JPH04113695A - Heat dissipating structure for electronic device - Google Patents

Abstract

PURPOSE:To simplify manufacturing, assembling and to reduce its cost by forming a through hole plated on its inner surface at a printed board. CONSTITUTION:A metal frame 3 is clamped at a metal housing 2 for sheathing an electronic device 1 through an electrically insulating thin silicone rubber sheet 4, and the frame 3 is substantially continuously provided at the housing 2. A printed board 5 in which electric wirings are printed is provided in the device 1, and many through holes 6 in which their inner surfaces are plated 7, are opened at the board 5. A heat generating component 8 as a heat generation source is so mounted at the upper surface side of the board 5 as to be opposed to the upper end side of the hole 6. The frame 3 is so disposed at the lower surface side of the board 4 as to be opposed to the lower end side of the hole 6, and the board 5 is secured to the frame 3.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a heat dissipation structure for an electronic device that radiates heat generated from heat generating components inside the device to the outside of the device, and provides a heat dissipation structure for an electronic device that is easy to manufacture and assemble and is inexpensive. For the purpose of A metal frame provided continuously to a heat radiating section that radiates heat is arranged on the other surface of the printed circuit board so as to face the other end of the through hole.

[Industrial application field]

The present invention relates to a heat dissipation structure for an electronic device for dissipating heat generated from heat generating components within the device to the outside of the device.

In recent years, electronic devices have become significantly smaller, and it is no longer possible to install fans for heat dissipation.

However, it is also necessary to efficiently dissipate the heat generated inside.

[Conventional technology]

FIGS. 5 and 6 show the heat dissipation structure of a conventional electronic device.

In the one shown in FIG. 5, a German part 51 is directly attached to a housing 52 to radiate heat to the outside. A connecting cable 55 extending from the heat generating component 5I is connected to a connector 54 provided on the printed circuit board 53.

In addition, in the one shown in FIG. 6, a heat generating component 51 is attached to a heat radiator 56 attached to a printed circuit board 53, and the heat radiator 56 is brought into contact with a metal frame 57 provided continuously on the housing 52. By this, the heat sink 56
The heat generated from the heat generating component 51 is transmitted to the housing 52 via the frame 57 and radiated to the outside.

[Problem to be solved by the invention]

However, in the structure shown in FIG. 5, since the electronic components that generate heat are mounted on components other than the printed circuit board, a process of connecting the cable to the printed circuit board is necessary.
In the structure shown in FIG. 6, the work of attaching the heat sink to the printed circuit board is required on the printed circuit board manufacturing line, and both have the disadvantage that manufacturing and assembly costs are high.

The present invention aims to eliminate such conventional drawbacks and provide a heat dissipation structure for electronic equipment that is easy to manufacture and assemble and is inexpensive.

[Means to solve the problem]

In order to achieve the above object, the heat dissipation structure of an electronic device of the present invention is such that a through hole 6 with an inner surface plated 7 is formed in a printed circuit board 5, as shown in FIG. A heat generating component 8 is attached to one surface side of the printed circuit board 5 so as to face one end side of the through hole 6, and a metal heat generating component 8 is attached continuously to the heat radiating part 2 that radiates heat toward the outside of the device. It is characterized in that the frame 3 is arranged on the other side of the printed circuit board 5 so as to face the other end side of the through hole 6.

[Effect]

Heat generated from the heat generating component 8 is transmitted to the frame 3 via the plating 7 applied to the inner surface of the through hole 6, and further transmitted from the frame 3 to the heat radiating section 2, where the heat is radiated to the outside.

〔Example〕

Examples will be described with reference to the drawings.

1 and 2 show a first embodiment of the invention.

A metal casing 2 made of, for example, an aluminum alloy, which serves as the exterior of the electronic device I, has a metal frame 3 made of an aluminum alloy, etc., for electrical insulation.
The frame 3 is fixed with screws across a silicone rubber sheet 4 having a thickness of about 0.2 to 0.5 mm, and the frame 3 is substantially continuously provided on the body 2.

The electronic device 1 is provided with a printed circuit board 5 on which electrical wiring is printed, and the printed circuit board 5 has a large number of through-holes 6 with internal plating 7 (copper plating, for example). has been done.

An electronic component (heat generating component) 8 that is a heat source, such as a three-terminal regulator or a transistor, is attached to the upper surface of the printed circuit board 5 so as to face the upper end side of these through holes 6.

Reference numeral 10 indicates a mounting screw that is screwed into a screw hole formed in the frame 3, and fixes the heat generating component 8 to the printed circuit board 5 and at the same time fixes the printed circuit board 5 to the frame 3. However, these three things do not necessarily have to be fixed with one screw 9.

10 is a terminal of the heat generating component 8, which is electrically connected to the printed circuit board 5.

In this way, the frame 3 is arranged on the lower surface side of the printed circuit board 5 so as to face the lower end side of the through hole 6, and the printed circuit board 5 is fixed to this frame 3.

Therefore, the trajectory generated from the heat generating component 8 is transmitted to the metal frame 3 via the plating 7 on the inner surface of the numerous through holes 6, and from there is further transmitted to the casing 2, and from the surface of the casing 2 to the outside. Heat is dissipated.

Note that by filling the through hole 6 with silicone grease, solder, or the like, heat transfer from the heat generating component 8 to the frame 3 is improved, and heat dissipation is improved.

Furthermore, by applying silicone grease or the like between the printed circuit board 5 and the heat generating component 8 and between the printed circuit board 5 and the frame 3, it is possible to eliminate the presence of an air layer and improve heat transfer. .

3 and 4 show a second embodiment of the present invention, in which a thin film (for example, 0.2 to 0.0 ．．
It is sandwiched between 5mm thick silicone rubber insulating sheaths 12). In this way, the electrical insulation between the heat generating component 8 and the frame 3 can be perfected, and the contact state can be improved by eliminating the presence of air from the contact surface.

〔Effect of the invention〕

According to the heat dissipation structure of the electronic device of the present invention, the heat from the heat generating components can be reliably transferred to the heat dissipation part and radiated to the outside, and the heat transfer is performed using the through holes. , there is no need to add extra steps when manufacturing printed circuit boards, and therefore manufacturing and assembly can be carried out efficiently, resulting in an excellent cost-saving effect.

[Brief explanation of drawings]

FIG. 1 is a front sectional view of the first embodiment, and FIG. 2 is a front sectional view of the first embodiment.
FIG. 3 is a front sectional view of the second embodiment, FIG. 4 is a plan view of the interior of the second embodiment, and FIG. 5 is a first conventional example. FIG. 6 is a front sectional view of the second conventional example. In the figure, 2... Housing (heat dissipation part), 3... Frame, 5... Printed circuit board, 6... Through hole, 7... Plating, 8... - Heat generating component.

Claims (1)

[Claims] A through hole (6) with an inner surface plated (7) is formed in the printed circuit board (5), and the printed circuit board (5) faces one end of the through hole (6). A heat-generating component (8) is attached to one side, and a metal frame (3) is installed continuously to the heat dissipation part (2) that radiates heat toward the outside of the device, in addition to the through hole (6). Place the printed circuit board (5) so that it faces the end side.
) A heat dissipation structure for electronic equipment characterized by being placed on the other side.