JPH07297506A - Printed circuit board with heat dissipation structure - Google Patents

Printed circuit board with heat dissipation structure

Info

Publication number
JPH07297506A
JPH07297506A JP6088585A JP8858594A JPH07297506A JP H07297506 A JPH07297506 A JP H07297506A JP 6088585 A JP6088585 A JP 6088585A JP 8858594 A JP8858594 A JP 8858594A JP H07297506 A JPH07297506 A JP H07297506A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heat dissipation
heat
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6088585A
Other languages
Japanese (ja)
Inventor
Shigeo Chikamori
成男 近森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP6088585A priority Critical patent/JPH07297506A/en
Publication of JPH07297506A publication Critical patent/JPH07297506A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To form a heat dissipation means for dissipating heat from an electronic part mounted on a printed circuit board without performing bonding work. CONSTITUTION:A heat dissipation plating layer 5 is formed thick enough to acquire satisfactory heat dissipation effect by electric plating in a part whereto an electric part 3 which generates heat on a printed circuit board 1 is mounted. Heat generated from the electric part 3 is conducted to the heat dissipation plating layer 5 and is dissipated to a case 10 through an mount screw 8 of the printed circuit board 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はプリント基板に関し、特
に放熱構造を有するプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly to a printed circuit board having a heat dissipation structure.

【０００２】[0002]

【従来の技術】従来技術の放熱構造を備えたプリント基
板実装に関して、図３を参照して説明する。2. Description of the Related Art Mounting of a printed circuit board having a conventional heat dissipation structure will be described with reference to FIG.

【０００３】図３においてプリント基板１に金属板７を
接着する。そして電気部品３を金属板７に接着する。更
にプリント基板１に電気部品３のリード１１をハンダ付
けして電気部品３を取り付ける。このようにして、取り
付けられた電気部品３から発生した熱はまず、金属板７
に伝導される。そして、プリント基板１と固定するネジ
８を介してケース１０に伝達され放熱される。In FIG. 3, a metal plate 7 is bonded to the printed board 1. Then, the electric component 3 is bonded to the metal plate 7. Further, the leads 11 of the electric component 3 are soldered to the printed board 1 to attach the electric component 3. In this way, the heat generated from the attached electric component 3 is first transferred to the metal plate 7
Is transmitted to. Then, the heat is transmitted to the case 10 via the screw 8 for fixing the printed circuit board 1 and radiated.

【０００４】以上、説明したように従来技術では電気部
品３で発生した熱を効果的に放熱する為に金属板７を使
用し、その金属板７はプリント基板１に接着して固定し
ている。As described above, in the prior art, the metal plate 7 is used to effectively dissipate the heat generated in the electric component 3, and the metal plate 7 is fixed to the printed board 1 by adhesion. .

【０００５】[0005]

【発明が解決しようとする課題】以上説明したように従
来技術では電気部品から発生する熱を効果的に放熱させ
る為に、金属板を使用し、かつ金属板とプリント基板は
接着している。従って、部品点数が増える共に、組立工
数も増加するという課題がある。As described above, in the prior art, a metal plate is used and the metal plate and the printed board are adhered to each other in order to effectively dissipate the heat generated from the electric component. Therefore, there is a problem that the number of parts increases and the number of assembling steps also increases.

【０００６】[0006]

【課題を解決するための手段】本発明はプリント基板上
に取り付けられた電気部品から発生する熱を効果的に放
熱出来て、部品点数を少なくし、かつ組立工数も削減出
来るようにする為に、プリント基板上に電気メッキによ
ってパターンを形成し、これを放熱板としている。According to the present invention, heat generated from an electric component mounted on a printed circuit board can be effectively dissipated to reduce the number of components and the number of assembling steps. A pattern is formed on the printed circuit board by electroplating, and this is used as a heat sink.

【０００７】[0007]

【実施例】本発明の一実施例について図面を参照して説
明する。図１は本発明の側面図，図２は斜視図を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a side view of the present invention, and FIG. 2 shows a perspective view.

【０００８】図１において、電気メッキによって、配線
パターンの膜厚よりも十分厚い厚さに放熱用パターン５
を形成し、これを放熱板として利用する。更にこの放熱
用パターン５に電気部品３を接着する。リード１１のハ
ンダ付及びプリント基板１とケース１０の固定は従来技
術と同様とする。In FIG. 1, the heat dissipation pattern 5 is formed by electroplating to a thickness sufficiently thicker than the thickness of the wiring pattern.
Is formed and used as a heat sink. Further, the electric component 3 is bonded to the heat radiation pattern 5. The soldering of the leads 11 and the fixing of the printed circuit board 1 and the case 10 are the same as those in the prior art.

【０００９】このようにして取り付けられた電気部品３
から発生した熱は、まず接着剤４を介して配線パターン
２より充分に厚い厚さの放熱用パターン５で伝導する。
そして取り付け穴９及びネジ８等を介してケース１０に
放熱されていく。The electrical component 3 thus mounted
The heat generated by the heat is first conducted through the adhesive 4 through the heat dissipation pattern 5 having a thickness sufficiently thicker than that of the wiring pattern 2.
Then, heat is radiated to the case 10 through the mounting holes 9 and the screws 8.

【００１０】以上説明したように、本発明は電気部品３
から発生した熱がケース１０まで放熱していく過程で、
従来技術と比較して本発明は金属板を使用しない為、金
属板とプリント基板の接着工事も必要である。As described above, the present invention provides an electric component 3
In the process that the heat generated from the heat is dissipated to the case 10,
Since the present invention does not use a metal plate as compared with the prior art, bonding work between the metal plate and the printed circuit board is also necessary.

【００１１】[0011]

【発明の効果】以上説明したように本発明は電気部品か
ら発生した熱をプリント基板上に電気メッキによってパ
ターンで形成した層を使用して放熱させている為、従来
技術で使用している金属板及び金属板とプリント基板の
接着工事が不要に出来る為、部品点数を減少出来、かつ
組立工数も削減出来る。As described above, according to the present invention, the heat generated from the electric parts is radiated by using the layer formed in the pattern by the electroplating on the printed circuit board. Therefore, the metal used in the prior art is used. Since the work of adhering the plate and the metal plate to the printed circuit board is unnecessary, the number of parts can be reduced and the number of assembly steps can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の側面図。FIG. 1 is a side view of an embodiment of the present invention.

【図２】本発明の一実施例の斜視図。FIG. 2 is a perspective view of an embodiment of the present invention.

【図３】従来技術の一実施例の側面図。FIG. 3 is a side view of an embodiment of the prior art.

【符号の説明】[Explanation of symbols]

１ プリント基板 ２ 配線パターン ３ 電気部品 ４ 接着剤 ５ 電気メッキによって形成した放熱用パターン ６ 接着剤 ７ 金属板 ８ プリント基板とケース固定用ネジ ９ 取り付け穴 １０ ケース １１ 電気部品のリード 1 Printed Circuit Board 2 Wiring Pattern 3 Electrical Component 4 Adhesive 5 Heat Dissipation Pattern Formed by Electroplating 6 Adhesive 7 Metal Plate 8 Printed Circuit Board and Case Fixing Screw 9 Mounting Hole 10 Case 11 Lead of Electrical Component

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 電気部品を搭載するプリント基板におい
て、放熱を必要とする電気部品の取り付け部にメッキに
よってパターンを形成し、放熱板として利用することを
特徴とする放熱構造を有するプリント基板。1. A printed circuit board having an electric component mounted thereon, wherein a pattern is formed on a mounting portion of an electric component that requires heat dissipation by plating to use as a heat dissipation plate. 【請求項２】 前記パターンを配線パターンの膜厚より
も厚くすることを特徴とする請求項１の放熱構造を有す
るプリント基板。2. The printed circuit board having a heat dissipation structure according to claim 1, wherein the pattern is thicker than the wiring pattern. 【請求項３】 前記パターンを電気メッキにより形成す
ることを特徴とする請求項１の放熱構造を有するプリン
ト基板。3. The printed circuit board having the heat dissipation structure according to claim 1, wherein the pattern is formed by electroplating.
JP6088585A 1994-04-26 1994-04-26 Printed circuit board with heat dissipation structure Pending JPH07297506A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6088585A JPH07297506A (en) 1994-04-26 1994-04-26 Printed circuit board with heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6088585A JPH07297506A (en) 1994-04-26 1994-04-26 Printed circuit board with heat dissipation structure

Publications (1)

Publication Number Publication Date
JPH07297506A true JPH07297506A (en) 1995-11-10

Family

ID=13946926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6088585A Pending JPH07297506A (en) 1994-04-26 1994-04-26 Printed circuit board with heat dissipation structure

Country Status (1)

Country Link
JP (1) JPH07297506A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7911796B2 (en) 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8023267B2 (en) 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8059409B2 (en) 2009-06-19 2011-11-15 General Electric Company Avionics chassis
JP2012094687A (en) * 2010-10-27 2012-05-17 Opnext Japan Inc Optical transceiver
US8222541B2 (en) 2009-06-19 2012-07-17 General Electric Company Avionics chassis
JP2014229829A (en) * 2013-05-24 2014-12-08 本田技研工業株式会社 Electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347066A (en) * 1986-08-15 1988-02-27 Mitsui Toatsu Chem Inc Regenerative treatment method for abrasive
JPH0258256A (en) * 1988-08-23 1990-02-27 Nec Corp Mounting structure of heat generating components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347066A (en) * 1986-08-15 1988-02-27 Mitsui Toatsu Chem Inc Regenerative treatment method for abrasive
JPH0258256A (en) * 1988-08-23 1990-02-27 Nec Corp Mounting structure of heat generating components

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7911796B2 (en) 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8023267B2 (en) 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8059409B2 (en) 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8222541B2 (en) 2009-06-19 2012-07-17 General Electric Company Avionics chassis
JP2012094687A (en) * 2010-10-27 2012-05-17 Opnext Japan Inc Optical transceiver
JP2014229829A (en) * 2013-05-24 2014-12-08 本田技研工業株式会社 Electronic device

Similar Documents

Publication Publication Date Title
US6249267B1 (en) Display apparatus having heat dissipation
GB2375655A (en) Circuit board assembly
JPH04113695A (en) Heat dissipating structure for electronic device
JPH07297506A (en) Printed circuit board with heat dissipation structure
US5394301A (en) Arrangement for dissipating heat from power components assembled on a printed-circuit board
JPH09213848A (en) Heat sink of electronic component
JP3192245B2 (en) How to attach the radiation fin
JPH07123186B2 (en) Circuit device
JP3728836B2 (en) LSI package cooling device and fixing method thereof
JP2004327693A (en) Motor drive
JP2002094196A (en) Electronic part heat dissipating structure of printed wiring board
JPH0451597A (en) Heat-dissipating type high-density printed wiring board
JPH04180660A (en) Power device mounting board
JPH09321471A (en) Heat radiating device for electronic component
JPH05251842A (en) Printed board
JP2753764B2 (en) Substrate for mounting electronic components
JPH0617355Y2 (en) Heat sink mounting structure for printed wiring board
JPH039341Y2 (en)
JPS5967687A (en) Printed circuit board
JPH0758426A (en) Electronic part mounting board
JPH08775Y2 (en) Printed wiring board with heat sink
JPS59217385A (en) Printed circuit board
JPH10107400A (en) Printed wiring board
JPH07135384A (en) Printed board with circuit component and fixing method of circuit component
JPS61188999A (en) Heat radiating/shielding board for printed wiring board

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19960514