JPS648739U - - Google Patents
Info
- Publication number
- JPS648739U JPS648739U JP10300087U JP10300087U JPS648739U JP S648739 U JPS648739 U JP S648739U JP 10300087 U JP10300087 U JP 10300087U JP 10300087 U JP10300087 U JP 10300087U JP S648739 U JPS648739 U JP S648739U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- wiring board
- printed wiring
- subcarrier
- screwed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案サブキヤリアの外観斜視図、第
２図は本考案のサブキヤリアのＰＣＢへの実装拡
大側面図、第３図はＰＣＢへのはんだ付けのため
にリード成形されたフラツトパツケージの外観斜
視図、第４図はフラツトパツケージの従来のＰＣ
Ｂへの実装拡大側面図を示す。
１：パツケージ本体、２：リード、３：ＰＣＢ
、４：サブキヤリア本体、５：ねじ部、６：ナツ
ト。
Fig. 1 is an external perspective view of the subcarrier of the present invention, Fig. 2 is an enlarged side view of the subcarrier of the present invention mounted on a PCB, and Fig. 3 is an external appearance of a flat package with lead molding for soldering to a PCB. The perspective view, Figure 4, shows a conventional PC in a flat package.
An enlarged side view of the mounting on B is shown. 1: Package body, 2: Lead, 3: PCB
, 4: Subcarrier body, 5: Threaded part, 6: Nut.
Claims (1)
ケージをプリント配線基板上に実装する場合にお
いて、プリント配線基板とフラツトパツケージ間
にフラツトパツケージ本体に固定が可能で、且つ
プリント配線基板にねじ止め可能な構造をもつサ
ブキヤリア。 When a flat package with a semiconductor integrated circuit mounted inside is mounted on a printed wiring board, the flat package can be fixed to the flat package body between the printed wiring board and the flat package, and can be screwed to the printed wiring board. Subcarrier with structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10300087U JPS648739U (en) | 1987-07-03 | 1987-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10300087U JPS648739U (en) | 1987-07-03 | 1987-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648739U true JPS648739U (en) | 1989-01-18 |
Family
ID=31333422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10300087U Pending JPS648739U (en) | 1987-07-03 | 1987-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012094687A (en) * | 2010-10-27 | 2012-05-17 | Opnext Japan Inc | Optical transceiver |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61190963A (en) * | 1984-12-06 | 1986-08-25 | テキサス インスツルメンツ インコ−ポレイテツド | Apparatus for mounting ceramic leadless chip carrier mounting apparatus |
-
1987
- 1987-07-03 JP JP10300087U patent/JPS648739U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61190963A (en) * | 1984-12-06 | 1986-08-25 | テキサス インスツルメンツ インコ−ポレイテツド | Apparatus for mounting ceramic leadless chip carrier mounting apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012094687A (en) * | 2010-10-27 | 2012-05-17 | Opnext Japan Inc | Optical transceiver |