JPH0758426A - Electronic part mounting board - Google Patents
Electronic part mounting boardInfo
- Publication number
- JPH0758426A JPH0758426A JP22056893A JP22056893A JPH0758426A JP H0758426 A JPH0758426 A JP H0758426A JP 22056893 A JP22056893 A JP 22056893A JP 22056893 A JP22056893 A JP 22056893A JP H0758426 A JPH0758426 A JP H0758426A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- component mounting
- hole
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，放熱性に優れ，高密度
実装化を図ることができる電子部品搭載用基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for mounting electronic parts, which has excellent heat dissipation and enables high-density mounting.
【０００２】[0002]
【従来技術】従来，電子部品搭載用基板としては，図７
に示すごとく，絶縁基板９４と，該絶縁基板９４の表側
面を覆う放熱板９３とを有し，上記絶縁基板９４には主
電子部品９２を搭載するための貫通穴９６を設け，ま
た，放熱板９３にはスルーホール９４５及びそのランド
９４６よりも大きい穴９３０を設けたピングリッドアレ
イが提案されている（特開昭６０−１８７０９８号公
報）。2. Description of the Related Art Conventionally, as a substrate for mounting electronic parts, FIG.
As shown in FIG. 3, the insulating substrate 94 and the heat dissipation plate 93 covering the front and side surfaces of the insulating substrate 94 are provided, the insulating substrate 94 is provided with through holes 96 for mounting the main electronic components 92, and heat dissipation is performed. A pin grid array having a through hole 945 and a hole 930 larger than the land 946 is proposed in the plate 93 (Japanese Patent Laid-Open No. 60-187098).
【０００３】上記貫通穴９６の中における，放熱板９３
の裏側面には，搭載用パッド９２１が形成されている。
該搭載用パッド９２１の上には，主電子部品９２が接着
されている。主電子部品９２は，ワイヤー９２０を介し
て，絶縁基板９４の裏側面に形成された回路パターン９
７と電気的に接続されている。上記スルーホール９４５
の内壁は，メッキ膜９４０により被覆されており，その
内部には外部接続用の入出力ピン９８が挿着されてい
る。上記放熱板９３は，接着剤９２４により，絶縁基板
９４の表側面に接着されている。A heat dissipation plate 93 in the through hole 96
A mounting pad 921 is formed on the back side surface of the.
The main electronic component 92 is bonded onto the mounting pad 921. The main electronic component 92 includes the circuit pattern 9 formed on the back surface of the insulating substrate 94 via the wire 920.
7 is electrically connected. Through hole 945
The inner wall of is covered with a plating film 940, and an input / output pin 98 for external connection is inserted in the inside thereof. The heat dissipation plate 93 is adhered to the front side surface of the insulating substrate 94 with an adhesive 924.
【０００４】上記電子部品搭載用基板においては，絶縁
基板９４の表側面全体が放熱板９３により覆われている
ため，熱放散性が良い。また，放熱板９３には，スルー
ホール９４５及びそのランド９４６を設ける位置に，こ
れらよりも大きい穴９３０を設けている。そのため，放
熱板９３とスルーホール９４５及びそのランド９４６と
は，電気的に短絡することがない。In the above electronic component mounting substrate, the entire front surface of the insulating substrate 94 is covered with the heat dissipation plate 93, so that the heat dissipation property is good. Further, in the heat dissipation plate 93, a hole 930 larger than these is provided at a position where the through hole 945 and the land 946 thereof are provided. Therefore, the heat dissipation plate 93, the through hole 945, and the land 946 thereof are not electrically short-circuited.
【０００５】ところで，近年においては，高密度実装化
へ対応するために，絶縁基板の表側面にも電子部品を搭
載したいという要望がある。しかし，上記電子部品搭載
用基板においては，その表側面全面が放熱板により覆わ
れているため，絶縁基板の表側面に電子部品を搭載する
ことができない。By the way, in recent years, in order to cope with high-density mounting, there is a demand for mounting electronic components also on the front surface of the insulating substrate. However, in the electronic component mounting board, the entire front surface is covered with the heat dissipation plate, so that the electronic component cannot be mounted on the front surface of the insulating substrate.
【０００６】そこで，図８，図９に示す電子部品搭載用
基板が考えられる。即ち，該電子部品搭載用基板におい
ては，絶縁基板９４の貫通穴９６よりも大きい放熱板９
３が，上記貫通穴９６の表側面周縁部に接着剤９２４に
より接着されている。絶縁基板９４の表側面における，
放熱板９３により覆われていない部分には，副電子部品
搭載部９１０が形成されている。該副電子部品搭載部９
１０の上には，チップコンデンサ，抵抗体等の副電子部
品９１が半田９１１により固定されている。Therefore, the electronic component mounting substrates shown in FIGS. 8 and 9 can be considered. That is, in the electronic component mounting board, the heat dissipation plate 9 larger than the through hole 96 of the insulating board 94 is used.
3 is adhered to the peripheral portion of the front surface of the through hole 96 with an adhesive 924. On the front surface of the insulating substrate 94,
A sub electronic component mounting portion 910 is formed in a portion not covered by the heat dissipation plate 93. The sub electronic component mounting section 9
Sub electronic components 91 such as a chip capacitor and a resistor are fixed on the top 10 by solder 911.
【０００７】また，上記副電子部品搭載部９１０の下に
は，メッキ膜９４０により覆われたスルーホール９４５
が形成されている。副電子部品９１は，半田９１１，副
電子部品搭載部９１０，及びスルーホール９４５のメッ
キ膜９４０を介して，該スルーホール９４５内に挿着さ
れた入出力ピン９８と電気的に接続している。上記電子
部品搭載用基板は，その表側面及び裏側面の両面に電子
部品を搭載しているため，高密度実装化に対応した回路
基板といえる。A through hole 945 covered with a plating film 940 is provided under the sub electronic component mounting portion 910.
Are formed. The sub electronic component 91 is electrically connected to the input / output pin 98 inserted in the through hole 945 through the solder 911, the sub electronic component mounting portion 910, and the plated film 940 of the through hole 945. . Since the electronic component mounting board has electronic components mounted on both the front and back surfaces thereof, it can be said to be a circuit board compatible with high-density mounting.
【０００８】[0008]
【解決しようとする課題】しかしながら，上記電子部品
搭載用基板においては，その表側面に副電子部品９１が
搭載されてるため，放熱板９３は，絶縁基板９４全体を
覆うことができず，放熱性が不十分である。However, since the sub-electronic component 91 is mounted on the front side surface of the electronic component mounting substrate, the heat dissipation plate 93 cannot cover the entire insulating substrate 94, resulting in heat dissipation. Is insufficient.
【０００９】また，図１０に示すごとく，回路パターン
の高密度化のために，２枚の絶縁基板９４，９５を積層
した回路基板９もあるが，この場合においても，上記と
同様の問題がある。本発明はかかる従来の問題点に鑑
み，放熱性に優れ，高密度実装化を図ることができる電
子部品搭載用基板を提供しようとするものである。Further, as shown in FIG. 10, there is a circuit board 9 in which two insulating boards 94 and 95 are laminated in order to increase the density of the circuit pattern, but in this case, the same problem as described above is also caused. is there. In view of the above conventional problems, the present invention is to provide an electronic component mounting substrate which has excellent heat dissipation and enables high-density mounting.
【００１０】[0010]
【課題の解決手段】本発明は，回路パターン及び主電子
部品搭載部を設けた回路基板と，該回路基板の表側面の
全面に設けた放熱板とを有し，該放熱板は，１又は複数
の貫通又は非貫通の副電子部品搭載穴を有し，該貫通穴
の内部において，上記回路基板の表側面に副電子部品を
搭載してなることを特徴とする電子部品搭載用基板にあ
る。According to the present invention, there is provided a circuit board having a circuit pattern and a main electronic component mounting portion, and a heat radiating plate provided on the entire front surface of the circuit board. There is provided a plurality of penetrating or non-penetrating sub electronic component mounting holes, and the sub electronic component is mounted on the front side surface of the circuit board inside the through holes. .
【００１１】本発明において最も注目すべきことは，回
路基板の表側面全面を放熱板により覆うこと，及び放熱
板は副電子部品を搭載するための貫通又は非貫通の副電
子部品搭載穴を有することである。上記副電子部品搭載
穴は，放熱板を貫通する貫通穴，又は放熱板に凹状に形
成された非貫通穴である。上記回路基板は，その表側面
又は裏側面に設けた回路パターンと，回路基板を貫通し
てなるスルーホールとを有する。What is most noticeable in the present invention is that the entire front surface of the circuit board is covered with a heat radiating plate, and the heat radiating plate has a penetrating or non-penetrating sub electronic component mounting hole for mounting a sub electronic component. That is. The sub electronic component mounting hole is a through hole penetrating the heat dissipation plate or a non-through hole formed in the heat dissipation plate in a concave shape. The circuit board has a circuit pattern provided on the front side surface or the back side surface thereof and a through hole penetrating the circuit board.
【００１２】上記回路基板の表側面全体には，上記放熱
板を設けている。そして，回路基板の表側面において，
放熱板の貫通穴の中には，回路基板の表側面に副電子部
品が搭載されている。上記副電子部品は，半田等によ
り，上記スルーホール等を介して他の基板と導通してい
る。また，回路基板の裏側面には，主電子部品を搭載す
るための主電子部品搭載部を設けている。主電子部品
は，ワイヤー等により回路パターンと電気的に接続され
ており，更に上記スルーホール等を介して他の基板と導
通している。The heat dissipation plate is provided on the entire front surface of the circuit board. And on the front side of the circuit board,
Sub electronic components are mounted on the front surface of the circuit board in the through holes of the heat sink. The sub electronic component is electrically connected to another substrate through the through hole or the like by solder or the like. Further, a main electronic component mounting portion for mounting the main electronic component is provided on the back side of the circuit board. The main electronic component is electrically connected to the circuit pattern by a wire or the like, and is electrically connected to another substrate through the through hole or the like.
【００１３】上記回路基板は，１又は２以上の絶縁基板
からなる。回路基板が複数枚の絶縁基板を積層したもの
である場合には，各絶縁基板の間に内部用の回路パター
ンを形成することができる。上記絶縁基板は，有機系樹
脂素材からなるプリント配線基板である。代表的なもの
はガラスエポキシ樹脂基板，紙フェノール樹脂基板，紙
エポキシ樹脂基板，ガラスポリイミド樹脂基板，ガラス
トリアジン樹脂基板などである。The circuit board is composed of one or more insulating boards. When the circuit board is formed by laminating a plurality of insulating boards, an internal circuit pattern can be formed between the insulating boards. The insulating substrate is a printed wiring board made of an organic resin material. Typical examples are a glass epoxy resin substrate, a paper phenol resin substrate, a paper epoxy resin substrate, a glass polyimide resin substrate, and a glass triazine resin substrate.
【００１４】上記放熱板は金属板であり銅，銅合金，
鉄，鉄合金，アルミニウム，アルミニウム合金などの比
較的熱伝導率が高い金属板が望ましく，必要に応じて金
属板表面に金属メッキを行ってもよい。上記絶縁基板と
放熱板とを接着するための接着剤としては，未硬化のエ
ポキシ樹脂含浸のガラスクロス，又は耐熱性の接着シー
ト，又は液状の樹脂などを用いる。The heat dissipation plate is a metal plate made of copper, copper alloy,
A metal plate having a relatively high thermal conductivity such as iron, iron alloy, aluminum, aluminum alloy or the like is desirable, and the metal plate surface may be metal-plated if necessary. An uncured epoxy resin-impregnated glass cloth, a heat-resistant adhesive sheet, a liquid resin, or the like is used as an adhesive for adhering the insulating substrate and the heat dissipation plate.
【００１５】上記回路基板は，スルーホールを有し，該
スルーホールには放熱板を設けていない裏側面に外部接
続用の入出力ピンが挿着されていてもよい。かかる回路
基板を有する電子部品搭載用基板は，ピングリッドアレ
イである。また，回路基板の裏側面には，外部接続用の
ランド（接続用パッド）が設けられていても良い。The circuit board may have a through hole, and an input / output pin for external connection may be attached to a back side surface of the through hole where no heat dissipation plate is provided. The electronic component mounting board having such a circuit board is a pin grid array. Further, a land (connection pad) for external connection may be provided on the back side surface of the circuit board.
【００１６】更に，ランドの表面には，半田等の金属バ
ンプが形成されていることが好ましい。このランドは，
上記金属バンプによりマザーボードのランドに接着され
る。上記ランドを有する電子部品搭載用基板は，ランド
グリッドアレイである。上記主電子部品としては，半導
体ＩＣチップ等がある。上記副電子部品としては，チッ
プコンデンサー，抵抗体，チップコイル等がある。Further, it is preferable that metal bumps such as solder are formed on the surface of the land. This land is
The metal bumps adhere to the land of the motherboard. The electronic component mounting board having the land is a land grid array. As the main electronic component, there is a semiconductor IC chip or the like. Examples of the sub electronic component include a chip capacitor, a resistor, and a chip coil.
【００１７】上記電子部品搭載用基板を製造するに当た
っては，例えば，予め副電子部品搭載穴を設けた放熱板
を準備し，これを回路基板の表側面に接着した後に，上
記副電子部品搭載穴内の副電子部品搭載部に副電子部品
を搭載する。また，先に副電子部品を回路基板に搭載
し，その後回路基板の表側面に，副電子部品搭載穴を設
けた放熱板を接着することができる。In manufacturing the above-mentioned electronic component mounting board, for example, a heat radiating plate provided with a sub electronic component mounting hole in advance is prepared, and this is adhered to the front surface of the circuit board, and then the sub electronic component mounting hole The sub electronic component is mounted on the sub electronic component mounting section of. In addition, the sub electronic component can be mounted on the circuit board first, and then the heat dissipation plate having the sub electronic component mounting hole can be attached to the front surface of the circuit board.
【００１８】[0018]
【作用及び効果】本発明の電子部品搭載用基板において
は，回路基板の表側面全面が，放熱性の良い放熱板によ
り覆われている。そのため，主電子部品及び副電子部品
から発生する熱を効率良く外方へ放熱することができ，
放熱性に優れている。In the electronic component mounting board of the present invention, the entire front surface of the circuit board is covered with a heat dissipation plate having a good heat dissipation property. Therefore, the heat generated from the main electronic component and the sub electronic component can be efficiently dissipated to the outside,
Excellent heat dissipation.
【００１９】また，放熱板は副電子部品を搭載するため
の副電子部品搭載穴を有する。そのため，回路基板の主
電子部品搭載部だけでなく，回路基板の表側面における
放熱板の副電子部品搭載穴の中にも，電子部品を搭載す
ることができる。それ故，電子部品の高密度実装化を図
ることができる。従って，本発明によれば，放熱性に優
れ，高密度実装化を図ることができる電子部品搭載用基
板を提供することができる。Further, the heat dissipation plate has a sub electronic component mounting hole for mounting the sub electronic component. Therefore, the electronic component can be mounted not only in the main electronic component mounting portion of the circuit board but also in the sub electronic component mounting hole of the heat dissipation plate on the front surface of the circuit board. Therefore, high density mounting of electronic components can be achieved. Therefore, according to the present invention, it is possible to provide an electronic component mounting board which has excellent heat dissipation and can be mounted in a high density.
【００２０】[0020]
【実施例】実施例１ 本発明にかかる電子部品搭載用基板について，図１〜図
３を用いて説明する。本例の電子部品搭載用基板は，図
１，図２に示すごとく，回路パターン５３及び主電子部
品搭載部３１を設けた回路基板７と，該回路基板７の表
側面全面に設けた放熱板１とを有する。放熱板１は，図
２に示すごとく，副電子部品搭載用の６個の副電子部品
搭載穴１０を有している。上記副電子部品搭載穴１０
は，放熱板１を貫通する貫通穴であり，その内部には，
上記回路基板７の表側面に副電子部品４が搭載されてい
る。EXAMPLE 1 An electronic component mounting board according to the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the electronic component mounting board of this example includes a circuit board 7 provided with a circuit pattern 53 and a main electronic component mounting portion 31, and a heat dissipation plate provided on the entire front side surface of the circuit board 7. 1 and. As shown in FIG. 2, the heat sink 1 has six sub electronic component mounting holes 10 for mounting sub electronic components. Sub electronic component mounting hole 10
Is a through hole that penetrates the heat sink 1, and
The sub electronic component 4 is mounted on the front surface of the circuit board 7.
【００２１】回路基板７は，その内部に設けた回路パタ
ーン５３と，回路基板７を貫通してなるスルーホール７
５とを有する。回路基板７の表側面には，上記副電子部
品搭載穴１０の中に副電子部品４を搭載するための副電
子部品搭載部４１を設けている。上記副電子部品４は，
図３に示すごとく，半田８により副電子部品搭載部４１
に接着されている。また，副電子部品４は，半田８及び
副電子部品搭載部４１を介して，スルーホール７５と導
通している。The circuit board 7 has a circuit pattern 53 provided therein and a through hole 7 penetrating the circuit board 7.
5 and. A sub electronic component mounting portion 41 for mounting the sub electronic component 4 in the sub electronic component mounting hole 10 is provided on the front side surface of the circuit board 7. The sub electronic component 4 is
As shown in FIG. 3, the sub electronic component mounting portion 41 is formed by the solder 8
Is glued to. The sub electronic component 4 is electrically connected to the through hole 75 via the solder 8 and the sub electronic component mounting portion 41.
【００２２】上記スルーホール７５は，図１に示すごと
く，回路基板７の裏側面に形成されたランド（接続用パ
ッド）５９と接続している。ランド５９の表面には，半
田等の金属バンプが形成されている。スルーホール７５
の内壁は，金属メッキにより被覆されている。また，回
路基板７の裏側面には，主電子部品３を搭載するための
主電子部品搭載部３１を設けている。The through hole 75 is connected to a land (connection pad) 59 formed on the back side surface of the circuit board 7, as shown in FIG. Metal bumps such as solder are formed on the surface of the land 59. Through hole 75
The inner wall of the is coated with metal plating. A main electronic component mounting portion 31 for mounting the main electronic component 3 is provided on the back side surface of the circuit board 7.
【００２３】主電子部品搭載部３１は，絶縁基板７１，
７２に穿設された貫通穴７１０，７２０と，該貫通穴７
２０をその表側面から覆う放熱板１と，該放熱板１の裏
側面に形成された搭載用パッド３５とよりなる。該搭載
用パッド３５の表面には，主電子部品３が接着されてい
る。主電子部品３は，図３に示すごとく，ワイヤー３０
により回路パターン５３と電気的に接続されており，更
に上記スルーホール７５及びランド５９を介して，マザ
ーボード６のランド６９と導通している。The main electronic component mounting portion 31 includes an insulating substrate 71,
Through holes 710 and 720 formed in the hole 72, and the through holes 7
The heat dissipation plate 1 covers the front surface 20 of the heat dissipation plate 20, and a mounting pad 35 formed on the back side surface of the heat dissipation plate 1. The main electronic component 3 is bonded to the surface of the mounting pad 35. The main electronic component 3 is a wire 30 as shown in FIG.
Is electrically connected to the circuit pattern 53, and is electrically connected to the land 69 of the mother board 6 through the through hole 75 and the land 59.
【００２４】上記回路基板７は，絶縁基板７１，７２を
積層したものであり，絶縁基板７１，７２の間には，主
電子部品３と導通している回路パターン５３が形成され
ている。上記絶縁基板７１，７２としては，ガラストリ
アジン基板を用いる。上記放熱板１としては，銅板にニ
ッケル及び金メッキを施した金属板を用いる。放熱板１
は，接着剤２により，絶縁基板７２の表側面に接着され
ている。The circuit board 7 is formed by laminating insulating boards 71 and 72, and a circuit pattern 53 which is electrically connected to the main electronic component 3 is formed between the insulating boards 71 and 72. A glass triazine substrate is used as the insulating substrates 71 and 72. As the heat dissipation plate 1, a metal plate obtained by plating a copper plate with nickel and gold is used. Heat sink 1
Are adhered to the front surface of the insulating substrate 72 with the adhesive 2.
【００２５】上記電子部品搭載用基板は，回路基板７の
裏側面にランド５９を設けたランドグリッドアレイであ
る。ランド５９は，図３に示すごとく，半田８によりマ
ザーボード６のランド６９に接合される。上記主電子部
品３は，半導体ＩＣチップである。上記副電子部品４
は，チップコンデンサである。The electronic component mounting board is a land grid array in which lands 59 are provided on the back side surface of the circuit board 7. The land 59 is joined to the land 69 of the mother board 6 by the solder 8 as shown in FIG. The main electronic component 3 is a semiconductor IC chip. Sub electronic component 4
Is a chip capacitor.
【００２６】次に，本例の作用効果について説明する。
本例の電子部品搭載用基板においては，回路基板７の表
側面全面が放熱板１により覆われている。そのため，主
電子部品３及び副電子部品４から発生する熱を効率良く
外方に放熱することができ，放熱性に優れている。Next, the function and effect of this example will be described.
In the electronic component mounting board of this example, the entire front surface of the circuit board 7 is covered with the heat dissipation plate 1. Therefore, the heat generated from the main electronic component 3 and the sub electronic component 4 can be efficiently radiated to the outside, and the heat radiation is excellent.
【００２７】また，放熱板１は副電子部品４を搭載する
ための副電子部品搭載穴１０を有する。そのため，回路
基板７の主電子部品搭載部３１だけではなく，回路基板
７の表側面における放熱板１の副電子部品搭載穴１０の
中にも，電子部品を搭載することができる。それ故，電
子部品の高密度実装化を図ることができる。Further, the heat dissipation plate 1 has a sub electronic component mounting hole 10 for mounting the sub electronic component 4. Therefore, the electronic component can be mounted not only in the main electronic component mounting portion 31 of the circuit board 7 but also in the sub electronic component mounting hole 10 of the heat dissipation plate 1 on the front surface of the circuit board 7. Therefore, high density mounting of electronic components can be achieved.
【００２８】実施例２ 本例の電子部品搭載用基板は，図４〜図５に示すごと
く，回路基板７のスルーホール７５内に外部接続用の入
出力ピン５５を挿着したピングリッドアレイである。副
電子部品４は，半田８，副電子部品搭載部４１，及びス
ルーホール７５を介して，入出力ピン５５と導通してい
る。入出力ピン５５の下先端部は，マザーボードのスル
ーホールに挿着される。その他は，実施例１と同様であ
る。本例においても，実施例１と同様の効果を得ること
ができる。Embodiment 2 As shown in FIGS. 4 to 5, the electronic component mounting board of this embodiment is a pin grid array in which input / output pins 55 for external connection are inserted in through holes 75 of the circuit board 7. is there. The sub electronic component 4 is electrically connected to the input / output pin 55 via the solder 8, the sub electronic component mounting portion 41, and the through hole 75. The lower tip of the input / output pin 55 is inserted into the through hole of the motherboard. Others are the same as in the first embodiment. Also in this example, the same effect as that of the first embodiment can be obtained.
【００２９】実施例３ 本例においては，図６に示すごとく，放熱板１に副電子
部品搭載穴１１０が形成されている。該副電子部品搭載
穴１１０は，凹状に窪んだ非貫通穴であり，その内部に
は，回路基板７の表側面に副電子部品４が搭載されてい
る。その他は，実施例１と同様である。本例の電子部品
搭載用基板は，実施例１と同様の効果を有すると共に，
特に副電子部品と外部との絶縁性が向上する。Embodiment 3 In this embodiment, as shown in FIG. 6, the radiator plate 1 is provided with a sub electronic component mounting hole 110. The sub electronic component mounting hole 110 is a non-through hole that is recessed in a concave shape, and the sub electronic component 4 is mounted on the front side surface of the circuit board 7 inside thereof. Others are the same as in the first embodiment. The electronic component mounting substrate of this example has the same effect as that of the first embodiment, and
In particular, the insulation between the sub electronic component and the outside is improved.
【図１】実施例１の電子部品搭載用基板の断面図。FIG. 1 is a sectional view of an electronic component mounting board according to a first embodiment.
【図２】実施例１の電子部品搭載用基板の斜視図。FIG. 2 is a perspective view of the electronic component mounting board according to the first embodiment.
【図３】実施例１における，マザーボードに搭載した電
子部品搭載用基板の断面図。FIG. 3 is a cross-sectional view of an electronic component mounting board mounted on a motherboard according to the first embodiment.
【図４】実施例２の電子部品搭載用基板の斜視図。FIG. 4 is a perspective view of an electronic component mounting board according to a second embodiment.
【図５】実施例２の電子部品搭載用基板の部分拡大断面
図。FIG. 5 is a partially enlarged cross-sectional view of the electronic component mounting board of the second embodiment.
【図６】実施例３の電子部品搭載用基板の部分拡大断面
図。FIG. 6 is a partially enlarged cross-sectional view of an electronic component mounting board according to a third embodiment.
【図７】従来例の電子部品搭載用基板の断面図。FIG. 7 is a cross-sectional view of a conventional electronic component mounting substrate.
【図８】従来例の，他の電子部品搭載用基板の斜視図。FIG. 8 is a perspective view of another electronic component mounting substrate of a conventional example.
【図９】従来例の，他の電子部品搭載用基板の断面図FIG. 9 is a cross-sectional view of another conventional electronic component mounting substrate.
【図１０】従来例の，その他の電子部品搭載用基板の断
面図。FIG. 10 is a cross-sectional view of another conventional electronic component mounting substrate.
１．．．放熱板， １０，１１０．．．副電子部品搭載穴， ２．．．接着剤， ３．．．主電子部品， ３１．．．主電子部品搭載部， ４．．．副電子部品 ４１．．．副電子部品搭載部， ５３．．．回路パターン， ５９．．．ランド， ６．．．マザーボード， ７．．．回路基板， ７５．．．スルーホール， 1. ． ． Heat sink, 10,110. ． ． Sub electronic component mounting hole, 2. ． ． Adhesive, 3. ． ． Main electronic components, 31. ． ． Main electronic component mounting section, 4. ． ． Sub electronic component 41. ． ． Sub electronic component mounting part, 53. ． ． Circuit pattern, 59. ． ． Land, 6. ． ． Motherboard, 7. ． ． Circuit board, 75. ． ． Through hole,
Claims (4)
けた回路基板と，該回路基板の表側面の全面に設けた放
熱板とを有し， 該放熱板は，１又は複数の貫通又は非貫通の副電子部品
搭載穴を有し，該貫通穴の内部において，上記回路基板
の表側面に副電子部品を搭載してなることを特徴とする
電子部品搭載用基板。1. A circuit board having a circuit pattern and a main electronic component mounting portion, and a heat radiating plate provided on the entire front surface of the circuit board, wherein the heat radiating plate has one or a plurality of through holes or non-holes. An electronic component mounting board having a penetrating sub electronic component mounting hole, wherein the sub electronic component is mounted on the front surface of the circuit board inside the through hole.
ールを有し，該スルーホールには放熱板を設けていない
裏側面に外部接続用の入出力ピンが挿着されていること
を特徴とする電子部品搭載用基板。2. The circuit board according to claim 1, wherein the circuit board has a through hole, and an input / output pin for external connection is attached to a back side surface of the through hole which is not provided with a heat dissipation plate. Substrate for mounting electronic components.
は，外部接続用のランドが設けられていることを特徴と
する電子部品搭載用基板。3. The electronic component mounting board according to claim 1, wherein a land for external connection is provided on a back side surface of the circuit board.
は，半田等の金属バンプが形成されていることを特徴と
する電子部品搭載用基板。4. The electronic component mounting substrate according to claim 3, wherein metal bumps such as solder are formed on the surface of the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22056893A JPH0758426A (en) | 1993-08-11 | 1993-08-11 | Electronic part mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22056893A JPH0758426A (en) | 1993-08-11 | 1993-08-11 | Electronic part mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0758426A true JPH0758426A (en) | 1995-03-03 |
Family
ID=16753034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22056893A Pending JPH0758426A (en) | 1993-08-11 | 1993-08-11 | Electronic part mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758426A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014854A (en) * | 2009-07-02 | 2011-01-20 | Samsung Electro-Mechanics Co Ltd | Ceramic laminate module and method of manufacturing the same |
-
1993
- 1993-08-11 JP JP22056893A patent/JPH0758426A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014854A (en) * | 2009-07-02 | 2011-01-20 | Samsung Electro-Mechanics Co Ltd | Ceramic laminate module and method of manufacturing the same |
| US8307546B2 (en) | 2009-07-02 | 2012-11-13 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing a ceramic elements module |
| US9374885B2 (en) | 2009-07-02 | 2016-06-21 | Samsung Electro-Mechanics Co., Ltd. | Ceramic elements module |
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