JP2830686B2 - Electronics - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus having a thermally improved power supply.

[0002]

2. Description of the Related Art Conventional electronic devices will be described below.

As shown in FIG. 3, a conventional electronic device includes a chassis 1 and a cover (not shown) that covers the chassis 1.
And consisted of

A power transformer 2 is provided at an end of the chassis 1.
And a parent board 3 on which electronic components are mounted is provided in the vicinity of the power transformer 2.

Reference numeral 4 denotes a heat sink provided on the bottom of the power transformer 2. Incidentally, as a technique similar to this, there is JP-A-4-352392.

[0006]

However, in such a conventional configuration, the power supply transformer 2 is directly connected to the chassis 1.
Is not suitable for independent management as a power supply block.

There is another problem that the heat of the power transformer 2 adversely affects the electronic components mounted on the mother board 3.

The present invention has been made to solve the above problems, and has as its object to integrate heat as a power supply block and to prevent heat from flowing out to a parent board.

[0009]

In order to achieve this object, an electronic apparatus according to the present invention comprises a chassis, a cover for covering the chassis, a power supply unit independently provided at an end of the chassis, and The power supply unit and the chassis
And a power supply unit mounted on the power supply unit.
And a rectifier circuit attached to the side of this power transformer.
A sub-base on which a road is mounted and which is provided on the parent board side;
Plate and said power source and a heat sink provided on the transformer bottom, the heat dissipation plate to derive extending from the bottom of the power transformer "L" shape in bending heat generating component mounting et al
A bent portion is formed, and the side surface of the bent portion is brought into contact with the child substrate, and the bent portion and the child substrate are brought into close proximity to or contact with the bottom surface of the chassis and the top surface of the cover. is there.

[0010]

With this configuration, the power transformer and the rectifier circuit
Bent with mounted child board and heat-generating components
The power supply unit is integrated as a block with a heat sink with
So it can be manufactured independently and independently
Can be managed. Further, since the daughter board to form a power unit between the parent board is provided, generated by the power supply unit
It is possible to prevent the discharged heat from flowing out to the parent substrate side.

Further, since the child board is used between the power supply section and the parent board, the heat of the power supply section does not flow to the parent board side.

[0012]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a main part of an electronic apparatus according to the present invention with a cover removed, and FIG. 2 is a cross-sectional view thereof.

First, in FIG. 2, reference numeral 11 denotes a chassis, and reference numeral 12 denotes a cover for covering the chassis 11. Next, in FIGS. 1 and 2, a power supply unit 14 is provided at an end 13 of the chassis 11. A parent board 16 is provided adjacent to the power supply section 14, and electronic components (not shown) are mounted on the mother board 16.

The power supply section 14 includes a power transformer 15.
The sub-substrate 17 is provided on the side surface.

The slave board 17 is provided on the mother board 16 side of the power transformer 15.
Electronic components are mounted to form a rectifier circuit. And
The child board 17 is provided close to the bottom surface of the chassis 11 and the top surface of the cover 12.

On the other hand, one side face 17a of the child board 17
The other side surface 17b of the child board 17 is in contact with the side surface 11a of the chassis 11 and is close to the other side surface 11b of the chassis 11.

Reference numeral 18 denotes a heat radiating plate, which is attached to the bottom surface of the power transformer 15. The side orthogonal to the sub-board 17 extends from the power transformer 15 and is bent into an "L" shape to be bent. 18a, which is the child substrate 1
7 is mounted near the other side surface 17b. A heat-generating component is attached to the bent portion 18a of the heat sink 18.

As described above, since the child substrate 17 is provided on the side surface and the heat radiating plate 18 is provided on the bottom surface with the power transformer 15 as the center, the power supply unit 14 can be manufactured and managed independently.

Further, since the child board 17 which is a heat non-conductor is provided and partitioned between the power supply section 14 and the parent board 16, the heat of the power supply section 14 flows out toward the parent board 16. There is no adverse effect on the electronic components on the parent substrate 16.

Here, reference numeral 19 in FIG. 2 denotes an insulating member which is hung from the cover 12 toward the parent board 16 and is provided in parallel with and near the daughter board 17. This ensures the insulation of the portion exposed from the back surface of the child substrate 17.

If the lower side and the upper side of the child board 17 are respectively brought into contact with the bottom surface of the chassis 11 and the top surface of the cover 12, it is possible to withstand the load received from above the cover 12.

Further, one side surface 17b of the child board 17 is brought into contact with the side surface 11b of the chassis 11, and the upper side is
, It is possible to more completely shut off the heat from the parent substrate 16.

[0024]

As described above, the electronic apparatus according to the present invention has a power supply
Transformer, child board on which rectifier circuit is mounted, and heat-generating components
Power supply unit with a radiator plate with a bent part attached
Is integrated as a block, so it is manufactured independently
Can be managed independently. Also,
A child board that forms a power supply section is provided between the mother board and the parent board.
As a result, heat generated in the power supply section may flow out to the parent board
Can be prevented. In addition, this power supply is
Because the bottom and the top of the cover are close to or in contact with each other,
It can withstand the load received from above the bar.

Further, since the child board is used between the power supply section and the parent board, the heat of the power supply section does not leak to the parent board side.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of an electronic device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an electronic device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a main part of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Chassis 12 Cover 13 Chassis end part 14 Power supply part 15 Power transformer 16 Parent board 17 Child board 18 Heat sink

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Motoyoshi Kitagawa 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-4-352392 (JP, A) JP-A-2 -170598 (JP, A) Fully open 1979-135555 (JP, U) Fully open 1988-98699 (JP, U) Fully open, 59-95690 (JP, U)

Claims (1)

(57) [Claims] 1. A chassis, a cover for covering the chassis, a power supply unit independently provided at an end of the chassis , and a power supply unit adjacent to the power supply unit and mounted on the chassis.
The power supply unit comprises a power transformer.
And a rectifier circuit attached to the side of this power transformer.
A child board that is attached and provided on the master board side,
A heat sink provided on the bottom surface of the power transformer,
The heatsink is extended from the bottom surface of the power transformer, drawn out and bent into an “L” shape, and a heat-generating component is attached.
A bent portion is formed, and a side surface of the bent portion is brought into contact with the child substrate, and the bent portion and the child substrate are
An electronic device that is close to or in contact with a bottom surface of the chassis and a top surface of the cover.