JPS61172393A - Substrate for carrying electronic component and manufacture thereof - Google Patents
Substrate for carrying electronic component and manufacture thereofInfo
- Publication number
- JPS61172393A JPS61172393A JP60013052A JP1305285A JPS61172393A JP S61172393 A JPS61172393 A JP S61172393A JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP S61172393 A JPS61172393 A JP S61172393A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- metal plate
- mounting
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、チップ素子又は半導体素子などの電子部品か
らの熱放散性を向上させ、電子部品への外部からの湿気
の浸入を遮断し、かつ薄型と小型化し得る高信頼性を有
した電子部品搭載用基板及びその製造方法に関するもの
である。[Detailed Description of the Invention] [Industrial Application Field] The present invention improves heat dissipation from electronic components such as chip elements or semiconductor elements, blocks moisture from entering the electronic components from the outside, The present invention also relates to a highly reliable electronic component mounting board that can be made thin and compact, and a method for manufacturing the same.
従来、半導体素子などの電子部品を直接プリント配線基
板に搭載し、ワイヤーボンディングにより電気的に接続
された基板が時計やカメラなどの内装基板として使用さ
れている。後示する図面（第５図）の（ａ）は半導体素
子を直接プリント配線基板に搭載する場合の基板の一例
であり、プリント配線基板としては、セラミックス基板
又は、有機系樹脂基板が用いられている。第５図の（ｂ
）に示すようにザグリ加工又は積ｌ−成形により半導体
素子実装部分の基板表面に凹部を設けその凹部内に半導
体素子を搭載したプリント配線基板がある。BACKGROUND ART Conventionally, electronic components such as semiconductor elements are directly mounted on a printed wiring board, and the board is electrically connected by wire bonding, and the board is used as an interior board for watches, cameras, and the like. (a) of the drawing (Figure 5) shown later is an example of a board in which a semiconductor element is directly mounted on a printed wiring board, and a ceramic board or an organic resin board is used as the printed wiring board. There is. (b) in Figure 5
), there is a printed wiring board in which a concave portion is formed on the surface of the substrate in a portion where a semiconductor element is mounted by counterbore processing or lamination molding, and a semiconductor element is mounted within the concave portion.
しかしながら、これら従来のプリント配線基板において
搭載した半導体素子からの発熱に対して十分な熱放散が
得られず、比較的低い出力の半導体素子すなわち発熱が
少ない半導体素子のみに適用されており、高い出力の半
導体素子搭載においては、放熱用のフィンを設けるなど
の対策が必要である。特に有機系樹脂基板は、金属など
に比較し熱伝導率が小さく半導体素子からの熱放散性は
劣っている。−万アルミナなどのセラミックス基板にお
いても最近高集積さｎた高い出力の半導体素子の搭載に
は不十分である。また有機系樹脂基板を半導体搭載基板
として用いる時の欠点は耐湿性がセラミックス基板に比
べて非常に低いため第５図の（ｂ）のような構造を有す
る有機系樹脂プリント配線基板の場合には外部からの湿
気が基板を透過して半導体素子まで達するこｔにより半
導体素子を腐蝕させるため、耐湿性に対して高い信頼性
が要求される分野には半導体搭載用基板として有機系樹
脂基板を使用することが困難である。However, these conventional printed wiring boards do not provide sufficient heat dissipation for the heat generated by the semiconductor elements mounted on them, and are only applied to semiconductor elements with relatively low output, that is, semiconductor elements that generate little heat, and high output When mounting a semiconductor device, it is necessary to take measures such as providing heat dissipation fins. In particular, organic resin substrates have lower thermal conductivity than metals and are inferior in heat dissipation from semiconductor elements. - Ceramic substrates such as alumina are not sufficient to mount high output semiconductor elements that have recently been highly integrated. In addition, the disadvantage of using an organic resin substrate as a semiconductor mounting board is that its moisture resistance is very low compared to a ceramic substrate. Organic resin substrates are used as semiconductor mounting substrates in fields that require high reliability in terms of moisture resistance, as moisture from the outside can corrode semiconductor elements by penetrating the substrate and reaching the semiconductor elements. difficult to do.
〔発明が解決しようとする手段・作用〕本発明は、上記
従来のプリント配線基板の欠点である熱放散性と耐湿性
を向上させるために、プリント配線用基板の裏面側には
凹部と該凹部底面には接着層を介して金属板が装着され
ており、前記金属板と両基板面に金属メッキ被膜が形成
されている電子部品搭載用基板を提供するものである。[Means and effects to be solved by the invention] In order to improve the heat dissipation property and moisture resistance, which are the drawbacks of the conventional printed wiring board, the present invention provides a recess and a recess on the back side of the printed wiring board. A metal plate is attached to the bottom surface via an adhesive layer, and a metal plating film is formed on the metal plate and both substrate surfaces to provide a substrate for mounting electronic components.
それ故、半導体素子などの電子部品から発生する熱を金
属板を通して効率よく放散することができ、又金属板を
プリント配線用基板の凹部に装着することにより、基板
全体を薄くすることが可能である。Therefore, the heat generated from electronic components such as semiconductor elements can be efficiently dissipated through the metal plate, and by attaching the metal plate to the recess of the printed wiring board, the entire board can be made thinner. be.
さらには、電子部品を搭載すべき凹部と該凹部の裏面側
にある金属板が基板と接触する部分に被覆した金属メッ
キ被膜は、外部の湿気が接着層及び基板を透過して電子
部品搭載部への浸入を遮断することができる。本発明は
、上記の如く熱放散性、耐湿性が著しく優れ、薄型化が
可能となる電子部品搭載用基板とその製造方法を提供す
ることを目的とするものである。Furthermore, the metal plating coating applied to the recess where the electronic component is to be mounted and the area where the metal plate on the back side of the recess contacts the board prevents external moisture from penetrating through the adhesive layer and the board, preventing the electronic component from being mounted. can be blocked from entering. An object of the present invention is to provide a substrate for mounting electronic components, which has extremely excellent heat dissipation properties and moisture resistance, and which can be made thinner as described above, and a method for manufacturing the same.
以下本発明を図面に基づいて具体的に説明する。The present invention will be specifically explained below based on the drawings.
まず、本発明の電子部品搭載用基板の製造方法を第２図
に示す工程にて便宜上説明する。First, for convenience, the method of manufacturing a substrate for mounting electronic components according to the present invention will be explained with reference to the steps shown in FIG.
第２図の（Ｂ）はプリント配線用基板（１）の裏面側を
ザグリ加工により凹部（３）を形成した縦断面図である
。FIG. 2B is a longitudinal sectional view of the printed wiring board (1) with a recess (3) formed by counterboring the back side thereof.
プリント配線用基板の代表的なものは、ガラス繊維強化
エポキシ樹脂基板、紙フエノール樹脂基板、紙エポキシ
樹脂基板、ガラスポリイミド樹脂基板、ガラストリアジ
ン樹脂基板などである。そしてこｎらの基板の両面には
予め銅箔（り等の金属被膜が形成されていてもよい。前
記基板（１）の裏面側に形成された凹部の大きさ深さな
どは特に限定されるものではない。次に第２図の（ｂ）
は、前記基板（１）の裏面に形成された凹部（３）の略
中夫の一部をザグリ加工又は打ち抜き加工などにより貫
通孔（滲を形成した縦断面図である。第２図の（ｅ）は
少なくとも前記基板（υの裏面側の凹部（３）と貫通孔
（４）とを含む基板表面に金属メッキ被膜（５）を形成
した縦断面図である。該凹部（３）の壁面及び底面と該
貫通孔の壁面に形成される金属メッキ被膜（５）は湿気
の透過を防ぐためのものである。第２図の（ｄ）は前記
凹部（３）内底面に、前記貫通孔（４）を塞ぎかつ該貫
通孔（４）が、前記基板（１）の表面で電子部品を搭載
すべき箇所の凹部（６）となるように接着層（′ｒ）を
介して金属板（８）を接合した状態の縦断面図である。Typical printed wiring boards include glass fiber-reinforced epoxy resin boards, paper phenol resin boards, paper epoxy resin boards, glass polyimide resin boards, and glass triazine resin boards. A metal coating such as copper foil may be formed on both sides of these substrates in advance.The size and depth of the recess formed on the back side of the substrate (1) are not particularly limited. (b) in Figure 2.
2 is a vertical cross-sectional view in which a through hole (bleeding) is formed by counterboring or punching a portion of the recess (3) formed on the back surface of the substrate (1). e) is a vertical sectional view in which a metal plating film (5) is formed on the surface of the substrate including at least the recess (3) on the back side of the substrate (υ) and the through hole (4). The wall surface of the recess (3). The metal plating film (5) formed on the bottom surface and the wall surface of the through hole is for preventing the penetration of moisture. FIG. (4) and the through hole (4) forms a recess (6) on the surface of the substrate (1) where the electronic component is to be mounted. 8) is a vertical cross-sectional view of the state in which they are joined.
前記接着層としては未硬化のエポキシ樹脂含浸のガラス
クロス又は耐熱性の接着シート又は液状の樹脂などであ
り、接着性、耐熱性、耐久性などの緒特性が高い接着層
が好ましい。−万金属板は、銅、銅系合金、鉄、鉄系合
金、アルミニウム、アルミニウム系合金など、比較的熱
伝導率が大きいものであればよい。The adhesive layer may be an uncured epoxy resin-impregnated glass cloth, a heat-resistant adhesive sheet, or a liquid resin, and preferably has high adhesive properties such as adhesiveness, heat resistance, and durability. - The ten thousand metal plate may be made of copper, copper-based alloy, iron, iron-based alloy, aluminum, aluminum-based alloy, etc., as long as it has a relatively high thermal conductivity.
金属板の大きさ、厚さは特に限定されるものではないが
、板厚が厚くて表面積が大きい方が、熱放散性を向上す
る上で有利である。前記金属板を装着する位置を決める
方法としては第３図の（ａ）、（ｂ）に示すように基板
裏面側の凹部（３）の平面形状を、辺又はコーナー部の
少なくとも２箇所が変形されている基板と第３図の（（
＋）、（Φのように前記金属板（匂の平面形状の辺又は
コーナー部の少なくとも２１！Ｉ所が変形されているこ
とにより金属板装着位置を決めることが有利である。前
記第２図の（ｅ）は前記凹部（匂を少なくとも含む基板
両面に金属メッキ被膜（９）を形成して、プリント配線
用基板（１）と金属板（８）とを一体化した状態の縦断
面図である。該金属メッキ被膜（９）はプリント配線用
基板（１）と前記金属板（８）の接着層への水の浸入を
遮断し電子部品搭載部への水の浸入を防ぐ効果があり又
金属板（８）と銅箔（２）が金属メッキ被膜（印によっ
て一体化されることにより電子部品からの発熱が金属板
から銅箔へ速やかに伝導し外部へ放散するため熱放散効
果が向上する利点がある。第２因の（ｆ）は本発明によ
る電子部品搭載基板に半導体素子（１２）を実装しワイ
ヤーボンディングにより結線し、半導体素子及びその周
辺部を樹脂（１４）にて封止した状態の縦断面図である
。この図面で（１４）は封止樹脂であり、エポキシ樹脂
、シリコーン樹脂などが好しい。また（１１）は封止用
樹脂の流出防止用の壊砕である。このようにして製造さ
れた本発明のプリント配線板は第１図の縦断面図に示す
特徴を有しているものである。その特徴は、有機系樹脂
素材からなるプリント配線用基板（１）の表面側には導
体回路と電子部品を搭載すべき凹部（６）を有し、前記
凹部（６）を裏面側にある金属板（８）と接触する金属
メッキ被膜（匂とを少なくとも有し、前記プリント配線
用基板（１）の裏面側には凹部（３）と該凹部表面には
金属メッキ被膜（５）と該金属メッキ被膜表面には接着
層（７）を介して金属板（８）が装着されており、前記
金属板と両差板面に金属メッキ被膜（９）が形成されて
いることである。第４図は、本発明のプラグインパッケ
ージ基板の斜視因である。これは前記電子部品搭載用基
板の外周部に設けられたスルホール（１５）に多数の導
体ピン（１６）が同列状に配設されて成るプラグインパ
ッケージである。斜線部（１））に示す前記基板外周部
及びスルホール（１５）表面に熱硬化性樹脂シート（１
７）が貼着されている。これはスルホールを完全に被覆
するためである。Although the size and thickness of the metal plate are not particularly limited, a thicker plate and a larger surface area are advantageous in improving heat dissipation. As shown in FIGS. 3(a) and 3(b), the method for determining the mounting position of the metal plate is to deform the planar shape of the recess (3) on the back side of the board in at least two places, the sides or the corners. The board shown in Figure 3 (((
+), (Φ) It is advantageous to determine the mounting position of the metal plate by deforming at least 21 points of the sides or corners of the planar shape of the metal plate (see FIG. 2). (e) is a vertical cross-sectional view of the printed wiring board (1) and the metal plate (8) integrated by forming a metal plating film (9) on both sides of the board containing at least the odor. The metal plating film (9) has the effect of blocking water from entering the adhesive layer between the printed wiring board (1) and the metal plate (8) and preventing water from entering the electronic component mounting area. The metal plate (8) and copper foil (2) are integrated by the metal plating coating (mark), which improves the heat dissipation effect as heat generated from electronic components is quickly conducted from the metal plate to the copper foil and dissipated to the outside. The second factor (f) is that the semiconductor element (12) is mounted on the electronic component mounting board according to the present invention, connected by wire bonding, and the semiconductor element and its surrounding area are sealed with resin (14). It is a longitudinal cross-sectional view of the state in which the resin is sealed. In this drawing, (14) is a sealing resin, preferably epoxy resin, silicone resin, etc. Also, (11) is a crusher to prevent the sealing resin from flowing out. The printed wiring board of the present invention manufactured in this way has the characteristics shown in the vertical cross-sectional view of Fig. 1.The printed wiring board (1 ) has a recess (6) in which a conductive circuit and electronic components are to be mounted, and a metal plating film (at least odor-free) that contacts the recess (6) with the metal plate (8) on the back side. The printed wiring board (1) has a recess (3) on the back side, a metal plating film (5) on the surface of the recess, and a metal plate (7) on the surface of the metal plating film via an adhesive layer (7). 8) is attached, and a metal plating film (9) is formed on the metal plate and the surfaces of both differential plates. Fig. 4 is a perspective view of the plug-in package board of the present invention. This is a plug-in package in which a large number of conductor pins (16) are arranged in the same row in through holes (15) provided on the outer periphery of the electronic component mounting board. A thermosetting resin sheet (1
7) is attached. This is to completely cover the through holes.
以上のように本発明の電子部品搭載用基板は発熱が大き
い電子部品を搭載しても熱放散性が高いため、該基板に
蓄熱することはなく、又実装された電子部品へ基板を通
じて外部の湿気が浸入することはほとんどないため電子
部品の耐久性が向上するとともに、実装後のプリント配
線基板を薄くできる利点がある。As described above, the electronic component mounting board of the present invention has high heat dissipation properties even when electronic components that generate a large amount of heat are mounted, so that heat does not accumulate on the board, and external heat is not transmitted through the board to the mounted electronic components. Since there is almost no intrusion of moisture, the durability of electronic components is improved, and the printed wiring board after mounting can be made thinner.
第１図は本発明のプリント配線基板の縦断面図、第２図
ｅ）〜（０は本発明のプリント配線基板の製造方法のフ
ローシートを示す該基板の縦断面図、第３図（→〜（ｄ
）は本発明の前記基板に金属板を装着する位置合せ部の
基板の平面図、第４図は本発明のプラグインパッケージ
基板の斜視囚、第５図は従来の電子部品搭載基板の縦断
面図である。
（１）−・・−・プリント配線用基板
（り・・・・・・銅 箔
（３）・・・・・・凹部（金属板装着用凹部）（滲・・
・・・・貫通孔
（５）・・・・−・金属メッキ層（第１回目のメッキ層
）（６） ・・・・−凹部（Ｗ子部品搭載用凹部）（η
・・・・・・接着層
（８）−・・−金属板
（９） ・−・−金属メッキ層（第２回目のメッキ層）
（Ｘ））−・・・ソルダーレジストマスク（１１３−・
・・−樹脂封止枠
Ｃ１２’）−・・・・半導体素子
（１３）・・・・−ボンディングワイヤー（１４）−・
・・・・封止樹脂
（１５）・・・−スルホール
（紛−・−導体ピンFIG. 1 is a vertical sectional view of the printed wiring board of the present invention, FIG. ~(d
) is a plan view of the substrate of the positioning part for attaching the metal plate to the substrate of the present invention, FIG. 4 is a perspective view of the plug-in package substrate of the present invention, and FIG. 5 is a longitudinal section of a conventional electronic component mounting substrate. It is a diagram. (1) --- Printed wiring board (ri... Copper foil (3) --- Recess (recess for attaching metal plate) (bleeding)
・・・・Through hole (5)・・・・・Metal plating layer (first plating layer) (6) ・・・・−Recess (recess for W child component mounting) (η
...Adhesive layer (8) ---Metal plate (9) ---Metal plating layer (second plating layer)
(X))--Solder resist mask (113--
...-Resin sealing frame C12')--Semiconductor element (13)--Bonding wire (14)--
...Sealing resin (15)...-Through hole (powder--Conductor pin)
Claims (1)
（１）の裏面側をザグリ加工により凹部（３）を形成す
る工程と、 （ｂ）前記凹部（３）の略中央の一部に貫通孔（４）を
形成する工程と、 （ｃ）少なくとも前記裏面側の凹部（３）と貫通孔（４
）を含む基板表面に金属メッキ被膜（５）を形成する工
程と、 （ｄ）前記凹部（３）内底面に、前記貫通孔を塞ぎかつ
前記基板（１）の表面に電子部品を搭載すべき箇所に凹
部（６）が形成されるように接着層（７）を介して金属
板（８）を接着する工程と、 （ｅ）前記凹部（６）を少なくとも含む両基板面に金属
メッキ（９）を施す工程とから成る電子部品搭載用基板
の製造方法。 ２、前記（ａ）〜（ｅ）の工程は、多数の電子部品搭載
用基板が格子状に配列された状態で加工されることを特
徴とする特許請求の範囲第１項記載の製造方法。 ３、前記金属板表面と基板表面とに同時に金属メッキ被
膜（９）を形成することを特徴とする特許請求の範囲第
１項〜第２項記載の製造方法。 ４、有機系樹脂素材からなるプリント配線用基板（１）
の表面側には導体回路と電子部品を搭載すべき凹部（６
）を有し、前記凹部（６）は前記プリント配線用基板（
１）の裏面側にある金属板（８）と接触する金属メッキ
被膜（９）とを少なくとも有し、前記プリント配線用基
板（１）の裏面側には凹部（３）と該凹部（３）表面に
は金属メッキ被膜（５）と該金属メッキ被膜（５）表面
には接着層（７）を介して金属板（８）が、装着されて
おり、前記金属板（８）と両基板面に金属メッキ被膜（
９）が形成されていることを特徴とする電子部品搭載用
基板。 ５、前記基板（１）裏面側の凹部（３）の平面形状は、
辺又はコーナー部の少なくとも２箇所が変形しており該
金属板装着用位置合せ部を形成していることを特徴とす
る特許請求の範囲第４項記載の電子部品搭載用基板。 ６、前記金属板（８）の平面形状は、辺又はコーナー部
の少なくとも２箇所が変形しており該金属板装着用位置
合せ部を形成していることを特徴とする特許請求の範囲
第４項記載の電子部品搭載用基板。 ７、前記基板の外周部に設けられた孔（１５）に多数の
導体ピン（１６）が周列状に設けられたプラグインパッ
ケージ用基板であることを特徴とする特許請求の範囲第
４項記載の電子部品搭載用基板。 ８、前記基板の外周部及び孔（１５）表面に熱硬化性樹
脂シート（１７）が貼着されていることを特徴とする特
許請求の範囲第４項記載の基板。[Claims] 1. (a) forming a recess (3) by counterboring the back side of a printed wiring board (1) made of an organic resin material; (b) forming a recess (3) in the recess (3); (c) forming at least the recess (3) on the back surface side and the through hole (4) in a part of the center;
) a step of forming a metal plating film (5) on the surface of the substrate including (d) closing the through hole on the inner bottom surface of the recess (3) and mounting an electronic component on the surface of the substrate (1); (e) bonding a metal plate (8) via an adhesive layer (7) so that a recess (6) is formed at the location; (e) metal plating (9) on both substrate surfaces including at least the recess (6); ) A method for manufacturing a board for mounting electronic components, comprising 2. The manufacturing method according to claim 1, wherein the steps (a) to (e) are performed with a large number of electronic component mounting substrates arranged in a grid. 3. The manufacturing method according to claim 1 or 2, characterized in that a metal plating film (9) is formed on the surface of the metal plate and the surface of the substrate at the same time. 4. Printed wiring board made of organic resin material (1)
On the surface side, there is a recess (6
), and the recess (6) has the printed wiring board (
The printed wiring board (1) has at least a metal plating film (9) in contact with the metal plate (8) on the back side of the printed wiring board (1), and a recess (3) on the back side of the printed wiring board (1). A metal plating film (5) is attached to the surface, and a metal plate (8) is attached to the surface of the metal plating film (5) via an adhesive layer (7), and the metal plate (8) and both substrate surfaces are attached. Metal plating film (
9) A substrate for mounting an electronic component, characterized in that the following is formed. 5. The planar shape of the recess (3) on the back side of the substrate (1) is as follows:
5. The electronic component mounting board according to claim 4, wherein at least two of the sides or corner portions are deformed to form positioning portions for mounting the metal plate. 6. The planar shape of the metal plate (8) is deformed at at least two sides or corner parts to form alignment parts for mounting the metal plate. Substrate for mounting electronic components as described in section. 7. Claim 4, characterized in that the substrate is a plug-in package substrate in which a large number of conductor pins (16) are provided in a circumferential row in holes (15) provided on the outer periphery of the substrate. Board for mounting electronic components as described. 8. The substrate according to claim 4, characterized in that a thermosetting resin sheet (17) is adhered to the outer periphery of the substrate and the surface of the hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61172393A true JPS61172393A (en) | 1986-08-04 |
| JPH0376795B2 JPH0376795B2 (en) | 1991-12-06 |
Family
ID=11822356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60013052A Granted JPS61172393A (en) | 1985-01-26 | 1985-01-26 | Substrate for carrying electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61172393A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01112739A (en) * | 1987-10-27 | 1989-05-01 | Matsushita Electric Works Ltd | Printed circuit board for mounting electronic component |
| JPH0379440U (en) * | 1989-12-01 | 1991-08-13 | ||
| JP2007311510A (en) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | Wiring board |
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
| JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946087A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board |
| JPS5946086A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
| JPS5967686A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board and method of producing same |
-
1985
- 1985-01-26 JP JP60013052A patent/JPS61172393A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946087A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board |
| JPS5946086A (en) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
| JPS5967686A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board and method of producing same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01112739A (en) * | 1987-10-27 | 1989-05-01 | Matsushita Electric Works Ltd | Printed circuit board for mounting electronic component |
| JPH0379440U (en) * | 1989-12-01 | 1991-08-13 | ||
| JP2007311510A (en) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | Wiring board |
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
| JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0376795B2 (en) | 1991-12-06 |
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