JPH10149901A - Electric resistor, and manufacturing method of electric resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To materialize a resistor which can withstand high load, is easy of mass production, can be reused without marring specified accuracy and reliability, and is suitable for measurement of currents of power. SOLUTION: The resistor for measurement of power is composed of a metallic substrate 1, an adhesive layer 3 containing ceramic powder, and a resistive alloy film 2 having a connector contact layer 4 on opposite side from the substrate. The manufacture is as follows: a connector contact layer 4 is made by applying metallic cover to a resistor film 2 made of resistive alloy, next a desired resistor and contact structure are made by etching the stack so as to form a plurality of resistor devices, further the metallic substrate face on the opposite side from the resistor film 2 is etched, and the stack is cut at the section of the joint of the remaining adhesive layer 3 to separate each resistor device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a metal resistive film made of a resistive alloy, a substrate having good thermal conductivity, and a method for forming a film between the film and the substrate. An electrical resistor, especially a low-resistance electrical resistor, which is composed of an adhesive layer made of an insulating material which strongly adheres the film and the substrate together, and which is preferably further opposite to the substrate The connector on the resistance film side
The present invention relates to an electric resistor provided with a contact surface, and to a method for manufacturing the electric resistor.

[0002]

BACKGROUND OF THE INVENTION Low resistance measuring resistors for such power types are typically in the milliohm (mΩ) range, but in many applications may be as low as 100Ω.
Or higher than that, often requiring an SMD (Surface Mounted Device) structure, and its flat connections, like well-known chip components (components). The contact surface can be soldered directly to a flat connection lead of a printed circuit board, or the flat substrate surface can be soldered or fixed with an adhesive on the surface of the cooling body. The resistor is used in conjunction with a power semiconductor and other passive elements in a so-called power hybrid circuit to attach external connection wires (wires) to the connector contact layer of the resistor ("bonding" or "bonding"). can do. An important advantage of this surface mount technology is its potential for miniaturization and space.
In addition to good utilization efficiency, good heat dissipation (heat dissipation) from the resistance element is required. Further, in many cases, it is desired to further reduce the size of a resistor for measurement or power. On the other hand, higher loads are required for the resistors and correspondingly higher operating temperatures are required. Another factor to consider is that circuits with resistors are often price sensitive,
Resistors must be able to be manufactured at the lowest possible cost and be reusable. Conventionally known SMD
With resistors or chip resistors, these requirements cannot always be fully met.

German Utility Model Application Publication No. DE 90 15 206
Resistors of the SMD type of the type described above known from U1 are compact (small) as connecting contacts.
Has solder beads or balls. In order to manufacture it, first, an aluminum-based metal substrate (eg, AlMg
_The composite (laminate) is formed by pressing the _three plates) and the resistive film of the resistive alloy with the adhesive film interposed therebetween. Next, the resistive film is formed into a required resistive path structure by photoetching. After the etching process, the surface of the composite supporting the resistive film is coated with a solder-blocking lacquer layer (or protective lacquer layer), whereby the subsequent connector contact areas are determined and white The solder paste is aussparen, then screen printed with a solder paste, and finally remelted to form the solder beads forming the connector contacts from the solder paste.

[0004] A low resistance resistor for measurement of the SMD structure is disclosed in German Patent DE 43 39 551 C1 (Japanese Patent Laid-Open No. 7-19).
No. 2902, corresponding to Japanese Patent No. 2649491), and the connector contacts are not arranged on the resistive film side on the opposite side of the substrate, but are constituted by the substrate itself. To manufacture it, first, copper plate (copper plate), covered with adhesive (cover)
A relatively large laminate is formed from the applied polyimide film and the resistive film, and this laminate constitutes a so-called “starting laminate”. Based on the laminate, a resistive film is etched to form a desired resistive structure or a resistive structure, and then a copper layer connecting the copper plate and the resistive film is formed, and then penetrated through the copper plate. The connection contacts formed by the substrate can be separated from each other, for example, by separating approximately 2000 resistors.

[0005]

SUMMARY OF THE INVENTION The main object of the present invention is to provide a device which can withstand a higher load than before, can be easily mass-produced, and has the required accuracy and reliability of a resistor. An object of the present invention is to realize a resistor suitable for a current measuring resistor for electric power, which can be reused without deteriorating the performance.

[0006]

The object of the present invention is attained by the structure described in the claims. That is, the electric resistor according to the present invention, particularly the low-resistance electric resistor, is a metal resistor film (2) made of a resistive alloy.
A substrate (1) having good thermal conductivity, and an adhesive layer (3) made of an insulating material that is located between the film and the substrate and strongly adheres or bonds the film and the substrate together; The adhesive layer (3) is made of an adhesive (adhesive) material such as plastic containing a powder of a thermally conductive insulating material.

Further, the method of manufacturing an electric resistor according to the present invention, in particular, an electric resistor having a low resistance, comprises a resistive film (which is located entirely (completely) inside the periphery of the substrate (1) of each resistor. 2) A method of manufacturing an electric resistor, wherein a metal resistance film made of a resistive alloy is formed on a substrate made of a material having a good heat conductivity on a heat conductive adhesive layer made of an insulating material. 3) being bonded through the resistive film, etching the resistive film to form a plurality of individual resistive elements, the etched resistive film, the substrate,
A method for manufacturing an electric resistor, in which a laminate comprising a resistive film and an adhesive layer located between a substrate is separated into individual resistors; the adhesive layer contains a powder of a thermally conductive insulating material. It is made of a tacky (adhesive) substance such as plastic, and is characterized in that a resistance film, a substrate, and an adhesive layer located between the resistance film and the substrate are heated and pressed together by a press.

Another method of manufacturing an electrical resistor according to the present invention, in particular a low-resistance electrical resistor, comprises a resistor located entirely (completely) inside the periphery of the substrate (1) of the individual resistor. A method for producing an electrical resistor comprising a film (2) and a connector contact layer (4) on the surface side of the resistor film opposite to the substrate; wherein the metal resistor film made of a resistive alloy comprises: A plurality of individual resistance elements are formed by etching a resistance film on a substrate made of a material having good thermal conductivity via a heat conductive adhesive layer (3) made of an insulating material. A method of manufacturing an electric resistor, in which a laminate comprising the etched resistance film, a substrate, and an adhesive layer located between the resistance film and the substrate is separated into individual resistors; Is the resistance on the other side At the surface of Irumu, a position where the connector contact layer of the resistor to be formed is placed, at least the required connector contact regions (2
3) Photolithographically defining a limited plurality of surface areas, including (3), then applying a connector contact metal coating to the limited plurality of surface areas, and then partially metallizing the connector contact metal. Etching the resistive film to form a resistive structure (22).

Yet another method of manufacturing an electrical resistor, in particular a low electrical resistor, according to the present invention is a resistive film located entirely (completely) inside the periphery of the substrate (1) of the individual resistor. (2) A method for manufacturing an electric resistor, wherein a metal resistance film made of a resistive alloy is formed on a substrate made of a metal having good heat conductivity, on a heat conductive adhesive layer made of an insulating material. A plurality of individual resistive elements formed by etching the resistive film and forming a plurality of individual resistive elements from the resistive film, the substrate, and the adhesive layer located between the resistive film and the substrate; A method of manufacturing an electrical resistor, comprising separating the laminate into individual resistors; in order to separate the laminate, an adhesive layer is provided along a separation line from a location on the surface of the substrate opposite the resistive film. Board to the position And etching, then, the substrate by applying pressure to the laminate from the opposite side, by destroying the connecting portion (52) of the remaining adhesive layer, separating the resistors, and wherein.

[0010]

According to the present invention, a resistance film,
From the prefabricated three-layer composite laminate composed of the adhesive layer and the substrate, resistors having the above-described characteristics or characteristics can be mass-produced at low cost. Even if the resistors need to be extremely miniaturized, 8000 resistors, for example, can easily be manufactured without difficulty from a “starting laminate” measuring 300 mm × 400 mm. The resistors can be used as needed as SMD elements for printed circuit boards, or as internal elements of other types of resistors, for example, mounted in housings, relatively thick copper supports, cooling bodies. It can be used by sticking to the like.

According to a first feature of the present invention, when a synthetic resin adhesive containing a relatively large amount of powder such as ceramics is used, it is preferably used in the form of a film constituting an adhesive layer in a laminate. This is advantageous not only in the step of separating the resistor in the manufacturing stage, but also in the element (resistor device) of the finished product. That is, the adhesive layer can withstand mechanical and thermal loads, and is superior to the polyimide adhesive film conventionally used in resistor manufacture in dissipating heat (radiation) from the resistance film. However, the resin-based adhesive layer itself containing the above-mentioned ceramic powder or other particulate material having thermal conductivity and electrical insulation is already known for bonding a semiconductor element to a heat radiating housing portion or a cooling body. Have been. However, the adhesive layer in the resistor described in this specification is excellent in that it does not have a known use, for example, has brittleness and easiness of breaking.

According to a second aspect of the present invention, in order to cut (break) the laminate along the separation line from the surface (back surface) opposite to the resistance film, preferably, for example, copper or copper is used. It is advantageous to etch deeply so as to penetrate a substrate containing a metal having good thermal conductivity such as aluminum. The resistive structure is formed by etching, and the connector / contact layer is etched if necessary.
Destruction point (destruction position) for all metals from the opposite side
, Only the adhesive layer material remains.
In particular, since the adhesive or pressure-sensitive adhesive containing the above-mentioned granular material is relatively brittle and easily broken, the entire surface of the “starting laminate” on the resistor side is covered with a rubber elastic mat (54), and the mat is formed. It is convenient to separate the resistors in one processing step of pressing the resistor to the resistor side of the laminate.

Further, according to a third aspect of the present invention, particularly with respect to the manufacturing method, the connector contact layer is not applied after the resistive structure is formed by etching as in the prior art, but rather than before. If the connector contact layer is applied with a partial metallization on the upper surface of the resistive film, or with a partial metallization, for example in a recess (43) previously formed by etching the resistive film, very It is advantageous. In order to simplify the manufacturing method, if the connector / contact layer is initially formed to be wider (larger) than the size (area) required later, the structure of the resistor and the contact will be the same one. It can be formed by etching at the processing stage. This advantage is also obtained when the resistor is manufactured with other adhesive layers that do not contain ceramic. On the other hand, the advantage of using an adhesive containing the above-mentioned granular material is that the resistance film is not preliminarily coated with the metal of the contact layer, but the connector / contact layer is joined in the separated resistor. You can also get it.

The present invention is particularly suitable for extremely small resistors, and also for components (resistors) having a large area of several centimeters (cm) on each side.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments of the present invention will be described in detail with reference to the drawings. The resistor shown in FIG. 1A is basically composed of a metal substrate 1 such as copper or aluminum, and a metal resistor film (a kind of CuNi-based alloy known as a resistor for high-precision measurement). (Foil, layer) 2 and an adhesive layer 3 disposed between the substrate 1 and the resistance film 2 to fix the resistance film 2 to the substrate 1
And is composed of The substrate 1 is generally thicker than the resistive film and has not only a support function but also functions as a cooling body or a heat sink. The resistance film 2 is formed in a structure having a desired resistance value by an ordinary method.
It is formed in the shape (pattern) of a terminal structure (see FIG. 3B) and / or a bent resistance path (circuit). Also, in each case, the resistive film has a plurality of connector contact surfaces, and specifically, the edge of the resistor on the surface opposite to the substrate (far side from the substrate) ( Opposite ends (on opposite sides) on the edge) have separate connector contact surfaces for electrically connecting the resistor to external circuitry. In the example shown in FIG. 1A, the metal surface of the connector contact layer 4 is provided on the surface, but the connector contact layer 4 is not always necessary. In each case, the connector contact may be composed of a plurality of different metal layers. For example, a lower layer 5 of a copper layer functioning as a low-resistance contact connection portion, and an upper layer 6 of a nickel layer are disposed thereon. Layer 6 facilitates the subsequent formation of external contacts, i.e., facilitates solder connection or connection of connection wires, depending on the application.

What is important as the method of manufacturing the resistor and the characteristics of the resistor described here is that the adhesive layer 3 is made of, for example, 75
Or, it is made of a flexible (flexible) plastic film having a thickness on the order of 100 μm or the like. Further, in addition to having a predetermined electrically insulating property, the adhesive layer 3 has a rigidity even under a high mechanical and thermal load state, and has an invariable and reliable adhesiveness for bonding the resistive film to the substrate. It must maintain a high adhesive force and have as good a thermal conductivity as possible. For these reasons, the adhesive layer 3 is made of, for example, a resin-based or plastic-based adhesive (adhesive) such as an epoxy resin or a polyimide-based material.
It is assumed that powder having thermal conductivity is mixed. As the powder, in other applications, it is preferable to use a known ceramic powder such as aluminum oxide and boron nitride. As described above, the heat dissipation from the resistive film to the substrate in the resistor having the above-described configuration is greatly improved as compared with the resin adhesive layer conventionally used for manufacturing the resistor. Its content (for example, about 60 to
70%) is selected so as to obtain good thermal conductivity (high content of powder) and sufficient adhesive force for bonding the resistance film 2 to the substrate 1.

FIG. 1B shows another embodiment of the resistor, whose connector contact layer 4 ′ is on the opposite side of the substrate 1 (substrate), as will be described in detail later. It is located in a recess 8 formed at the lateral edge of the resistor on the surface of the resistor film 2 ′ (away from 1). The connector / contact layer 4 'is also composed of one metal layer or a plurality of different metal layers as required. As is evident from FIG. 1 and as will be seen in the following description, the connector contact layers 4, 4 'are located entirely or completely inside the outer periphery of the resistive layer, Also, the resistance layer is located entirely or completely inside the outer peripheral edge of the substrate.

The above-described resistor element, which is schematically illustrated, is then provided with a protective layer in the usual manner and / or is easily and easily integrated (mounted) in a housing or other external device.

Next, a method of manufacturing a resistor will be described. First, FIG. 2 (A) having a size capable of manufacturing thousands of resistors from a metal plate such as a copper plate having a thickness of 0.5 mm or the like, which constitutes the substrate 1, an adhesive layer 3, and a metal resistor film 2. A laminate having the structure shown is manufactured. The adhesive layer is applied in a multilayer manner, for example, by subjecting the substrate to a screen printing process, or prepared in advance as a dry film and heating it with a heating press (temperierten Presse)
Transfer to The actual adhesion of this three-layer composite is high temperature (eg, on the order of 180 ° C.) and high pressure (eg,
0 bar = 20 × 10 ⁵ Pa) under vacuum press machine
(Vakuumpresse). In this case, a vacuum is necessary to prevent the entrapment of air, since the encapsulation of the adhesive and the ability to dissipate heat through the adhesive is greatly reduced when air is enclosed between the layers. .

Next, in order to manufacture the individual resistors, in a first processing step, a surface area including a resistor film-side contact surface of a resistor to be formed later is subjected to a photomask and a photosensitive material lamination. It is determined by a method known as photolithography using a film. As is clear from FIG. 3B, first, the surface region 42 is determined so as to be wider than the contact region 23 of the completed resistor formed later. The reason is that it is easier to process than accurately determining the region by photolithography so as to correspond to the connector contact layer (4, 4 ') having the desired shape from the beginning. The later formed resistive or resistive structure 22 is indicated by dashed lines. The area 42 is then galvanized or chemically metallized. Prior to the metallization process, area 4
The portion between the areas 42, 42 is provided with a photoresist layer or other protective layer, and the portion between the areas 42, 42 is covered with a photoresist layer or other protective layer during the metallization process. It is left covered with a layer. However, the partial metallization is accomplished by first metallizing the entire surface and then selectively etching (negative) areas complementary to the contact surface (to the underlying resistor metal). (Without damage).

As apparent from FIG. 3B, the resistance structure 22 is formed so as to have two connector surfaces 23 separated from each other at both ends located on opposite sides of each other. This four-terminal structure is necessary for a four-terminal measurement, and as is well known, its two connection contacts function for current connection and the other two connection contacts function for voltage connection.

FIG. 4C is a cross-sectional view of the laminate of FIG.
FIG. 3 is a vertical cross-sectional view taken along a plane A. The metallization in region 42 is comprised of one or more layers as shown in FIGS. As described above, the lower layer 5 (FIG. 1)
(See also (A)) constitutes a region of low resistance, preferably of copper Cu, while its upper layer 6, as already explained, facilitates the subsequent contact, preferably of nickel It consists of Ni.

When an extremely low resistance value is formed, a correspondingly thick resistive film must be used. As a result, in order to obtain the desired effect,
Correspondingly, the copper layer constituting the connector contact layer must be thickened, and the thick copper layer must be removed (etched). In particular, in this case, before the metallization is applied, the thickness of the resistive film in the determined area 42 must be reduced by etching by an amount corresponding to (approximately) the thickness of the subsequently applied copper layer. There is. This process includes, in particular,
There is the advantage that the process is not hindered by steps formed between the metallized area and the uncoated area. FIG.
In the cross-sectional view of FIG. 4D, a deep dent or recess 43 is formed by etching.
(Corresponds to (C)). In this case, a metal coating of a nickel layer 6 as thin as possible is provided on the copper layer formed in the concave portion 43.

After the resistive side, ie, the resistive film side, of the laminate (“starting laminate”) is partially covered in advance as described above, a region is determined by photolithography, and etching is further performed. For the first time, the original structure of the resistor and the contact surface is formed. The etching is preferably performed in one processing step,
As is evident from FIG. 5 (E) relating to the example of the embodiment according to FIG. 5 (D) (alternative to FIG. 4 (C)), only the resistive material is deeply etched in the region of the original resistor. In the contact area, the resistive film is etched deeply through the metallization to the position of the adhesive layer (until the adhesive layer is exposed). The sides of the etched edges or edges at the edges of the resistors to be formed later are indicated by reference numeral 44 (sides 44 extend across the layer surface of the resistive film).

As a modification of the above manufacturing method, a connector
It is also possible to manufacture resistors without a contact layer. In that case, only a desired resistance structure is determined by photolithography and formed by etching. Depending on the application, the required connections may be made later when utilizing substantially completed individual resistors.

After the resistive structure is formed by etching, the above-mentioned auxiliary layer (auxiliary film such as a photoresist layer) necessary for etching is removed, and the laminate is cleaned (cleaned). The resistors are ready to be separated. If necessary, the resistance can be adjusted in advance, ie on the “starting laminate”, and can be adjusted, for example, by cutting (ie, notching or notching) the resistance film.

To separate the resistors, for example, using a conventional coordinate punching machine (DE 43 39 55)
The individual resistors may be punched out one after another at 1 C1). However, the adhesive that is preferably used in the manufacturing method described herein contains ceramic powder, which severely wears the punching device, so that the punching device always post dresses. I have to. For example, the punching device must be post-dressed each time the punching process step is not repeated 1000 times, otherwise it may not be possible to separate even one "startup" resistor. There is. Also, as shown by reference numeral 30 in FIG. 7 for explanation, when the punching process is performed, the adhesive peel 30 that penetrates and extends to the inside of the material in the edge region of the resistor during the process is formed to a width. There is a risk that some differences will occur. The width of the edge region 31 where the adhesive has peeled off from the substrate may be larger than 0.5 mm. The danger of such debonding arises, in particular, because the adhesives used here are relatively brittle due to their high ceramic content, which limits the miniaturization of the resistors which would be desirable. Will be done.

One method of avoiding such a difficult problem is to separate the resistors by a cutting method using a laser cutting device, but this method is costly.
The processing speed is low, and the electrical characteristics of the device may be impaired.

Therefore, here, as a method of separating the resistor, a softer method which is lower in cost and does not damage the element is used. As shown in FIG. 6F, the resistance film 2 and the side surfaces 4 of the connector contact surfaces 5 and 6 are formed.
4 (FIG. 5 (E)), the narrow area of the metal substrate 1 along the outline of the resistor is formed on the back side (substrate face side) opposite to the resistance film 2 by the same method as that formed by etching. ) Is removed by etching to form a plurality of grooves 50. The groove 50 extends to a depth reaching the adhesive layer 3, ie, the substrate 1 has a side surface 5 at the edge of the substrate of the component to be manufactured.
1 is formed by etching (side surface 51 extends in a direction crossing the layer surface of the substrate). Since the shape of the separation line (partition line) or the groove (slot) 50 is determined and formed by photolithography and etching technology, it can be easily and easily formed into a nearly desired complicated shape. In addition, this method has the advantage that other desired openings, hollows, holes or recesses can be formed in the resistor, if required, without any extra expense.

Since this etching process is performed simultaneously on all the resistors formed on one “starting laminate”, the process is performed in comparison with the case where the individual components are individually processed. Manufacturing costs are reduced by a small amount.

After the etching process, the individual resistors are only connected to each other by the "starting laminate", ie, the adhesive layer 3 in the original large laminate, so that the next process can be performed easily and without difficulty. . On the other hand, also in the structure formed by the etching process described with reference to FIG. 5E, the resistive metal in the separation line is removed as shown in FIG. 6F. Therefore, after the grooves 50 have been formed by etching, the resistors are only connected to each other only by the connecting portion or bridge-like portion (bridge) 52 of the short adhesive layer, and the connecting portion 52 is fragile and easily formed. Can be broken or cut. Separation of resistors is achieved by a simple one-time press on a plate press.
Can be performed in cycles (repetition periods). As shown in FIG. 6 (G), when the silicone mat 54 is disposed on the entire area of the “starting laminate” on the resistor side and the component is pressed inward by a press machine (pressure (Arrow), the deformation or flow deformation of the flexible silicone material causes the adhesive layer to cut or break along the outer edge of the resistor at the break point or break point 55 shown in FIG. 6 (G). Occurs.

Resistors of the type described herein are manufactured from a plurality of films and are suitable not only for SMD mounting but also for connection by bonding wires, mainly in the milliohm range (typically 1 to 50
It can be used as a measuring resistor having a resistance value of 0 mΩ). Also, the resistor can withstand high loads and its internal thermal resistance is extremely low (typically 1).
K / W × cm ² ), so that it can withstand a temporary (short-time) overload.

Methods other than those described above are also suitable for producing resistors having a powder-containing adhesive layer between the resistive film and the substrate according to the present invention. For example, the resistors can be separated by a known method of cutting a laminate using a laser. On the other hand, the above-described embodiment of the manufacturing method is more advantageous than a known method even when an adhesive film containing no ceramic powder is used.

[Brief description of the drawings]

1A and 1B are schematic diagrams of two embodiments of the resistor of the present invention.

FIG. 2A is a schematic structural view of a laminate used in an embodiment of the method for manufacturing a resistor of the present invention.

FIG. 3B is a schematic view of a structure formed in a laminate at a processing stage in an embodiment of the method of manufacturing a resistor according to the present invention.

FIG. 4 (C) is a vertical view along the AA plane of FIG. 2 (B) showing a structure formed on the laminate at the processing stage in the embodiment of the method of manufacturing the resistor of the present invention. It is sectional drawing.

5 (D) and 5 (E) are schematic diagrams for explaining processing steps in another embodiment of the method of manufacturing a resistor according to the present invention.

6 (F) and 6 (G) are schematic views for explaining a resistor separating process in the embodiment of the resistor manufacturing method according to the present invention.

FIG. 7 is a diagram for explaining an advantage of a preferred method of separating a resistor in a processing stage according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Resistive film 3 Adhesive layer 4, 4 'Connector / contact layer 5 Lower layer 6 Upper layer 52 Connection part of adhesive layer

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[Procedure amendment]

[Submission date] December 16, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

The object of the present invention is attained by the structure described in the claims. That is, the electric resistor according to the present invention, particularly the low-resistance electric resistor, is a metal resistor film (2) made of a resistive alloy.
A substrate (1) having good thermal conductivity, and an adhesive layer (3) made of an insulating material that is located between the film and the substrate and strongly adheres or bonds the film and the substrate together; the adhesive layer (3), characterized in that it consists of plastic materials containing a powder of a thermally conductive insulating material.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

Further, the method of manufacturing an electric resistor according to the present invention, particularly a low-resistance electric resistor, comprises a resistive film ( completely (entirely ) inside the periphery of the substrate (1) of each resistor. 2) A method of manufacturing an electric resistor, wherein a metal resistance film made of a resistive alloy is formed on a substrate made of a material having a good heat conductivity on a heat conductive adhesive layer made of an insulating material. 3) are bonded by the, the resistor film is etched to form a plurality of individual separate resistance element, a resistive film that is the etching, and the substrate,
The laminate comprising an adhesive layer located between the resistive film and the substrate is separated into individual separate resistors, in the manufacturing method of the electric resistor; adhesive layer containing a powder of an insulating material having a thermal conductivity adhesive layer der of plastics is, the resistance film and the substrate and, be pressed together by heating the adhesive layer in a press machine which is located between the resistor film and the substrate,
It is characterized by.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

Further, the electrical resistor according to the present invention, in particular another method for manufacturing the electric resistor having a low resistance is entirely (entirely) located inside the periphery of the substrate of the individual separate resistor (1) The resistance film (2) and the substrate on the opposite side of the resistance film substrate
A method of manufacturing an electric resistor having a connector / contact layer (4) on a surface ; a metal resistor film made of a resistive alloy is formed on a substrate made of a material having good thermal conductivity by using an insulating material. comprising thermally conductive adhesive layer (3) is bonded by the, the resistor film is etched to form a plurality of <br/> individual separate resistive element, a resistor film which is the etching, and the substrate, the laminate comprising an adhesive layer located between the resistive film and the substrate is separated into individual separate resistors,
In the manufacturing method of the electric resistor; First, the film resistor
At least the required connector contact area (23) is provided on the surface opposite to the substrate at the position where the connector contact layer of the resistor to be formed is arranged.
A plurality of defined surface areas (42) are photolithographically formed, then the defined plurality of surface areas are coated with a connector contact metal, and the partially metallized resistive film is then applied. Etch,
Forming a resistance structure (22). Departure
In the illustrated embodiment, the connector contact metal
The cover is galvanically or electrochemically (electroplated
) Or chemically deposited.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

[0009] Yet another method of manufacturing an electrical resistor, in particular a low electrical resistor, according to the present invention is a resistive film located completely (entirely ) inside the periphery of the substrate (1) of the individual resistor. (2) A method for manufacturing an electric resistor, wherein a metal resistance film made of a resistive alloy is formed on a substrate made of a metal having good heat conductivity, on a heat conductive adhesive layer made of an insulating material. are bonded by the (3), the resistor film is etched to form a plurality of individual separate resistive element, a resistor film which is etched, a substrate, a bonding layer located between the resistive film and the substrate the laminate of, separated into individual separate resistors, in the manufacturing method of the electric resistor; to separate laminate film resistor substrate
The substrate is etched until <br/> reaching the adhesive layer along the separation line from the surface opposite to the, then, the substrate by applying pressure to the laminate from the opposite side, connecting the rest of the adhesive layer Part (5
2) is destroyed and separated into individual resistors.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction contents]

Next, in order to manufacture the individual resistors, in a first processing step, a surface area including a resistor film-side contact surface of a resistor to be formed later is subjected to a photomask and a photosensitive material lamination. It is determined by a method known as photolithography using a film. As is clear from FIG. 3B, first, the surface region 42 is determined so as to be wider than the contact region 23 of the completed resistor formed later. The reason is that it is easier to process than accurately determining the region by photolithography so as to correspond to the connector contact layer (4, 4 ') having the desired shape from the beginning. The later formed resistive or resistive structure 22 is indicated by dashed lines. The area 42 is then electroplated (galvanic , Galve).
Applying Anikku a) or chemical metallization process. Before the metallization process, a portion between the regions 42, 42 is coated with a photoresist layer or other protective layer (cover) during the metallization process. Is covered with a photoresist layer or other protective layer. However, the partial metallization is accomplished by first metallizing the entire surface and then selectively etching (negative) areas complementary to the contact surface (to the underlying resistor metal). (Without damage).

Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01C 17/28 H01C 17/24 C

Claims (18)

[Claims] 1. A resistance film made of a metal made of a resistance alloy, a substrate having good thermal conductivity, and the resistance film and the substrate located between the resistance film and the substrate, and the resistance film and the substrate are strongly bonded together. An electrical resistor, in particular, a low-resistance electrical resistor, comprising an adhesive layer made of an insulating material, wherein the adhesive layer is made of an adhesive material containing a powder of a thermally conductive insulating material. An electrical resistor, characterized by: 2. The electric resistor according to claim 1, wherein the adhesive layer is made of an epoxy resin or a polyimide plastic containing ceramic powder. 3. The electrical resistor according to claim 1, wherein the content of the powder is about 60 to 70%. 4. A connector contact layer is disposed on the resistive film side opposite the substrate, wherein the connector contact layer is formed by electroplating or chemically deposited copper and / or copper. The electrical resistor according to any one of claims 1 to 3, further comprising a metal coating such as nickel. 5. The connector according to claim 1, wherein a connector contact is arranged in a concave portion of the resistance film formed on a surface of the resistance film opposite to the substrate. An electrical resistor as described. 6. The electric resistor according to claim 1, wherein a side surface of said metal extending in a direction transverse to each surface of each of said layers is formed by etching. . 7. A method for manufacturing an electrical resistor, in particular a low-resistance electrical resistor, having a resistive film located entirely inside the periphery of the substrate of the individual resistor; A resistance film is bonded on a substrate made of a material having good thermal conductivity via a heat conductive adhesive layer made of an insulating material, and etching the resistance film to form a plurality of individual resistance elements. A method for manufacturing an electric resistor, comprising separating a laminated body formed and formed of the etched resistive film, the substrate, and the adhesive layer located between the resistive film and the substrate into individual resistors. Wherein the adhesive layer is made of an adhesive substance containing a powder of an insulating material having thermal conductivity, and comprises: the resistive film, the substrate, and the adhesive layer located between the resistive film and the substrate. Heated together Pressing, characterized by the method of manufacturing an electric resistor. 8. The method according to claim 7, wherein the bonding is performed by pressing the laminate in a vacuum state. 9. The method according to claim 7, wherein the adhesive layer is applied by a screen printing method or is disposed between the resistive film and the substrate in the form of a previously prepared dry film. Or a method for producing an electric resistor according to item 8. 10. An electrical resistor having a resistor film located entirely inside a periphery of a substrate of an individual resistor, and a connector contact layer on a surface side of the resistor film opposite to the substrate. In particular, a method for manufacturing a low-resistance electric resistor, wherein a metal resistance film made of a resistive alloy is formed on a substrate made of a material having good heat conductivity, on a substrate made of an insulating material, The resistance film is etched to form a plurality of individual resistance elements, the etched resistance film, the substrate, and the adhesion positioned between the resistance film and the substrate. A method for manufacturing an electrical resistor, comprising separating a laminate comprising layers into individual resistors; first, the resistor to be formed on the surface of the resistor film opposite to the substrate Photolithographically forming a plurality of limited surface areas including at least required connector contact areas at positions where the connector contact layers are arranged; A method of manufacturing an electrical resistor, comprising: applying a coating of a metal for use; and etching the resistance film partially metal-coated to form a resistance structure. 11. The limited metallized surface area is initially wider than the required connector contact area, and the required connector contact layer is etched simultaneously with the formation of the resistive structure. The method for manufacturing an electrical resistor according to claim 10, wherein: 12. The method as claimed in claim 10, wherein the metal for connector contact is applied by electroplating or chemical metallization. 13. The method according to claim 13, wherein two different metal layers are applied as the metal for the connector / contact.
A method for manufacturing the electric resistor according to claim 12. 14. A recess is formed in the surface of the resistive film opposite the substrate to partially metallize the limited plurality of surface areas of the resistive film. 14. The method according to claim 10, wherein the recess is filled with a contact metal. 15. The method according to claim 14, wherein the concave portion is formed by etching. 16. A method for manufacturing an electrical resistor, in particular a low-resistance electrical resistor, having a resistive film located entirely inside the periphery of the substrate of the individual resistors, comprising a metal made of a resistive alloy. A resistance film is bonded on a substrate made of a metal having good heat conductivity via a heat conductive adhesive layer made of an insulating material. The resistance film is etched to form a plurality of individual resistance elements. Forming an electrical resistor, separating a laminate comprising the etched resistive film, the substrate, and the adhesive layer located between the resistive film and the substrate into individual resistors. In the method, to separate the laminate, etching the substrate from a position on the surface of the substrate opposite to the resistance film to a position of the adhesive layer along a separation line; Applying a pressure to the laminate from the opposite side to break the connection portion of the remaining adhesive layer and separate the resistor. 17. The laminate is formed by using a film made of an adhesive substance such as plastic containing ceramic powder as the adhesive layer.
A method for manufacturing the electric resistor according to claim 7. 18. A method for applying a pressure for separating the resistor by using a rubber elastic mat covering one entire surface of the laminate in a press machine.
A method for manufacturing the electric resistor according to claim 16.