JPH02136301U - - Google Patents
Info
- Publication number
- JPH02136301U JPH02136301U JP4526689U JP4526689U JPH02136301U JP H02136301 U JPH02136301 U JP H02136301U JP 4526689 U JP4526689 U JP 4526689U JP 4526689 U JP4526689 U JP 4526689U JP H02136301 U JPH02136301 U JP H02136301U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- terminal
- caulking
- electrode
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図はこの考案の要部の拡大断面図、第２図
は第１図に使用される端子の拡大斜視図、第３図
はこの考案の実施例による電子部品の側断面図、
第４図は第３図のＡ−Ａ断面図、第５図は第３図
に使用される絶縁基板に端子を取付けた状態を示
す平面図、第６図は従来の端子導出構造の要部を
示す拡大断面図である。
FIG. 1 is an enlarged sectional view of the main part of this invention, FIG. 2 is an enlarged perspective view of the terminal used in FIG. 1, and FIG. 3 is a side sectional view of an electronic component according to an embodiment of this invention.
Figure 4 is a sectional view taken along the line A-A in Figure 3, Figure 5 is a plan view showing the state in which the terminals are attached to the insulating substrate used in Figure 3, and Figure 6 is the main part of the conventional terminal lead-out structure. FIG.
Claims (1)
の周囲の前記絶縁基板の一面上に電極が形成され
、板状端子の板面から突出して設けられたかしめ
部が前記かしめ孔に通され、そのかしめ部が前記
絶縁基板にこう着されて、前記電極に前記端子の
板面が圧接されてなる電子部品の端子導出構造に
おいて、 前記端子の前記電極と対面する部分に孔が設け
られ、その孔の内周面と前記孔により露出した前
記電極の部分にわたつて導電接着剤が付着される
ことを特徴とする電子部品の端子導出構造。[Claims for Utility Model Registration] A caulking hole is provided in an insulating substrate, an electrode is formed on one surface of the insulating substrate around the caulking hole, and a caulking portion protruding from the plate surface of a plate-shaped terminal is provided. In a terminal lead-out structure for an electronic component, the terminal is passed through the caulking hole, the caulking part is adhered to the insulating substrate, and the plate surface of the terminal is pressure-contacted to the electrode, comprising: a portion of the terminal that faces the electrode; 1. A terminal lead-out structure for an electronic component, characterized in that a hole is provided in the hole, and a conductive adhesive is adhered to an inner peripheral surface of the hole and a portion of the electrode exposed by the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4526689U JPH02136301U (en) | 1989-04-17 | 1989-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4526689U JPH02136301U (en) | 1989-04-17 | 1989-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02136301U true JPH02136301U (en) | 1990-11-14 |
Family
ID=31559286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4526689U Pending JPH02136301U (en) | 1989-04-17 | 1989-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02136301U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014038515A1 (en) * | 2012-09-04 | 2014-03-13 | 株式会社アテックス | Production method for bus bar insert resin molded article, and bus bar insert resin molded article |
| CN110323578A (en) * | 2018-03-29 | 2019-10-11 | 泰科电子(上海)有限公司 | Conductive terminal |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524151B1 (en) * | 1975-08-28 | 1977-02-01 | ||
| JPS61185877A (en) * | 1985-02-14 | 1986-08-19 | 松下電器産業株式会社 | Terminal staking |
-
1989
- 1989-04-17 JP JP4526689U patent/JPH02136301U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524151B1 (en) * | 1975-08-28 | 1977-02-01 | ||
| JPS61185877A (en) * | 1985-02-14 | 1986-08-19 | 松下電器産業株式会社 | Terminal staking |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014038515A1 (en) * | 2012-09-04 | 2014-03-13 | 株式会社アテックス | Production method for bus bar insert resin molded article, and bus bar insert resin molded article |
| JP2014049415A (en) * | 2012-09-04 | 2014-03-17 | Atex Co Ltd | Manufacturing method of bus bar insert resin molding, and bus bar insert resin molding |
| CN110323578A (en) * | 2018-03-29 | 2019-10-11 | 泰科电子(上海)有限公司 | Conductive terminal |
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