WO2012141117A1

WO2012141117A1 - Liquid crystal module, and display device

Info

Publication number: WO2012141117A1
Application number: PCT/JP2012/059633
Authority: WO
Inventors: 弘文大澤; 寛樹河邑; 光正阪口; 浩司北村; 慶一林田; 哲之竹本
Original assignee: シャープ株式会社
Priority date: 2011-04-15
Filing date: 2012-04-09
Publication date: 2012-10-18

Abstract

Provided is a liquid crystal module of which the size can be reduced. A liquid crystal module (100) provided with a liquid crystal panel (10) and a backlight unit (20). The backlight unit (20) is disposed on a wiring board (30) and the wiring board (30) has an elongated section (35) extending further outward than the backlight unit (20). A first connection terminal (31) is disposed on the elongated section (35). An array substrate (10A) has a bulging section (15) bulging further than a color filter substrate (10B), and a second connection terminal (11) is disposed on the bulging section (15). The second connection terminal (11) of the array substrate (10A) and the first connection terminal (31) of the wiring board (30) are coupled to one another by means of a wire bond (50).

Description

Liquid crystal module and display device

The present invention relates to a liquid crystal module and a display device, and more particularly to a liquid crystal module including a liquid crystal panel.
Note that this application claims priority based on Japanese Patent Application No. 2011-90995 filed on April 15, 2011, the entire contents of which are incorporated herein by reference. .

In recent years, display devices (particularly flat panel display devices) such as liquid crystal display devices including liquid crystal modules and organic EL display devices including organic EL elements have become widespread. The liquid crystal module includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight unit arranged on the back side of the liquid crystal panel. FIG. 9 is a perspective view showing a configuration of the liquid crystal module 1000 disclosed in Patent Document 1. As shown in FIG.

The liquid crystal module 1000 shown in FIG. 9 includes a liquid crystal panel 110, a light guide plate 164 disposed on the back surface of the liquid crystal panel 110, and a fluorescent tube 162 that emits light to the light guide plate 164. A panel frame 170 is set on the liquid crystal panel 110 via a cushion rubber 172. Further, flexible printed circuit boards (FPC) 130 and 132 are connected to the liquid crystal panel 110. The common driver board 150 is connected to the FPC 130, while the segment driver board 152 is connected to the FPC 132. The illustrated liquid crystal module 1000 is used in a form in which the

FPCs

130 and 132 are bent so as to wrap around the back surface of the light guide plate 164.

Japanese Utility Model Publication No. 4-135730

FIG. 7 is a cross-sectional view schematically showing the configuration of the liquid crystal module 2000 examined by the present inventors. The liquid crystal module 2000 includes a liquid crystal panel 110 and a backlight unit 120. The liquid crystal panel 110 includes an array substrate 110A including TFT elements and a color filter substrate 110B including color filters. A polarizing plate 112 is attached to the liquid crystal panel 110. The polarizing plate 112 is attached not only to the upper surface of the color filter substrate 110B but also to the lower surface of the array substrate 110A.

The liquid crystal panel 110 is disposed on the backlight unit 120. The backlight unit 120 includes a light source (LED element), a light guide plate, a housing, and the like. A semiconductor element (IC chip) is mounted on a part 115 of the array substrate 110 A of the liquid crystal panel 110. One end of the FPC 130 is connected to a part 115 of the array substrate 110A. The FPC 130 is bent and connected to the back surface of the backlight unit 120. A connector 132 and a chip component (chip resistor, chip capacitor, etc.) 134 are mounted on the FPC 130 located on the back side of the backlight unit 120.

In the liquid crystal module 2000 shown in FIG. 7, the flexible FPC 130 is bent 180 °. Here, since the FPC 130 has a bent configuration, the FPC 130 projects outward from the end surface of the array substrate 110A. Therefore, the region 160 between the FPC 130 and the outermost part is relatively long with reference to the end portion 130e of the FPC 130. Further, in order to ensure connection reliability with a part (terminal portion) 115 of the array substrate 110A, it is necessary to lengthen the bonding length between the array substrate 110A and the FPC 130 to some extent. Furthermore, in the configuration of this example, when the FPC 130 is bent, the bending radius (R) needs to be 0.45 mm at a minimum.

FIG. 8 is a perspective view of the liquid crystal module 2000. In the liquid crystal module 200 shown in FIG. 8, polarizing

plates

112A and 112B are attached to both surfaces of the liquid crystal panel 110, and the protruding portion 115 of the array substrate 110A is a mounting region 115. A semiconductor element 140 is mounted on the mounting region 115 of the array substrate 110A, and a connection portion 130b of the FPC 130 is connected to the outside thereof. The connection portion 130b of the FPC 130 and the terminals provided in the mounting region 115 of the array substrate 110A are connected via an anisotropic conductive film (ACF).

The illustrated FPC 130 includes a main body portion 130a on which the LED element 125 and the chip element 134 are mounted, a connection portion 130b connected to the array substrate 110A, and an extension portion 130c extending from the main body portion 130a. A connector 132 is attached to the tip of the extension 130c.

In the FPC 130, as indicated by an arrow 170, the connection portion 130b is connected to the mounting region 115 and the main body portion 130a is bent. Here, the LED element 125 mounted on the main body 130 a is disposed so as to face the light guide plate included in the backlight unit 120. Further, the extension part 130c of the FPC 130 is pulled out, and the connector 132 is taken out to the outside.

Recently, there is an increasing demand for further downsizing and cost reduction of liquid crystal modules. In this configuration example, it is desirable to change the design of the bent portion (130a) of the FPC 130 in order to further reduce the size of the module outer shape. However, in practice, it is difficult to reduce the overhang of the bent portion (130a) of the FPC 130 due to the relationship of the bending radius (R) of the FPC 130. Further, since the FPC 130 is made of polyimide, it is very expensive. If the cost reduction of the liquid crystal panel 110 is close to the limit, it is desirable to review the cost of the FPC 130. However, since the FPC 130 must use various conditions such as connection reliability and bending reliability, it is actually difficult to reduce the cost of the FPC 130. Furthermore, since the connection between the FPC 130 and the terminal portion of the array substrate 110A can be performed at once by the ACF, it is difficult to abandon the advantage of the ease of the connection process.

Under such circumstances, the inventor of the present application has been diligently studying to realize further downsizing and cost reduction of the liquid crystal module. The present invention has been made in view of such a point, and a main object thereof is to provide a liquid crystal module that can be downsized. Another object of the present invention is to provide a liquid crystal module that can be reduced in size and easily reduced in cost.

A liquid crystal module according to the present invention includes a liquid crystal panel composed of a pair of substrates and a backlight unit that irradiates the liquid crystal panel with irradiation light, and the backlight unit is disposed on a wiring substrate. The wiring board has an extension part extending outward from the backlight unit, the first connection terminals are arranged in the extension part, and the pair of boards is arranged with an array substrate and a collar. The array substrate has a projecting portion projecting from the color filter substrate, and a second connection terminal is disposed at the projecting portion of the array substrate, and the array substrate The second connection terminal in and the first connection terminal in the wiring board are connected to each other by wire bonding.

In a preferred embodiment, the wiring board is a rigid wiring board, and the first connection terminal and the second connection terminal are sealed with a sealing resin.

In a preferred embodiment, a semiconductor chip is disposed in a region between the second connection terminal and an end face of the color filter substrate at the projecting portion of the array substrate, and the first of the wiring substrates is the first of the wiring substrates. A chip component is mounted on the surface opposite to the surface on which one connection terminal is arranged.

In a preferred embodiment, the backlight unit includes an LED element and a light guide plate, and the LED element is mounted on the wiring board.

In a preferred embodiment, a connector is mounted on the surface of the wiring board opposite to the surface on which the first connection terminals are arranged.

In a preferred embodiment, a chip component is mounted on the same surface of the wiring board as the surface on which the first connection terminals are arranged.

In a preferred embodiment, a touch panel is disposed on the liquid crystal panel, and the touch panel and the wiring board are connected by a second wire bond.

The display device according to the present invention is a display device including a display element for displaying an image, and the display element is disposed on a wiring board, and the wiring board extends outward from the display element. A first connection terminal is disposed at the extension portion, a second connection terminal is disposed at an end portion of the display element, and an end portion of the display element. The second connection terminal in and the first connection terminal in the wiring board are connected to each other by wire bonding.

In a preferred embodiment, the display element is an organic EL element.

In a preferred embodiment, a touch panel is disposed on the display element, and the touch panel and the wiring board are connected by a second wire bond.

According to the liquid crystal module of the present invention, the liquid crystal panel and the backlight unit disposed on the wiring board, the second connection terminal of the array board constituting the liquid crystal panel, the first connection terminal of the wiring board, Are connected to each other by wire bonds. Therefore, it is easy to realize downsizing as compared with a structure in which the flexible substrate is bent to ensure electrical connection of the array substrate. Further, when the wiring board is a rigid wiring board, it is easy to reduce the cost as compared with a structure using a flexible board.

It is sectional drawing which shows typically the structure of the liquid crystal module 100 which concerns on embodiment of this invention. (A) is a top view of the liquid crystal module 100, and (b) is a partially enlarged view of the periphery of the connection terminals 11 of the array substrate 10A. 2 is a perspective view illustrating a configuration of a liquid crystal module 100. FIG. FIG. 2A is an exploded perspective view showing the configuration of the liquid crystal module 100, and FIG. 2B is a perspective view showing the configuration of the liquid crystal module 100. It is sectional drawing which shows the example of a modification of the liquid crystal module 100 typically. It is sectional drawing which shows the example of a modification of the liquid crystal module 100 typically. It is sectional drawing which shows the structure of the liquid crystal module 2000 of a comparative example. It is a perspective view which shows the structure of the liquid crystal module 2000 of a comparative example. It is a disassembled perspective view which shows the structure of the conventional liquid crystal module 1000. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.

FIG. 1 is a cross-sectional view schematically showing a configuration of a liquid crystal module 100 according to an embodiment of the present invention. The liquid crystal module 100 according to the present embodiment is a device capable of displaying an image, and includes a liquid crystal panel 10 composed of a pair of substrates (10A, 10B) and a backlight unit 20 that irradiates the liquid crystal panel 10 with irradiation light. It is configured. The liquid crystal panel 10 of the present embodiment has a size of 1 to 20 inches, for example.

The liquid crystal panel 10 of this embodiment generally has a rectangular shape as a whole, and is composed of a pair of translucent substrates (glass substrates) 10A and 10B. Both substrates (10A, 10B) are arranged to face each other, and a liquid crystal layer (not shown) is provided between them. The liquid crystal layer is made of a liquid crystal material whose optical characteristics change with application of an electric field between the

substrates

10A and 10B. A sealing agent (not shown) is provided on the outer edge portions of the

substrates

10A and 10B to seal the liquid crystal layer.

In the present embodiment, of the

substrates

10A and 10B, the back side is the array substrate (TFT substrate) 10A, while the front side is the color filter substrate (CF substrate) 10B. A plurality of switching elements (TFT elements) are formed on the array substrate 10A. Color filter layers (for example, red, green, and blue color layers) are formed on the color filter substrate 10B. A polarizing plate 12 is attached to the outer surfaces of both the

substrates

10A and 10B. In FIG. 1, the polarizing plate 12 attached to the outer surface of the CF substrate 10B is shown, and the polarizing plate attached to the outer surface of the array substrate 10A is omitted.

The backlight unit 20 of the present embodiment is disposed on the wiring board 30. The backlight unit 20 in this example includes a light source (for example, an LED element) and a light guide plate that propagates light emitted from the light source. The light source and the light guide plate are housed in a metal bezel that is a casing of the backlight unit 20. The wiring board 30 has an extension part 35 extending outward from the backlight unit 20, and the first connection terminal 31 is disposed in the extension part 35. The wiring board 30 of this embodiment is a rigid wiring board, for example, a glass epoxy printed board.

In the configuration of this embodiment, the array substrate 10A has an overhanging portion 15 that overhangs the color filter substrate 10B. The second connection terminal 11 is disposed on the projecting portion 15. In the configuration of the present embodiment, the second connection terminals 11 of the array substrate 10 A and the first connection terminals 31 of the wiring substrate 30 are connected to each other by wire bonding using wires 50. The second connection terminal 11, the first connection terminal 31 and the wire 50 are sealed with a sealing resin 55.

A semiconductor chip (for example, driver IC) 40 is mounted on the projecting portion 15 of the array substrate 10A. In the illustrated example, the semiconductor chip 40 is disposed in a region between the end face 13 of the color filter substrate 10 B and the second connection terminal 11. A chip component 34 is mounted on a surface (lower surface) 30 b opposite to the surface (upper surface) 30 a on which the first connection terminals 31 are arranged in the wiring substrate 30. The chip component 34 is, for example, a chip capacitor, a chip resistor, a chip inductor, or the like.

Furthermore, a connector 32 is disposed on the lower surface 30 b of the wiring board 30. The connector 32 is a member that electrically connects the wiring board 30 and another member. Note that it may not be provided depending on the specifications of the liquid crystal module 100. When the chip component 34 and the connector 32 are provided on the lower surface 30b of the wiring board 30, the wiring board 30 is a double-sided printed board, and the lower surface 30b of the wiring board 30 has a mounting area where the chip component 34 and the like can be mounted. Is provided.

FIG. 2A shows a view of the liquid crystal module 100 as viewed from above, and FIG. 2B shows an enlarged view of the periphery of the protruding portion 15 of the array substrate 10A.

As shown in FIG. 2A, a polarizing plate 12 is disposed on the upper surface of the CF substrate 10B of the liquid crystal panel 10. The second connection terminals 11 are arranged on the projecting portion 15 of the array substrate 10A. In addition, the first connection terminals 31 are arranged in the extended portion 35 of the wiring board 30. A semiconductor chip (driver IC) 40 is disposed in a part of the overhanging portion 15.

2B, the second connection terminal 11 of the array substrate 10A and the first connection terminal 31 of the wiring substrate 30 are wire-bonded by wires 50 and are electrically connected to each other. The wire 50 is a thin wire made of, for example, gold, and the wire diameter (diameter) is, for example, 0.02 μm. The wire bond region 57 including the first connection terminal 31 and the second connection terminal 11 is sealed with a sealing resin 55. The sealing resin 55 protects the connection of both connection terminals (31, 11).

In the liquid crystal module 100 of the present embodiment, the second connection terminals 11 arranged on the array substrate 10A constituting the liquid crystal panel 10 and the first connection terminals 31 of the wiring board 30 are connected to each other by wire bonds 50. Therefore, as compared with the liquid crystal module 2000 shown in FIG. 7, the liquid crystal module 100 of the present embodiment can easily be downsized.

That is, in the configuration shown in FIG. 7, the flexible connection (FPC) 130 is bent to ensure the electrical connection of the array substrate 110A, so that the size of the region 160 becomes relatively large. In addition, since the limit of the bending radius of the FPC 130 is determined, it is technically difficult to reduce the size of the region 160. On the other hand, as shown in FIG. 1, in the configuration of the present embodiment, the electrical connection of the array substrate 10 A is ensured by the wire bond 50, so that the size of the region 60 can be made relatively small. Here, the region 60 means a range (distance) between one end (55e) of the sealing resin 55 and the end surface 30e of the wiring board 30.

Further, in the configuration shown in FIG. 7, in order to ensure connection reliability with a part (terminal portion) 115 of the array substrate 110A, it is necessary to lengthen the bonding length between the array substrate 110A and the FPC 130 to some extent. Accordingly, the external shape of the liquid crystal module 2000 must be relatively large.

On the other hand, in the liquid crystal module 100 of this embodiment, since the connection is secured by wire bonding using the wire 50 having a wire diameter of 0.02 μm, the distance of the overhanging portion 15 is compared with the configuration shown in FIG. Can be reduced. Specifically, the region outside the region where the semiconductor chip 40 is mounted in the overhanging portion 15 can be reduced. That is, a space in which the second connection terminal 11 can be disposed may be ensured in a region outside the semiconductor chip 40 in the projecting portion 15. As a result, in the liquid crystal module 100 of this embodiment, it is easy to reduce the size of the module as compared with the liquid crystal module 2000 shown in FIG.

Furthermore, in the configuration shown in FIG. 7, there is a possibility that the thinning of the liquid crystal module 2000 may be restricted due to the bending of the FPC 130. That is, in the case of the thinner liquid crystal module 2000, the degree of bending of the FPC 130 becomes smaller than the bending radius, and there is a possibility that the FPC 130 cannot be bent. On the other hand, unlike the configuration shown in FIG. 7, the liquid crystal module 100 of the present embodiment does not have a structure in which the FPC 130 is bent. Therefore, even if a thinner liquid crystal module 100 is designed, such a problem can be avoided. . Specifically, even if the backlight unit 20 is further reduced in thickness, the electrical connection between the connection terminals (11, 31) can be secured by wire bonding using the wires 50.

Further, in the liquid crystal module 2000 shown in FIG. 7, since the FPC 130 manufactured from an expensive material such as polyimide is used, the component cost is high. In particular, the cost of the high-performance FPC 130 with a small bending radius is high, and therefore the cost of the liquid crystal module 2000 is high. On the other hand, in the liquid crystal module 100 of the present embodiment, a very inexpensive wiring board (for example, a glass epoxy printed board) 30 can be used, so that the cost can be reduced as compared with the liquid crystal module 2000 including the FPC 130. Becomes easy. In addition, in the configuration shown in FIG. 1, even when the wiring board 30 is not a rigid wiring board but a flexible wiring board, an inexpensive flexible wiring board can be used. That is, in the configuration shown in FIG. 1, it is not necessary to bend the flexible wiring board, so avoid using an expensive one that can be used even if the bending radius is small, and use an inexpensive one. Is possible.

Next, the liquid crystal module 100 of this embodiment will be further described with reference to FIGS. FIG. 3 is a perspective view showing configurations of the wiring board 30 and the liquid crystal module 100. FIG. 4A is an exploded perspective view of the liquid crystal module 100, and FIG. 4B is a perspective view of the liquid crystal module 100.

As shown in FIG. 3, an LED element (point light source) 25 is mounted on the wiring board 30 of this example. The LED elements 25 are arranged on the upper surface 30 a of the wiring board 30. An electronic component (chip component) 34 is mounted on the lower surface 30 b of the wiring board 30. A connector 32 is mounted on the lower surface 30 b of the wiring board 30. A flexible wiring board (for example, single-sided FPC) 33 extends from the connector 32. The connection between the flexible wiring board 33 and the wiring board 30 is not limited to the connector 32, and a technique such as solder connection or ACF connection may be employed.

In the structure shown in FIG. 3, the lower part of the casing unit 21 of the backlight unit 20 is open, and the lower part of the casing unit 21 is configured to be closed by the wiring board 30. Specifically, as indicated by an arrow 70, when the lower surface of the housing part 21 is closed with the wiring board 30, the LED elements 25 mounted on the wiring board 30 are accommodated in the housing part 21. . After the wiring board 30 is set in the housing portion 21, the first connection terminals 31 of the wiring board 30 and the second connection terminals 11 of the array substrate 10 A are wire-bonded with the wires 50. Next, when the wire-bonded region is sealed with the sealing resin 55, the liquid crystal module 100 of the present embodiment is obtained.

More specifically, the liquid crystal module 100 of the present embodiment has a structure as shown in FIG. As shown in FIG. 4A, the liquid crystal panel 10 is composed of a pair of substrates (10A, 10B), and polarizing plates (12A, 12B) are attached to the outer surfaces thereof. A semiconductor chip 40 is mounted on the projecting portion 15 of the array substrate 10A.

Between the liquid crystal panel 10 and the wiring board 30, an optical sheet 22, a light guide plate 23, and a casing unit 21 are disposed. The optical sheet 22 is, for example, a lens sheet, a prism sheet, or a diffusion plate. The light guide plate 23 has a surface facing the LED element 25, and the surface serves as a light incident surface. The housing part 21 is a metal bezel. In this example, the housing part 21 is mounted on the wiring board 30 by soldering. An optical sheet 22 and a light guide plate 23 positioned below the liquid crystal panel 10 are set at the center of the casing 21. A reflective sheet 27 may be inserted between the light guide plate 23 and the wiring board 30 (see arrow 72).

The wiring board 30 of the present embodiment serves as a back bezel that closes the bottom surface of the housing portion 21, and the liquid crystal panel 10, the optical sheet 22, the light guide plate 23, and the housing portion 21 are the top surface of the wiring substrate 30 as indicated by an arrow 71. Set to Thereafter, as shown in FIG. 4B, the first connection terminal 31 of the wiring substrate 30 and the second connection terminal 11 of the array substrate 10A are wire-bonded with the wire 50, and then the wire-bonded region is sealed. Sealed with resin 55. Then, the liquid crystal module 100 of this embodiment is completed.

In addition, since the connection of the 1st connection terminal 31 and the 2nd connection terminal 11 in the structure of this embodiment is performed by wire bonding, it is suitable for automation. On the other hand, in the configuration shown in FIG. 7, since it is an FPC that is thin and flexible and difficult to handle, the connection by FPC is not suitable for automation as compared with the connection of the rigid wiring board (30). Since it is easier to reduce the manufacturing cost if it is suitable for automation, the liquid crystal module 100 of this embodiment also has technical significance in this respect.

Next, a modified example of the liquid crystal module 100 of the present embodiment will be described with reference to FIGS. 5 and 6 are cross-sectional views schematically showing a configuration of a modification example of the liquid crystal module 100. FIG.

In the liquid crystal module 100 shown in FIG. 5, in addition to the chip component 34 being mounted on the lower surface 30b of the wiring substrate 30, the chip component 36 is also mounted on the upper surface 30a of the wiring substrate 30. Specifically, in the upper surface 30a of the wiring board 30, the area other than the area where the backlight unit 20 and the sealing resin 55 are arranged is used as a mounting area for electronic components (for example, chip components, semiconductor chips, etc.). Can do. Therefore, the chip component 36 can be disposed on the upper surface 30 a of the wiring board 30.

In the liquid crystal module 100 shown in FIG. 6, the touch panel 16 is placed on the liquid crystal panel 10. In the configuration shown in FIG. 6, the touch panel 16 and a further connection terminal (31 B) of the wiring board 30 are wire-bonded with a wire 50 B. Further, the second connection terminal 11 of the array substrate 10A and the first connection terminal 31A of the wiring substrate 30 are wire-bonded by a wire 50A. Even when a touch panel function is added to the liquid crystal panel 10, electrical connection can be performed using the method of the present embodiment. Therefore, the method of the present embodiment also has technical value.

Furthermore, in the above-described embodiment, the liquid crystal module 100 including the liquid crystal panel 10 has been described. However, the technology of the present embodiment can be widely applied to display devices including a display element. As an example, an organic EL element can be used in place of the liquid crystal panel 10 as a display element for displaying an image. A light emitting device (organic EL device) using organic EL (Organic electroluminescence) constitutes a light emitting diode (LED) whose light emitting layer is made of an organic compound, and recombines electrons and holes injected into the organic compound. It emits light by excitons generated by. Since the organic EL element is a self-luminous light emitting element, a backlight is not necessary. Therefore, when an organic EL element is used as a display element for displaying an image, the backlight unit 20 does not have to be used in the configuration shown in FIGS.

In the display device of the present invention, when an organic EL element is used as a display element, the following configuration is obtained. Referring to FIG. 1, the liquid crystal panel 10 composed of a pair of glass substrates 10 A and 10 B becomes an organic EL element (display element 10), and the organic EL element (10) is disposed on the wiring substrate 30. Is done. Note that the backlight unit 20 may not be provided. The wiring board 30 has an extension part 35 extending outward from the organic EL element (10), and the first connection terminal 31 is disposed in the extension part 35. The second connection terminal 11 is disposed at the end 15 of the organic EL element (10). And the 2nd connection terminal 11 in the edge part 15 of the organic EL element (10) and the 1st connection terminal 31 in the wiring board 30 are mutually connected by the wire bond 50. FIG.

In this example as well, an inexpensive rigid wiring board can be used for the wiring board 30. As described above, even if a flexible substrate is used as the wiring substrate 30, the cost can be reduced. The first connection terminal 31 and the second connection terminal 11 are sealed with a sealing resin 55.

Furthermore, various modifications as described above can be performed in a display device including other display elements such as organic EL elements. For example, as shown in FIG. 6, a touch panel 16 can be disposed on the display element (for example, organic EL element) 10. The touch panel 16 and the wiring substrate 30 are connected by a second wire bond 50B. Further, the lower surface 30b of the wiring board 30 and / or the upper surface 30a of the wiring board can be used as a mounting region for electronic components (for example, chip components, semiconductor chips, etc.).

As mentioned above, although this invention has been demonstrated by suitable embodiment, such description is not a limitation matter and, of course, various modifications are possible.

According to the present invention, it is possible to provide a display device that can be reduced in size and / or reduced in cost.

10 liquid crystal panel 10A array substrate 10B color filter substrate 11 connection terminal (second connection terminal)
DESCRIPTION OF SYMBOLS 12 Polarizing plate 15 Overhang | projection part 16 Touch panel 20 Backlight unit 21 Case part 22 Optical sheet 23 Light guide plate 25 LED element (light source)
27 Reflective sheet 30 Wiring board 31 Connection terminal (first connection terminal)
32 Connector 33 Flexible wiring board 34 Chip part 35 Extension part 36 Chip part 40 Semiconductor chip 50 Wire (wire bond)
55 Sealing resin 57 Wire bond region 100 Liquid crystal module 1000 Liquid crystal module 2000 Liquid crystal module

Claims

A liquid crystal panel composed of a pair of substrates;
A backlight unit for irradiating the liquid crystal panel with irradiation light,
The backlight unit is disposed on a wiring board,
The wiring board has an extended portion extending outward from the backlight unit,
A first connection terminal is disposed in the extension part,
The pair of substrates includes an array substrate and a color filter substrate,
The array substrate has a protruding portion protruding from the color filter substrate,
A second connection terminal is disposed at the projecting portion of the array substrate,
The liquid crystal module, wherein the second connection terminal on the array substrate and the first connection terminal on the wiring substrate are connected to each other by wire bonding.
The wiring board is a rigid wiring board,
The liquid crystal module according to claim 1, wherein the first connection terminal and the second connection terminal are sealed with a sealing resin.
In the projecting portion of the array substrate, a semiconductor chip is disposed in a region between the second connection terminal and an end surface of the color filter substrate,
3. The liquid crystal module according to claim 1, wherein a chip component is mounted on a surface of the wiring board opposite to a surface on which the first connection terminals are disposed.
The backlight unit includes an LED element and a light guide plate,
The liquid crystal module according to claim 1, wherein the LED element is mounted on the wiring board.
3. The liquid crystal module according to claim 1, wherein a connector is mounted on a surface of the wiring board opposite to the surface on which the first connection terminals are arranged.
6. The liquid crystal module according to claim 1, wherein a chip component is mounted on the same surface of the wiring substrate as the surface on which the first connection terminals are arranged.
A touch panel is disposed on the liquid crystal panel,
The liquid crystal module according to claim 1, wherein the touch panel and the wiring board are connected by a second wire bond.
A display device including a display element for displaying an image,
The display element is disposed on a wiring board,
The wiring board has an extended portion extending outward from the display element,
A first connection terminal is disposed in the extension part,
A second connection terminal is disposed at an end of the display element,
The display device, wherein the second connection terminal at the end of the display element and the first connection terminal in the wiring substrate are connected to each other by wire bonding.
The wiring board is a rigid wiring board,
The display device according to claim 8, wherein the first connection terminal and the second connection terminal are sealed with a sealing resin.
The display device according to claim 8 or 9, wherein the display element is an organic EL element.
A touch panel is disposed on the display element,
The display device according to claim 8, wherein the touch panel and the wiring substrate are connected by a second wire bond.