JP2002094196A - Electronic part heat dissipating structure of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate factors to cause troubles to electronic parts so as to improve the electronic parts in durability and reliability by a method wherein heat released from the electronic part due to a power loss is effectively dissi pated so as to prevent a temperature rise in the electronic part. SOLUTION: Solders are placed on the lands 10 of a printed wiring board 1 provided for an electric apparatus, a heat-releasing electronic part 2 is mounted on the lands 10 of the printed wiring board 1, and the electronic part 2 is wired with a pattern 13. An electronic part heat dissipating structure is used for the above printed wiring board 1 and formed of heat dissipating patterns 12 provided to the lands 10, and the surface area of the heat dissipating pattern is set two to four times as large as that of the land, by which heat released from the electronic part is transmitted to the heat dissipating pattern to improve the heat dissipating effect of the printed wiring board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for an electronic component of a printed wiring board, and more particularly to a heat dissipation structure for an electronic component of a printed wiring board in which the heat generated from the electronic component due to power loss is enhanced.

[0002]

2. Description of the Related Art Hitherto, an electronic component mounting structure for a printed wiring board shown in the structural view of FIG. 4 has been proposed.

In the structural diagram of FIG. 4, a surface of a printed wiring board 101 of an electric device made of a thermally conductive substrate material on which electronic components are mounted is made of copper used for connection or attachment of the electronic components. A land made of a foil, here two lands 110, 110, is formed, and electrodes of the electronic component 102 having a need for heat radiation are mounted on the lands 110, 110 with solders 111, 111. In addition, the lands 110, 110 are formed through patterns 112, 112 made of copper foil and coated with a resist.
Electrodes of another electronic component different from the electronic component 102 are respectively wired to other lands to which solder is attached (not shown).

[0004]

However, the conventional structure for mounting an electronic component on a printed wiring board, which is a conventional example, is provided with an effective heat radiating means for radiating heat generated from the electronic component 102 due to power loss. Electronic component 1
There has been a problem that the rise of the temperature 02 (component temperature) causes a failure of the electronic component 102.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned difficulties, and has a function of radiating heat generated from an electronic component due to power loss and suppressing a rise in the temperature of the electronic component. It is an object of the present invention to provide an electronic component heat radiation structure for a printed wiring board which reduces the above factors and improves durability and reliability.

[0006]

In order to achieve the above object, an electronic component heat dissipation structure for a printed wiring board according to the present invention is provided. The electronic component heat dissipation structure of the printed wiring board for mounting and wiring the electronic components in a pattern,
By providing a heat radiation pattern on the land, and setting the surface area of the heat radiation pattern to 2 to 4 times the surface area of the land,
It is characterized in that heat generated from the electronic component is transmitted to the heat radiation pattern to enhance the heat radiation effect.

The electronic component structure of a printed wiring board according to the present invention is an electronic component of a printed wiring board in which solder is mounted on lands of a printed wiring board of an electric device, heat-generating electronic components are mounted, and the electronic components are wired in a pattern. A component heat dissipation structure, in which a heat dissipation pattern is provided separately from the land on which the electronic components of the printed wiring board are mounted, and the lands are wired to the heat dissipation pattern in a pattern, so that the heat generated from the electronic components is transferred to the heat dissipation pattern. It is characterized by increasing the heat dissipation effect by transmitting the heat.

The electronic component heat dissipation structure of a printed wiring board according to the present invention is a printed wiring board of an electronic device in which solder is mounted on a land of the printed wiring board of an electric device, heat-generating electronic components are mounted, and the electronic components are wired in a pattern. Electronic component heat dissipation structure, providing through holes in the pattern of the printed wiring board, providing a heat dissipation pattern on the back of the printed wiring board,
By connecting the lands to the heat radiation pattern via the through holes, the heat generated from the electronic component is transmitted to the heat radiation pattern to enhance the heat radiation effect.

According to the electronic component heat dissipation structure of the printed wiring board of the present invention, the heat generated from the electronic component due to the power loss is generated by the heat dissipation formed on the front or back surface of the printed wiring board on which the electronic component is mounted. The heat is transmitted to the pattern, and the heat can be efficiently radiated from the heat radiation pattern into the atmosphere. As a result, an abnormal rise in temperature of the electronic component is suppressed, and the cause of failure of the electronic component can be reduced, thereby improving durability and reliability.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention;

FIG. 1 is a structural view showing a heat radiation structure of an electronic component of a printed wiring board according to a first embodiment of the present invention. The substrate material having thermal conductivity, for example, a composite epoxy resin laminate (CEM-3) A surface (hereinafter referred to as a surface) of a printed wiring board 1 of an electric device made of a material such as glass epoxy material on which electronic components are mounted is a copper foil (electrolytic copper foil) used for connection or attachment of the electronic components. Or lands made of rolled copper foil), here two lands 10, 10 are formed. On these lands 10, 10, semiconductor elements having a need for heat radiation, such as resistors, capacitors, power elements, etc., are formed. The electrodes of the electronic component 2 are attached with solders 11 and 11. The lands 10, 10 are provided with heat radiation patterns 12, 12 made of copper foil and used to radiate heat generated from the electronic component 2 due to power loss. Furthermore, the heat radiation pattern 1
Reference numerals 2 and 12 denote that electrodes of other electronic components different from the electronic component 2 are attached by solder via patterns (hereinafter referred to as wiring patterns) 13 and 13 made of copper foil and coated with a resist. Are connected to other heat radiation patterns provided in contact with the lands (not shown). The surface area of the heat radiation patterns 12, 12 is set to be 2 to 4 times the surface area of the lands 10, 10.

In the electronic component heat dissipation structure of the printed wiring board according to the first embodiment of the present invention, heat generated from the electronic component 2 due to power loss is formed on the surface of the printed wiring board 1 and The lands 10, 1 are connected via the lands 10, 10 to which electrodes are attached by solders 11, 11, respectively.
Heat radiation patterns 12, 1 provided in a state of contact with
2 and are radiated from the radiation patterns 12 and 12 into the atmosphere. In addition, the heat radiation patterns 12, 12
Is set to be 2 to 4 times the surface area of the lands 10 and 10, so that the temperature of the electronic component 2 (component temperature) is lower than that of the conventional example in which no effective heat radiation means is provided. For example, it becomes possible to lower by 20 to 50 ° C,
The heat generated from the electronic component 2 due to the power loss can be efficiently radiated to the atmosphere, and the abnormal temperature rise of the electronic component 2 is suppressed.

Further, heat generated from the electronic component 2 due to power loss is transmitted to other heat radiation patterns (not shown) via wiring patterns 13 for wiring the heat radiation patterns 12 and 12, respectively. It can be diffused over the entire surface of the printed wiring board 1. Thereby, the electronic component 2
In addition, a rise in temperature of other electronic components (not shown) is also suppressed, and a factor of failure of the electronic components (including other electronic components) 2 can be reduced, thereby improving durability and reliability.

Next, another embodiment of the electronic component heat dissipation structure of the printed wiring board according to the present invention, which has the same effect as the first embodiment in which the heat dissipation effect of the heat generated from the electronic component due to the power loss is improved. The second embodiment will be described below with reference to the structural diagram of FIG.

In the structural diagram of FIG. 2, the electrical equipment is composed of a substrate material having thermal conductivity, for example, a composite epoxy resin laminate (CEM-3) similar to the first embodiment of the present invention, a glass epoxy material or the like. On the surface of the printed wiring board 21, lands made of copper foil used for connection or attachment of the electronic component, here two lands 30, 30, and heat generated from the electronic component 22 due to power loss are radiated. Pattern 32, 32 made of copper foil and used for
Are formed separately. The lands 30, 30 and the heat-dissipating patterns 32, 32 are made of copper foil and are coated with a resist (hereinafter referred to as wiring patterns) 33,
33 are wired. In addition, lands 30, 3
Electrodes of an electronic component 22 composed of a semiconductor element having a need for heat radiation, for example, a resistor, a capacitor, a power element, etc. equivalent to those of the first embodiment of the present invention are mounted on the solder 0 by soldering 31, 31. . Further, other heat radiation patterns are wired to the heat radiation patterns 32, 32 via wiring patterns 34, 34, and the other heat radiation patterns are electrodes of another electronic component different from the electronic component 22. Are wired to other lands attached by solder with other wiring patterns (not shown).

In the structure for dissipating electronic components of a printed wiring board according to the second embodiment of the present invention, the heat generated from the electronic components 22 due to the power loss is reduced.
The electrodes of the electronic component 22 formed on the surface of
Lands 30, 30 attached in 1, wiring pattern 3
The heat is transmitted to the heat radiation patterns 32 and 32 via the heat radiation patterns 3 and 33, respectively, and is radiated from the heat radiation patterns 32 and 32 to the atmosphere. Thus, the temperature of the electronic component 22 (component temperature) is lower than that of the conventional example in which no effective heat radiation means is provided.
Can be reduced by, for example, 20 to 50 ° C., and the heat generated from the electronic component 22 due to the power loss can be efficiently radiated into the atmosphere, and the abnormal temperature rise of the electronic component 22 is suppressed.

Further, heat generated from the electronic component 22 due to power loss is transmitted to other heat radiation patterns (not shown) via wiring patterns 34, 34 for wiring the heat radiation patterns 32, 32, respectively. It can be diffused over the entire surface of the printed wiring board 21. Thereby, the temperature rise of not only the electronic component 22 but also other electronic components (not shown) is suppressed, and the factor of failure of the electronic component (including other electronic components) 22 can be reduced, and the durability and reliability are improved. I do.

Next, another embodiment of the electronic component heat dissipation structure of the printed wiring board which has the same effect as the first and second embodiments in which the heat dissipation effect of the heat generated from the electronic component due to the power loss is improved. FIG. 3 shows a third embodiment of the present invention.
This will be described with reference to the structural diagram of FIG.

In the structural diagram of FIG. 3, a substrate material having thermal conductivity, for example, a composite epoxy resin laminate (CEM-3) similar to the first and second embodiments of the present invention, a glass epoxy material and the like are used. On the surface of the printed wiring board 41 of the electric device, lands made of copper foil used for connection or attachment of the electronic components, here two lands 50, 50
Are formed on the lands 50, 50, and electronic components including, for example, a resistor, a capacitor, a power element, and the like similar to those of the first and second embodiments of the present invention. 42 electrodes are attached with solders 51,51. Also, the lands 50, 50 are connected to electrodes of another electronic component different from the electronic component 42 by solder via patterns (hereinafter, referred to as wiring patterns) 53, 53 made of copper foil and coated with a resist. Each of the other lands is wired (not shown). Further, the wiring patterns 53, 53 are used to radiate heat generated from the electronic component 42 due to power loss, and the radiating patterns 52, 52 made of copper foil formed on the back surface of the printed wiring board 51 and the lands. Plating, for example, copper-plated through-holes 54, 54 are formed in the inner walls for connecting to 50 (including other lands).

In the electronic component heat dissipation structure of the printed wiring board according to the third embodiment of the present invention, the heat generated from the electronic component 42 due to the power loss is reduced by the printed wiring board 4.
The electrodes of the electronic component 42 formed on the surface of
Lands 50, 50, wiring pattern 5 attached in 1
3, 53, the through holes 54, 54 formed in the wiring patterns 53, 53, and the printed wiring board 41, respectively, are transmitted to the heat radiation patterns 52, 52 formed on the back surface of the printed wiring board 41, respectively. The heat is radiated from the heat radiating patterns 52 and 52 into the atmosphere. As a result, the temperature of the electronic component 42 (component temperature) can be reduced, for example, by 20 to 50 ° C., as compared with the related art in which no effective heat radiation means is provided, and the heat generated from the electronic component 42 due to power loss Can be efficiently radiated into the atmosphere, and the electronic components 42
In addition, abnormal temperature rise of other electronic components (not shown) is suppressed, and the cause of failure of the electronic component (including other electronic components) 42 can be reduced, thereby improving durability and reliability.

In each of the above-described embodiments, the heat radiation pattern used to enhance the heat radiation effect of the heat generated from the electronic components due to the power loss is provided on the lands 10 and 10 formed on the surface of the printed wiring board 1. The heat radiation patterns 12 and 12 provided so as to be in contact with each other (first embodiment), and the heat radiation patterns 32 and 32 formed on the surface of the printed wiring board 21 separately from the lands 30 and 30 (second embodiment) Example), a heat radiation pattern 52 formed on the back surface of the printed wiring board 41,
52 (third embodiment) is used in a different manner, but by using the various heat radiation patterns used in these embodiments in combination, the heat generated from the electronic components due to the power loss can be reduced. Irrespective of the front surface or the back surface of the wiring board, the heat dissipation effect can be further enhanced (not described in detail).

[0022]

As is apparent from the above description, according to the electronic component heat radiation structure of the printed wiring board of the present invention, the heat generated from the electronic component due to the power loss is reduced by the printed wiring board on which the electronic component is mounted. The heat is transmitted to the heat radiation pattern formed on the front surface or the rear surface, and heat can be efficiently released from the heat radiation pattern into the atmosphere. As a result, an abnormal rise in temperature of the electronic component is suppressed, and the cause of failure of the electronic component can be reduced, thereby improving durability and reliability.

[Brief description of the drawings]

FIG. 1 is a structural view showing an electronic component heat radiation structure of a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a structural view showing a heat dissipation structure of electronic components of a printed wiring board according to a second embodiment of the present invention.

FIG. 3 is a structural diagram showing a heat radiation structure of electronic components of a printed wiring board according to a third embodiment of the present invention.

FIG. 4 is a structural view showing an electronic component mounting structure of a printed wiring board as a conventional example.

[Explanation of symbols]

1, 21, 41: Printed wiring board of electronic equipment 2, 22, 42: Electronic component 10, 30, 50: Land 11, 31, 51: Solder 12, 32, 52 ... heat radiation pattern 13, 33, 34, 53 ... pattern (wiring pattern) 54 ... through hole

Claims (3)

[Claims] An electronic component (2) that generates heat by mounting solder (11) on a land (10) of a printed wiring board (1) of an electric device, and wiring the electronic component in a pattern (13). An electronic component heat radiation structure for a wiring board, wherein a heat radiation pattern (12) is provided on the land, and the surface area of the heat radiation pattern is set to 2 to 4 times the surface area of the land, thereby generating the electronic component. A heat radiation structure for an electronic component of a printed wiring board, wherein the heat radiation is transmitted to the heat radiation pattern to enhance the heat radiation effect. 2. An electronic component (22) that generates heat by mounting solder (31) on a land (30) of a printed wiring board (21) of an electric device, and attaching the electronic component to a pattern (33, 3).
4) The electronic component heat dissipation structure of the printed wiring board to be wired in 4), wherein a heat dissipation pattern (32) is provided separately from a land on which the electronic component of the printed wiring board is mounted, and the land is formed by the pattern for the heat dissipation. An electronic component heat dissipation structure for a printed wiring board, wherein heat generated from the electronic component is transmitted to the heat dissipation pattern by wiring in a pattern to enhance a heat dissipation effect. 3. A printed circuit in which a solder (51) is placed on a land (50) of a printed wiring board (41) of an electric device, an electronic component (42) that generates heat is attached, and the electronic component is wired in a pattern (53). An electronic component heat radiation structure for a wiring board, wherein the pattern of the printed wiring board has a through hole (5
4), a heat radiation pattern (52) is provided on the back surface of the printed wiring board, and the land is connected to the heat radiation pattern from the pattern via the through hole, so that heat generated from the electronic component is obtained. The printed circuit board electronic component heat dissipation structure, wherein the heat dissipation effect is enhanced by transmitting the heat to the heat dissipation pattern.