JPH0376795B2 - - Google Patents
Info
- Publication number
- JPH0376795B2 JPH0376795B2 JP60013052A JP1305285A JPH0376795B2 JP H0376795 B2 JPH0376795 B2 JP H0376795B2 JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP H0376795 B2 JPH0376795 B2 JP H0376795B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal plate
- plating film
- mounting
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 164
- 239000002184 metal Substances 0.000 claims description 164
- 238000007747 plating Methods 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、放熱用金属板を強固に固定できると
共に、熱放散性を向上させ、電子部品への外部か
らの湿気の侵入を遮断できる電子部品搭載用基板
及びその製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is an electronic device that can firmly fix a heat dissipation metal plate, improve heat dissipation performance, and block moisture from entering electronic components from the outside. The present invention relates to a component mounting board and a manufacturing method thereof.
従来、チツプ素子、半導体素子などの電子部品
を直接プリント配線用基板に搭載し、ワイヤーボ
ンデイングにより電気的に接続された電子部品搭
載用基板が、時計やカメラなどの内装基板として
使用されている。
BACKGROUND ART Conventionally, electronic parts mounting boards, in which electronic parts such as chip elements and semiconductor elements are directly mounted on printed wiring boards and electrically connected by wire bonding, have been used as interior boards for watches, cameras, and the like.
第５図のａは、半導体素子１２を直接プリント
配線用基板１の上に搭載した場合の電子部品搭載
用基板の例である。このプリント配線用基板とし
ては、セラミツクス基板又は、有機系樹脂基板が
用いられている。 FIG. 5a shows an example of an electronic component mounting board in which the semiconductor element 12 is directly mounted on the printed wiring board 1. In FIG. A ceramic substrate or an organic resin substrate is used as this printed wiring board.
また、第５図のｂは、プリント配線用基板１の
表面側にザグリ加工又は積層成形により電子部品
搭載用凹部を設け、その凹部内に半導体素子１２
を搭載した電子部品搭載用基板を示している。 In addition, in FIG. 5b, a recess for mounting an electronic component is provided on the front surface side of the printed wiring board 1 by counterbore processing or lamination molding, and a semiconductor element 12 is placed in the recess.
The figure shows a board for mounting electronic components.
なお、上記第５図ａ，ｂにおいて、符号２はプ
リント配線用基板１上に設けられた銅箔、５はそ
上に形成された金属メツキ被膜、１３はボンデイ
ングワイヤー、１４は封止用樹脂である。 In FIGS. 5a and 5b, reference numeral 2 indicates a copper foil provided on the printed wiring board 1, 5 indicates a metal plating film formed thereon, 13 indicates a bonding wire, and 14 indicates a sealing resin. It is.
また、これら従来の電子部品搭載用基板におい
ては、電子部品からの発熱に対して十分な熱放散
が得られず、比較的低い出力の電子部品しか搭載
できない。そのため、高い出力の電子部品を搭載
する場合においては、放熱用のフインを設けるな
どの対策が必要である。 Further, in these conventional electronic component mounting boards, sufficient heat dissipation for heat generated from the electronic components cannot be obtained, and only relatively low output electronic components can be mounted. Therefore, when mounting high-output electronic components, it is necessary to take measures such as providing heat dissipation fins.
特にプリント配線用基板として有機系樹脂素材
を用いる場合には、軽量及び加工容易性の点でセ
ラミツク基板に比して有利であるが、金属などに
比較し熱伝導率が小さく電子部品からの熱放散性
は劣つている。 In particular, when organic resin materials are used as printed wiring boards, they are advantageous over ceramic boards in terms of light weight and ease of processing, but they have lower thermal conductivity than metals, so they absorb heat from electronic components. Dissipation is poor.
また、有機系樹脂素材を用いる場合の問題点
は、耐湿性がセラミツクス基板に比べて非常に低
い。そのため、第５図ｂの構造を採用する場合に
は、外部からの湿気がプリント配線用基板を透過
して電子部品まで達し、電子部品を腐食させるお
それがある。 Another problem when using an organic resin material is that its moisture resistance is much lower than that of a ceramic substrate. Therefore, when the structure shown in FIG. 5B is adopted, there is a risk that moisture from the outside will pass through the printed wiring board and reach the electronic components, corroding the electronic components.
そのため、耐湿性に対して高い信頼性が要求さ
れる分野には、有機系樹脂基板を使用することが
困難である。 Therefore, it is difficult to use organic resin substrates in fields where high reliability with respect to moisture resistance is required.
また、従来の電子部品搭載用基板として、耐湿
性の向上のために、電子部品搭載用凹部の表面に
金属メツキ層を設けたものがある（特開昭59−
67686号公報参照）。しかし、このものは、電子部
品搭載用凹部の底面が有機系樹脂素材であるた
め、熱放散性に劣る。
In addition, some conventional substrates for mounting electronic components have a metal plating layer provided on the surface of the recess for mounting electronic components in order to improve moisture resistance (Japanese Patent Application Laid-Open No. 59-1989-1).
(See Publication No. 67686). However, in this case, the bottom surface of the electronic component mounting recess is made of an organic resin material, and therefore has poor heat dissipation properties.
また、プリント配線用基板に貫通穴を設け、そ
の中に金属板を圧入して、電子部品搭載用凹部を
形成した電子部品搭載用基板も提案されている
（特開昭59−67687号公報参照）。しかし、このも
のは、金属板が上記貫通穴内に圧入され、せいぜ
い接着層又はソルダーレジストによつて、その周
囲がプリント配線用基板の裏面側に支持されてい
る程度である。それ故、長期使用中に、金属板が
離脱するおそれがある。 In addition, a board for mounting electronic components has been proposed in which a through hole is provided in a printed wiring board and a metal plate is press-fitted into the hole to form a recess for mounting electronic components (see Japanese Patent Laid-Open No. 59-67687). ). However, in this case, the metal plate is press-fitted into the through hole, and the periphery thereof is supported on the back side of the printed wiring board at most by an adhesive layer or a solder resist. Therefore, there is a risk that the metal plate will come off during long-term use.
特に、電子部品搭載用基板は、高温から低温の
広範囲で繰り返し使用される。そのため、金属板
とプリント配線用基板との間が、両者の熱膨張率
の差異等により、剥離し易い。 In particular, substrates for mounting electronic components are repeatedly used over a wide range of temperatures from high temperatures to low temperatures. Therefore, separation between the metal plate and the printed wiring board is likely to occur due to the difference in coefficient of thermal expansion between the two.
また、プリント配線用基板に貫通穴を設け、そ
の中にプリント配線用基板と同じ厚みの金属板を
圧入し、プリント配線用基板及び金属板の上下面
に金属メツキ層を形成し、その後金属板をザグリ
加工して電子部品搭載用凹部を設ける技術もある
（特開昭59−46086号公報参照）。しかし、この方
法は、金属板を圧入した後ザグリ加工するため、
プリント配線用基板上より切削屑等の除去が必要
となり、洗浄が煩雑となる。 In addition, a through hole is made in the printed wiring board, a metal plate with the same thickness as the printed wiring board is press-fitted into the hole, a metal plating layer is formed on the top and bottom surfaces of the printed wiring board and the metal plate, and then the metal plate is There is also a technique of counterboring the material to provide a recess for mounting electronic components (see Japanese Patent Laid-Open No. 59-46086). However, this method involves counterboring the metal plate after press-fitting it.
It is necessary to remove cutting debris from the printed wiring board, making cleaning complicated.
また、プリント配線用基板に貫通穴を設け、こ
の中に、凹状に形成した金属加工物を挿入固定し
た電子部品搭載用基板もある（特開昭59−46087
号公報参照）。しかし、このものは、上記２番目
の公報の技術と同様に、金属板が剥離し易い。 There is also a board for mounting electronic components in which a through hole is provided in the printed wiring board and a metal workpiece formed in a concave shape is inserted and fixed into the hole (Japanese Patent Laid-Open No. 59-46087
(see publication). However, in this case, the metal plate is likely to peel off, similar to the technique of the second publication.
本発明はかかる従来の問題点に鑑み、プリント
配線用基板に対して金属板を強固に固定すること
ができ、かつ熱放散性及び耐湿性に優れた電子部
品搭載用基板及びその製造方法を提供しようとす
るものである。 In view of these conventional problems, the present invention provides a board for mounting electronic components that can firmly fix a metal plate to a printed wiring board and has excellent heat dissipation and moisture resistance, and a method for manufacturing the same. This is what I am trying to do.
本発明は、有機系樹脂素材からなるプリント配
線用基板の裏面側に、熱熱用の金属板を搭載する
ための金属板用凹部を、ザグリ加工により形成す
る工程と、
上記金属板用凹部の略中央の一部に電子部品を
搭載するための貫通穴を形成する工程と、
少なくとも上記金属板用凹部及び貫通穴の表面
に第１金属メツキ被膜を形成する工程と、
上記金属板用凹部の内底面に、上記貫通穴の裏
面側を塞ぐと共に、プリント配線用基板の表面側
に電子部品搭載用凹部が形成されるように、上記
第１金属メツキ被膜の上に接着層を介して金属板
を接着する工程と、
上記金属板及び金属板用凹部の表面に連続して
第２金属メツキ被膜を形成すると共に、上記電子
部品搭載用凹部の表面にも第３金属メツキ被膜を
形成する工程と、
よりなることを特徴とする電子部品搭載用基板の
製造方法にある。
The present invention includes a step of forming a metal plate recess for mounting a thermal metal plate on the back side of a printed wiring board made of an organic resin material by counterboring, and a step of forming a through hole for mounting an electronic component in a substantially central part; a step of forming a first metal plating film on at least the surface of the metal plate recess and the through hole; A metal plate is placed on the first metal plating film via an adhesive layer on the inner bottom surface so as to close the back side of the through hole and form a recess for mounting electronic components on the front side of the printed wiring board. a step of forming a second metal plating film continuously on the surface of the metal plate and the recess for the metal plate, and a step of forming a third metal plating film also on the surface of the recess for mounting the electronic component; A method of manufacturing a board for mounting electronic components, characterized by comprising the following steps.
本発明において最も注目すべきことは、プリン
ト配線用基板に上記のごとく金属板用凹部と貫通
穴とを設け、これらの表面に第１金属メツキ被膜
を形成し、その後金属板用凹部に対して貫通穴を
塞ぐと共に電子部品搭載用凹部が形成されるよう
に金属板を接着すること、その後金属板と金属板
用凹部の表面に連続して第２金属メツキ被膜と形
成し、また電子部品搭載用凹部の表面に第３金属
メツキ被膜を形成することである。 What is most noteworthy about the present invention is that the recess for the metal plate and the through hole are provided in the printed wiring board as described above, the first metal plating film is formed on these surfaces, and then the recess for the metal plate is formed. A metal plate is bonded so as to close the through hole and form a recess for mounting an electronic component, and then a second metal plating film is continuously formed on the surface of the metal plate and the recess for the metal plate, and the electronic component is mounted. A third metal plating film is formed on the surface of the recess.
そして、上記第１金属メツキ被膜は、上記金属
板を接着した後に上記第２金属メツキ被膜及び第
３金属メツキ被膜を形成するために施すものであ
る。 The first metal plating film is applied to form the second metal plating film and the third metal plating film after bonding the metal plates.
また、上記の全工程は、多数の電子部品搭載用
基板が格子状に配列された基板シートの状態で行
うことが望ましい。これにより、上記金属メツキ
層の形成を各電子部品搭載用基板に対して一度に
行うことができ、生産性が向上する。 Further, all of the above steps are preferably performed on a substrate sheet in which a large number of electronic component mounting substrates are arranged in a grid. Thereby, the metal plating layer can be formed on each electronic component mounting substrate at once, improving productivity.
また、上記第２金属メツキ被膜と第３金属メツ
キ被膜とは同時に形成することが望ましい。 Further, it is desirable that the second metal plating film and the third metal plating film are formed at the same time.
また、上記方法により得られる電子部品搭載用
基板としては、次のものがある。 Moreover, the electronic component mounting substrate obtained by the above method includes the following.
即ち、このものは、有機系樹脂素材からなるプ
リント配線用基板において、該プリント配線用基
板はその裏面側にザグリ加工により形成した金属
板用凹部を有し、またその表面側には上記金属板
用凹部に貫通する貫通穴を有し、また、上記金属
板用凹部及び貫通穴の表面には連続した第１金属
メツキ被膜が形成されており、また該金属板用凹
部の内底面には上記貫通穴の裏面側を塞ぐと共に
プリント配線用基板の表面側に電子部品搭載用凹
部が形成されるように、上記第１金属メツキ被膜
の上に接着層を介して金属板を接着している。さ
らに、金属板の表面には金属板用凹部の表面まで
連続的に形成された第２金属メツキ被膜を有する
と共に、電子部品搭載用凹部の表面にも第３金属
メツキ被膜を有している。 That is, this is a printed wiring board made of an organic resin material, which has a metal plate recess formed by counterboring on its back side, and the metal plate on its front side. A continuous first metal plating film is formed on the surfaces of the metal plate recess and the through hole, and the inner bottom surface of the metal plate recess has a through hole that penetrates the metal plate recess. A metal plate is bonded onto the first metal plating film via an adhesive layer so as to close the back side of the through hole and form a recess for mounting an electronic component on the front side of the printed wiring board. Furthermore, the surface of the metal plate has a second metal plating film formed continuously up to the surface of the recess for the metal plate, and the surface of the recess for mounting electronic components also has a third metal plating film.
また、上記金属板用凹部の平面形状は、辺又は
コーナー部の少なくとも２箇所が変形しており、
金属板装着用位置合わせ部と形成している。 In addition, the planar shape of the metal plate recess is deformed in at least two places, the sides or the corners,
It is formed with a positioning part for attaching a metal plate.
また、金属板の平面形状についても、上記金属
板用凹部の形状と同様である。 Further, the planar shape of the metal plate is also the same as the shape of the metal plate recess.
また、上記プリント配線用基板は、上記電子部
品搭載用凹部よりも外側に導体ピン挿入用の多数
の孔を有しているプラグインパツケージ用基板と
することができる。 Further, the printed wiring board may be a plug-in package board having a large number of holes for inserting conductor pins outside the electronic component mounting recess.
以下に、本発明の実施例を、第１図〜第４図を
用いて説明する。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 4.
なお、下記説明において、金属メツキ層５は、
上記第１金属メツキ被膜を示し、金属メツキ層９
は金属板表面及び金属板用凹部３側のものが上記
第２金属板メツキ被膜を、電子部品搭載用凹部６
側のものが上記第３金属メツキ被膜を示してい
る。 In addition, in the following description, the metal plating layer 5 is
The first metal plating film is shown, metal plating layer 9
The surface of the metal plate and the side of the recess 3 for metal plate are covered with the second metal plate plating coating, and the recess 6 for mounting electronic components is
The one on the side shows the third metal plating film.
まず、本発明の電子部品搭載用基板の製造方法
を第２図に示す工程にて便宜上説明する。 First, for convenience, the method of manufacturing a substrate for mounting electronic components according to the present invention will be explained with reference to the steps shown in FIG.
第２図のａはプリント配線用基板１の裏面側を
ザグリ加工により凹部３を形成した縦断面図であ
る。プリント配線用基板の代表的なものは、ガラ
ス繊維強化エポキシ樹脂基板、紙フエノール樹脂
基板、紙エポキシ樹脂基板、ガラスポリイミド樹
脂基板、ガラストリアジン樹脂基板などである。
そしてこれらの基板の両面には予め銅箔２等の金
属被膜が形成されていてもよい。前記基板１の裏
面側に形成された凹部の大きさ深さなどは特に限
定されるものではない。次に第２図のｂは、前記
基板１の裏面に形成された凹部３の略中央の一部
をザグリ加工又は打ち抜き加工などにより貫通孔
４を形成した縦断面図である。第２図のｃは少な
くとも前記基板１の裏面側の凹部３と貫通孔４と
を含む基板表面に金属メツキ被膜５を形成した縦
断面図である。該凹部３の壁面及び底面と該貫通
孔の壁面に形成される金属メツキ被膜５は湿気の
透過を防ぐためのものである。第２図のｄは前記
凹部３内底面に、前記貫通孔４を塞ぎかつ該貫通
孔４が、前記基板１の表面で電子部品を搭載すべ
き箇所の凹部６となるように接着層７を介して金
属板８を接合した状態の縦断面図である。前記接
着層としては未硬化のエポキシ樹脂含浸のガラス
クロス又は耐熱性の接着シート又は液状の樹脂な
どであり、接着性、耐熱性、耐久性などの諸特性
が高い接着層が好ましい。一方金属板は、銅、銅
系合金、鉄、鉄系合金、アルミニウム、アルミニ
ウム系合金など、比較的熱伝導率が大きいもので
あればよい。金属板の大きさ、厚さは特に限定さ
れるものではないが、板厚が厚くて表面積が大き
い方が、熱放散性を向上する上で有利である。前
記金属板を装着する位置を決める方法としては第
３図のａ，ｂに示すように基板裏面側の凹部３の
平面形状を、辺又はコーナー部の少なくとも２箇
所が変形されている基板と第３図のｃ，ｄのよう
に前記金属板８の平面形状の辺又はコーナー部の
少なくとも２箇所が変形されていることにより金
属板装着位置を決めることが有利である。前記第
２図のｅは前記凹部６の少なくとも含む基板両面
に金属メツキ被膜９を形成して、プリント配線用
基板１を金属板８とを一体化した状態の縦断面図
である。該金属メツキ被膜９はプリント配線用基
板１と前記金属板８の接着層への水の浸入を遮断
し電子部品搭載部への水の侵入を防ぐ効果があり
又金属板８と銅箔２が金属メツキ被膜８によつて
一体化されることにより電子部品からの発熱が金
属板から銅箔へ速やかに伝導し外部へ放散するた
め熱放散効果が向上する利点がある。第２図のｆ
は本発明による電子部品搭載基板に半導体素子１
２を実装しワイヤーボンデイングにより結線し、
半導体素子及びその周辺部を樹脂１４にて封止し
た状態の縦断面図である。この図面で１４は封止
樹脂であり、エポキシ、シリコーン樹脂などが好
しい。また１１は封止用樹脂の流出防止用の堰枠
である。このようにして製造された本発明のプリ
ント配線板は第１図の縦断面図に示す特徴を有し
ているものである。その特徴は、有機系樹脂素材
からなるプリント配線用基板１の表面側には導体
回路と電子部品を搭載すべき凹部６を有し、前記
凹部６を裏面側にある金属板８と接触する金属メ
ツキ被膜９とを少なくとも有し、前記プリント配
線用基板１の裏面側には凹部３と該凹部表面には
金属メツキ被膜５と該金属メツキ被膜表面には接
着層７を介して金属板８が装着されており、前記
金属板と両基板面に金属メツキ被膜９が形成され
ていることである。第４図は、本発明のプラグイ
ンパツケージ基板の斜視図である。これは前記電
子部品搭載用基板の外周部に設けられたスルホー
ル１５に多数の導体ピン１６が周列状に配設され
て成るプラグインパツケージである。斜線部１７
に示す前記基板外周部及びスルホール１５表面に
熱硬化性樹脂シート１７が粘着されている。これ
はスルホールを完全に被覆するためである。 FIG. 2A is a longitudinal cross-sectional view of the back side of the printed wiring board 1 in which a recess 3 is formed by counterboring. Typical printed wiring boards include glass fiber-reinforced epoxy resin boards, paper phenol resin boards, paper epoxy resin boards, glass polyimide resin boards, and glass triazine resin boards.
A metal coating such as copper foil 2 may be formed on both surfaces of these substrates in advance. The size and depth of the recess formed on the back side of the substrate 1 are not particularly limited. Next, FIG. 2b is a longitudinal cross-sectional view in which a through hole 4 is formed in a part of the approximate center of the recess 3 formed on the back surface of the substrate 1 by counterboring or punching. FIG. 2c is a longitudinal cross-sectional view in which a metal plating film 5 is formed on the surface of the substrate 1, including at least the recess 3 and the through hole 4 on the back side of the substrate 1. The metal plating film 5 formed on the walls and bottom of the recess 3 and the wall of the through hole is for preventing moisture from permeating. 2d, an adhesive layer 7 is applied to the inner bottom surface of the recess 3 so as to close the through hole 4 and to form a recess 6 at a location on the surface of the substrate 1 where the electronic component is to be mounted. It is a longitudinal cross-sectional view of a state in which metal plates 8 are joined through. The adhesive layer may be an uncured epoxy resin-impregnated glass cloth, a heat-resistant adhesive sheet, or a liquid resin, and an adhesive layer with high properties such as adhesiveness, heat resistance, and durability is preferable. On the other hand, the metal plate may be made of copper, copper-based alloy, iron, iron-based alloy, aluminum, aluminum-based alloy, etc., as long as it has a relatively high thermal conductivity. Although the size and thickness of the metal plate are not particularly limited, a thicker plate and a larger surface area are advantageous in improving heat dissipation. As shown in FIG. 3 a and b, the method of determining the mounting position of the metal plate is as shown in FIG. It is advantageous to determine the mounting position of the metal plate by deforming at least two sides or corners of the planar shape of the metal plate 8, as shown in c and d of FIG. FIG. 2e is a vertical sectional view of the printed wiring board 1 and the metal plate 8 integrated with each other by forming a metal plating film 9 on both surfaces of the board including at least the recess 6. The metal plating film 9 has the effect of blocking water from entering the adhesive layer between the printed wiring board 1 and the metal plate 8 and preventing water from entering the electronic component mounting area. By being integrated with the metal plating film 8, heat generated from the electronic components is quickly conducted from the metal plate to the copper foil and radiated to the outside, which has the advantage of improving the heat dissipation effect. f in Figure 2
The semiconductor element 1 is mounted on the electronic component mounting board according to the present invention.
2 is mounted and connected by wire bonding,
FIG. 2 is a longitudinal cross-sectional view of a semiconductor element and its surrounding area sealed with resin 14; In this drawing, 14 is a sealing resin, preferably epoxy, silicone resin, or the like. Further, 11 is a weir frame for preventing the sealing resin from flowing out. The printed wiring board of the present invention manufactured in this manner has the characteristics shown in the longitudinal sectional view of FIG. The feature is that the front side of the printed wiring board 1 made of an organic resin material has a recess 6 on which a conductor circuit and electronic components are to be mounted, and the recess 6 is made of metal that contacts the metal plate 8 on the back side. The printed wiring board 1 has a recess 3 on the back side thereof, a metal plating film 5 on the surface of the recess, and a metal plate 8 on the surface of the metal plating film with an adhesive layer 7 interposed therebetween. A metal plating film 9 is formed on the metal plate and both substrate surfaces. FIG. 4 is a perspective view of the plug-in package board of the present invention. This is a plug-in package in which a large number of conductor pins 16 are arranged in a circumferential row in through holes 15 provided on the outer periphery of the electronic component mounting board. Shaded area 17
A thermosetting resin sheet 17 is adhered to the outer periphery of the substrate and the surface of the through hole 15 shown in FIG. This is to completely cover the through holes.
本発明法により得られる電子部品搭載用基板に
おいては、金属板は金属板用凹部の表面に形成し
た第１金属メツキ被膜の上に接着層を介して接着
されており、かつ該金属板はその表面及び金属板
用凹部の第１金属メツキ被膜の上に連続して形成
した第２金属メツキ被膜によつてプリント配線用
基板に固定されている。
In the electronic component mounting substrate obtained by the method of the present invention, the metal plate is bonded via an adhesive layer onto the first metal plating film formed on the surface of the metal plate recess; It is fixed to the printed wiring board by a second metal plating film formed continuously on the surface and the first metal plating film in the metal plate recess.
即ち、金属板は、上記接着層と共に上記連続し
た第２金属メツキ被膜によつても、プリント配線
用基板に固定され、そして該第２金属メツキ被膜
は第１金属メツキ被膜に対して金属結合（金属メ
ツキ）により強固に結合されている。 That is, the metal plate is fixed to the printed wiring board by the continuous second metal plating film as well as the adhesive layer, and the second metal plating film is metallically bonded to the first metal plating film ( It is firmly connected by metal plating).
そして、第１金属メツキ被膜と第２金属メツキ
被膜とは、互いに金属であり熱膨張係数も同様で
ある。 The first metal plating film and the second metal plating film are each made of metal and have the same coefficient of thermal expansion.
それ故、電子部品搭載用基板が、高温から低温
までの広い温度範囲において繰り返し使用される
場合においても、金属板を覆つている第２金属メ
ツキ被膜が第１金属メツキ被膜から剥離するとい
うことがない。 Therefore, even if the board for mounting electronic components is used repeatedly in a wide temperature range from high to low temperatures, the second metal plating film covering the metal plate will not peel off from the first metal plating film. do not have.
そのため、金属板は、接着層及び第２金属メツ
キ被膜によつて、第１金属メツキ被膜を介してプ
リント配線用基板に強固に結合され離脱のおそれ
は全くない。 Therefore, the metal plate is firmly bonded to the printed wiring board via the first metal plating film by the adhesive layer and the second metal plating film, and there is no fear of separation.
一方、電子部品搭載用凹部に関しては、その内
壁には第１金属メツキ被膜及び第３金属メツキ被
膜が形成されている。そのため、電子部品が発生
した熱は、その側面にある両金属メツキ被膜に急
速に吸収される。そして、その熱は底面の第３金
属メツキ被膜より金属板に直ちに伝えられる。 On the other hand, regarding the electronic component mounting recess, a first metal plating film and a third metal plating film are formed on the inner wall thereof. Therefore, the heat generated by the electronic component is quickly absorbed by the metal plating on both sides. Then, the heat is immediately transferred to the metal plate from the third metal plating film on the bottom surface.
また、第３金属メツキ被膜から第１金属メツキ
被膜に伝わつた熱は金属板用凹部側の第１金属メ
ツキ被膜に伝わり、更に第２金属メツキ被膜を経
て外部へ放散される。 Further, the heat transmitted from the third metal plating film to the first metal plating film is transmitted to the first metal plating film on the side of the metal plate recess, and is further dissipated to the outside via the second metal plating film.
このことは、第１金属メツキ被膜が金属板用凹
部と貫通穴に連続した形成され、また金属板搭載
後に第２金属メツキ被膜及び第３金属メツキ被膜
が形成されているために達成される伝熱経路であ
る。 This is achieved because the first metal plating film is formed continuous with the metal plate recess and the through hole, and the second metal plating film and the third metal plating film are formed after the metal plate is mounted. It is a heat path.
上記のごとく、電子部品の発生熱は、第３金属
メツキ被膜、第１金属メツキ被膜、第２金属メツ
キ被膜、金属板により、効率的に放散される。 As described above, the heat generated by the electronic component is efficiently dissipated by the third metal plating film, the first metal plating film, the second metal plating film, and the metal plate.
また、電子部品搭載用凹部は、上記二重の第１
金属メツキ被膜及び第３金属メツキ被膜により囲
まれている。また、底面は第３金属メツキ被膜及
び金属板が位置している。それ故、電子部品搭載
用凹部の電子部品に湿気が侵入することがなく、
耐湿性に優れている。 In addition, the electronic component mounting recess is located in the double
It is surrounded by a metal plating film and a third metal plating film. Moreover, a third metal plating film and a metal plate are located on the bottom surface. Therefore, moisture does not enter the electronic components in the electronic component mounting recess.
Excellent moisture resistance.
以上のごとく、本発明によれば、プリント配線
用基板に対して金属板を強固に固定することがで
き、かつ熱放散性及び耐湿性に優れた電子部品搭
載用基板及びその製造方法を提供することができ
る。 As described above, according to the present invention, there is provided a board for mounting electronic components, which can firmly fix a metal plate to a printed wiring board, and has excellent heat dissipation properties and moisture resistance, and a method for manufacturing the same. be able to.
第１図は本発明のプリント配線基板の縦断面
図、第２図ａ〜ｆは本発明のプリント配線基板の
製造方法のフローシートを示す該基板の縦断面
図、第３図ａ〜ｄは本発明の前記基板に金属板を
装着する位置合せ部の基板の平面図、第４図は本
発明のプラグインパツケージ基板の斜視図、第５
図は従来の電子部品搭載基板の縦断面図である。
１…プリント配線用基板、２…銅箔、３…凹部
（金属板装着用凹部）、４…貫通孔、５…金属メツ
キ層（第１回目のメツキ層）、６…凹部（電子部
品搭載用凹部）、７…接着層、８…金属板、９…
金属メツキ層（第２回目のメツキ層）、１０…ソ
ルダーレジストマスク、１１…樹脂封止枠、１２
…半導体素子、１３…ボンデイングワイヤー、１
４…封止樹脂、１５…スルホール、１６…導体ピ
ン、１７…熱硬化性樹脂シート。
FIG. 1 is a longitudinal sectional view of a printed wiring board of the present invention, FIGS. 2 a to f are longitudinal sectional views of the board showing a flow sheet of a method for manufacturing a printed wiring board of the invention, and FIGS. 3 a to d are FIG. 4 is a plan view of the substrate of the alignment section for attaching the metal plate to the substrate of the present invention; FIG. 4 is a perspective view of the plug-in package substrate of the present invention;
The figure is a vertical cross-sectional view of a conventional electronic component mounting board. 1... Printed wiring board, 2... Copper foil, 3... Recess (recess for mounting metal plate), 4... Through hole, 5... Metal plating layer (first plating layer), 6... Recess (for mounting electronic components) recess), 7...adhesive layer, 8...metal plate, 9...
Metal plating layer (second plating layer), 10... Solder resist mask, 11... Resin sealing frame, 12
...Semiconductor element, 13...Bonding wire, 1
4...Sealing resin, 15...Through hole, 16...Conductor pin, 17...Thermosetting resin sheet.
Claims (1)
の裏面側に、放熱用の金属板を搭載するための金
属板用凹部を、ザグリ加工により形成する工程
と、 上記金属板用凹部の略中央の一部に電子部品を
搭載するための貫通穴を形成する工程と、 少なくとも上記金属板用凹部及び貫通穴の表面
に第１金属メツキ被膜を形成する工程と、 上記金属板用凹部の内底面に、上記貫通穴の裏
面側を塞ぐと共に、プリント配線用基板の表面側
に電子部品搭載用凹部が形成されるように、上記
第１金属メツキ被膜の上に接着層を介して金属板
を接着する工程と、 上記金属板及び金属板用凹部の表面に連続して
第２金属メツキ被膜を形成すると共に、上記電子
部品搭載用凹部の表面にも第３金属メツキ被膜を
形成する工程と よりなることを特徴とする電子部品搭載用基板の
製造方法。 ２ 請求項１において、上記全工程は、多数の電
子部品搭載用基板が格子状に配列された基板シー
トの状態で行われることを特徴とする電子部品搭
載用基板の製造方法。 ３ 請求項１及び２において、第２金属メツキ被
膜及び第３金属メツキ被膜は、同時に形成される
ことを特徴とする電子部品搭載用基板の製造方
法。 ４ 有機系樹脂素材からなるプリント配線用基板
において、該プリント配線用基板はその裏面側に
ザグリ加工により形成した金属板用凹部を有し、
またその表面側には上記金属板用凹部に貫通する
貫通穴を有し、 また上記金属板用凹部及び貫通穴の表面には連
続した第１金属メツキ被膜が形成されており、 また該金属板用凹部の内底面には上記貫通穴の
裏面側を塞ぐと共にプリント配線用基板の表面側
に電子部品搭載用凹部が形成されるように、上記
第１金属メツキ被膜の上に接着層を介して金属板
を接着してなり、 さらに、金属板の表面には金属板用凹部の表面
まで連続的に形成された第２金属メツキ被膜を有
すると共に、電子部品搭載用凹部の表面にも第３
金属メツキ被膜を有することを特徴とする電子部
品搭載用基板。 ５ 請求項４において、金属板用凹部の平面形状
は、辺又はコーナー部の少なくとも２箇所が変形
しており、金属板装着用位置合わせ部を形成して
いることを特徴とする電子部品搭載用基板。 ６ 請求項４において、金属板の平面形状は、辺
又はコーナー部の少なくとも２箇所が変形してお
り、金属板装着用位置合わせ部を形成しているこ
とを特徴とする電子部品搭載用基板。 ７ 請求項４において、上記プリント配線用基板
は、上記電子部品搭載用凹部よりも外側に導体ピ
ン挿入用の多数の孔を有しているプラグインパツ
ケージ用基板であることを特徴とする電子部品搭
載用基板。[Scope of Claims] 1. A step of forming, by counterbore processing, a metal plate recess for mounting a heat dissipating metal plate on the back side of a printed wiring board made of an organic resin material; a step of forming a through hole for mounting an electronic component in a part approximately in the center of the recess; a step of forming a first metal plating film on at least the surface of the recess for the metal plate and the through hole; An adhesive layer is placed on the first metal plating film on the inner bottom surface of the recess so as to close the back side of the through hole and form a recess for mounting an electronic component on the front side of the printed wiring board. a step of bonding the metal plates; and forming a second metal plating film continuously on the surfaces of the metal plate and the recess for the metal plate, and also forming a third metal plating film on the surface of the electronic component mounting recess. A method for manufacturing a board for mounting electronic components, characterized by the following steps: 2. The method of manufacturing a substrate for mounting electronic components according to claim 1, wherein all of the above steps are performed on a substrate sheet in which a large number of substrates for mounting electronic components are arranged in a grid. 3. The method of manufacturing an electronic component mounting substrate according to claim 1, wherein the second metal plating film and the third metal plating film are formed at the same time. 4. A printed wiring board made of an organic resin material, the printed wiring board having a metal plate recess formed by counterboring on the back side thereof,
Further, the surface side thereof has a through hole penetrating into the recess for the metal plate, and a continuous first metal plating film is formed on the surface of the recess for the metal plate and the through hole, and the metal plate An adhesive layer is placed on the first metal plating film on the inner bottom surface of the first metal plating film so as to close the back side of the through hole and form a recess for mounting electronic components on the front side of the printed wiring board. It is made by bonding metal plates, and further has a second metal plating film formed continuously up to the surface of the recess for the metal plate on the surface of the metal plate, and a third metal plating film on the surface of the recess for mounting electronic components.
A board for mounting electronic components, characterized by having a metal plating film. 5. The electronic component mounting device according to claim 4, wherein the planar shape of the metal plate recess is deformed at at least two sides or corner portions to form a positioning portion for mounting the metal plate. substrate. 6. The board for mounting electronic components according to claim 4, wherein the planar shape of the metal plate is deformed at at least two locations, one of the sides and the corner, to form a positioning portion for mounting the metal plate. 7. The electronic component according to claim 4, wherein the printed wiring board is a plug-in package board having a number of holes for inserting conductor pins outside the electronic component mounting recess. Mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61172393A JPS61172393A (en) | 1986-08-04 |
| JPH0376795B2 true JPH0376795B2 (en) | 1991-12-06 |
Family
ID=11822356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60013052A Granted JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61172393A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2520429B2 (en) * | 1987-10-27 | 1996-07-31 | 松下電工株式会社 | Printed wiring board for mounting electronic components |
| JPH0379440U (en) * | 1989-12-01 | 1991-08-13 | ||
| JP4856470B2 (en) * | 2006-05-18 | 2012-01-18 | 日本特殊陶業株式会社 | Wiring board |
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
| JP6138500B2 (en) * | 2013-01-30 | 2017-05-31 | 株式会社 日立パワーデバイス | Power semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS5946087A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board |
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
| JPS5967686A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board and method of producing same |
-
1985
- 1985-01-26 JP JP60013052A patent/JPS61172393A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS5946087A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board |
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
| JPS5967686A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board and method of producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61172393A (en) | 1986-08-04 |
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