JPH06326484A - Electronic apparatus - Google Patents

Abstract

PURPOSE:To thermally improve an electronic apparatus, and unify it as a power supply block, and prevent heat from flowing out to the master board side. CONSTITUTION:A heat dissipating plate 18 is stretched and led out from the bottom surface of a power supply transformer 15, and bent in an L-shape. The bent part 18a is made to abut against a subordinate board 17. The bent part 18a of the heat dissipating plate 18, and the upper side and the lower side of the subordinate board 17 are constituted so as to be adjacent to the bottom surface of a chassis 11 and the ceiling surface of a cover. Hence a power supply part 14 is surrounded by the bent part 18a of the heat dissipating plate 18 and the subordinate board 17, and unified in a body as a power supply block, so that handling is facilitated. Since the subordinate board 17 is installed between the power supply part 14 and the master board 16, the heat of the power supply part 14 can be prevented from flowing out to the master board 16 side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a thermally improved power supply unit.

[0002]

2. Description of the Related Art A conventional electronic device will be described below.

As shown in FIG. 3, the conventional electronic equipment includes a chassis 1 and a cover (not shown) covering the chassis 1.
It was composed of and.

A power transformer 2 is provided at the end of the chassis 1.
Was provided, and the parent board 3 on which electronic components were mounted was provided in the vicinity of the power transformer 2.

Reference numeral 4 is a heat radiating plate provided on the bottom surface of the power transformer 2. As a technique similar to this, there is JP-A-4-352392.

[0006]

However, in such a conventional configuration, the power transformer 2 is directly connected to the chassis 1.
Was attached, and it was not suitable for independent management as a power supply block.

There is also a problem that the heat of the power transformer 2 adversely affects the electronic components mounted on the parent board 3.

The present invention solves such a problem, and an object thereof is to integrate it as a power source block and prevent heat from flowing out to the main substrate.

[0009]

In order to achieve this object, an electronic apparatus according to the present invention comprises a chassis, a cover for covering the chassis, a power supply unit provided at the end of the chassis,
A child board attached to the side of the power transformer of this power supply unit,
A mother board mounted on the opposite side of the chassis from the power supply unit and a heat sink provided on the bottom surface of the power transformer, and a child board of the heat sink provided on the power transformer. The orthogonal side extends from the bottom surface and is led out and bent into an “L” shape, and the side of the bent portion is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper side of the child board are The cover is brought close to or in contact with the top surface of the cover.

[0010]

With this structure, the power source is surrounded by the radiator plate and the sub-board so that they can be easily handled.

Further, since the child board is used between the power source section and the parent board, the heat of the power source section does not flow out to the parent board side.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an essential part of the electronic device of the present invention with a cover removed, and FIG. 2 is a sectional view thereof.

First, in FIG. 2, 11 is a chassis, and 12 is a cover for covering the chassis 11. Next, in FIGS. 1 and 2, a power supply unit 14 is provided at the end portion 13 of the chassis 11. A parent board 16 is provided adjacent to the power supply unit 14, and electronic components (not shown) are mounted on the parent board 16.

Further, the power supply section 14 includes a power supply transformer 15
Is provided with a child board 17.

This child board 17 is provided on the parent board 16 side of the power transformer 15, and on this child board 17,
Electronic components are mounted to form a rectifier circuit. And
The child board 17 is provided close to the bottom surface of the chassis 11 and the top surface of the cover 12.

On the other hand, one side surface 17a of this child board 17 is
The side surface 11 a of the chassis 11 is abutted, and the other side surface 17 b of the child board 17 is close to the other side surface 11 b of the chassis 11.

A heat radiating plate 18 is attached to the bottom surface of the power transformer 15, and a side orthogonal to the sub board 17 extends from the power transformer 15 and is led out to be bent into an "L" shape to be bent. 18a, which is the child board 1
7 is attached near the other side surface 17b. A heat-generating component is attached to the bent portion 18a of the heat dissipation plate 18.

As described above, since the power supply transformer 15 is provided as the center and the child board 17 is provided on the side surface and the heat dissipation plate 18 is provided on the bottom surface, the power supply unit 14 can be manufactured independently and can be managed independently.

Further, since the child board 17 which is a non-heat conductor is provided and partitioned between the power source section 14 and the parent board 16, the heat of the power source section 14 flows out to the parent board 16. It does not adversely affect the electronic components on the parent board 16.

Here, reference numeral 19 in FIG. 2 denotes an insulating member which is hung from the cover 12 toward the parent board 16 and is provided in parallel with the child board 17. This makes the insulation of the portion exposed from the rear surface of the child board 17 more reliable.

If the lower side and the upper side of the child board 17 are brought into contact with the bottom surface of the chassis 11 and the top surface of the cover 12, respectively, it is possible to withstand the load received from above the cover 12.

Further, one side surface 17b of the child board 17 is brought into contact with the side surface 11b of the chassis 11, and the upper side is covered with the cover 12.
If it is brought into contact with, the heat can be shut off from the parent board 16 more completely.

[0024]

As described above, the electronic apparatus of the present invention is provided with the chassis, the cover for covering the chassis, the power source section provided at the end of the chassis, and the power transformer side surface of the power source section. A child board, and a parent board mounted on the opposite side of the chassis from the power supply section with the child board sandwiched therebetween,
A heat radiating plate provided on the bottom surface of the power transformer, the side of the heat radiating plate provided on the power transformer orthogonal to the sub-board extends from the bottom surface and is bent into an "L" shape. Since the side edge is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper edge of the child board are brought close to or abut against the top surface of the cover, the power supply section is made by the heat dissipation board and the child board. Since it is integrated as a structure surrounded by, it is easy to handle.

Further, since the child board is used between the power source section and the parent board, the heat of the power source section does not flow out to the parent board side.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part of an electronic device according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a main part of a conventional electronic device.

[Explanation of symbols]

 11 chassis 12 cover 13 chassis end 14 power supply 15 power transformer 16 parent board 17 child board 18 heat sink

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Motoyoshi Kitagawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A chassis, a cover for covering the chassis, a power supply unit provided at an end of the chassis, a sub-board attached to a side surface of a power transformer of the power supply unit, and the sub-board sandwiching the sub-board. The chassis includes a mother board mounted on a portion opposite to the power supply section of the chassis, and a heat dissipation plate provided on the bottom surface of the power transformer, and a side of the heat dissipation plate provided on the power transformer extending perpendicular to the child board extends from the bottom surface. Then, the bent side of the bent portion is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper side of the child board are close to the top surface of the cover or The electronic device that was brought into contact.