JPH04291999A - Part cooling structure - Google Patents

Part cooling structure

Info

Publication number
JPH04291999A
JPH04291999A JP5728491A JP5728491A JPH04291999A JP H04291999 A JPH04291999 A JP H04291999A JP 5728491 A JP5728491 A JP 5728491A JP 5728491 A JP5728491 A JP 5728491A JP H04291999 A JPH04291999 A JP H04291999A
Authority
JP
Japan
Prior art keywords
parts
heat
board
internal
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5728491A
Other languages
Japanese (ja)
Inventor
Hisao Anzai
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5728491A priority Critical patent/JPH04291999A/en
Publication of JPH04291999A publication Critical patent/JPH04291999A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Abstract

PURPOSE: To discharge heat produced in parts without use of special cooling parts such as a heat sink in a parts cooling structure and particularly in a part mounted on a board are cooled by guiding heat produced in the parts to the internal parts and dissipating the heat via the internal parts to the outside.
CONSTITUTION: Heat produced in a part 2 mounted on a board 1 including an internal conductor 4 is dissipated by allowing the heat to be conduced to the internal conductor 4, and further the part 2 is cooled by allowing the heat to be conduced to the internal conductor 4 also via a bonding agent 5 disposed on the lower surface of the parts 2 and a through-hole 6 formed in the board 1 in contact with the bonding agent 5.
COPYRIGHT: (C)1992,JPO&Japio
JP5728491A 1991-03-20 1991-03-20 Part cooling structure Pending JPH04291999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5728491A JPH04291999A (en) 1991-03-20 1991-03-20 Part cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5728491A JPH04291999A (en) 1991-03-20 1991-03-20 Part cooling structure

Publications (1)

Publication Number Publication Date
JPH04291999A true JPH04291999A (en) 1992-10-16

Family

ID=13051243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5728491A Pending JPH04291999A (en) 1991-03-20 1991-03-20 Part cooling structure

Country Status (1)

Country Link
JP (1) JPH04291999A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508885A (en) * 1993-04-26 1996-04-16 Mitsubishi Denki Kabushiki Kaisha IC card having improved heat dissipation
US5590030A (en) * 1989-01-13 1996-12-31 Hitachi, Ltd. Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections
EP1855517A1 (en) 2006-05-08 2007-11-14 Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho Soldering structure of through hole
US7605525B2 (en) 2004-11-11 2009-10-20 Samsung Sdi Co., Ltd. Plasma display panel assembly having a short circuit preventive unit
CN102554394A (en) * 2010-12-22 2012-07-11 联合汽车电子有限公司 Common temperature auxiliary welding structure applicable to selective wave soldering

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring
JPS6158297A (en) * 1984-08-29 1986-03-25 Oki Electric Ind Co Ltd Multilayer printed circuit board
JPS63301594A (en) * 1987-06-01 1988-12-08 Hitachi Ltd Laminated wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring
JPS6158297A (en) * 1984-08-29 1986-03-25 Oki Electric Ind Co Ltd Multilayer printed circuit board
JPS63301594A (en) * 1987-06-01 1988-12-08 Hitachi Ltd Laminated wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590030A (en) * 1989-01-13 1996-12-31 Hitachi, Ltd. Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections
US5508885A (en) * 1993-04-26 1996-04-16 Mitsubishi Denki Kabushiki Kaisha IC card having improved heat dissipation
US7605525B2 (en) 2004-11-11 2009-10-20 Samsung Sdi Co., Ltd. Plasma display panel assembly having a short circuit preventive unit
EP1855517A1 (en) 2006-05-08 2007-11-14 Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho Soldering structure of through hole
CN102554394A (en) * 2010-12-22 2012-07-11 联合汽车电子有限公司 Common temperature auxiliary welding structure applicable to selective wave soldering

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19961112