JP4089300B2 - Substrate storage box - Google Patents

Substrate storage box Download PDF

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Publication number
JP4089300B2
JP4089300B2 JP2002164239A JP2002164239A JP4089300B2 JP 4089300 B2 JP4089300 B2 JP 4089300B2 JP 2002164239 A JP2002164239 A JP 2002164239A JP 2002164239 A JP2002164239 A JP 2002164239A JP 4089300 B2 JP4089300 B2 JP 4089300B2
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circuit board
screw
heat
board
storage box
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JP2004014690A (en
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基生 中井
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JTEKT Corp
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JTEKT Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、放熱部を備える箱本体に回路基板を収容する基板収容箱に関し、特に、回路基板で発生した熱を効率的に放熱部へ伝熱させるものである。
【0002】
【従来の技術】
従来、各種制御用の回路基板は基板自体の保護に加えて防水及び防塵等を確保するため基板収容箱に収容されている。また、収容される回路基板の発熱量が大きい場合は、熱による不具合発生を防止するため、基板収容箱に放熱部を設けて発生した熱を外部に放熱するようにしている。このような基板収容箱は種々の箇所で使用されており、特に、車両に搭載されて車両の各種電装品の制御に用いられることが多い。
【0003】
図7は、従来の基板収容箱1の断面図である。基板収容箱1は車両の電動パワーステアリング装置の制御用であり、箱本体2の内部に電源供給の制御を行うパワー回路基板4及び各種信号の制御等を行う制御回路基板5を夫々間隔を隔てた積層状態で収容し、カバー8で箱本体2の開口を被うようにしている。
【0004】
箱本体2はインサート成形で形成した合成樹脂製の周壁2aの底部にアルミニウム製のヒートシンク3を設けると共に周壁2aに制御回路基板5用の載置部2bを突設している。パワー回路基板4はセラミック製の基板部4aにパワー用回路導体4bを形成すると共に、発熱量が大きい電力制御用のパワートランジスタ等のパワー半導体4c等を実装している。一方、制御回路基板5も基板部5aに制御用回路導体5bを形成し、制御用の半導体5c等を実装している。
【0005】
パワー回路基板4は合成接着剤6でヒートシンク3に載置された状態で固定され、発生した熱をヒートシンク3へ伝達しヒートシンク3から外部へ放熱している。一方、制御回路基板5は、パワー回路基板4から間隔を隔てた載置部2aに合成接着剤6で固定され、パワー回路基板4で発生する熱の影響を受けないようにしている。また、パワー回路基板4及び制御回路基板5は中継線7をコネクタ接続することで、両基板4、5間に所要の回路を接続している。
【0006】
【発明が解決しようとする課題】
基板収容箱1は、パワー回路基板4の熱をヒートシンク3から放熱するようにしているが、パワー回路基板4とヒートシンク3との間に合成接着剤6が介在している。合成接着剤6はパワー回路基板4をヒートシンク3へ固定するために必要であるが、樹脂成分等が含まれるためパワー回路基板4で発生した熱をヒートシンク3へ伝達する妨げとなり、放熱効率が低減する問題がある。
【0007】
なお、このような問題に対して、ヒートシンク3にネジ穴を設けてパワー回路基板4をヒートシンク3にボルトによりネジ止め固定することも想定できる。しかし、このようなネジ止め固定構造では、複雑な形状のヒートシンク3にネジ穴を形成する必要がある上に、セラミック製のパワー回路基板4の基板部4aにネジ止めによる締結力で割れが生じることが考えられ、このような固定構造は好ましくない。
【0008】
一方、図7に示す基板収容箱1では、パワー回路基板4及び制御回路基板5を中継線7で接続して所要の回路を形成しているが、中継線7を接続するために、パワー回路基板4及び制御回路基板5に接続用のコネクタ等を設けねばならず、各基板4、5に係るコストが上昇すると共に、中継線7の接続に手間を要する問題もある。
【0009】
本発明は、斯かる問題に鑑みてなされたものであり、パワー回路基板等の回路基板に発生した熱を効率的にヒートシンクから放熱できる基板収容箱を提供することを目的とする。
また、本発明は、基板部に割れ等の支障が生じない構成で確実にパワー回路基板等の回路基板をヒートシンクに固定する基板収容箱を提供することを目的とする。
さらに、本発明は、収容される複数の回路基板間の回路の接続に係る手間等を削減した基板収容箱を提供することを目的とする。
【0010】
【課題を解決するための手段】
第1発明に係る基板収容箱は、放熱部が設けてある箱本体に回路基板を前記放熱部に載置して収容する基板収容箱において、前記放熱部に載置してある第1回路基板と、該第1回路基板に対して平行的に前記箱本体の周壁から突設しており、貫通ネジ穴が形成してある載置部と、該載置部に載置してあり、前記貫通ネジ穴と連通する貫通穴が形成してある第2回路基板と、前記貫通穴を挿通して前記貫通ネジ穴との螺合により前記第2回路基板を前記載置部に固定した状態で、先端部が前記第1回路基板を前記放熱部へ押圧する押圧ネジとを備えることを特徴とする。
【0011】
第1発明にあっては、第2回路基板を載置部に固定する押圧ネジを利用して、第1回路基板を放熱部へ押圧するため、合成接着剤を使用せずに第1回路基板を放熱部へ直接的に接触させた状態で固定でき、熱伝導性に優れた状態を確保して放熱性を向上できる。また、押圧ネジは、載置部の貫通ネジ穴と螺合するため放熱部にネジ穴を加工する必要もない。
【0012】
なお、押圧時に第1回路基板に反りが生じないようにするため、少なくとも第1回路基板の周囲4角及び中央1箇所を押圧ネジで押圧して第1回路基板を均等に放熱部へ押圧することが好ましい。また、第1回路基板の基板面積が大きい場合は、確実に放熱部へ押圧するために、前記5箇所に加えて周囲各辺及び中央近傍を押圧ネジでさらに押圧することが好適である。さらに、第1回路基板及び放熱部が当接する各面の面粗度によっては、第1回路基板を放熱部へ押圧しても両者の間に隙間が生じることもあるため、両者の間に熱伝達用グリース等を充填することが好適である。
【0013】
また、前記第1回路基板には、前記第2回路基板に比べて発熱量が大きいパワー回路基板等を適用することが好ましく、このようにすることで、第1回路基板が発生した熱を放熱部から放熱し、発熱量が小さい制御回路基板等の第2回路基板が熱により誤作動する等の不具合を低減できる。なお、発熱量の小さい第2回路基板は1枚に限定されるものではなく、箱本体に載置部を積層方向に設けることで、複数の第2回路基板を基板収容箱に収めるようにしてもよい。
【0014】
第2発明に係る基板収容箱は、前記押圧ネジが、前記第1回路基板を前記放熱部へ付勢する弾性部を備えることを特徴とする。
第2発明にあっては、押圧ネジに弾性部を設けることで、第1回路基板の放熱部への押圧荷重を適切に設定でき、第1回路基板の押圧負担を低減して無理なく放熱部に当接させることができる。なお、弾性部には板バネ及びコイルバネ等が適用可能である。
【0015】
第3発明に係る基板収容箱は、前記第1回路基板が、表出してある第1回路導体を備え、該第1回路導体に前記押圧ネジの先端部が当接してあることを特徴とする。
第3発明にあっては、押圧ネジで第1回路導体を押圧することで、押圧にかかる第1回路基板の負担を一段と低減した状態で、確実に第1回路基板を所要の押圧力で放熱部に押し付けることができる。
【0016】
第4発明に係る基板収容箱は、前記第2回路基板が、表出してある第2回路導体を備え、前記押圧ネジは、導電材で形成してあり、前記第2回路導体と接触してあることを特徴とする。
第4発明にあっては、導電材で形成した押圧ネジを両方の回路基板の各回路導体に接触させることで、押圧ネジ自体を中継用導電部材として利用でき、従来、両方の回路基板間の回路接続に必要であった中継線を不要にでき、回路基板間の回路接続を容易に行うことができる。
【0017】
なお、押圧ネジを形成する導電材としては、アルミニウム、銅、金、又は、銀等の材料を適用できる。また、押圧ネジを上述した各種材料で形成する以外には、押圧ネジを非導電材で形成すると共に上述した各種材料で押圧ネジを被覆して導電性を確保するようにしてもよい。
【0018】
【発明の実施の形態】
以下、本発明をその実施形態を示す図面に基づいて説明する。
図1は、本発明の実施形態に係る基板収容箱10の断面図である。本実施形態の基板収容箱10は車両に搭載されて、図2に示す電動パワーステアリング装置21における操舵補助用のモータ22及びトルクセンサ23等と接続されてモータ22の回転の制御を行っている。
【0019】
基板収容箱10は、底部に放熱部であるヒートシンク13を設けた箱本体12の内部に、電源供給を制御するパワー回路基板14及びモータ22の回転に係る信号等を制御する制御回路基板15を、間隔を隔てた積層状態で押圧ネジ11により夫々固定して収容し、カバー18で箱本体12を被うようにしている。
【0020】
箱本体12は、図3に示すように、三方を囲う周壁12aを設けており、周壁12aの内部の4角には、ヒートシンク13から間隔を隔てた箇所でヒートシンク13の上面13aと平行となる向きに載置部12bを夫々突設しており、また、三方の周壁12aの一つには辺方向の中央箇所から箱本体12の中央部へ突設する中央載置部12cを設けている。これら各載置部12b及び中央載置部12cには貫通ネジ穴12dを夫々形成している。
【0021】
なお、箱本体12は合成樹脂製であり、アルミニウム製のヒートシンク13と共にインサート成形することでヒートシンク13と一体に形成されている。また、カバー18は、箱本体12の上方の開口部12e及び側方の開口部12fを被う略L字形状に形成している。
【0022】
一方、図1に示すパワー回路基板14は、セラミック製の基板部14aにエッチング処理を行うことで上面14dに第1回路導体14bを回路形状に合わせて表出させると共に、電源供給を制御するパワー半導体14cを実装している。なお、本実施形態のパワー回路基板14は、図3に示す箱本体12に収容された状態で、載置部12b及び中央載置部12cの各貫通ネジ穴12dと平面視方向で対向する箇所に第1回路導体14bが存在する回路形状にしている。
【0023】
上述したパワー回路基板14は第1回路基板に相当し、第1回路導体14b等により形成された回路に電圧値の高い電源(車載バッテリー)からの電流が流れるため、電流が流れる際のパワー半導体14c等で発生する発熱量は、第2回路基板に相当する制御回路基板15に比べて大きくなっている。
【0024】
図1に示す制御回路基板15は、基板部15aの上面15dに第2回路導体15bを回路形状に合わせて表出させ、制御用の各種半導体15cを実装している。また、図4に示すように、制御回路基板15は、パワー回路基板14と同様に箱本体12に収容された状態で貫通ネジ穴12dに対向する箇所に第2回路導体15bが存在する回路形状にしていると共に、各貫通ネジ穴12dと一致する箇所に貫通穴15eを夫々形成している。
【0025】
なお、制御回路基板15の第2回路導体15bを流れる電流の電流値は、パワー回路基板14の第1回路導体14bを流れる電流値に比べて微小である。また、制御回路基板15の第2回路導体15bで形成される回路の一部は、電源供給等のためパワー回路基板14の第1回路導体14bで形成される所要回路と接続する必要があり、制御回路基板15とパワー回路基板14との間の回路接続には、押圧ネジ11を利用している。
【0026】
押圧ネジ11は、図5(a)に示すように、ネジ頭部11a、ネジ部11b、及び、所要の付勢力を有する弾性部である板バネ状のバネ部11cを一体にして形成されており、材質には導電材である銅を用いている。なお、ネジ部11bは箱本体12の各貫通ネジ穴12dと螺合する寸法に設定されており、また、無荷重時のバネ部11cは、貫通ネジ穴12dの穴径に収まる範囲で緩やかに湾曲した形状にして、荷重時に撓む方向が一様になるようにしている。
【0027】
次に、本実施形態に係る基板収容箱10の組立手順を説明する。
先ず、図3に示す箱本体12のヒートシンク13の上面13aに、図1及び図5(a)(b)に示すように伝熱用グリース20を塗布する。伝熱用グリース20の塗布後、パワー回路基板14を箱本体12の側方の開口部12fから差し込んでヒートシンク13の上面13aに載置する。また、制御回路基板15は、箱本体12の上方の開口部12eから内部に収めて載置部12b及び中央載置部12cに載置する。
【0028】
なお、このように制御回路基板15を載置することで、図1、図5(a)(b)に示すように、制御回路基板15の各貫通穴15eと、載置部12b及び中央載置部12cの各貫通ネジ穴12dとは連通した状態になっている。次に、各貫通穴15e及び貫通ネジ穴12dに押圧ネジ11を挿通して螺合方向に回転させると、図5(b)に示すように、先端部であるバネ部11cがパワー回路基板14の第1回路導体14bに当接する。なお、この状態では、押圧ネジ11のネジ頭部11aは制御回路基板15の第2回路導体15bと接触していない。
【0029】
上述した状態から、押圧ネジ11を更に螺合方向に回転させると、バネ部11cが撓んで貫通ネジ穴12dと完全に螺合し、図1に示すように、ネジ頭部11aが制御回路基板15の第2回路導体15bと接触し、制御回路基板15を載置部12b及び中央載置部12cに締結固定する。一方、螺合した押圧ネジ11は、バネ部11cの撓みによりパワー回路基板14を伝熱用グリース20を介在させてヒートシンク13へ均等に所要の付勢力で押圧して適切な荷重がかかった状態で固定している。このようにパワー回路基板14及び制御回路基板15を箱本体12に固定した後、カバー18を被せて基板収容箱10を完成している。
【0030】
完成した基板収容箱10は、パワー回路基板14が伝熱用グリース20を介在させてヒートシンク13へ押圧されることで、パワー回路基板14とヒートシンク13との間には隙間が存在せず、パワー回路基板14で発生した熱は確実にヒートシンク13へ伝達されて外部へ放熱されている。また、パワー回路基板14は剛性のある第1回路導体14bを、バネ部11cを有する押圧ネジ11で押圧されているため、基板部14aの押圧に対する負担は、ネジで直接固定される場合に比べて軽減されており、割れ等の不具合も生じにくい。
【0031】
さらに、押圧ネジ11は、バネ部11cでパワー回路基板14の第1回路部14と接触すると共に、ネジ頭部11aで制御回路基板15の第2回路導体15bと接触することで、押圧ネジ11自体を導通させて両基板間の所要の回路接続を行っており、基板収容箱10は接続用の中継線を廃止し、回路の中継に係る手間等を削減している。
【0032】
なお、本発明に係る基板収容箱10は上述した形態に限定されるものではなく、種々の変形例を適用することが可能である。例えば、図6(a)に示す押圧ネジ31のように、バネ部31cにコイルバネ状のものを適用でき、バネ部31cはネジ部31bと別々に回転するようしてもよく、一緒に回転するようにしてもよい。また、図6(b)に示す押圧ネジ41のように、ネジ部41bの途中にバネ部41cを設けるようにしてもよく、さらに、図6(c)に示すように、ネジ部51bの内部にバネ部51cを内蔵したプランジャタイプの押圧ネジ51を適用することも可能である。
【0033】
さらに、また、押圧ネジ11(変形例の押圧ネジも含む。以下同様)は導電性を確保するために、銅以外の材質として、アルミニウム、金、又は、銀で製作することができ、また、導電性が低い材質で製作する場合等は、アルミニウム、銅、金、又は、銀で表面をメッキ等により被覆して導電性を確保するようにしてもよい。なお、パワー回路基板14及び制御回路基板15間の回路の接続が必要ない場合等は、押圧ネジ11に導電性を確保しなくてもよく、押圧ネジ11と制御回路基板15の第2回路導体15bとを接触させる必要もない。
【0034】
また、パワー回路基板14の基板部14aはセラミックで形成する以外に、絶縁層を有するアルミニウム等の金属で形成するようにしてもよく、このように基板部14aを金属で形成すると共にパワー回路基板14及び制御回路基板15間の回路の接続が必要ないときは、押圧ネジ11で基板部14aを直接的に押圧するようにしてもよい。
【0035】
さらに、基板収容箱10は、箱本体12の周壁12aに基板積層方向に複数の載置部12b等を設けることで、1枚のパワー回路基板14に対して複数枚の制御回路基板15を収容するようにしてもよい。
【0036】
【発明の効果】
以上に詳述した如く、第1発明にあっては、第1回路基板を放熱部に対して熱伝導性に優れた状態で固定できるため放熱性を従来に比べて向上できる。
第2発明にあっては、第1回路基板を適切な荷重で放熱部へ押圧でき、第1回路基板の基板に対する押圧の負担を低減して、放熱に対して良好な状態で第1回路基板を放熱部へ押し付けることができる。
【0037】
第3発明にあっては、押圧に係る第1回路基板の負担を一段と低減することができる。
第4発明にあっては、回路基板間の所要の回路を導電性を確保した押圧ネジにより接続することができ、回路基板間の接続の効率化を図れる。
【図面の簡単な説明】
【図1】本発明の実施形態に係る基板収容箱の断面図である。
【図2】基板収容箱を適用した電動パワーステアリング装置の全体概略図である。
【図3】基板収容箱の箱本体及びカバーの分解状態の斜視図である。
【図4】制御回路基板の要部斜視図である。
【図5】(a)は押圧ネジを貫通穴及び貫通ネジ穴に挿通する前の状態の概略図、(b)は、押圧ネジを貫通ネジ穴に螺合して制御回路基板を載置部に固定する前の状態の概略図である。
【図6】(a)(b)(c)は、変形例の押圧ネジの概略正面図である。
【図7】従来の基板収容箱の断面図である。
【符号の説明】
10 基板収容箱
11 押圧ネジ
11c バネ部(弾性部)
12 箱本体
12a 周壁
12b 載置部
12d 貫通ネジ穴
13 ヒートシンク(放熱部)
14 パワー回路基板
14b 第1回路導体
15 制御回路基板
15b 第2回路導体
15e 貫通穴
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a board housing box that houses a circuit board in a box body provided with a heat radiating section, and in particular, efficiently transfers heat generated in the circuit board to the heat radiating section.
[0002]
[Prior art]
Conventionally, various control circuit boards are housed in a board housing box in order to ensure waterproofness and dustproofness in addition to protecting the board itself. Further, when the heat generation amount of the circuit board to be accommodated is large, in order to prevent the occurrence of trouble due to heat, a heat radiation part is provided in the board housing box so that the generated heat is radiated to the outside. Such a substrate storage box is used in various places, and in particular, it is often mounted on a vehicle and used for controlling various electrical components of the vehicle.
[0003]
FIG. 7 is a cross-sectional view of a conventional substrate storage box 1. The board housing box 1 is used for controlling an electric power steering device of a vehicle, and a power circuit board 4 for controlling power supply and a control circuit board 5 for controlling various signals are provided in the box body 2 at intervals. They are housed in a stacked state, and the cover 8 covers the opening of the box body 2.
[0004]
The box body 2 is provided with a heat sink 3 made of aluminum at the bottom of a synthetic resin peripheral wall 2a formed by insert molding and a mounting portion 2b for the control circuit board 5 protruding from the peripheral wall 2a. In the power circuit board 4, a power circuit conductor 4b is formed on a ceramic substrate portion 4a, and a power semiconductor 4c such as a power transistor for power control that generates a large amount of heat is mounted. On the other hand, the control circuit board 5 is also formed with a control circuit conductor 5b on the board portion 5a and mounted with a control semiconductor 5c and the like.
[0005]
The power circuit board 4 is fixed with the synthetic adhesive 6 in a state where it is placed on the heat sink 3, and the generated heat is transmitted to the heat sink 3 to be radiated from the heat sink 3 to the outside. On the other hand, the control circuit board 5 is fixed to the mounting portion 2 a spaced from the power circuit board 4 with the synthetic adhesive 6 so as not to be affected by the heat generated in the power circuit board 4. In addition, the power circuit board 4 and the control circuit board 5 are connected to both the boards 4 and 5 by connecting the relay line 7 with a connector.
[0006]
[Problems to be solved by the invention]
In the substrate storage box 1, the heat of the power circuit board 4 is radiated from the heat sink 3, but the synthetic adhesive 6 is interposed between the power circuit board 4 and the heat sink 3. The synthetic adhesive 6 is necessary for fixing the power circuit board 4 to the heat sink 3, but since a resin component or the like is included, the heat generated in the power circuit board 4 is hindered from being transmitted to the heat sink 3, and the heat radiation efficiency is reduced. There is a problem to do.
[0007]
For such a problem, it can be assumed that a screw hole is provided in the heat sink 3 and the power circuit board 4 is fixed to the heat sink 3 with bolts. However, in such a screw fixing structure, it is necessary to form a screw hole in the heat sink 3 having a complicated shape, and a crack is generated in the board portion 4a of the ceramic power circuit board 4 by a fastening force by screwing. Such a fixing structure is not preferable.
[0008]
On the other hand, in the substrate storage box 1 shown in FIG. 7, the power circuit board 4 and the control circuit board 5 are connected by the relay line 7 to form a required circuit. A connector or the like must be provided on the board 4 and the control circuit board 5, which increases the costs associated with the boards 4 and 5 and also requires a troublesome connection to the relay line 7.
[0009]
The present invention has been made in view of such problems, and an object of the present invention is to provide a board housing box that can efficiently dissipate heat generated in a circuit board such as a power circuit board from a heat sink.
It is another object of the present invention to provide a substrate housing box that securely fixes a circuit board such as a power circuit board to a heat sink with a configuration that does not cause problems such as cracks in the board portion.
Furthermore, an object of the present invention is to provide a board storage box that reduces the labor involved in connecting circuits between a plurality of circuit boards to be stored.
[0010]
[Means for Solving the Problems]
A substrate housing box according to a first aspect of the present invention is a substrate housing box in which a circuit board is placed on the heat radiating portion and housed in a box body provided with a heat radiating portion, and the first circuit board placed on the heat radiating portion. And projecting from the peripheral wall of the box body in parallel to the first circuit board, and a mounting portion in which a through screw hole is formed, and the mounting portion is mounted on the mounting portion, In a state where the second circuit board is formed with a through hole communicating with the through screw hole and the second circuit board is fixed to the mounting portion by screwing with the through screw hole through the through hole. The tip portion includes a pressing screw that presses the first circuit board against the heat radiating portion.
[0011]
In the first invention, the first circuit board is pressed without using the synthetic adhesive because the first circuit board is pressed against the heat radiating part by using a pressing screw for fixing the second circuit board to the mounting part. Can be fixed in a state of being in direct contact with the heat radiating portion, and a state excellent in thermal conductivity can be ensured to improve heat dissipation. Further, since the pressing screw is screwed into the through screw hole of the mounting portion, it is not necessary to process a screw hole in the heat radiating portion.
[0012]
In order to prevent the first circuit board from warping when pressed, at least the four corners and the center of the first circuit board are pressed with a pressing screw to evenly press the first circuit board to the heat radiating portion. It is preferable. In addition, when the board area of the first circuit board is large, it is preferable to further press the surrounding sides and the vicinity of the center with a pressing screw in addition to the five places in order to surely press the heat radiating portion. Furthermore, depending on the surface roughness of each surface where the first circuit board and the heat radiating part come into contact, even if the first circuit board is pressed against the heat radiating part, a gap may be formed between them. It is preferable to fill with transmission grease or the like.
[0013]
The first circuit board is preferably a power circuit board or the like that generates a larger amount of heat than the second circuit board. In this way, heat generated by the first circuit board is dissipated. It is possible to reduce problems such as malfunction of the second circuit board such as a control circuit board that radiates heat from the portion and generates a small amount of heat. Note that the second circuit board having a small amount of heat generation is not limited to one, but by providing a mounting portion on the box body in the stacking direction, a plurality of second circuit boards can be accommodated in the board housing box. Also good.
[0014]
The board storage box according to a second aspect of the invention is characterized in that the pressing screw includes an elastic part that biases the first circuit board toward the heat radiating part.
In the second invention, by providing an elastic portion on the pressing screw, it is possible to appropriately set the pressing load on the heat radiating portion of the first circuit board, reducing the pressing load on the first circuit board, and radiating portion without difficulty. It can be made to contact. In addition, a leaf | plate spring, a coil spring, etc. are applicable to an elastic part.
[0015]
According to a third aspect of the present invention, there is provided the substrate storage box, wherein the first circuit board includes an exposed first circuit conductor, and a tip end portion of the pressing screw is in contact with the first circuit conductor. .
In the third invention, by pressing the first circuit conductor with the pressing screw, the first circuit board is surely radiated with the required pressing force in a state where the burden on the first circuit board is further reduced. Can be pressed against the part.
[0016]
According to a fourth aspect of the present invention, there is provided the substrate storage box, wherein the second circuit board includes a second circuit conductor exposed, and the pressing screw is formed of a conductive material and is in contact with the second circuit conductor. It is characterized by being.
In the fourth invention, the pressing screw itself can be used as a relay conductive member by bringing the pressing screw formed of a conductive material into contact with each circuit conductor of both circuit boards. Conventionally, between the two circuit boards, The relay line required for circuit connection can be eliminated, and circuit connection between circuit boards can be easily performed.
[0017]
In addition, as a conductive material for forming the pressing screw, a material such as aluminum, copper, gold, or silver can be applied. In addition to forming the pressing screw with the various materials described above, the pressing screw may be formed with a non-conductive material and the pressing screw may be covered with the various materials described above to ensure conductivity.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof.
FIG. 1 is a cross-sectional view of a substrate storage box 10 according to an embodiment of the present invention. The board storage box 10 of this embodiment is mounted on a vehicle and connected to a steering assist motor 22 and a torque sensor 23 in the electric power steering apparatus 21 shown in FIG. 2 to control the rotation of the motor 22. .
[0019]
The substrate housing box 10 includes a power circuit board 14 that controls power supply and a control circuit board 15 that controls a signal related to rotation of the motor 22 inside a box body 12 provided with a heat sink 13 as a heat radiating part at the bottom. The box main body 12 is covered with the cover 18 by being fixedly accommodated by the pressing screws 11 in a stacked state at intervals.
[0020]
As shown in FIG. 3, the box body 12 is provided with a peripheral wall 12 a that surrounds three sides, and the four corners inside the peripheral wall 12 a are parallel to the upper surface 13 a of the heat sink 13 at a location spaced from the heat sink 13. Each of the mounting portions 12b protrudes in the direction, and a central mounting portion 12c that protrudes from the central portion in the side direction to the central portion of the box body 12 is provided on one of the three peripheral walls 12a. . Each of the mounting portions 12b and the central mounting portion 12c is formed with a through screw hole 12d.
[0021]
The box body 12 is made of synthetic resin, and is formed integrally with the heat sink 13 by insert molding together with the aluminum heat sink 13. The cover 18 is formed in a substantially L shape that covers the opening 12e above the box body 12 and the opening 12f on the side.
[0022]
On the other hand, the power circuit board 14 shown in FIG. 1 has a power for controlling the power supply as well as causing the first circuit conductor 14b to be exposed on the upper surface 14d in accordance with the circuit shape by etching the ceramic substrate portion 14a. A semiconductor 14c is mounted. In addition, the power circuit board 14 of this embodiment is a portion facing the through screw holes 12d of the mounting portion 12b and the central mounting portion 12c in a plan view direction while being accommodated in the box body 12 shown in FIG. The circuit shape is such that the first circuit conductor 14b exists.
[0023]
The power circuit board 14 described above corresponds to a first circuit board, and a current from a power source (vehicle-mounted battery) having a high voltage value flows in a circuit formed by the first circuit conductor 14b and the like. The amount of heat generated by 14c and the like is larger than that of the control circuit board 15 corresponding to the second circuit board.
[0024]
In the control circuit board 15 shown in FIG. 1, the second circuit conductor 15b is exposed on the upper surface 15d of the board portion 15a in accordance with the circuit shape, and various semiconductors 15c for control are mounted. Further, as shown in FIG. 4, the control circuit board 15 has a circuit shape in which the second circuit conductor 15 b exists at a position facing the through screw hole 12 d in a state of being accommodated in the box body 12 like the power circuit board 14. In addition, through holes 15e are formed at locations corresponding to the respective through screw holes 12d.
[0025]
Note that the current value of the current flowing through the second circuit conductor 15b of the control circuit board 15 is very small compared to the current value flowing through the first circuit conductor 14b of the power circuit board 14. Further, a part of the circuit formed by the second circuit conductor 15b of the control circuit board 15 needs to be connected to a required circuit formed by the first circuit conductor 14b of the power circuit board 14 for power supply or the like. A press screw 11 is used for circuit connection between the control circuit board 15 and the power circuit board 14.
[0026]
As shown in FIG. 5A, the pressing screw 11 is formed integrally with a screw head portion 11a, a screw portion 11b, and a leaf spring-like spring portion 11c which is an elastic portion having a required urging force. The material is copper, which is a conductive material. The threaded portion 11b is set to a size to be screwed with each through screw hole 12d of the box body 12, and the spring portion 11c at the time of no load is gently adjusted within the range of the diameter of the through screw hole 12d. A curved shape is used so that the direction of bending when the load is applied is uniform.
[0027]
Next, the assembly procedure of the substrate storage box 10 according to the present embodiment will be described.
First, the heat transfer grease 20 is applied to the upper surface 13a of the heat sink 13 of the box body 12 shown in FIG. 3 as shown in FIGS. 1 and 5A and 5B. After applying the heat transfer grease 20, the power circuit board 14 is inserted from the side opening 12 f of the box body 12 and placed on the upper surface 13 a of the heat sink 13. Further, the control circuit board 15 is housed inside the opening 12e above the box body 12 and placed on the placement part 12b and the central placement part 12c.
[0028]
By placing the control circuit board 15 in this way, as shown in FIGS. 1, 5A and 5B, the through holes 15e, the placement part 12b, and the central mounting part of the control circuit board 15 are provided. The through screw holes 12d of the mounting portion 12c are in communication with each other. Next, when the pressing screw 11 is inserted into each through hole 15e and the through screw hole 12d and rotated in the screwing direction, as shown in FIG. The first circuit conductor 14b. In this state, the screw head 11 a of the pressing screw 11 is not in contact with the second circuit conductor 15 b of the control circuit board 15.
[0029]
When the pressing screw 11 is further rotated in the screwing direction from the above-described state, the spring portion 11c is bent and completely screwed into the through screw hole 12d. As shown in FIG. The second circuit conductor 15b comes into contact with 15 and the control circuit board 15 is fastened and fixed to the mounting portion 12b and the central mounting portion 12c. On the other hand, the screwed press screw 11 is in a state where an appropriate load is applied by pressing the power circuit board 14 to the heat sink 13 evenly with a required urging force by interposing the heat transfer grease 20 due to the bending of the spring portion 11c. It is fixed with. Thus, after fixing the power circuit board 14 and the control circuit board 15 to the box main body 12, the cover 18 is covered and the board | substrate storage box 10 is completed.
[0030]
In the completed substrate storage box 10, the power circuit board 14 is pressed against the heat sink 13 with the heat transfer grease 20 interposed therebetween, so that there is no gap between the power circuit board 14 and the heat sink 13. The heat generated in the circuit board 14 is reliably transmitted to the heat sink 13 and radiated to the outside. Further, since the power circuit board 14 presses the rigid first circuit conductor 14b with the pressing screw 11 having the spring part 11c, the burden on the pressing of the board part 14a is compared with the case where it is directly fixed with the screw. It is less likely to cause defects such as cracks.
[0031]
Further, the pressing screw 11 is in contact with the first circuit portion 14 of the power circuit board 14 at the spring portion 11c, and is in contact with the second circuit conductor 15b of the control circuit board 15 at the screw head portion 11a. The required circuit connection between the two boards is performed by conducting the circuit itself, and the board storage box 10 eliminates the connecting relay line and reduces the labor involved in the circuit relay.
[0032]
In addition, the board | substrate storage box 10 which concerns on this invention is not limited to the form mentioned above, A various modification can be applied. For example, like a pressing screw 31 shown in FIG. 6A, a coil spring-like one can be applied to the spring portion 31c, and the spring portion 31c may be rotated separately from the screw portion 31b, or rotate together. You may do it. Further, like the pressing screw 41 shown in FIG. 6B, a spring part 41c may be provided in the middle of the screw part 41b. Furthermore, as shown in FIG. 6C, the inside of the screw part 51b. It is also possible to apply a plunger-type pressing screw 51 incorporating a spring portion 51c.
[0033]
Further, the pressing screw 11 (including the pressing screw of the modified example, the same applies hereinafter) can be made of aluminum, gold, or silver as a material other than copper in order to ensure conductivity, When manufacturing with a material having low conductivity, the surface may be covered with aluminum, copper, gold, or silver by plating or the like to ensure conductivity. In addition, when the circuit connection between the power circuit board 14 and the control circuit board 15 is not necessary, it is not necessary to secure the conductivity to the pressing screw 11, and the second circuit conductor of the pressing screw 11 and the control circuit board 15 is not required. There is no need to contact 15b.
[0034]
Further, the substrate portion 14a of the power circuit board 14 may be formed of a metal such as aluminum having an insulating layer in addition to being formed of ceramic. Thus, the substrate portion 14a is formed of metal and the power circuit board. When it is not necessary to connect a circuit between the control circuit board 15 and the control circuit board 15, the board part 14a may be directly pressed by the pressing screw 11.
[0035]
Further, the substrate housing box 10 accommodates a plurality of control circuit boards 15 with respect to one power circuit board 14 by providing a plurality of mounting portions 12b and the like on the peripheral wall 12a of the box body 12 in the board stacking direction. You may make it do.
[0036]
【The invention's effect】
As described above in detail, in the first invention, since the first circuit board can be fixed to the heat radiating portion in a state excellent in thermal conductivity, the heat radiating property can be improved as compared with the conventional one.
In the second invention, the first circuit board can be pressed to the heat radiating portion with an appropriate load, the pressure load on the board of the first circuit board is reduced, and the first circuit board is in good condition for heat dissipation. Can be pressed against the heat dissipation part.
[0037]
In the third invention, the burden on the first circuit board related to the pressing can be further reduced.
In the fourth aspect of the invention, a required circuit between the circuit boards can be connected by the press screw that secures conductivity, and the connection efficiency between the circuit boards can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a substrate storage box according to an embodiment of the present invention.
FIG. 2 is an overall schematic diagram of an electric power steering apparatus to which a substrate housing box is applied.
FIG. 3 is a perspective view of a disassembled state of a box body and a cover of a substrate storage box.
FIG. 4 is a perspective view of a main part of a control circuit board.
5A is a schematic diagram of a state before the pressing screw is inserted into the through hole and the through screw hole, and FIG. 5B is a diagram illustrating a state where the control circuit board is mounted by screwing the pressing screw into the through screw hole. It is the schematic of the state before fixing to.
FIGS. 6A, 6B, and 6C are schematic front views of modified pressing screws.
FIG. 7 is a cross-sectional view of a conventional substrate storage box.
[Explanation of symbols]
10 Substrate housing box 11 Press screw 11c Spring part (elastic part)
12 box main body 12a peripheral wall 12b mounting part 12d through screw hole 13 heat sink (heat radiation part)
14 Power circuit board 14b First circuit conductor 15 Control circuit board 15b Second circuit conductor 15e Through hole

Claims (4)

放熱部が設けてある箱本体に回路基板を前記放熱部に載置して収容する基板収容箱において、
前記放熱部に載置してある第1回路基板と、
該第1回路基板に対して平行的に前記箱本体の周壁から突設しており、貫通ネジ穴が形成してある載置部と、
該載置部に載置してあり、前記貫通ネジ穴と連通する貫通穴が形成してある第2回路基板と、
前記貫通穴を挿通して前記貫通ネジ穴との螺合により前記第2回路基板を前記載置部に固定した状態で、先端部が前記第1回路基板を前記放熱部へ押圧する押圧ネジと
を備えることを特徴とする基板収容箱。
In the substrate housing box that houses the circuit board placed on the heat radiating portion in the box body where the heat radiating portion is provided,
A first circuit board placed on the heat dissipating part;
A mounting portion projecting from the peripheral wall of the box body in parallel with the first circuit board, and having a through screw hole formed thereon;
A second circuit board mounted on the mounting portion and having a through hole communicating with the through screw hole;
A pressing screw that inserts through the through hole and fixes the second circuit board to the mounting portion by screwing with the through screw hole, and a tip portion presses the first circuit board to the heat radiating portion; A substrate storage box comprising:
前記押圧ネジは、前記第1回路基板を前記放熱部へ付勢する弾性部を備える請求項1に記載の基板収容箱。2. The substrate storage box according to claim 1, wherein the pressing screw includes an elastic portion that biases the first circuit board toward the heat radiating portion. 前記第1回路基板は、表出してある第1回路導体を備え、
該第1回路導体に前記押圧ネジの先端部が当接してある請求項1又は請求項2に記載の基板収容箱。
The first circuit board includes an exposed first circuit conductor;
The substrate storage box according to claim 1, wherein a tip end portion of the pressing screw is in contact with the first circuit conductor.
前記第2回路基板は、表出してある第2回路導体を備え、
前記押圧ネジは、導電材で形成してあり、前記第2回路導体と接触してある請求項3に記載の基板収容箱。
The second circuit board includes a exposed second circuit conductor;
The board accommodation box according to claim 3, wherein the pressing screw is made of a conductive material and is in contact with the second circuit conductor.
JP2002164239A 2002-06-05 2002-06-05 Substrate storage box Expired - Fee Related JP4089300B2 (en)

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JP4089300B2 true JP4089300B2 (en) 2008-05-28

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