JPS636767U - - Google Patents
Info
- Publication number
- JPS636767U JPS636767U JP9915186U JP9915186U JPS636767U JP S636767 U JPS636767 U JP S636767U JP 9915186 U JP9915186 U JP 9915186U JP 9915186 U JP9915186 U JP 9915186U JP S636767 U JPS636767 U JP S636767U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- substrate
- thick film
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図の、線に沿う拡大断面図、第３図は従
来構造の斜視図、第４図は従来の他の構造の平面
図である。
１……誘電体基板、２……抵抗体（素子）、３
……表面導体、４……裏面導体、６……スルーホ
ール、１１……誘電体基板、１２……抵抗、１３
……表面導体、１４……裏面導体、１５……側面
導体、１６……スルーホール。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is an enlarged sectional view along the line of Fig. 1, Fig. 3 is a perspective view of a conventional structure, and Fig. 4 is a diagram of another conventional structure. FIG. 1... Dielectric substrate, 2... Resistor (element), 3
...Surface conductor, 4...Back conductor, 6...Through hole, 11...Dielectric substrate, 12...Resistance, 13
...Surface conductor, 14...Back conductor, 15...Side conductor, 16...Through hole.
Claims (1)
し、この素子を前記基板の裏面に設けた裏面導体
に接続してなる厚膜混成集積回路において、前記
素子の一部を、基板に開設したスルーホールの内
面にまで延長して形成し、かつこのスルーホール
内面において前記裏面導体に接続する構成とした
ことを特徴とする厚膜混成集積回路。 (2) 素子及び裏面電極はペースト印刷時にペー
ストを真空引きしてその一部をスルーホール内に
引き込ませ、この状態で焼成してなる実用新案登
録請求の範囲第１項記載の厚膜混成集積回路。[Claims for Utility Model Registration] (1) A thick film hybrid integrated circuit in which an element such as a resistor is formed on the surface of a dielectric substrate, and this element is connected to a back conductor provided on the back surface of the substrate. 1. A thick film hybrid integrated circuit characterized in that a part of the element is formed to extend to the inner surface of a through hole formed in a substrate, and is connected to the back surface conductor on the inner surface of the through hole. (2) The element and the back electrode are formed by vacuuming the paste during paste printing, drawing a part of it into the through hole, and firing it in this state. circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9915186U JPS636767U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9915186U JPS636767U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636767U true JPS636767U (en) | 1988-01-18 |
Family
ID=30967766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9915186U Pending JPS636767U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636767U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237604A (en) * | 1988-07-26 | 1990-02-07 | Ono Gijutsu Kenkyusho:Kk | Thin type light box |
| JPH0252216U (en) * | 1988-10-06 | 1990-04-16 |
-
1986
- 1986-06-30 JP JP9915186U patent/JPS636767U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237604A (en) * | 1988-07-26 | 1990-02-07 | Ono Gijutsu Kenkyusho:Kk | Thin type light box |
| JPH0252216U (en) * | 1988-10-06 | 1990-04-16 |