JP2570630Y2 - Heat sink - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention is to easily separate and disassemble a radiator plate soldered to an electronic substrate by using a radiator plate mounting leg from an electronic substrate when disposing of the electronic device using a general tool. The present invention also relates to a radiator plate that enables the reuse of resources of a separated radiator plate.

[0002]

2. Description of the Related Art In recent years, in an electronic device composed of an electronic substrate on which electronic components are mounted at high density and high density, it is necessary to prevent malfunction or destruction of the semiconductor device due to heat, and to exhibit sufficient performance of the semiconductor device. Sufficient heat dissipation of semiconductor elements that generate heat cannot be ignored, and extruded aluminum heat sinks with good thermal conductivity and good workability are often used as general heat sinks. ing.

Conventionally, as shown in FIG. 3, a semiconductor element 10 requiring heat radiation is fixed to a heat radiating plate 30 with screws 40 via an insulating sheet 20 such as mica, and is directly soldered to an electronic substrate 70. The heat-dissipating plate 30 made of aluminum or the like that cannot be fixed is provided at one or more places by fitting and caulking 30a a flat plate-shaped heat-dissipating plate mounting leg 50 made of a solderable metal. Electronic substrate 70
Is usually fixed to the electronic substrate 70 by soldering.

[0004]

[Problems to be solved by the invention] However, when considering the disassembly and disassembly of components at the time of disposing of electronic boards of electronic devices composed of composite materials, the heat dissipated by the conventional fitting and caulking is considered. When disposing of electronic equipment, the heat sink fixed by the plate mounting legs can be removed by using a general tool to remove the screw that locks the semiconductor element to the heat sink using a general tool. It is difficult to separate and disassemble the heat sink from the electronic board using a general tool, and the heat sink that cannot be removed must be disposed of together with other electronic components together with the electronic board. There was a problem that it could not be used.

In view of the above-mentioned problems, the present invention provides a shape above the heat sink mounting leg where a general tool can be easily inserted into a gap in contact with the heat sink. Through this shape, the tool is connected to the heat sink and the heat sink mounting leg. The heat sink can be easily separated from the electronic board, and the heat sink can be easily separated from the electronic board by removing the fitting and crimping of the heat sink and the heat sink mounting legs by twisting the tool. The purpose of the present invention is to provide a heat sink mounting leg for reusing the material.

[0006]

The heat sink mounting leg of the present invention has a shape in which a general tool can be easily inserted into a gap formed by contacting the heat sink with the heat sink mounting leg, and the tool is inserted into this gap. By twisting the tool, the radiator plate and the radiator plate mounting legs can be disengaged from each other by fitting and caulking, thereby improving the separation and disassembly of the radiator plate from the electronic board.

[0007]

According to the heat sink mounting leg of the present invention, the heat sink mounting leg is provided with a shape in which a general tool can be easily inserted into a gap in contact with the heat sink. It can be inserted into the gap where the mounting legs are in contact, and by twisting a general tool inserted into this gap, the heat sink and the heat sink mounting feet are disengaged and the connection by caulking is removed, and the heat sink is removed from the electronic board. Separation can be easily performed, and the material of the radiator plate that has been separated can be reused.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat sink according to the present invention. FIG. 1 is an embodiment of the present invention, and schematically shows the configuration thereof. FIG. 2 shows a process of removing the heat sink from the electronic board in the present invention.

In FIG. 1, a semiconductor element 1 has an extruded heat sink 3 made of aluminum via an insulating sheet 2.
Is fixed with a small screw 4. The heat radiating plate 3 has a U-shaped groove 3a provided on both sides thereof, and heat radiating plate mounting legs 5 provided at two front and rear portions in the figure are fitted to each other to form a caulking connection 3b. The heat sink mounting legs 5 are each heat sink 3
A flat screwdriver is provided at two places near the portion where the groove 3a is fitted so that the flathead screwdriver 6 of a general tool can be easily inserted into the gap where the heatsink 3 and the heatsink mounting leg 5 are in contact with each other. A fukurin-shaped recess 5a is provided. The heat sink 3 is fixed by soldering the heat sink mounting legs 5 to the electronic board 7.

The case where the heat radiating plate 3 having the heat radiating plate mounting leg 5 of the present invention constructed on the electronic substrate 7 as described above is separated and disassembled from the electronic substrate 7 will be described below with reference to FIGS. Will be described.

When the heat radiating plate 3 constructed as shown in FIG. 1 is separated and disassembled from the electronic substrate 7, first, a small diameter screw 4 for fixing the semiconductor element 1 is removed by using a general tool 8 such as a screwdriver. And the heat sink 3 are separated. next,
Insert the tip of the tool 6 into a fukurin-shaped concave portion 5a provided by partially widening a gap between the general tool 6 such as a flathead screwdriver and the heat radiating plate 3 provided on the heat radiating plate mounting leg 5. By prying, the heat sink 3 and the heat sink mounting leg 5 can be disengaged from each other by fitting and caulking. By repeating this for another portion 5a, the heat sink 3 and the heat sink mounting leg 5 can be separated. The same operation is performed on the heat sink 3 on the opposite side of the heat sink 3 from the drawing, so that the heat sink 3
It becomes possible to separate easily.

[0012]

As described above, according to the present invention, the heat sink mounting leg is provided with a shape in which the general tool can be easily inserted into the gap in contact with the heat sink, so that the tool can be connected to the heat sink through this shape. The heat sink can be inserted into the gap where it comes into contact with the mounting feet, and by twisting this tool, the heat sink and the heat sink mounting feet can be disengaged and disengaged by caulking, and the heat sink can be easily separated from the electronic board. There is an effect that can be.
In addition, it is possible to reuse the separated material of the heat sink.

[Brief description of the drawings]

FIG. 1 is a view of a heat sink attached to an electronic board according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating separation of a heat sink from an electronic board according to an embodiment of the present invention;

FIG. 3 is a view of a heat sink fixed to an electronic board using conventional heat sink mounting legs.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 3 Heat sink 5 Heat sink attachment leg 5a Fukurin-shaped recess 6 Flathead screwdriver 7 Electronic board

Claims (1)

(57) [Scope of request for utility model registration] A radiator plate on which electronic components to be radiated are mounted, and a radiator plate mounting leg which is fixed to an electronic substrate by soldering and has a concave portion for allowing a tool to be inserted are integrally connected. And a gap for allowing a tool to be inserted is provided on a surface where the heat radiating plate and the heat radiating plate mounting leg are in contact.