JPS6292679U - - Google Patents

Info

Publication number
JPS6292679U
JPS6292679U JP18532385U JP18532385U JPS6292679U JP S6292679 U JPS6292679 U JP S6292679U JP 18532385 U JP18532385 U JP 18532385U JP 18532385 U JP18532385 U JP 18532385U JP S6292679 U JPS6292679 U JP S6292679U
Authority
JP
Japan
Prior art keywords
terminal electrodes
solder resists
width
insulating substrate
wider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18532385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18532385U priority Critical patent/JPS6292679U/ja
Publication of JPS6292679U publication Critical patent/JPS6292679U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の実施例を示す混成集積回
路の要部斜視図、第２図は、第１図におけるＡ―
Ａ線断面図、第３図は、混成集積回路の従来例を
示す要部斜視図である。 １１……絶縁基板、１２……端子用電極、１３
……半田レジスト。 FIG. 1 is a perspective view of the main parts of a hybrid integrated circuit showing an embodiment of this invention, and FIG. 2 is an A--
A sectional view taken along line A and FIG. 3 are perspective views of essential parts showing a conventional example of a hybrid integrated circuit. 11...Insulating substrate, 12...Terminal electrode, 13
...Solder resist.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板１１の上に間隔をおいて端子用電極１
２，１２…と、半田レジスト１３，１３…が形成
された混成集積回路の引出端子において、端子用
電極１２，１２…の幅ｗ１が半田レジスト１３，
１３…の間隔ｄ２より広く、端子用電極１２，１
２…の間隔ｄ１が半田レジスト１３，１３…の幅
ｗ２より狭く設定され、半田レジスト１３，１３
…が端子用電極１２，１２…の上に何れも同じピ
ツチｐ１，ｐ２で一部重ね合わせて形成されてい
ることを特徴とする混成集積回路の引出端子。 Terminal electrodes 1 are placed on the insulating substrate 11 at intervals.
2, 12... and solder resists 13, 13... are formed, the width w 1 of the terminal electrodes 12, 12... is the same as the solder resists 13, 13...
The interval d between 13... is wider than 2 , and the terminal electrodes 12,1
2... is set narrower than the width w2 of the solder resists 13, 13..., and the solder resists 13, 13
. . . are formed on terminal electrodes 12 , 12, .
JP18532385U 1985-11-29 1985-11-29 Pending JPS6292679U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18532385U JPS6292679U (en) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18532385U JPS6292679U (en) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292679U true JPS6292679U (en) 1987-06-13

Family

ID=31133841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18532385U Pending JPS6292679U (en) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292679U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593069U (en) * 1992-02-17 1993-12-17 台灣杜邦股▲ふん▼有限公司 Printed circuit board
JP2006059996A (en) * 2004-08-19 2006-03-02 Toshiba Corp Printed-wiring board and its manufacturing method and design tool, printed circuit board, and electronic equipment
JP2013041647A (en) * 2011-08-17 2013-02-28 Dainippon Printing Co Ltd Suspension substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593069U (en) * 1992-02-17 1993-12-17 台灣杜邦股▲ふん▼有限公司 Printed circuit board
JP2006059996A (en) * 2004-08-19 2006-03-02 Toshiba Corp Printed-wiring board and its manufacturing method and design tool, printed circuit board, and electronic equipment
JP4709512B2 (en) * 2004-08-19 2011-06-22 株式会社東芝 Electronics
JP2013041647A (en) * 2011-08-17 2013-02-28 Dainippon Printing Co Ltd Suspension substrate

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