JPH02127067U - - Google Patents
Info
- Publication number
- JPH02127067U JPH02127067U JP3711289U JP3711289U JPH02127067U JP H02127067 U JPH02127067 U JP H02127067U JP 3711289 U JP3711289 U JP 3711289U JP 3711289 U JP3711289 U JP 3711289U JP H02127067 U JPH02127067 U JP H02127067U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- surface mount
- mount component
- electrode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1,2図はこの考案の一実施例によるプリン
ト基板の構成を示す断面図及び平面図、第3図は
従来のプリント基板に表面実装部品をはんだ付け
した状態を示す斜視図、第4,5図は従来のプリ
ント基板の構成を示す断面図及び平面図である。
図において、1は絶縁板、2は絶縁部材、3,
3Aは電極板、4ははんだ、5は表面実装部品、
6は電極板の絶縁が施こされた部分である。なお
、図中、同一符号は同一または相当部分を示す。
1 and 2 are a cross-sectional view and a plan view showing the configuration of a printed circuit board according to an embodiment of the invention, FIG. 3 is a perspective view showing a state in which surface mount components are soldered to a conventional printed circuit board, and FIG. FIG. 5 is a sectional view and a plan view showing the structure of a conventional printed circuit board. In the figure, 1 is an insulating plate, 2 is an insulating member, 3,
3A is an electrode plate, 4 is solder, 5 is a surface mount component,
Reference numeral 6 indicates an insulated portion of the electrode plate. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
リント基板において、上記電極板に上記表面実装
部品が装着される側を除く他の3辺の外周部から
内部へ所定位置の間に絶縁部材を施すように構成
したことを特徴とするプリント基板。 In a printed circuit board on which a surface mount component is mounted between two electrode plates, an insulating member is inserted between predetermined positions from the outer periphery of the other three sides to the inside, excluding the side on which the surface mount component is mounted on the electrode plate. A printed circuit board characterized in that the printed circuit board is configured so as to be applied.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711289U JPH02127067U (en) | 1989-03-29 | 1989-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711289U JPH02127067U (en) | 1989-03-29 | 1989-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02127067U true JPH02127067U (en) | 1990-10-19 |
Family
ID=31543930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3711289U Pending JPH02127067U (en) | 1989-03-29 | 1989-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02127067U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0595176A (en) * | 1991-10-02 | 1993-04-16 | Matsushita Electric Ind Co Ltd | Printed board for high-frequency amplifying module |
-
1989
- 1989-03-29 JP JP3711289U patent/JPH02127067U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0595176A (en) * | 1991-10-02 | 1993-04-16 | Matsushita Electric Ind Co Ltd | Printed board for high-frequency amplifying module |