JPH06326484A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JPH06326484A JPH06326484A JP11133993A JP11133993A JPH06326484A JP H06326484 A JPH06326484 A JP H06326484A JP 11133993 A JP11133993 A JP 11133993A JP 11133993 A JP11133993 A JP 11133993A JP H06326484 A JPH06326484 A JP H06326484A
- Authority
- JP
- Japan
- Prior art keywords
- board
- power supply
- chassis
- heat
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は熱的に改善された電源部
を有する電子機器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a thermally improved power supply unit.
【0002】[0002]
【従来の技術】以下、従来の電子機器について説明す
る。2. Description of the Related Art A conventional electronic device will be described below.
【0003】従来の電子機器は、図3に示すように、シ
ャーシ1と、このシャーシ1を覆うカバー(図示せず)
とで構成されていた。As shown in FIG. 3, the conventional electronic equipment includes a chassis 1 and a cover (not shown) covering the chassis 1.
It was composed of and.
【0004】このシャーシ1の端部には電源トランス2
が設けられ、この電源トランス2に近接して電子部品が
搭載された親基板3が設けられていた。A power transformer 2 is provided at the end of the chassis 1.
Was provided, and the parent board 3 on which electronic components were mounted was provided in the vicinity of the power transformer 2.
【0005】また、4は電源トランス2の底面に設けら
れた放熱板である。尚、これに類する技術として、特開
平4−352392号公報がある。Reference numeral 4 is a heat radiating plate provided on the bottom surface of the power transformer 2. As a technique similar to this, there is JP-A-4-352392.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の構成では、シャーシ1に直接電源トランス2
が取り付けられており、電源部ブロックとして独立に管
理するには不向きであった。However, in such a conventional configuration, the power transformer 2 is directly connected to the chassis 1.
Was attached, and it was not suitable for independent management as a power supply block.
【0007】また、電源トランス2の熱が親基板3に実
装された電子部品に悪影響を与えるという問題があっ
た。There is also a problem that the heat of the power transformer 2 adversely affects the electronic components mounted on the parent board 3.
【0008】本発明はこのような問題点を解決するもの
で電源ブロックとして一体化するとともに、親基板に熱
が流出しないようにすることを目的としたものである。The present invention solves such a problem, and an object thereof is to integrate it as a power source block and prevent heat from flowing out to the main substrate.
【0009】[0009]
【課題を解決するための手段】この目的を達成するため
に本発明の電子機器は、シャーシと、このシャーシを覆
うカバーと、前記シャーシ端部に設けられた電源部と、
この電源部の電源トランス側面に付設された子基板と、
この子基板をはさんで前記シャーシの電源部とは反対部
分に装着された親基板と、前記電源トランス底面に設け
られた放熱板とを備え、前記電源トランスに設けた放熱
板の子基板と直交する辺を底面から延在して導出し
「L」字状に折り曲げ、その折り曲げ部の側辺を前記子
基板に当接させるとともに、この放熱板の折り曲げ部と
前記子基板の上辺は、前記カバーの天面に近接または当
接させたものである。In order to achieve this object, an electronic apparatus according to the present invention comprises a chassis, a cover for covering the chassis, a power supply unit provided at the end of the chassis,
A child board attached to the side of the power transformer of this power supply unit,
A mother board mounted on the opposite side of the chassis from the power supply unit and a heat sink provided on the bottom surface of the power transformer, and a child board of the heat sink provided on the power transformer. The orthogonal side extends from the bottom surface and is led out and bent into an “L” shape, and the side of the bent portion is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper side of the child board are The cover is brought close to or in contact with the top surface of the cover.
【0010】[0010]
【作用】この構成により放熱板と子基板により電源部が
囲まれた構成として一体化されるので取扱いが容易にな
る。With this structure, the power source is surrounded by the radiator plate and the sub-board so that they can be easily handled.
【0011】また、電源部と親基板との間には子基板が
用いられているので、電源部の熱が親基板側へ流出する
ことはない。Further, since the child board is used between the power source section and the parent board, the heat of the power source section does not flow out to the parent board side.
【0012】[0012]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0013】図1は、本発明の電子機器においてカバー
を外した状態における要部斜視図であり、図2はその断
面図である。FIG. 1 is a perspective view of an essential part of the electronic device of the present invention with a cover removed, and FIG. 2 is a sectional view thereof.
【0014】まず、図2において11はシャーシであ
り、12はこのシャーシ11を覆うカバーである。次
に、図1及び図2において、シャーシ11の端部13に
は、電源部14が設けられている。この電源部14に隣
接して親基板16が設けられており、この親基板16に
は、図示していないが電子部品が実装されている。First, in FIG. 2, 11 is a chassis, and 12 is a cover for covering the chassis 11. Next, in FIGS. 1 and 2, a power supply unit 14 is provided at the end portion 13 of the chassis 11. A parent board 16 is provided adjacent to the power supply unit 14, and electronic components (not shown) are mounted on the parent board 16.
【0015】また、電源部14には、電源トランス15
の側面に子基板17が設けられている。Further, the power supply section 14 includes a power supply transformer 15
Is provided with a child board 17.
【0016】この子基板17は、電源トランス15の親
基板16側に設けられており、この子基板17上には、
電子部品が装着され整流回路を構成している。そして、
この子基板17は、シャーシ11の底面とカバー12の
天面に近接して設けられている。This child board 17 is provided on the parent board 16 side of the power transformer 15, and on this child board 17,
Electronic components are mounted to form a rectifier circuit. And
The child board 17 is provided close to the bottom surface of the chassis 11 and the top surface of the cover 12.
【0017】一方、この子基板17の一側面17aは、
シャーシ11の側面11aに当接し、子基板17の他側
面17bはシャーシ11の他方の側面11bに近接して
いる。On the other hand, one side surface 17a of this child board 17 is
The side surface 11 a of the chassis 11 is abutted, and the other side surface 17 b of the child board 17 is close to the other side surface 11 b of the chassis 11.
【0018】18は放熱板であり、電源トランス15の
底面に取り付けられており、子基板17と直交する辺は
電源トランス15から延在して導出され「L」字状に折
り曲げられて折り曲げ部18aとなり、これが子基板1
7の他側面17b近傍に取り付けられている。また、こ
の放熱板18の折り曲げ部18aには発熱部品が取り付
けられている。A heat radiating plate 18 is attached to the bottom surface of the power transformer 15, and a side orthogonal to the sub board 17 extends from the power transformer 15 and is led out to be bent into an "L" shape to be bent. 18a, which is the child board 1
7 is attached near the other side surface 17b. A heat-generating component is attached to the bent portion 18a of the heat dissipation plate 18.
【0019】このように、電源トランス15を中心とし
て、その側面に子基板17と底面に放熱板18を設けて
いるので電源部14は、独立して製造できるとともに独
立して管理できる。As described above, since the power supply transformer 15 is provided as the center and the child board 17 is provided on the side surface and the heat dissipation plate 18 is provided on the bottom surface, the power supply unit 14 can be manufactured independently and can be managed independently.
【0020】また、電源部14と親基板16の間には熱
の不導体である子基板17が設けられて仕切られている
ので、電源部14の熱が親基板16の方へ流出して親基
板16上の電子部品に悪影響を与えることはない。Further, since the child board 17 which is a non-heat conductor is provided and partitioned between the power source section 14 and the parent board 16, the heat of the power source section 14 flows out to the parent board 16. It does not adversely affect the electronic components on the parent board 16.
【0021】ここで、図2における19はカバー12か
ら親基板16に向かって垂下された絶縁部材であり、子
基板17に近接して平行に設けられている。これは子基
板17裏面から露出した部分の絶縁をより確実なものと
している。Here, reference numeral 19 in FIG. 2 denotes an insulating member which is hung from the cover 12 toward the parent board 16 and is provided in parallel with the child board 17. This makes the insulation of the portion exposed from the rear surface of the child board 17 more reliable.
【0022】尚、子基板17の下辺と上辺は夫々シャー
シ11底面とカバー12の天面に当接させれば、カバー
12上から受ける荷重に耐え得ることができる。If the lower side and the upper side of the child board 17 are brought into contact with the bottom surface of the chassis 11 and the top surface of the cover 12, respectively, it is possible to withstand the load received from above the cover 12.
【0023】また、子基板17の一側面17bをシャー
シ11の側面11bに当接させ、また上辺をカバー12
に当接させれば、親基板16との間の熱遮断がより完全
にできる。Further, one side surface 17b of the child board 17 is brought into contact with the side surface 11b of the chassis 11, and the upper side is covered with the cover 12.
If it is brought into contact with, the heat can be shut off from the parent board 16 more completely.
【0024】[0024]
【発明の効果】以上のように、本発明の電子機器は、シ
ャーシと、このシャーシを覆うカバーと、前記シャーシ
端部に設けられた電源部と、この電源部の電源トランス
側面に付設された子基板と、この子基板をはさんで前記
シャーシの電源部とは反対部分に装着された親基板と、
前記電源トランス底面に設けられた放熱板とを備え、前
記電源トランスに設けた放熱板の子基板と直交する辺を
底面から延在して導出し「L」字状に折り曲げ、その折
り曲げ部の側辺を前記子基板に当接させるとともに、こ
の放熱板の折り曲げ部と前記子基板の上辺は、前記カバ
ーの天面に近接または当接させたので、前記放熱板と前
記子基板により電源部が囲まれた構成として一体化され
るので取扱いが容易になる。As described above, the electronic apparatus of the present invention is provided with the chassis, the cover for covering the chassis, the power source section provided at the end of the chassis, and the power transformer side surface of the power source section. A child board, and a parent board mounted on the opposite side of the chassis from the power supply section with the child board sandwiched therebetween,
A heat radiating plate provided on the bottom surface of the power transformer, the side of the heat radiating plate provided on the power transformer orthogonal to the sub-board extends from the bottom surface and is bent into an "L" shape. Since the side edge is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper edge of the child board are brought close to or abut against the top surface of the cover, the power supply section is made by the heat dissipation board and the child board. Since it is integrated as a structure surrounded by, it is easy to handle.
【0025】また、電源部と親基板との間には子基板が
用いられているので電源部の熱が親基板側へ流出するこ
とはない。Further, since the child board is used between the power source section and the parent board, the heat of the power source section does not flow out to the parent board side.
【図1】本発明の一実施例による電子機器の要部斜視図FIG. 1 is a perspective view of an essential part of an electronic device according to an embodiment of the present invention.
【図2】本発明の一実施例による電子機器の断面図FIG. 2 is a sectional view of an electronic device according to an embodiment of the present invention.
【図3】従来の電子機器の要部斜視図FIG. 3 is a perspective view of a main part of a conventional electronic device.
11 シャーシ 12 カバー 13 シャーシ端部 14 電源部 15 電源トランス 16 親基板 17 子基板 18 放熱板 11 chassis 12 cover 13 chassis end 14 power supply 15 power transformer 16 parent board 17 child board 18 heat sink
───────────────────────────────────────────────────── フロントページの続き (72)発明者 北川 元祥 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Motoyoshi Kitagawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (1)
と、前記シャーシ端部に設けられた電源部と、この電源
部の電源トランス側面に付設された子基板と、この子基
板をはさんで前記シャーシの電源部とは反対部分に装着
された親基板と、前記電源トランス底面に設けられた放
熱板とを備え、前記電源トランスに設けた放熱板の子基
板と直交する辺を底面から延在して導出し「L」字状に
折り曲げ、その折り曲げ部の側辺を前記子基板に当接さ
せるとともに、この放熱板の折り曲げ部と前記子基板の
上辺は、前記カバーの天面に近接または当接させた電子
機器。1. A chassis, a cover for covering the chassis, a power supply unit provided at an end of the chassis, a sub-board attached to a side surface of a power transformer of the power supply unit, and the sub-board sandwiching the sub-board. The chassis includes a mother board mounted on a portion opposite to the power supply section of the chassis, and a heat dissipation plate provided on the bottom surface of the power transformer, and a side of the heat dissipation plate provided on the power transformer extending perpendicular to the child board extends from the bottom surface. Then, the bent side of the bent portion is brought into contact with the child board, and the bent portion of the heat dissipation plate and the upper side of the child board are close to the top surface of the cover or The electronic device that was brought into contact.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11133993A JP2830686B2 (en) | 1993-05-13 | 1993-05-13 | Electronics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11133993A JP2830686B2 (en) | 1993-05-13 | 1993-05-13 | Electronics |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06326484A true JPH06326484A (en) | 1994-11-25 |
JP2830686B2 JP2830686B2 (en) | 1998-12-02 |
Family
ID=14558695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11133993A Expired - Fee Related JP2830686B2 (en) | 1993-05-13 | 1993-05-13 | Electronics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2830686B2 (en) |
-
1993
- 1993-05-13 JP JP11133993A patent/JP2830686B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2830686B2 (en) | 1998-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |