JPS6292679U - - Google Patents
Info
- Publication number
- JPS6292679U JPS6292679U JP18532385U JP18532385U JPS6292679U JP S6292679 U JPS6292679 U JP S6292679U JP 18532385 U JP18532385 U JP 18532385U JP 18532385 U JP18532385 U JP 18532385U JP S6292679 U JPS6292679 U JP S6292679U
- Authority
- JP
- Japan
- Prior art keywords
- terminal electrodes
- solder resists
- width
- insulating substrate
- wider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は、この考案の実施例を示す混成集積回
路の要部斜視図、第2図は、第1図におけるA―
A線断面図、第3図は、混成集積回路の従来例を
示す要部斜視図である。
11……絶縁基板、12……端子用電極、13
……半田レジスト。
FIG. 1 is a perspective view of the main parts of a hybrid integrated circuit showing an embodiment of this invention, and FIG. 2 is an A--
A sectional view taken along line A and FIG. 3 are perspective views of essential parts showing a conventional example of a hybrid integrated circuit. 11...Insulating substrate, 12...Terminal electrode, 13
...Solder resist.
Claims (1)
2,12…と、半田レジスト13,13…が形成
された混成集積回路の引出端子において、端子用
電極12,12…の幅w1が半田レジスト13,
13…の間隔d2より広く、端子用電極12,1
2…の間隔d1が半田レジスト13,13…の幅
w2より狭く設定され、半田レジスト13,13
…が端子用電極12,12…の上に何れも同じピ
ツチp1,p2で一部重ね合わせて形成されてい
ることを特徴とする混成集積回路の引出端子。 Terminal electrodes 1 are placed on the insulating substrate 11 at intervals.
2, 12... and solder resists 13, 13... are formed, the width w 1 of the terminal electrodes 12, 12... is the same as the solder resists 13, 13...
The interval d between 13... is wider than 2 , and the terminal electrodes 12,1
2... is set narrower than the width w2 of the solder resists 13, 13..., and the solder resists 13, 13
. . . are formed on terminal electrodes 12 , 12, .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18532385U JPS6292679U (en) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18532385U JPS6292679U (en) | 1985-11-29 | 1985-11-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6292679U true JPS6292679U (en) | 1987-06-13 |
Family
ID=31133841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18532385U Pending JPS6292679U (en) | 1985-11-29 | 1985-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6292679U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0593069U (en) * | 1992-02-17 | 1993-12-17 | 台灣杜邦股▲ふん▼有限公司 | Printed circuit board |
JP2006059996A (en) * | 2004-08-19 | 2006-03-02 | Toshiba Corp | Printed-wiring board and its manufacturing method and design tool, printed circuit board, and electronic equipment |
JP2013041647A (en) * | 2011-08-17 | 2013-02-28 | Dainippon Printing Co Ltd | Suspension substrate |
-
1985
- 1985-11-29 JP JP18532385U patent/JPS6292679U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0593069U (en) * | 1992-02-17 | 1993-12-17 | 台灣杜邦股▲ふん▼有限公司 | Printed circuit board |
JP2006059996A (en) * | 2004-08-19 | 2006-03-02 | Toshiba Corp | Printed-wiring board and its manufacturing method and design tool, printed circuit board, and electronic equipment |
JP4709512B2 (en) * | 2004-08-19 | 2011-06-22 | 株式会社東芝 | Electronics |
JP2013041647A (en) * | 2011-08-17 | 2013-02-28 | Dainippon Printing Co Ltd | Suspension substrate |
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