JPS61190173U - - Google Patents
Info
- Publication number
- JPS61190173U JPS61190173U JP7429685U JP7429685U JPS61190173U JP S61190173 U JPS61190173 U JP S61190173U JP 7429685 U JP7429685 U JP 7429685U JP 7429685 U JP7429685 U JP 7429685U JP S61190173 U JPS61190173 U JP S61190173U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- copper foil
- hole
- circuit board
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。
１……回路基板、２……チツプ部品、４ａ……
銅箔端部、７……孔。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example. 1... Circuit board, 2... Chip parts, 4a...
Copper foil end, 7... hole.
Claims (1)
基板に前記チツプ部品の形状と略等しく形成され
た貫通孔と、前記貫通孔の回路パターン側を一部
閉塞する銅箔とを備え、前記貫通孔内にチツプ部
品を挿入し、かつ前記銅箔上に当接させ、チツプ
部品と銅箔間を半田付けしたことを特徴とするチ
ツプ部品の取付け構造。 A chip part to be mounted on a circuit board, a through hole formed in the circuit board to be substantially the same as the shape of the chip component, and a copper foil partially closing the circuit pattern side of the through hole, A structure for mounting a chip component, characterized in that a chip component is inserted into the hole, brought into contact with the copper foil, and soldered between the chip component and the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7429685U JPS61190173U (en) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7429685U JPS61190173U (en) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190173U true JPS61190173U (en) | 1986-11-27 |
Family
ID=30614461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7429685U Pending JPS61190173U (en) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190173U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793594A (en) * | 1980-12-03 | 1982-06-10 | Suwa Seikosha Kk | Thin circuit mounting structure |
-
1985
- 1985-05-20 JP JP7429685U patent/JPS61190173U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793594A (en) * | 1980-12-03 | 1982-06-10 | Suwa Seikosha Kk | Thin circuit mounting structure |