board 17 or the case 19. Is prevented.

In this embodiment, the example in which only the transistor 12 is mounted on the separation substrate section 22 is shown.
In addition to the transistor 12, other semiconductors that require heat radiation may be mounted on the transistor 22, and electrical components other than the semiconductor that may simply be fixed may be mounted on the transistor 22.

Further, in this embodiment, the jumper wire 33 has been described as an example of the flexible member for connecting the main board portion 21 and the separation board portion 22, but instead of the jumper wire 33,
A resistor, a rectifying element with a lead wire, etc., which are necessary for an electric circuit, may also be used in combination.

The connecting portion 25 between the main substrate portion 21 and the separation substrate portion 22 is not separated in advance, and when the transistor 12 is mounted on the separation substrate portion 22 and cannot be aligned with the side surface 20 of the case, or vibration occurs. They may be separated when other impact is applied.

[0027]

According to the electrical component mounting apparatus of the present invention, since the substrate is formed so that the separation substrate portion and the main substrate portion can be separated from each other, the mounting position of the fixed electrical component on the other surface is slightly displaced. However, it can be easily installed.

Further, since the separation substrate portion on which the fixed electric component is mounted and the main substrate portion are electrically connected by the flexible member, the fixed electric component is within the deformable range of the flexible member. Can be attached to another surface, and even if the circuit board and the other surface relatively move due to vibration, stress is absorbed by the flexible member, so Stress is less likely to be applied to the connecting portion, and it is possible to prevent a defective electrical connection of the fixed electric component.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing an embodiment of an electric component mounting device of the present invention.

FIG. 2 is a perspective view showing a state before assembly of an embodiment of an electric component mounting apparatus of the present invention.

FIG. 3 is a partially cutaway perspective view showing a conventional electrical component mounting device.

[Explanation of symbols]

 12 Transistor as fixed electrical component 16 Electrical component 17 Circuit board as substrate 20 Side of case as surface 21 Main substrate 22 Separation substrate 33 Jumper wire as flexible member

Claims (1)

[Claims] 1. An electrical component mounting device in which an electrical connection portion provided on one surface of a fixed electrical component is connected to a substrate and the other surface of the fixed electrical component is fixed to a surface different from the substrate. A main board part on which the board mounts at least an electric component other than the fixed electric part; a separation board part formed so as to be separable from the main board part to mount the fixed electric part; and the main board part. And a flexible member for electrically connecting the separation substrate portion, the electric component mounting device.