JP2012094687A - Optical transceiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical transceiver that suppresses stress generated in an electrical connection part between an outer lead of an electro-optical component and a circuit board.SOLUTION: The optical transceiver includes: an electro-optical component 10 having an outer lead 12 for electrical connection; a circuit board 22 on which the outer lead 12 is soldered; an adhesion part 26 adhering the electro-optical component 10 to the circuit board 22; and a fixing part 28 fixing the electro-optical component 10 to the circuit board 22 strongly in comparison to the adhesion part 26. The fixing part 28 is provided away from the part on which the outer lead 12 is soldered in comparison to the adhesion part 26, and at least a part of the adhesion part 26 is provided near the part on which the outer lead 12 is soldered in comparison to fixing part 28.

Description

  The present invention relates to an optical transceiver.

  The electro-optic component mounted on the circuit board has an electrical connection portion (for example, an external lead) in addition to the optical connection portion. External leads are usually soldered to the circuit board. In optical transceivers, electro-optical components are often locally fastened to a circuit board or housing with screws.

  Optical transceivers are subject to various influences such as vibration and heat depending on the use environment. In particular, vibrations are transmitted to circuit boards and electro-optical components, and adversely affect the soldered portions of external leads. In particular, the natural vibration has a great influence because there is a vibration mode in which the circuit board and the electro-optical component are separated or have a movement of compressing the external lead.

  In order to solve this problem, Patent Document 1 discloses a method in which a holding portion formed in the middle of an external lead of an electronic component is soldered to a substrate to suppress stress applied to the soldering portion of the conductive portion at the tip. It is disclosed. Patent Document 2 discloses a method of attenuating generated vibration by the spring property of the external lead by forming the external lead of the electronic component into a three-dimensional shape.

JP-A-8-279579 JP 2000-223812 A

  However, the technique described in Patent Document 1 is difficult to form the external lead by a simple forming method because the external lead is folded back by the holding portion. Further, the length of the external lead itself needs to be increased, which is not practical. Further, the technique described in Patent Document 2 requires the formation of an external lead and is not versatile.

  The present invention has been made in view of the above problems, and an object thereof is to provide an optical transceiver that suppresses stress generated in an electrical connection portion between an external lead of an electro-optic component and a circuit board.

  (1) An optical transceiver according to the present invention bonds an electro-optic component having an external lead for electrical connection, a circuit board to which the external lead is soldered, and the electro-optic component and the circuit board. An adhesive portion; and a fixing portion that fixes the electro-optic component and the circuit board more firmly than the adhesive portion. The fixing portion is connected to a portion of the external lead that is soldered more than the adhesive portion. It is provided apart from each other, and at least a part of the bonding portion is provided closer to the portion to be soldered of the external lead than the fixing portion. According to the present invention, since the circuit board bends with the fixed portion to be firmly fixed as a fulcrum, a large stress is generated by the bend near the fulcrum.

  (2) In the optical transceiver described in (1), the adhesive portion is attached to a bottom surface of the electro-optic component, and the external lead extends from a side surface rising upward from the bottom surface of the electro-optic component. The soldering may be performed outside the bottom surface.

  (3) In the optical transceiver described in (2), the bottom surface of the electro-optic component includes a region adjacent to the bottom of the external lead, and at least a part of the adhesive portion is provided in the region. The fixing portion may be provided to avoid the region.

  (4) In the optical transceiver described in (3), a polygon having a plurality of the fixing portions, and having a minimum area in which all of the plurality of the fixing portions are arranged at the apexes or inside thereof is formed on the external leads. It may be characterized in that it is located avoiding the region adjacent immediately below the root.

  (5) In the optical transceiver described in any one of (1) to (4), the optical transceiver further includes a case that accommodates the electro-optical component, the circuit board, and the adhesive portion, and the case is an upper case And a lower case, and a peripheral portion of the circuit board may be disposed between the upper case and the lower case.

  (6) In the optical transceiver described in (5), the fixing portion may also serve to fix the lower case and the circuit board.

  (7) In the optical transceiver described in any one of (1) to (4), the optical transceiver further includes a case that accommodates the electro-optical component, the circuit board, and the bonding portion, and the case is an upper case. And the lower case, wherein the fixing portion also serves to fix the lower case and the circuit board.

  (8) In the optical transceiver described in any one of (1) to (7), the fixing portion may include a screw.

  (9) In the optical transceiver described in any one of (1) to (8), the adhesive portion may be a double-sided adhesive tape.

1 is an exploded perspective view of an optical transceiver according to an embodiment of the present invention. It is a bottom perspective view of an electro-optic component. It is a top view of a circuit board. It is a disassembled perspective view of the optical transceiver which concerns on the modification of embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is an exploded perspective view of an optical transceiver according to the present embodiment. FIG. 2 is a bottom perspective view of the electro-optical component. FIG. 3 is a top view of the circuit board.

  The optical transceiver has an electro-optical component 10. An optical modulator (for example, an LN modulator) that is an example of the electro-optical component 10 outputs modulated light. The electro-optical component 10 is a large optical device necessary for high-speed and long-distance optical transmission. The electro-optical component 10 has external leads 12 for electrical connection. The external lead 12 is formed by simple bending. The external lead 12 extends from a side surface 16 that rises upward from the bottom surface 14 (see FIG. 2) of the electro-optic component 10. The external lead 12 (specifically, its tip) is soldered outside the bottom surface 14 of the electro-optic component 10. The bottom surface 14 of the electro-optical component 10 includes a region 18 that is adjacent to the base of the external lead 12. Further, a mounting screw hole 20 is provided on the bottom surface 14 of the electro-optical component 10.

  The optical transceiver has a circuit board 22. The circuit board 22 includes, for example, a board made of glass epoxy resin and a wiring pattern (not shown) formed on the board. On the circuit board 22, optical parts and electronic parts (not shown) are mounted. The external leads 12 are soldered to the circuit board 22 (a wiring pattern not shown in detail). As shown in FIG. 3, a hole 24 a for screw fastening with the electro-optic component 10 is formed in the circuit board 22. The circuit board 22 also has a hole 24 b used for screw fastening with the upper case 32 and a hole (or notch) 24 c used for screw fastening with the upper case 32 and the lower case 34.

  As shown in FIG. 1, the optical transceiver includes an adhesive portion 26 that adheres the electro-optical component 10 and the circuit board 22. The bonding portion 26 is attached to the bottom surface 14 of the electro-optical component 10. At least a part of the adhesive portion 26 is provided in a region 18 adjacent to the bottom of the base of the external lead 12. The adhesive part 26 is a double-sided adhesive tape. As for a double-sided adhesive tape, a base material consists of a nonwoven fabric, for example, and has an acrylic adhesive on both surfaces of a base material.

  The optical transceiver includes a plurality of fixing portions 28 that fix the electro-optical component 10 and the circuit board 22 more firmly than the bonding portion 26. The fixing part 28 is provided locally. The fixing portion 28 includes a screw 28a and a screw hole 20 (see FIG. 2). The screw 28 a is passed through the hole 24 a (see FIG. 3) of the circuit board 22 and fastened to the screw hole 20 of the electro-optical component 10. The fixing portion 28 is provided to avoid the adjacent region 18 immediately below the base of the external lead 12. As shown in FIG. 2, when a polygon P having a minimum area in which all of the plurality of fixing portions 28 are located at the apexes or inside is drawn, the polygon P is an area immediately below the base of the external lead 12. 18 is located.

  The fixing portion 28 is provided farther from the portion (for example, the tip portion) to be soldered of the external lead 12 than the bonding portion 26. Then, at least a part of the bonding portion 26 is provided at a position closer to the portion to which the external lead 12 is soldered than the fixing portion 28.

  According to the present embodiment, since the circuit board 22 bends with the fixed portion 28 to be firmly fixed as a fulcrum, a large stress is generated by the bend near the fulcrum.

  The optical transceiver includes a case 30 that houses the electro-optic component 10, the circuit board 22, and the bonding portion 26. In other words, the case 30 has an internal space for housing various components (such as the electro-optical component 10). Case 30 plays the role which protects the components accommodated in the interior space. Case 30 is made of aluminum, for example. The case 30 includes an upper case 32 and a lower case 34. The circuit board 22 is fixed to the upper case 32 with screws 28b. The screw 28b passes through the hole 24b (see FIG. 3) of the circuit board 22. The upper case 32 and the lower case 34 are fixed with screws 28c. The screw 28c includes a screw that penetrates the peripheral portion 22a (see FIG. 3) of the circuit board 22 and a screw that penetrates the center portion (portion excluding the peripheral portion 22a) of the circuit board 22. The circuit board 22 is not screwed to the lower case 34, but the peripheral edge portion 22a of the circuit board 22 is sandwiched between the upper case 32 and the lower case 34 as shown in FIG. It is pinched.

[Modification]
FIG. 4 is an exploded perspective view of an optical transceiver according to a modification of the embodiment of the present invention. In the above-described embodiment (see FIG. 1), the four screws 28 a penetrate the circuit board 22 and fix the electro-optical component 10 and the circuit board 22. On the other hand, in the present modification shown in FIG. 4, at least one fixing portion 128 also serves to fix the lower case 134 and the circuit board 122. That is, the screw 128a for fixing the electro-optical component 110 passes through the lower case 134 and the circuit board 122 to fix the electro-optical component 110 and the lower case 134, and the circuit board 122 is sandwiched therebetween.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. In addition, the configuration described in the above embodiment can be replaced with a configuration that is substantially the same, a configuration that exhibits the same operational effects, or a configuration that can achieve the same purpose. For example, in the above embodiment, the electro-optic component 10 (light modulator) is a rectangular parallelepiped, but a cylindrical shape may be adopted.

  P Polygon, 10 Electro-optic component, 12 External lead, 14 Bottom, 16 Side, 18 Region, 20 Screw hole, 22 Circuit board, 22a Peripheral part, 24a hole, 24b hole, 24c hole, 26 Adhesive part, 28 Fixed part , 28a screw, 28b screw, 28c screw, 30 case, 32 upper case, 34 lower case, 110 electro-optic component, 122 circuit board, 128 fixing part, 128 screw, 134 lower case.

Claims (9)

An electro-optic component having external leads for electrical connection;
A circuit board to which the external leads are soldered;
An adhesion part for adhering the electro-optic component and the circuit board;
A fixing portion for fixing the electro-optical component and the circuit board more firmly than the bonding portion;
Have
The fixing portion is provided farther from the soldered portion of the external lead than the bonding portion,
At least a part of the adhesive portion is provided at a position closer to the portion to be soldered of the external lead than the fixing portion. The optical transceiver of claim 1.
The adhesive portion is attached to the bottom surface of the electro-optic component,
The optical transceiver is characterized in that the external lead extends from a side surface rising upward from the bottom surface of the electro-optical component and is soldered outside the bottom surface. The optical transceiver according to claim 2,
The bottom surface of the electro-optic component includes a region immediately adjacent to a base of the external lead;
At least a part of the adhesive portion is provided in the region;
An optical transceiver characterized in that the fixed portion is provided to avoid the region. The optical transceiver according to claim 3,
A plurality of the fixing portions;
An optical transceiver characterized in that a polygon having a minimum area in which all of the plurality of fixing portions are arranged at the apexes or inside thereof is located avoiding the region adjacent immediately below the root of the external lead. The optical transceiver according to any one of claims 1 to 4,
A case that accommodates the electro-optical component, the circuit board, and the bonding portion;
The case includes an upper case and a lower case,
An optical transceiver characterized in that a peripheral portion of the circuit board is disposed between the upper case and the lower case. The optical transceiver according to claim 5,
The optical transceiver is characterized in that the fixing portion also serves to fix the lower case and the circuit board. The optical transceiver according to any one of claims 1 to 4,
A case that accommodates the electro-optical component, the circuit board, and the bonding portion;
The case includes an upper case and a lower case,
The optical transceiver is characterized in that the fixing portion also serves to fix the lower case and the circuit board. The optical transceiver according to any one of claims 1 to 7,
The optical transceiver is characterized in that the fixing part includes a screw. The optical transceiver according to any one of claims 1 to 8,
The optical transceiver is a double-sided adhesive tape.

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