WO2012141117A1 - Module à cristaux liquides et dispositif d'affichage - Google Patents

Module à cristaux liquides et dispositif d'affichage Download PDF

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Publication number
WO2012141117A1
WO2012141117A1 PCT/JP2012/059633 JP2012059633W WO2012141117A1 WO 2012141117 A1 WO2012141117 A1 WO 2012141117A1 JP 2012059633 W JP2012059633 W JP 2012059633W WO 2012141117 A1 WO2012141117 A1 WO 2012141117A1
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WO
WIPO (PCT)
Prior art keywords
liquid crystal
wiring board
connection terminal
crystal module
disposed
Prior art date
Application number
PCT/JP2012/059633
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English (en)
Japanese (ja)
Inventor
弘文 大澤
寛樹 河邑
光正 阪口
浩司 北村
慶一 林田
哲之 竹本
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012141117A1 publication Critical patent/WO2012141117A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Definitions

  • the present invention relates to a liquid crystal module and a display device, and more particularly to a liquid crystal module including a liquid crystal panel. Note that this application claims priority based on Japanese Patent Application No. 2011-90995 filed on April 15, 2011, the entire contents of which are incorporated herein by reference. .
  • the liquid crystal module includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight unit arranged on the back side of the liquid crystal panel.
  • FIG. 9 is a perspective view showing a configuration of the liquid crystal module 1000 disclosed in Patent Document 1. As shown in FIG.
  • the liquid crystal module 1000 shown in FIG. 9 includes a liquid crystal panel 110, a light guide plate 164 disposed on the back surface of the liquid crystal panel 110, and a fluorescent tube 162 that emits light to the light guide plate 164.
  • a panel frame 170 is set on the liquid crystal panel 110 via a cushion rubber 172.
  • flexible printed circuit boards (FPC) 130 and 132 are connected to the liquid crystal panel 110.
  • the common driver board 150 is connected to the FPC 130, while the segment driver board 152 is connected to the FPC 132.
  • the illustrated liquid crystal module 1000 is used in a form in which the FPCs 130 and 132 are bent so as to wrap around the back surface of the light guide plate 164.
  • FIG. 7 is a cross-sectional view schematically showing the configuration of the liquid crystal module 2000 examined by the present inventors.
  • the liquid crystal module 2000 includes a liquid crystal panel 110 and a backlight unit 120.
  • the liquid crystal panel 110 includes an array substrate 110A including TFT elements and a color filter substrate 110B including color filters.
  • a polarizing plate 112 is attached to the liquid crystal panel 110.
  • the polarizing plate 112 is attached not only to the upper surface of the color filter substrate 110B but also to the lower surface of the array substrate 110A.
  • the liquid crystal panel 110 is disposed on the backlight unit 120.
  • the backlight unit 120 includes a light source (LED element), a light guide plate, a housing, and the like.
  • a semiconductor element (IC chip) is mounted on a part 115 of the array substrate 110 ⁇ / b> A of the liquid crystal panel 110.
  • One end of the FPC 130 is connected to a part 115 of the array substrate 110A.
  • the FPC 130 is bent and connected to the back surface of the backlight unit 120.
  • a connector 132 and a chip component (chip resistor, chip capacitor, etc.) 134 are mounted on the FPC 130 located on the back side of the backlight unit 120.
  • the flexible FPC 130 is bent 180 °.
  • the FPC 130 since the FPC 130 has a bent configuration, the FPC 130 projects outward from the end surface of the array substrate 110A. Therefore, the region 160 between the FPC 130 and the outermost part is relatively long with reference to the end portion 130e of the FPC 130. Further, in order to ensure connection reliability with a part (terminal portion) 115 of the array substrate 110A, it is necessary to lengthen the bonding length between the array substrate 110A and the FPC 130 to some extent. Furthermore, in the configuration of this example, when the FPC 130 is bent, the bending radius (R) needs to be 0.45 mm at a minimum.
  • FIG. 8 is a perspective view of the liquid crystal module 2000.
  • polarizing plates 112A and 112B are attached to both surfaces of the liquid crystal panel 110, and the protruding portion 115 of the array substrate 110A is a mounting region 115.
  • a semiconductor element 140 is mounted on the mounting region 115 of the array substrate 110A, and a connection portion 130b of the FPC 130 is connected to the outside thereof.
  • the connection portion 130b of the FPC 130 and the terminals provided in the mounting region 115 of the array substrate 110A are connected via an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the illustrated FPC 130 includes a main body portion 130a on which the LED element 125 and the chip element 134 are mounted, a connection portion 130b connected to the array substrate 110A, and an extension portion 130c extending from the main body portion 130a.
  • a connector 132 is attached to the tip of the extension 130c.
  • connection portion 130b is connected to the mounting region 115 and the main body portion 130a is bent.
  • the LED element 125 mounted on the main body 130 a is disposed so as to face the light guide plate included in the backlight unit 120.
  • the extension part 130c of the FPC 130 is pulled out, and the connector 132 is taken out to the outside.
  • the present invention has been made in view of such a point, and a main object thereof is to provide a liquid crystal module that can be downsized. Another object of the present invention is to provide a liquid crystal module that can be reduced in size and easily reduced in cost.
  • a liquid crystal module includes a liquid crystal panel composed of a pair of substrates and a backlight unit that irradiates the liquid crystal panel with irradiation light, and the backlight unit is disposed on a wiring substrate.
  • the wiring board has an extension part extending outward from the backlight unit, the first connection terminals are arranged in the extension part, and the pair of boards is arranged with an array substrate and a collar.
  • the array substrate has a projecting portion projecting from the color filter substrate, and a second connection terminal is disposed at the projecting portion of the array substrate, and the array substrate The second connection terminal in and the first connection terminal in the wiring board are connected to each other by wire bonding.
  • the wiring board is a rigid wiring board, and the first connection terminal and the second connection terminal are sealed with a sealing resin.
  • a semiconductor chip is disposed in a region between the second connection terminal and an end face of the color filter substrate at the projecting portion of the array substrate, and the first of the wiring substrates is the first of the wiring substrates.
  • a chip component is mounted on the surface opposite to the surface on which one connection terminal is arranged.
  • the backlight unit includes an LED element and a light guide plate, and the LED element is mounted on the wiring board.
  • a connector is mounted on the surface of the wiring board opposite to the surface on which the first connection terminals are arranged.
  • a chip component is mounted on the same surface of the wiring board as the surface on which the first connection terminals are arranged.
  • a touch panel is disposed on the liquid crystal panel, and the touch panel and the wiring board are connected by a second wire bond.
  • the display device is a display device including a display element for displaying an image, and the display element is disposed on a wiring board, and the wiring board extends outward from the display element.
  • a first connection terminal is disposed at the extension portion, a second connection terminal is disposed at an end portion of the display element, and an end portion of the display element.
  • the second connection terminal in and the first connection terminal in the wiring board are connected to each other by wire bonding.
  • the wiring board is a rigid wiring board, and the first connection terminal and the second connection terminal are sealed with a sealing resin.
  • the display element is an organic EL element.
  • a touch panel is disposed on the display element, and the touch panel and the wiring board are connected by a second wire bond.
  • the liquid crystal panel and the backlight unit disposed on the wiring board, the second connection terminal of the array board constituting the liquid crystal panel, the first connection terminal of the wiring board, are connected to each other by wire bonds. Therefore, it is easy to realize downsizing as compared with a structure in which the flexible substrate is bent to ensure electrical connection of the array substrate. Further, when the wiring board is a rigid wiring board, it is easy to reduce the cost as compared with a structure using a flexible board.
  • FIG. 1 is a top view of the liquid crystal module 100
  • FIG. 2A is an exploded perspective view showing the configuration of the liquid crystal module 100
  • FIG. 2B is a perspective view showing the configuration of the liquid crystal module 100.
  • FIG. 2000 It is sectional drawing which shows the structure of the liquid crystal module 2000 of a comparative example. It is a perspective view which shows the structure of the liquid crystal module 2000 of a comparative example. It is a disassembled perspective view which shows the structure of the conventional liquid crystal module 1000.
  • FIG. 1 It is sectional drawing which shows the structure of the liquid crystal module 2000 of a comparative example. It is a perspective view which shows the structure of the liquid crystal module 2000 of a comparative example. It is a disassembled perspective view which shows the structure of the conventional liquid crystal module 1000.
  • FIG. 1 is a cross-sectional view schematically showing a configuration of a liquid crystal module 100 according to an embodiment of the present invention.
  • the liquid crystal module 100 according to the present embodiment is a device capable of displaying an image, and includes a liquid crystal panel 10 composed of a pair of substrates (10A, 10B) and a backlight unit 20 that irradiates the liquid crystal panel 10 with irradiation light. It is configured.
  • the liquid crystal panel 10 of the present embodiment has a size of 1 to 20 inches, for example.
  • the liquid crystal panel 10 of this embodiment generally has a rectangular shape as a whole, and is composed of a pair of translucent substrates (glass substrates) 10A and 10B. Both substrates (10A, 10B) are arranged to face each other, and a liquid crystal layer (not shown) is provided between them.
  • the liquid crystal layer is made of a liquid crystal material whose optical characteristics change with application of an electric field between the substrates 10A and 10B.
  • a sealing agent (not shown) is provided on the outer edge portions of the substrates 10A and 10B to seal the liquid crystal layer.
  • the back side is the array substrate (TFT substrate) 10A
  • the front side is the color filter substrate (CF substrate) 10B
  • a plurality of switching elements (TFT elements) are formed on the array substrate 10A.
  • Color filter layers (for example, red, green, and blue color layers) are formed on the color filter substrate 10B.
  • a polarizing plate 12 is attached to the outer surfaces of both the substrates 10A and 10B. In FIG. 1, the polarizing plate 12 attached to the outer surface of the CF substrate 10B is shown, and the polarizing plate attached to the outer surface of the array substrate 10A is omitted.
  • the backlight unit 20 of the present embodiment is disposed on the wiring board 30.
  • the backlight unit 20 in this example includes a light source (for example, an LED element) and a light guide plate that propagates light emitted from the light source.
  • the light source and the light guide plate are housed in a metal bezel that is a casing of the backlight unit 20.
  • the wiring board 30 has an extension part 35 extending outward from the backlight unit 20, and the first connection terminal 31 is disposed in the extension part 35.
  • the wiring board 30 of this embodiment is a rigid wiring board, for example, a glass epoxy printed board.
  • the array substrate 10A has an overhanging portion 15 that overhangs the color filter substrate 10B.
  • the second connection terminal 11 is disposed on the projecting portion 15.
  • the second connection terminals 11 of the array substrate 10 ⁇ / b> A and the first connection terminals 31 of the wiring substrate 30 are connected to each other by wire bonding using wires 50.
  • the second connection terminal 11, the first connection terminal 31 and the wire 50 are sealed with a sealing resin 55.
  • a semiconductor chip (for example, driver IC) 40 is mounted on the projecting portion 15 of the array substrate 10A.
  • the semiconductor chip 40 is disposed in a region between the end face 13 of the color filter substrate 10 ⁇ / b> B and the second connection terminal 11.
  • a chip component 34 is mounted on a surface (lower surface) 30 b opposite to the surface (upper surface) 30 a on which the first connection terminals 31 are arranged in the wiring substrate 30.
  • the chip component 34 is, for example, a chip capacitor, a chip resistor, a chip inductor, or the like.
  • a connector 32 is disposed on the lower surface 30 b of the wiring board 30.
  • the connector 32 is a member that electrically connects the wiring board 30 and another member. Note that it may not be provided depending on the specifications of the liquid crystal module 100.
  • the wiring board 30 is a double-sided printed board, and the lower surface 30b of the wiring board 30 has a mounting area where the chip component 34 and the like can be mounted. Is provided.
  • FIG. 2A shows a view of the liquid crystal module 100 as viewed from above
  • FIG. 2B shows an enlarged view of the periphery of the protruding portion 15 of the array substrate 10A.
  • a polarizing plate 12 is disposed on the upper surface of the CF substrate 10B of the liquid crystal panel 10.
  • the second connection terminals 11 are arranged on the projecting portion 15 of the array substrate 10A.
  • the first connection terminals 31 are arranged in the extended portion 35 of the wiring board 30.
  • a semiconductor chip (driver IC) 40 is disposed in a part of the overhanging portion 15.
  • connection terminal 11 of the array substrate 10A and the first connection terminal 31 of the wiring substrate 30 are wire-bonded by wires 50 and are electrically connected to each other.
  • the wire 50 is a thin wire made of, for example, gold, and the wire diameter (diameter) is, for example, 0.02 ⁇ m.
  • the wire bond region 57 including the first connection terminal 31 and the second connection terminal 11 is sealed with a sealing resin 55.
  • the sealing resin 55 protects the connection of both connection terminals (31, 11).
  • the second connection terminals 11 arranged on the array substrate 10A constituting the liquid crystal panel 10 and the first connection terminals 31 of the wiring board 30 are connected to each other by wire bonds 50. Therefore, as compared with the liquid crystal module 2000 shown in FIG. 7, the liquid crystal module 100 of the present embodiment can easily be downsized.
  • the flexible connection (FPC) 130 is bent to ensure the electrical connection of the array substrate 110A, so that the size of the region 160 becomes relatively large.
  • the limit of the bending radius of the FPC 130 is determined, it is technically difficult to reduce the size of the region 160.
  • the electrical connection of the array substrate 10 ⁇ / b> A is ensured by the wire bond 50, so that the size of the region 60 can be made relatively small.
  • the region 60 means a range (distance) between one end (55e) of the sealing resin 55 and the end surface 30e of the wiring board 30.
  • the distance of the overhanging portion 15 is compared with the configuration shown in FIG. Can be reduced. Specifically, the region outside the region where the semiconductor chip 40 is mounted in the overhanging portion 15 can be reduced. That is, a space in which the second connection terminal 11 can be disposed may be ensured in a region outside the semiconductor chip 40 in the projecting portion 15. As a result, in the liquid crystal module 100 of this embodiment, it is easy to reduce the size of the module as compared with the liquid crystal module 2000 shown in FIG.
  • the liquid crystal module 100 of the present embodiment does not have a structure in which the FPC 130 is bent. Therefore, even if a thinner liquid crystal module 100 is designed, such a problem can be avoided. . Specifically, even if the backlight unit 20 is further reduced in thickness, the electrical connection between the connection terminals (11, 31) can be secured by wire bonding using the wires 50.
  • the component cost is high.
  • the cost of the high-performance FPC 130 with a small bending radius is high, and therefore the cost of the liquid crystal module 2000 is high.
  • a very inexpensive wiring board for example, a glass epoxy printed board 30 can be used, so that the cost can be reduced as compared with the liquid crystal module 2000 including the FPC 130.
  • an inexpensive flexible wiring board can be used. That is, in the configuration shown in FIG. 1, it is not necessary to bend the flexible wiring board, so avoid using an expensive one that can be used even if the bending radius is small, and use an inexpensive one. Is possible.
  • FIG. 3 is a perspective view showing configurations of the wiring board 30 and the liquid crystal module 100.
  • FIG. 4A is an exploded perspective view of the liquid crystal module 100
  • FIG. 4B is a perspective view of the liquid crystal module 100.
  • an LED element (point light source) 25 is mounted on the wiring board 30 of this example.
  • the LED elements 25 are arranged on the upper surface 30 a of the wiring board 30.
  • An electronic component (chip component) 34 is mounted on the lower surface 30 b of the wiring board 30.
  • a connector 32 is mounted on the lower surface 30 b of the wiring board 30.
  • a flexible wiring board (for example, single-sided FPC) 33 extends from the connector 32.
  • the connection between the flexible wiring board 33 and the wiring board 30 is not limited to the connector 32, and a technique such as solder connection or ACF connection may be employed.
  • the lower part of the casing unit 21 of the backlight unit 20 is open, and the lower part of the casing unit 21 is configured to be closed by the wiring board 30.
  • the LED elements 25 mounted on the wiring board 30 are accommodated in the housing part 21.
  • the wiring board 30 is set in the housing portion 21, the first connection terminals 31 of the wiring board 30 and the second connection terminals 11 of the array substrate 10 ⁇ / b> A are wire-bonded with the wires 50.
  • the liquid crystal module 100 of the present embodiment is obtained.
  • the liquid crystal module 100 of the present embodiment has a structure as shown in FIG.
  • the liquid crystal panel 10 is composed of a pair of substrates (10A, 10B), and polarizing plates (12A, 12B) are attached to the outer surfaces thereof.
  • a semiconductor chip 40 is mounted on the projecting portion 15 of the array substrate 10A.
  • the optical sheet 22 is, for example, a lens sheet, a prism sheet, or a diffusion plate.
  • the light guide plate 23 has a surface facing the LED element 25, and the surface serves as a light incident surface.
  • the housing part 21 is a metal bezel. In this example, the housing part 21 is mounted on the wiring board 30 by soldering.
  • An optical sheet 22 and a light guide plate 23 positioned below the liquid crystal panel 10 are set at the center of the casing 21.
  • a reflective sheet 27 may be inserted between the light guide plate 23 and the wiring board 30 (see arrow 72).
  • the wiring board 30 of the present embodiment serves as a back bezel that closes the bottom surface of the housing portion 21, and the liquid crystal panel 10, the optical sheet 22, the light guide plate 23, and the housing portion 21 are the top surface of the wiring substrate 30 as indicated by an arrow 71.
  • the first connection terminal 31 of the wiring substrate 30 and the second connection terminal 11 of the array substrate 10A are wire-bonded with the wire 50, and then the wire-bonded region is sealed. Sealed with resin 55.
  • the liquid crystal module 100 of this embodiment is completed.
  • connection of the 1st connection terminal 31 and the 2nd connection terminal 11 in the structure of this embodiment is performed by wire bonding, it is suitable for automation.
  • the connection by FPC is not suitable for automation as compared with the connection of the rigid wiring board (30). Since it is easier to reduce the manufacturing cost if it is suitable for automation, the liquid crystal module 100 of this embodiment also has technical significance in this respect.
  • FIGS. 5 and 6 are cross-sectional views schematically showing a configuration of a modification example of the liquid crystal module 100.
  • FIGS. 5 and 6 are cross-sectional views schematically showing a configuration of a modification example of the liquid crystal module 100.
  • the chip component 36 is also mounted on the upper surface 30a of the wiring substrate 30.
  • the area other than the area where the backlight unit 20 and the sealing resin 55 are arranged is used as a mounting area for electronic components (for example, chip components, semiconductor chips, etc.). Can do. Therefore, the chip component 36 can be disposed on the upper surface 30 a of the wiring board 30.
  • the touch panel 16 is placed on the liquid crystal panel 10.
  • the touch panel 16 and a further connection terminal (31 ⁇ / b> B) of the wiring board 30 are wire-bonded with a wire 50 ⁇ / b> B.
  • the second connection terminal 11 of the array substrate 10A and the first connection terminal 31A of the wiring substrate 30 are wire-bonded by a wire 50A.
  • the liquid crystal module 100 including the liquid crystal panel 10 has been described.
  • an organic EL element can be used in place of the liquid crystal panel 10 as a display element for displaying an image.
  • a light emitting device (organic EL device) using organic EL (Organic electroluminescence) constitutes a light emitting diode (LED) whose light emitting layer is made of an organic compound, and recombines electrons and holes injected into the organic compound. It emits light by excitons generated by. Since the organic EL element is a self-luminous light emitting element, a backlight is not necessary. Therefore, when an organic EL element is used as a display element for displaying an image, the backlight unit 20 does not have to be used in the configuration shown in FIGS.
  • the liquid crystal panel 10 composed of a pair of glass substrates 10 ⁇ / b> A and 10 ⁇ / b> B becomes an organic EL element (display element 10), and the organic EL element (10) is disposed on the wiring substrate 30. Is done.
  • the backlight unit 20 may not be provided.
  • the wiring board 30 has an extension part 35 extending outward from the organic EL element (10), and the first connection terminal 31 is disposed in the extension part 35.
  • the second connection terminal 11 is disposed at the end 15 of the organic EL element (10).
  • the 2nd connection terminal 11 in the edge part 15 of the organic EL element (10) and the 1st connection terminal 31 in the wiring board 30 are mutually connected by the wire bond 50.
  • an inexpensive rigid wiring board can be used for the wiring board 30. As described above, even if a flexible substrate is used as the wiring substrate 30, the cost can be reduced.
  • the first connection terminal 31 and the second connection terminal 11 are sealed with a sealing resin 55.
  • a touch panel 16 can be disposed on the display element (for example, organic EL element) 10.
  • the touch panel 16 and the wiring substrate 30 are connected by a second wire bond 50B.
  • the lower surface 30b of the wiring board 30 and / or the upper surface 30a of the wiring board can be used as a mounting region for electronic components (for example, chip components, semiconductor chips, etc.).
  • liquid crystal panel 10 liquid crystal panel 10A array substrate 10B color filter substrate 11 connection terminal (second connection terminal) DESCRIPTION OF SYMBOLS 12 Polarizing plate 15 Overhang

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention porte sur un module à cristaux liquides, dont la taille peut être réduite. Un module à cristaux liquides (100) comporte un panneau à cristaux liquides (10) et une unité de rétro-éclairage (20). L'unité de rétro-éclairage (20à) est disposée sur une carte de câblage (30), et la carte de câblage (30) présente une section allongée (35) s'étendant davantage vers l'extérieur que l'unité de rétro-éclairage (20). Une première borne de connexion (31) est disposée sur la section allongée (35). Un substrat de groupement (10A) présente une section de renflement (15) se renflant davantage qu'un substrat de filtre de couleur (10B), et une seconde borne de connexion (11) est disposée sur la section de renflement (15). La seconde borne de connexion (11) du substrat de groupement (10A) et la première borne de connexion (31) de la carte de câblage (30) sont couplées l'une à l'autre à l'aide d'une liaison à fil.
PCT/JP2012/059633 2011-04-15 2012-04-09 Module à cristaux liquides et dispositif d'affichage WO2012141117A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-090995 2011-04-15
JP2011090995 2011-04-15

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WO2012141117A1 true WO2012141117A1 (fr) 2012-10-18

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014162386A1 (fr) * 2013-04-01 2014-10-09 パイオニア株式会社 Structure de connexion par câble et dispositif électrique
JP2015056522A (ja) * 2013-09-12 2015-03-23 株式会社ジャパンディスプレイ タッチパネル機能内蔵表示装置
JP2016092592A (ja) * 2014-11-04 2016-05-23 セイコーエプソン株式会社 超音波デバイスユニット並びにプローブおよび電子機器
JP2018107133A (ja) * 2013-12-02 2018-07-05 株式会社半導体エネルギー研究所 携帯型情報端末
EP4132229A4 (fr) * 2020-03-27 2023-05-24 BOE Technology Group Co., Ltd. Module d'affichage et dispositif d'affichage
EP4131245A4 (fr) * 2020-03-27 2023-05-24 BOE Technology Group Co., Ltd. Panneau d'affichage et dispositif d'affichage

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JP2015056522A (ja) * 2013-09-12 2015-03-23 株式会社ジャパンディスプレイ タッチパネル機能内蔵表示装置
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JP2018107133A (ja) * 2013-12-02 2018-07-05 株式会社半導体エネルギー研究所 携帯型情報端末
US11004925B2 (en) 2013-12-02 2021-05-11 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
JP2016092592A (ja) * 2014-11-04 2016-05-23 セイコーエプソン株式会社 超音波デバイスユニット並びにプローブおよび電子機器
EP4132229A4 (fr) * 2020-03-27 2023-05-24 BOE Technology Group Co., Ltd. Module d'affichage et dispositif d'affichage
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