JPH0258256A - Mounting structure of heat generating components - Google Patents

Abstract

PURPOSE:To unnecessitate the manhours necessary for mounting heat dissipation components, to save mounting space, and reduce the cost of a total device by forming a conductor pattern on a contact part between heat generating components and a circuit board, which pattern has an area larger than or equal to the contact part, and by fixing the heat generating part of the heat generating components so as to be in close contact with the conductor pattern. CONSTITUTION:In the title mounting structure wherein heat generating components such as a transistor, an FET 3 and a transformer are mounted on a circuit board 1, on a contact part between the above heat generating components and the circuit board 1, a conductor pattern 2 having an area at least larger than or equal to the contact part is formed, and the heat generating parts are mounted on the conductor pattern 2 so as to be in close contact with the pattern. For example, a copper pattern 2 is inserted between the circuit board 1 and the FET 3, and fixed by a screw so as to be close contact with the heat generating part of the FET 3. The copper pattern 2 is made larger than the shape of the FET 3, and in about 20X25mm<2>. By this constitution, the heat generated in the FET 3 is transmitted to a copper pattern 2 and dissipated.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a mounting structure for heat generating components on a circuit board.

[Conventional technology]

Conventionally, the mounting structure for heat-generating components on a circuit board has been such that a heat dissipating component such as a heat sink is attached to the heat-generating component and then mounted on the circuit board. FIG. 3 shows an example in which the FET 3 is mounted on the circuit board 1 via a heat sink 5.

[Problem to be solved by the invention]

The conventional method for mounting heat-generating components onto a circuit board as described above involves attaching a heat-radiating component such as a heat sink to the heat-generating component and then mounting it on the circuit board. There are disadvantages such as extra man-hours required for mounting parts, etc., and (C) increased mounting space, which increases the cost of the entire device.

[Means to solve the problem]

The present invention provides a structure for mounting heat-generating components on a circuit board.
The present invention is characterized in that a conductive pattern having an area larger than the contact area is formed at the contact portion between the heat generating component and the circuit board, and the heat generating portion of the heat generating component is tightly fixed onto the conductive pattern.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention. A copper pattern 2 is inserted between a circuit board 1 and an FET 3.
The heat generating part and the copper pattern 2 are fixed with screws so as to be in close contact with each other. At this time, the copper pattern 2 needs to be larger than the shape of the FET 3, for example, 20 mm
The size is 25mm. With such a structure, the heat generated in the FET 3 is conducted to the copper pattern 2 and radiated.

FIG. 2 is a diagram showing a second embodiment of the present invention. The difference from the first embodiment shown in FIG. 1 is that the circuit board 1 has copper patterns 2 on both sides as a heat sink, and the copper patterns 2 on both sides are connected to each other by through holes 4. be. In this embodiment, the heat dissipation effect is improved by about 21% over the first embodiment shown in FIG. Therefore, the area of the steel pattern 2 can be made smaller than that of the embodiment shown in FIG.
It was possible to set it to 0 mm. Although the above two embodiments have been described using FET as an example of a heat generating component, it is clear that the invention is not limited to this and can be applied to mounting heat generating components such as transistors and transformers. Further, the conductor pattern is not limited to a copper pattern.

〔Effect of the invention〕

As explained above, according to the present invention, the heat dissipating conductor pattern is formed at the contact portion between the heat generating component and the circuit board, and the heat dissipating conductor pattern is brought into close contact with the heat generating part of the heat generating component, so no heat dissipating component is required. becomes.

This eliminates the need for man-hours for attaching the heat dissipation components, and in addition, the mounting space is relatively small, making it possible to reduce device costs.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment of the invention, and FIG. 3 is a sectional view showing a conventional example. 1... Circuit board, 2... Copper pattern, 3... FE
T, 4...Through hole, 5...Heat sink.

Claims (1)

[Claims] In a structure for mounting heat-generating components such as transistors, FETs, or transformers on a circuit board, a conductor pattern having an area at least larger than the contact area is formed at the contact portion between the heat-generating component and the circuit board, and the heat-generating component is mounted on this conductor pattern. A mounting structure for heat-generating components that is characterized by tightly fixing the components.