JPS6265868U - - Google Patents
Info
- Publication number
- JPS6265868U JPS6265868U JP15804085U JP15804085U JPS6265868U JP S6265868 U JPS6265868 U JP S6265868U JP 15804085 U JP15804085 U JP 15804085U JP 15804085 U JP15804085 U JP 15804085U JP S6265868 U JPS6265868 U JP S6265868U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- board
- attached
- pin
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の第一実施例の断面図、第２
図は、本考案の第二実施例の断面図を示し、第３
図は従来例の断面図である。
１：高周波デバイス、１ａ：ピン、２：金属板
、２ａ：孔、３：基板、３ａ：接続孔、３ｂ：導
体箔、４：半田。
FIG. 1 is a cross-sectional view of the first embodiment of the present invention, and the second
The figure shows a sectional view of the second embodiment of the present invention, and the figure shows the third embodiment of the present invention.
The figure is a sectional view of a conventional example. 1: High frequency device, 1a: Pin, 2: Metal plate, 2a: Hole, 3: Substrate, 3a: Connection hole, 3b: Conductor foil, 4: Solder.
Claims (1)
るとともに、他方の面に基板を取り付け、前記高
周波デバイスに設けたピンを、金属板に設けた孔
を通して基板に半田付けする高周波回路用の回路
基板において、前記高周波デバイスのピンを取り
付ける前記基板のピン接続部の厚みを薄くしたこ
とを特徴とする高周波回路用の回路基板。 A circuit board for a high frequency circuit, in which a high frequency device is attached to one side of a metal plate, a board is attached to the other side, and a pin provided on the high frequency device is soldered to the board through a hole provided in the metal plate, A circuit board for a high frequency circuit, characterized in that a pin connection portion of the board to which a pin of the high frequency device is attached is thinned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804085U JPS6265868U (en) | 1985-10-15 | 1985-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804085U JPS6265868U (en) | 1985-10-15 | 1985-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265868U true JPS6265868U (en) | 1987-04-23 |
Family
ID=31081155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15804085U Pending JPS6265868U (en) | 1985-10-15 | 1985-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366U (en) * | 1989-05-18 | 1991-01-07 |
-
1985
- 1985-10-15 JP JP15804085U patent/JPS6265868U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366U (en) * | 1989-05-18 | 1991-01-07 |