JPH039341Y2 - - Google Patents
Info
- Publication number
- JPH039341Y2 JPH039341Y2 JP1984143239U JP14323984U JPH039341Y2 JP H039341 Y2 JPH039341 Y2 JP H039341Y2 JP 1984143239 U JP1984143239 U JP 1984143239U JP 14323984 U JP14323984 U JP 14323984U JP H039341 Y2 JPH039341 Y2 JP H039341Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- heat dissipation
- mounting
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 99
- 239000002184 metal Substances 0.000 claims description 99
- 230000017525 heat dissipation Effects 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011247 coating layer Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 description 15
- 239000004020 conductor Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、時計、カメラおよび各種用途のチツ
プ素子搭載用基板として最適な電子部品搭載用基
板に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a substrate for mounting electronic components, which is optimal as a substrate for mounting chip elements for watches, cameras, and various other uses.
従来、半導体素子などの電子部品をプリント配
線用基板に搭載し、ワイヤーボンデイングにより
電気的に接続した電子部品搭載用基板が、時計や
カメラなどの内装基板として使用されている。
Conventionally, electronic component mounting boards, in which electronic components such as semiconductor elements are mounted on printed wiring boards and electrically connected by wire bonding, have been used as interior boards for watches, cameras, and the like.
第７図ａは、半導体素子を直接プリント配線用
基板に搭載する場合の一例であり、プリント配線
用基板としては、セラミツク基板や有機系樹脂基
板が用いられている。 FIG. 7a shows an example in which a semiconductor element is directly mounted on a printed wiring board, and a ceramic substrate or an organic resin substrate is used as the printed wiring board.
第７図ｂは、ザグリ加工又は積層成形により、
プリント配線用基板の表面側に電子部品搭載用凹
部を設け、その中に半導体素子を搭載した電子部
品搭載用基板である。 Figure 7b shows that by counterbore processing or lamination molding,
This is a board for mounting electronic parts in which a recess for mounting electronic parts is provided on the front side of the printed wiring board, and a semiconductor element is mounted in the recess for mounting electronic parts.
ところで、これら従来の電子部品搭載用基板
は、半導体素子から発生する熱に対して十分な熱
放散ができない。そのため、比較的低い出力、即
ち発熱量が少ない半導体素子のみに適用されてお
り、高出力の半導体素子搭載には適していない。 By the way, these conventional electronic component mounting boards cannot sufficiently dissipate heat generated from semiconductor elements. Therefore, it is applied only to semiconductor elements with relatively low output, that is, with a small amount of heat generation, and is not suitable for mounting high-output semiconductor elements.
特に、有機系樹脂基板は、軽量であるため、前
記時計用、カメラ用の電子部品搭載用基板として
最適であるが、他面、金属などに比べ熱電導率が
低いため半導体素子からの熱放散性は劣つてい
る。 In particular, organic resin substrates are lightweight, making them ideal for use as substrates for mounting electronic components for watches and cameras, but on the other hand, their thermal conductivity is lower than that of metals, so they are difficult to dissipate heat from semiconductor elements. gender is inferior.
そのため、有機系樹脂基板は、特に最近の高集
積化された高い出力の半導体素子の搭載にはその
放熱能力が不十分である。また、有機系樹脂基板
の欠点は、耐湿性がセラミツク基板に比べて非常
に低い。そのため、第７図ｂに示す構造の場合に
は、外部からの湿気がプリント配線用基板の裏面
側から浸入して、半導体素子を腐食させる。 Therefore, the heat dissipation ability of the organic resin substrate is insufficient, especially when mounting the recent highly integrated high output semiconductor elements. Another disadvantage of organic resin substrates is that their moisture resistance is much lower than that of ceramic substrates. Therefore, in the case of the structure shown in FIG. 7b, moisture from the outside enters from the back side of the printed wiring board and corrodes the semiconductor element.
そこで、従来、上記放熱性を向上させるため
に、アルミニウム、銅、鉄等の熱良導伝基板の上
に、ニツケルめつき層、はんだを介在させてSi素
子を搭載した電子回路が提案されている（特開昭
55−93286号公報）。 Therefore, in order to improve the above-mentioned heat dissipation, electronic circuits have been proposed in which Si elements are mounted on a thermally conductive substrate made of aluminum, copper, iron, etc. with a nickel plating layer and solder interposed. There is (Tokukai Akira
55-93286).
また、プリント配線用基板の裏面側の全面に放
熱用金属板を接合し、プリント配線用基板の表面
側には電子部品搭載用凹部を設けた半導体装置用
配線基板が提案されている（特開昭50−143072号
公報）。 In addition, a wiring board for semiconductor devices has been proposed in which a metal plate for heat dissipation is bonded to the entire back side of the printed wiring board, and a recess for mounting electronic components is provided on the front side of the printed wiring board (Unexamined Japanese Patent Publication No. Publication number 50-143072).
更に、プリント配線用基板の裏面側の全面に放
熱用金属板を接合し、プリント配線用基板の表面
側には半導体素子を搭載した印刷配線基板が提案
されている（特開昭47−27376号公報）。 Furthermore, a printed wiring board has been proposed in which a metal plate for heat dissipation is bonded to the entire back side of the printed wiring board, and a semiconductor element is mounted on the front side of the printed wiring board (Japanese Patent Laid-Open No. 47-27376). Public bulletin).
ところで、上記従来の電子部品搭載用基板に
は、次の問題点がある。
By the way, the above-mentioned conventional electronic component mounting board has the following problems.
即ち、まず、前記のごとく、時計、カメラなど
に用いる電子部品搭載用基板は、できるだけ軽量
で、かつ薄型、小型であることが要求される。 That is, first, as mentioned above, electronic component mounting boards used in watches, cameras, etc. are required to be as lightweight, thin, and small as possible.
また、放熱用金属板は、プリント配線用基板に
確実に装着され、長期間の使用中にも脱落するこ
とがないように接合しておく必要がある。 Further, the heat dissipation metal plate needs to be securely attached to the printed wiring board and bonded so that it will not fall off even during long-term use.
しかしながら、上記公開公報に示される従来の
電子部品搭載用基板は、その裏面側の全面に、放
熱用金属板が接合されている。そのため、該放熱
用金属板の厚み分だけ電子部品搭載用基板全体の
厚みが大きくなつてしまう。 However, in the conventional electronic component mounting board disclosed in the above-mentioned publication, a heat dissipation metal plate is bonded to the entire back surface thereof. Therefore, the thickness of the entire electronic component mounting board increases by the thickness of the heat dissipation metal plate.
また、いずれの場合もプリント配線用基板の裏
面側に放熱用金属板が接合されており、放熱用金
属板の全体が露出しているため、長期使用中にプ
リント配線用基板と放熱用金属板との間に剥離を
生じ、放熱用金属板が脱落するおそれがある。 In addition, in both cases, the heat dissipation metal plate is bonded to the back side of the printed wiring board, and the entire heat dissipation metal plate is exposed, so during long-term use, the printed wiring board and the heat dissipation metal plate There is a risk that peeling may occur between the heat dissipating metal plate and the heat dissipating metal plate falling off.
特に、プリント配線用基板として有機系樹脂基
板を用いた場合には、プリント配線用基板と放熱
用金属板とは一方が樹脂、一方が金属であるた
め、両者の熱膨張係数が大きく異なる。それ故、
使用環境下における熱サイクル（加熱，冷却）の
繰り返しによつて、両者の接合部に剥離を生じ易
く、放熱用金属板の脱落のおそれが大きい。 In particular, when an organic resin substrate is used as a printed wiring board, the printed wiring board and the heat dissipation metal plate are made of resin on one side and metal on the other, and therefore have significantly different coefficients of thermal expansion. Therefore,
Due to repeated thermal cycles (heating, cooling) under the usage environment, peeling is likely to occur at the joint between the two, and there is a great possibility that the heat dissipation metal plate will fall off.
また、従来のごとく放熱用金属板をプリント配
線用基板の裏面側全面に設けた場合には、プリン
ト配線用基板の裏面側には導体回路を全く設ける
ことができない。そのため、導体回路設計の自由
度が低い。特に、近年は、電子部品搭載用基板に
対してより大きくの導体回路を設けることが切望
されている。 Further, when a heat dissipation metal plate is provided on the entire back side of the printed wiring board as in the conventional case, no conductor circuit can be provided on the back side of the printed wiring board. Therefore, the degree of freedom in designing the conductor circuit is low. In particular, in recent years, there has been a strong desire to provide larger conductor circuits on substrates for mounting electronic components.
本考案はかかる従来技術の問題点に鑑み、有機
系樹脂基板のプリント配線用基板を用いた場合に
おいて、放熱用金属板の確実な装着接合ができ、
全体厚みが薄く、放熱性、耐湿性に優れた電子部
品搭載用基板を提供しようとするものである。 In view of the problems of the prior art, the present invention enables reliable mounting and bonding of a heat dissipation metal plate when using a printed wiring board made of an organic resin board.
The present invention aims to provide a substrate for mounting electronic components that has a small overall thickness and excellent heat dissipation and moisture resistance.
本考案は、有機系樹脂基板よりなるプリント配
線用基板の裏面側に放熱用金属板を装着するため
の装着用凹所を有し、また該装着用凹所の天井面
には金属被膜層を有してなり、また、上記装着用
凹所内には上記金属被膜層に対してはんだ層を介
して上記放熱用金属板を装着接合し、一方プリン
ト配線用基板の表面側には上記放熱用金属板に達
する電子部品搭載用凹部を形成してなることを特
徴とする電子部品搭載用基板にある。
The present invention has a mounting recess for mounting a heat dissipation metal plate on the back side of a printed wiring board made of an organic resin board, and a metal coating layer on the ceiling surface of the mounting recess. The heat dissipation metal plate is attached and bonded to the metal coating layer through a solder layer in the mounting recess, while the heat dissipation metal plate is attached to the surface side of the printed wiring board. There is provided a board for mounting electronic components, characterized by forming a recess for mounting electronic components that reaches the board.
本考案において最も注目すべきことは、プリン
ト配線用基板として有機系樹脂基板を用い、該プ
リント配線用基板の裏面側に上記装着用凹所を設
け、該装着用凹所内には上記金属被膜層及びはん
だ層を介して放熱用金属板を装着接合したことに
ある。 What is most noteworthy about this invention is that an organic resin substrate is used as the printed wiring board, the mounting recess is provided on the back side of the printed wiring board, and the metal coating layer is provided in the mounting recess. and a heat dissipation metal plate is attached and bonded via a solder layer.
本考案においては、プリント配線用基板の裏面
側に装着用凹所を設け、該装着用凹所の中に放熱
用金属板を装着固定している。そのため、従来の
ごとくプリント配線用基板の裏面側の全面に放熱
用金属板を接合する場合に比して、電子部品搭載
用基板全体の厚みを薄くすることができ、前記の
ごとく時計用、カメラ用等の電子部品搭載用基板
として極めて好適である。
In the present invention, a mounting recess is provided on the back side of the printed wiring board, and a heat dissipation metal plate is mounted and fixed in the mounting recess. Therefore, compared to the conventional case where a metal plate for heat dissipation is bonded to the entire back side of a printed circuit board, the thickness of the entire board for mounting electronic components can be made thinner. It is extremely suitable as a board for mounting electronic components such as for commercial use.
また、装着用凹所の中へ放熱用金属板を装着接
合するに当つては、装着用凹所の天井面に金属被
膜層を設け、該金属被膜層に対してはんだ層を介
して放熱用金属板を接合している。そのため、熱
膨張係数が大きく異なる有機系樹脂基板（プリン
ト配線用基板）と放熱用金属板との間には、金属
被膜層とはんだ層が介在し、両者間の熱膨張差が
緩和される。 In addition, when attaching and bonding a metal plate for heat dissipation into the mounting recess, a metal coating layer is provided on the ceiling surface of the mounting recess, and a heat dissipation metal plate is attached to the metal coating layer via a solder layer. Joining metal plates. Therefore, a metal coating layer and a solder layer are interposed between the organic resin substrate (printed wiring board) and the heat dissipation metal plate, which have significantly different coefficients of thermal expansion, to alleviate the difference in thermal expansion between the two.
それ故、熱サイクルに対しても、プリント配線
用基板と放熱用金属板の接合は強く保持され、放
熱用金属板がプリント配線用基板から剥離するこ
とはない。 Therefore, the bond between the printed wiring board and the heat dissipating metal plate is strongly maintained even during thermal cycles, and the heat dissipating metal plate does not peel off from the printed wiring board.
また、放熱用金属板はプリント配線用基板の装
着用凹所内に装着されているので、放熱用金属板
はその上面及び外周が装着用凹所により覆われた
状態となる。そのため、従来のごとく、プリント
配線用基板の裏面側全体に放熱用金属板を接合し
た場合に比して、放熱用金属板が確実に保持され
る。 Furthermore, since the heat dissipation metal plate is mounted within the mounting recess of the printed wiring board, the upper surface and outer periphery of the heat dissipation metal plate is covered by the mounting recess. Therefore, the heat dissipation metal plate can be held more reliably than in the conventional case where the heat dissipation metal plate is bonded to the entire back side of the printed wiring board.
また、放熱用金属板は、プリント配線用基板の
裏面側の一部に設けた装着用凹所内に設けてある
ため、装着用凹所以外の上記裏面側部分には必要
に応じて導体回路を形成することができ、導体回
路設計の自由度が向上する。 In addition, since the metal plate for heat dissipation is provided in a recess for mounting provided on a part of the back side of the printed wiring board, conductor circuits may be placed on the back side of the part other than the recess for mounting as necessary. This increases the degree of freedom in designing conductor circuits.
また、電子部品搭載用凹部の底面及びその周辺
には、上記金属被膜層、はんだ層、更には放熱用
金属板があり、これらは全て金属である。そのた
め、電子部品の熱は、金属被膜層、はんだ層、放
熱用金属板を通じて極めて円滑に放熱される。 Further, on the bottom surface of the electronic component mounting recess and its surroundings, there are the metal coating layer, the solder layer, and a heat dissipation metal plate, all of which are made of metal. Therefore, the heat of the electronic component is extremely smoothly radiated through the metal coating layer, the solder layer, and the heat radiating metal plate.
更に、上記金属被膜層、はんだ層、放熱用金属
板があるため、電子部品搭載用凹部への湿気浸入
が阻止される。もしも、プリント配線用基板と放
熱用金属板との接合を樹脂接着剤で行つた場合に
は、該樹脂接着剤を介して、電子部品搭載用凹部
内に湿気が浸入するばかりか、該湿気により該樹
脂接着剤が膨潤し、プリント配線用基板から放熱
用金属板が脱落する。 Furthermore, the presence of the metal coating layer, solder layer, and heat dissipation metal plate prevents moisture from entering the electronic component mounting recess. If the printed wiring board and the metal plate for heat dissipation are bonded using a resin adhesive, not only will moisture infiltrate into the electronic component mounting recess through the resin adhesive, but the moisture will also cause damage. The resin adhesive swells and the heat dissipation metal plate falls off from the printed wiring board.
しかも、本考案と構成全体として、電子部品搭
載用凹部と上記装着用凹所とを設けたことによ
り、電子部品と基板裏面との距離が短縮される。
つまり、有機系樹脂基板の裏面から電子部品に浸
入しようとする、湿気の浸入経路が短縮される。
しかし、本考案においては、その浸入経路内に上
記金属被膜層、はんだ層を設けているので、裏面
側からの湿気浸入を完全に遮断できる。 Moreover, in the present invention and overall configuration, by providing the electronic component mounting recess and the above-mentioned mounting recess, the distance between the electronic component and the back surface of the board can be shortened.
In other words, the path of moisture entering the electronic component from the back surface of the organic resin substrate is shortened.
However, in the present invention, since the metal coating layer and the solder layer are provided within the infiltration path, it is possible to completely block moisture intrusion from the back side.
以上のごとく、本考案によれば、有機系樹脂基
板のプリント配線用基板を用いた場合において、
放熱用金属板の確実な装着接合ができ、全体厚み
が薄く、放熱性、耐湿性に優れた電子部品搭載用
基板を提供することができる。 As described above, according to the present invention, when using a printed wiring board made of an organic resin board,
It is possible to provide a substrate for mounting electronic components, which allows reliable attachment and bonding of heat dissipation metal plates, has a small overall thickness, and has excellent heat dissipation performance and moisture resistance.
以下に、本考案の実施例にかかる電子部品搭載
用基板につき、第１図〜第６図を用いて具体的に
説明する。
Below, an electronic component mounting board according to an embodiment of the present invention will be specifically explained using FIGS. 1 to 6.
本例の電子部品搭載用基板は、第４図に示すご
とく、有機系樹脂基板よりなるプリント配線用基
板１の裏面側に放熱用金属板４を装着するための
装着用凹所を有し、また該装着用凹所の天井面に
は金属被膜層２を形成してある。また、上記装着
用凹所内には、上記金属被膜層２に対してはんだ
層３を介して放熱用金属板４を装着、接合してい
る。一方、プリント配線用基板１の表面側には上
記放熱用金属板４に達する電子部品搭載用凹部５
を形成している。 As shown in FIG. 4, the electronic component mounting board of this example has a mounting recess for mounting a heat dissipation metal plate 4 on the back side of a printed wiring board 1 made of an organic resin board. Further, a metal coating layer 2 is formed on the ceiling surface of the mounting recess. Furthermore, a heat dissipation metal plate 4 is mounted and bonded to the metal coating layer 2 via a solder layer 3 in the mounting recess. On the other hand, on the front side of the printed wiring board 1, there is a recess 5 for mounting electronic components that reaches the metal plate 4 for heat dissipation.
is formed.
上記プリント配線用基板に用いる有機系樹脂基
板の代表的なものは、ガラス繊維強化エポキシ樹
脂基板、ガラス・ポリイミド樹脂基板、ガラス・
トリアジン樹脂基板、紙・エポキシ樹脂基板、
紙・フエノール樹脂基板などである。 Typical organic resin substrates used for the printed wiring boards mentioned above are glass fiber reinforced epoxy resin substrates, glass polyimide resin substrates, and glass/polyimide resin substrates.
Triazine resin substrate, paper/epoxy resin substrate,
Paper, phenolic resin substrates, etc.
金属被膜層２は、金属メツキ被膜や銅箔等の金
属箔の貼着、又は金属箔に金属メツキを施すこと
により形成される。 The metal coating layer 2 is formed by adhering a metal plating film or a metal foil such as copper foil, or by applying metal plating to a metal foil.
はんだ層３は、鉛、スズなどを主成分としたも
ので組成は特に限定されるものではない。放熱用
金属板４は、銅、銅系合金、鉄、鉄系合金、アル
ミニウム、アルミニウム系合金など、比較的熱電
導率が大きいものが好ましい。該放熱用金属板４
は、電子部品搭載用凹部よりも幅広く、プリント
配線用基板１よりは幅狭である。 The solder layer 3 is mainly composed of lead, tin, etc., and its composition is not particularly limited. The metal plate 4 for heat dissipation is preferably made of copper, copper-based alloy, iron, iron-based alloy, aluminum, aluminum-based alloy, or the like, which has a relatively high thermal conductivity. The heat dissipation metal plate 4
is wider than the electronic component mounting recess and narrower than the printed wiring board 1.
次に、第１図は、放熱用金属板接合部分の拡大
図を示すもので、プリント配線用基板１に対して
金属被膜層２、はんだ層３、電子部品搭載用基板
４を順次接合した状態が示されている。なお、電
子部品搭載用凹部５（第３図）は、未だ形成され
ていない。 Next, FIG. 1 shows an enlarged view of the joint portion of the metal plates for heat dissipation, in which the metal coating layer 2, the solder layer 3, and the electronic component mounting board 4 are sequentially joined to the printed wiring board 1. It is shown. Note that the electronic component mounting recess 5 (FIG. 3) has not yet been formed.
また、第２図は、プリント配線用基板１に装着
用凹所が形成され、該装着用凹所の天井面に金属
被膜層２を有し、放熱用金属板４がはんだ層３を
介して、接合されている場合の縦断面図である。
該装着用凹所は、積層成形やザグリ加工などによ
り形成され、その大きさは放熱用金属板４の厚み
より若干大きな深さを有し、また放熱用金属板４
の外周形状より若干大きい。なお、前記プリント
配線用基板１の片面又は両面には、予め銅箔等の
導電被膜が積層貼着されていてもよい。 Further, in FIG. 2, a mounting recess is formed in the printed wiring board 1, a metal coating layer 2 is provided on the ceiling surface of the mounting recess, and a heat dissipating metal plate 4 is inserted through a solder layer 3. , is a vertical cross-sectional view of the case where they are joined.
The mounting recess is formed by lamination molding, counterbore processing, etc., and has a depth slightly larger than the thickness of the heat dissipation metal plate 4.
Slightly larger than the outer circumferential shape of. Note that a conductive film such as copper foil may be laminated and pasted on one or both sides of the printed wiring board 1 in advance.
第３図及び第４図は、半導体素子等の電子部品
を搭載するための電子部品搭載用凹部５が設けら
れた状態を拡大して示すものである。 3 and 4 are enlarged views showing a state in which an electronic component mounting recess 5 for mounting an electronic component such as a semiconductor element is provided.
両図に示すごとく、プリント配線用基板１の表
面に導体回路部６が形成されている。また、電子
部品を搭載する箇所に電子部品搭載用凹部５が形
成され、その底面には放熱用金属板４の一部が露
出している。 As shown in both figures, a conductive circuit section 6 is formed on the surface of the printed wiring board 1. Further, an electronic component mounting recess 5 is formed at a location where the electronic component is to be mounted, and a portion of the heat dissipation metal plate 4 is exposed at the bottom surface thereof.
上記放熱用金属板４は、金属被膜層２に、はん
だ層３を介して接合されている。そのため、電子
部品から発生した熱は、金属被膜層２、はんだ層
３を介して、放熱用金属板４へ速やかに伝導し、
外部へ放散される。それ故、高出力の電子部品の
搭載も可能となる。 The heat dissipation metal plate 4 is bonded to the metal coating layer 2 via a solder layer 3. Therefore, the heat generated from the electronic components is quickly conducted to the heat dissipation metal plate 4 via the metal coating layer 2 and the solder layer 3.
Dissipated to the outside. Therefore, it becomes possible to mount high-output electronic components.
また、装着用凹所内へ放熱用金属板４を装着す
るに際しては、まず装着用凹所の天井面に金属被
膜層２を形成しておき、次いではんだ層３を介し
て放熱用金属板４を接合している。そのため、熱
膨張係数が大きく異なる有機系樹脂基板と放熱用
金属板４との間には、金属被膜層２とはんだ層３
とが介在することとなり、プリント配線用基板１
と放熱用金属板４との間の熱膨張差が緩和される
こととなる。 In addition, when installing the heat dissipating metal plate 4 into the mounting recess, the metal coating layer 2 is first formed on the ceiling surface of the mounting recess, and then the heat dissipating metal plate 4 is attached via the solder layer 3. It is joined. Therefore, between the organic resin substrate and the heat dissipation metal plate 4, which have significantly different coefficients of thermal expansion, there is a metal coating layer 2 and a solder layer 3.
, and the printed wiring board 1
The difference in thermal expansion between the metal plate 4 and the metal plate 4 for heat dissipation is alleviated.
それ故、電子部品搭載用基板の使用環境下にお
ける熱サイクルに対しても、プリント配線用基板
１と放熱用金属板４の接合は強く保持され、放熱
用金属板４が剥離することはない。 Therefore, the bond between the printed wiring board 1 and the heat dissipation metal plate 4 is strongly maintained even during thermal cycles in the environment in which the electronic component mounting board is used, and the heat dissipation metal plate 4 does not peel off.
また、放熱用金属板４はプリント配線用基板１
の装着用凹所内に装着されているので、プリント
配線用基板１の裏面側全体に放熱用金属板を接合
した従来技術に比して、電子部品搭載用基板全体
の厚みを薄くすることができる。 Further, the heat dissipation metal plate 4 is the printed wiring board 1
Since it is mounted in the mounting recess of the printed wiring board 1, the overall thickness of the electronic component mounting board can be reduced compared to the conventional technology in which a heat dissipation metal plate is bonded to the entire back side of the printed wiring board 1. .
また、放熱用金属板４は、プリント配線用基板
１の裏面側において、その一部に設けた装着用凹
所内に設けてあるので、装着用凹所以外の上記裏
面側部分には必要に応じて、導体回路を形成する
ことができる。それ故、導体回路設計の自由度が
向上する。 In addition, since the heat dissipation metal plate 4 is provided in a mounting recess provided in a part of the back surface side of the printed wiring board 1, the heat dissipating metal plate 4 is provided in the back surface side portion other than the mounting recess as necessary. A conductor circuit can be formed using the above-described method. Therefore, the degree of freedom in designing the conductor circuit is improved.
また、電子部品搭載用凹部５の底面及びその周
辺には、上記金属被膜層２、はんだ層３、放熱用
金属板４があるため、プリント配線用基板１の下
面を通じて、電子部品搭載用凹部５の内部へ湿気
が浸入することがない。 In addition, since the metal film layer 2, the solder layer 3, and the heat dissipation metal plate 4 are present on the bottom surface of the electronic component mounting recess 5 and its surroundings, the electronic component mounting recess 5 can be passed through the lower surface of the printed wiring board 1. Moisture will not infiltrate into the interior.
第５図は、第４図の電子部品搭載用凹部５の壁
面及び底面に金属メツキ被膜７を形成した場合の
縦断面図である。該金属メツキ被膜７は外部の湿
気がプリント配線用基板の外周面方向（同図の横
方向）を伝わつて、電子部品搭載用凹部５へ浸入
するのを防ぐ効果があり、一層耐湿性が向上する
利点を有する。 FIG. 5 is a longitudinal cross-sectional view of the case where a metal plating film 7 is formed on the wall and bottom surfaces of the electronic component mounting recess 5 shown in FIG. 4. The metal plating film 7 has the effect of preventing external moisture from traveling along the outer peripheral surface of the printed wiring board (lateral direction in the figure) and infiltrating into the electronic component mounting recess 5, further improving moisture resistance. It has the advantage of
第６図は、本考案による電子部品搭載用基板に
半導体素子８を実装し、ワイヤーボンデイングに
より結線し、半導体素子及びその周辺部を樹脂１
０にて封止した状態の縦断面図である。前記樹脂
１０は封止用樹脂であり、エポキシ樹脂、シリコ
ーン樹脂などである。 FIG. 6 shows a semiconductor element 8 mounted on an electronic component mounting board according to the present invention, connected by wire bonding, and a resin 1
FIG. The resin 10 is a sealing resin, such as epoxy resin or silicone resin.
本例の電子部品搭載用基板によれば、チツプキ
ヤリアやピングリツドアレイなどのパツケージ基
板として利用され、薄型で、放熱用金属板が確実
に装着でき、高熱放散性を有し、耐湿性が極めて
高いパツケージが得られる。 The electronic component mounting board of this example can be used as a package board for chip carriers, pin grid arrays, etc., is thin, allows for secure attachment of heat dissipating metal plates, has high heat dissipation properties, and is extremely moisture resistant. You can get a high package.
第１図は、本考案の電子部品搭載用基板の一部
構成を示す部分拡大縦断面図、第２図は、本考案
の電子部品搭載用基板の他の一部構成を示す部分
拡大縦断面図、第３図は、本考案の電子部品搭載
用基板の実施例を示す部分拡大縦断面図、第４図
は、本考案の電子部品搭載用基板の他の実施例を
示す部分拡大縦断面図、第５図は、本考案の電子
部品搭載用基板の更に他の実施例を示す部分拡大
縦断面図、第６図は、第３図に示した実施例に半
導体素子を実装した状態を示す部分拡大縦断面
図、第７図は、従来の電子部品搭載用基板の部分
拡大縦断面図である。
１……プリント配線用基板、２……金属被膜
層、３……はんだ層、４……金属板、５……電子
部品搭載用凹部、６……導体回路部、７……金属
メツキ被膜、８……半導体素子、９……ボンデイ
ングワイヤー、１０……封止用樹脂。
FIG. 1 is a partially enlarged vertical cross-sectional view showing a partial configuration of the electronic component mounting board of the present invention, and FIG. 2 is a partially enlarged vertical cross-sectional view showing another partial configuration of the electronic component mounting board of the present invention. 3 is a partially enlarged vertical cross-sectional view showing an embodiment of the electronic component mounting board of the present invention, and FIG. 4 is a partially enlarged longitudinal cross-sectional view showing another embodiment of the electronic component mounting board of the present invention. 5 is a partially enlarged longitudinal cross-sectional view showing still another embodiment of the electronic component mounting board of the present invention, and FIG. 6 shows a state in which a semiconductor element is mounted on the embodiment shown in FIG. 3. FIG. 7 is a partially enlarged vertical cross-sectional view of a conventional electronic component mounting board. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Metal coating layer, 3... Solder layer, 4... Metal plate, 5... Recessed portion for mounting electronic components, 6... Conductor circuit portion, 7... Metal plating film, 8... Semiconductor element, 9... Bonding wire, 10... Sealing resin.
Claims (1)
の裏面側に放熱用金属板を装着するための装着
用凹所を有し、また該装着用凹所の天井面には
金属被膜層を有してなり、 また、上記装着用凹所内には上記金属被膜層
に対してはんだ層を介して上記放熱用金属板を
装着接合し、一方プリント配線用基板の表面側
には上記放熱用金属板に達する電子部品搭載用
凹部を形成してなることを特徴とする電子部品
搭載用基板。 (2) 実用新案登録請求の範囲第１項において、電
子部品搭載用凹部の壁面及び底面には金属めつ
き被膜が形成されていることを特徴とする電子
部品搭載用基板。[Scope of Claim for Utility Model Registration] (1) A printed wiring board made of an organic resin substrate has a mounting recess for mounting a heat dissipation metal plate on the back side thereof, and the ceiling of the mounting recess. The surface has a metal coating layer, and the heat dissipation metal plate is attached and bonded to the metal coating layer in the mounting recess through a solder layer, while the surface of the printed wiring board is A board for mounting an electronic component, characterized in that a recess for mounting an electronic component is formed on the side thereof, reaching the metal plate for heat dissipation. (2) The substrate for mounting electronic components as set forth in claim 1 of the utility model registration claim, characterized in that a metal plating film is formed on the wall and bottom surfaces of the recess for mounting electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143239U JPH039341Y2 (en) | 1984-09-20 | 1984-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143239U JPH039341Y2 (en) | 1984-09-20 | 1984-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157555U JPS6157555U (en) | 1986-04-17 |
| JPH039341Y2 true JPH039341Y2 (en) | 1991-03-08 |
Family
ID=30701541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984143239U Expired JPH039341Y2 (en) | 1984-09-20 | 1984-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039341Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (en) * | 1974-05-08 | 1975-11-18 | ||
| JPS5593286A (en) * | 1979-01-10 | 1980-07-15 | Hitachi Ltd | Electronic circuit and method of fabricating same |
-
1984
- 1984-09-20 JP JP1984143239U patent/JPH039341Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (en) * | 1974-05-08 | 1975-11-18 | ||
| JPS5593286A (en) * | 1979-01-10 | 1980-07-15 | Hitachi Ltd | Electronic circuit and method of fabricating same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157555U (en) | 1986-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102332362B1 (en) | Ultra-thin embedded semiconductor device package and method of manufacturing therof | |
| JP4159861B2 (en) | Method for manufacturing heat dissipation structure of printed circuit board | |
| JP4610414B2 (en) | Electronic component storage package, electronic device, and electronic device mounting structure | |
| WO1985002515A1 (en) | Printed-circuit board for mounting electronic element and method of manufacture thereof | |
| JP2002203942A (en) | Power semiconductor module | |
| JPH04230056A (en) | Electronic constitution element, method for manufacture of said electronic constitution element | |
| JPH0917919A (en) | Semiconductor device | |
| JP2725448B2 (en) | Semiconductor device | |
| JPS6134990A (en) | Substrate for placing electronic part and method of producing same | |
| JPH039341Y2 (en) | ||
| JP3975203B2 (en) | Capacitor board with radiator | |
| JPH0420279B2 (en) | ||
| JPH0831990A (en) | Heat radiating fin | |
| JPH06334286A (en) | Circuit board | |
| JPH0263141A (en) | Manufacture of substrate for electronic component loading use | |
| JPH0376795B2 (en) | ||
| JPS61202495A (en) | Substrate for carrying electronic component and manufacture thereof | |
| JPS6134989A (en) | Substrate for placing electronic part and method of producing same | |
| JP2612468B2 (en) | Substrate for mounting electronic components | |
| JPH07273462A (en) | Electronic part mounting substrate | |
| JP2521624Y2 (en) | Semiconductor device | |
| JP2614495B2 (en) | Substrate for mounting electronic components | |
| JP2804765B2 (en) | Substrate for mounting electronic components | |
| JPH056714Y2 (en) | ||
| JP3039485B2 (en) | Semiconductor package for surface mounting and method of manufacturing the same |