JPH0629421A - Electronic parts mounting board - Google Patents
Electronic parts mounting boardInfo
- Publication number
- JPH0629421A JPH0629421A JP4206062A JP20606292A JPH0629421A JP H0629421 A JPH0629421 A JP H0629421A JP 4206062 A JP4206062 A JP 4206062A JP 20606292 A JP20606292 A JP 20606292A JP H0629421 A JPH0629421 A JP H0629421A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- recess
- protrusion
- insulating substrate
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，電子部品を正確に位置
決めすることができる電子部品搭載用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for mounting electronic parts on which electronic parts can be accurately positioned.
【０００２】[0002]
【従来技術】電子部品搭載用基板は，電子部品を搭載す
ると共に，電子部品の電気信号を，他の基板に送信する
ものである。 従来，例えば電子部品搭載用基板は，絶縁基板と，該絶
縁基板に設けた電子部品搭載用の凹部とを有する。電子
部品搭載用基板の表面には，導体回路が形成されてい
る。凹部には電子部品が搭載され，電子部品と導体回路
とはボンディングワイヤーにより接続される（特開昭６
１−６５４９０号公報）。2. Description of the Related Art An electronic component mounting board is for mounting an electronic component and transmitting an electric signal of the electronic component to another substrate. Conventionally, for example, an electronic component mounting substrate has an insulating substrate and an electronic component mounting recess provided on the insulating substrate. Conductor circuits are formed on the surface of the electronic component mounting board. An electronic component is mounted in the recess, and the electronic component and the conductor circuit are connected by a bonding wire (Japanese Unexamined Patent Application Publication No. Sho-6).
1-65490).
【０００３】[0003]
【解決しようとする課題】ところで，上記凹部は，電子
部品の大きさよりも，通常１ｍｍ〜３ｍｍ大きく開口し
ている。そのため，電子部品を凹部内に配置固定する場
合，その位置ずれが生じる。特に，近年は，電子部品搭
載用基板の高密度実装化が必要とされている。そのた
め，この位置ずれは，高密度に実装された電子部品搭載
用基板の性能を大きく低下させることになる。By the way, the above-mentioned recess is normally opened by 1 mm to 3 mm larger than the size of the electronic component. Therefore, when the electronic component is placed and fixed in the recess, the position shift occurs. In particular, in recent years, high density mounting of electronic component mounting boards has been required. Therefore, this misalignment significantly deteriorates the performance of the electronic component mounting board mounted with high density.
【０００４】また，電子部品の位置ずれは，ワイヤーボ
ンディングの際におけるワイヤーの接続不良の原因とな
る。本発明は，かかる問題点に鑑み，電子部品を正確に
位置決めすることができる電子部品搭載用基板を提供し
ようとするものである。Further, the displacement of the electronic components causes a defective connection of the wires during wire bonding. In view of such a problem, the present invention is to provide an electronic component mounting board that can accurately position an electronic component.
【０００５】[0005]
【課題の解決手段】本発明は，絶縁基板と該絶縁基板に
設けた電子部品搭載用の凹部を有する電子部品搭載用基
板において，上記凹部には，電子部品位置決め用の突出
部を設けたことを特徴とする電子部品搭載用基板にあ
る。本発明において最も注目すべきことは，電子部品搭
載用の凹部に，電子部品位置決め用の突出部を設けたこ
とである。According to the present invention, there is provided an electronic component mounting board having an insulating substrate and a concave portion for mounting electronic components provided on the insulating substrate, wherein the concave portion is provided with a protrusion for positioning an electronic component. The electronic component mounting board is characterized by What is most noticeable in the present invention is that the recess for mounting the electronic component is provided with the protrusion for positioning the electronic component.
【０００６】凹部は，通常，四角形状に開口している。
上記突出部は，凹部の開口面に各辺少なくとも１箇所以
上形成されている。突出部の先端には，平面状の突出面
が形成されている。該突出面は，電子部品の側面を所定
の位置に支持，位置決めする形状に形成されている。The recess is usually opened in a square shape.
The protrusions are formed at least at one location on each side of the opening surface of the recess. A planar protruding surface is formed at the tip of the protruding portion. The protruding surface is formed in a shape that supports and positions the side surface of the electronic component at a predetermined position.
【０００７】突出部を形成するに当たっては，ルーター
加工により上記凹部を形成するときに，所望する突出部
の形状に絶縁基板を残す。この場合には，上記突出部は
絶縁基板に一体的に形成されることになる。また，突出
部は，絶縁基板と別個に作製し，これを上記凹部内に配
設，固定することもできる。In forming the protrusion, the insulating substrate is left in a desired shape of the protrusion when the recess is formed by router processing. In this case, the protrusion is integrally formed on the insulating substrate. Alternatively, the protrusion may be formed separately from the insulating substrate, and the protrusion may be disposed and fixed in the recess.
【０００８】[0008]
【作用及び効果】本発明の電子部品搭載用基板は，電子
部品搭載用の凹部に，電子部品の側面を支持する形状
の，電子部品位置決め用の突出部を設けている。そのた
め，上記凹部の内部に，電子部品を正確に位置決めする
ことができる。以上のごとく，本発明によれば，電子部
品を正確に位置決めすることができる電子部品搭載用基
板を提供することができる。In the electronic component mounting board of the present invention, the electronic component mounting concave portion is provided with the electronic component positioning protrusion having a shape for supporting the side surface of the electronic component. Therefore, the electronic component can be accurately positioned inside the recess. As described above, according to the present invention, it is possible to provide an electronic component mounting board capable of accurately positioning an electronic component.
【０００９】[0009]
【実施例】実施例１ 本発明にかかる実施例につき，図１〜図３を用いて説明
する。本例の電子部品搭載用基板は，図１，図２に示す
ごとく，絶縁基板９と，該絶縁基板９の表面側に設けら
れた電子部品搭載用の凹部１及び導体回路５２を有す
る。上記凹部１は，図１〜図３に示すごとく，四角形状
に開口し，電子部品位置決め用の突出部１０を設けてい
る。EXAMPLES Example 1 An example according to the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the electronic component mounting substrate of this example has an insulating substrate 9, and a recess 1 for mounting electronic components and a conductor circuit 52 provided on the front surface side of the insulating substrate 9. As shown in FIGS. 1 to 3, the recess 1 is opened in a quadrangular shape, and a protrusion 10 for positioning an electronic component is provided.
【００１０】突出部１０は，凹部１の開口面９０の下方
に各辺の中央に１箇所ずつ形成されている。突出部１０
の先端には，平面状の突出面１００が形成されている。
突出部１０を形成するに当たっては，絶縁基板９にルー
ター加工により凹部１を形成するときに，突出部１０の
形成部分を残す。電子部品３は，凹部１の底面１９に銀
ペースト４９により接着固定される。The projecting portion 10 is formed below the opening surface 90 of the recess 1 at one position at the center of each side. Protrusion 10
A planar protruding surface 100 is formed at the tip of the.
In forming the protrusion 10, when forming the recess 1 in the insulating substrate 9 by router processing, the portion where the protrusion 10 is formed is left. The electronic component 3 is adhesively fixed to the bottom surface 19 of the recess 1 with a silver paste 49.
【００１１】絶縁基板９の表面側には，導体回路５２が
形成されている。凹部付近における導体回路５２の先端
には，ボンディングパッド５２０が設けられている（図
３）。ボンディングパッド５２０は，凹部１に搭載され
る電子部品３と，ボンディングワイヤー５９を介して接
続される。A conductor circuit 52 is formed on the surface side of the insulating substrate 9. A bonding pad 520 is provided at the tip of the conductor circuit 52 near the recess (FIG. 3). The bonding pad 520 is connected to the electronic component 3 mounted in the recess 1 via the bonding wire 59.
【００１２】絶縁基板９の裏面側には，電子部品３から
発生する熱を発散させるための，銅箔にＮｉ／Ａｕメッ
キを施した金属箔５０を設けている。絶縁基板７の表面
は，凹部１，ボンディングパッド５２０，スルーホール
９５，及び金属箔５０を除いて，ソルダーレジスト２が
被覆されている。On the back side of the insulating substrate 9, there is provided a metal foil 50 made by plating Ni / Au on a copper foil for radiating heat generated from the electronic component 3. The surface of the insulating substrate 7 is covered with the solder resist 2 except for the recesses 1, the bonding pads 520, the through holes 95, and the metal foil 50.
【００１３】凹部１の周辺部におけるソルダーレジスト
２の上には，樹脂封止用枠２２が設けられている。該樹
脂封止用枠２２は，凹部１内に充填される樹脂の流出を
防止するためのものである。絶縁基板９には，スルーホ
ール９５が貫通して設けられている。スルーホール９５
には，図２に示すごとく，リードピン５５が挿入され
る。本例の電子部品搭載用基板は，凹部１がリードピン
５５の脚部５５１と反対側に設けられたフェースアップ
型である。A resin sealing frame 22 is provided on the solder resist 2 in the peripheral portion of the recess 1. The resin sealing frame 22 is for preventing the resin filled in the recess 1 from flowing out. A through hole 95 is provided through the insulating substrate 9. Through hole 95
As shown in FIG. 2, the lead pin 55 is inserted into the. The electronic component mounting substrate of this example is a face-up type in which the recess 1 is provided on the side opposite to the leg 551 of the lead pin 55.
【００１４】次に，本例の作用効果につき説明する。本
例の電子部品搭載用基板においては，電子部品搭載用の
凹部１に，電子部品３の側面３０を支持する形状に成形
された，突出部１０を設けている。また，該突出部１０
の突出面１００は，電子部品３の側面３０を隙間なく支
持する形状に成形されている。そのため，突出部１０
は，電子部品３を正確に位置決めすることができる。ま
た，突出部１０の突出面１００は，凹部１の開口面９０
よりも内側に形成されている。そのため，凹部１に電子
部品３を容易に搭載することができる。Next, the function and effect of this example will be described. In the electronic component mounting substrate of this example, the recessed portion 1 for mounting the electronic component is provided with the protruding portion 10 formed in a shape that supports the side surface 30 of the electronic component 3. Also, the protrusion 10
The protruding surface 100 is formed in a shape that supports the side surface 30 of the electronic component 3 without a gap. Therefore, the protrusion 10
Can accurately position the electronic component 3. In addition, the protruding surface 100 of the protruding portion 10 is the opening surface 90
Is formed inside. Therefore, the electronic component 3 can be easily mounted in the recess 1.
【００１５】実施例２ 本例の電子部品搭載用基板は，図４，図５に示すごと
く，多層積層板である。そして絶縁基板６，７，８に設
けた貫通穴１１と，絶縁基板８の表面側に接合したヒー
トシンク５１とから，電子部品搭載用の凹部１を形成し
ている。また，ヒートシンク５１の上に銀ペースト４９
により電子部品３を接合している。上記電子部品搭載用
基板は，リードピン５５の脚部５５１と同じ側に上記凹
部１を開口させると共にスルーホール９５内のリードピ
ン５５を電子部品搭載用基板の裏面側に突出させている
フェースダウン型である。Example 2 The electronic component mounting substrate of this example is a multilayer laminate as shown in FIGS. 4 and 5. Then, the through hole 11 provided in the insulating substrates 6, 7, and 8 and the heat sink 51 joined to the surface side of the insulating substrate 8 form the recess 1 for mounting electronic components. Also, on the heat sink 51, the silver paste 49
The electronic component 3 is joined by. The electronic component mounting board is a face-down type in which the recess 1 is opened on the same side as the leg portion 551 of the lead pin 55 and the lead pin 55 in the through hole 95 is projected to the back surface side of the electronic component mounting board. is there.
【００１６】上記絶縁基板７，８の裏面側には，導体回
路５３，５４が形成されている。上記貫通穴１１は，絶
縁基板６，７，８の四角形状の開口面６０，７０，８０
からなる。開口面６０，７０，８０は，順にその口径が
小さく形成されており，その周辺の導体回路５３，５４
の先端にはボンディングパッド５３０，５４０が設けら
れている。該ボンディングパッドは，電子部品３に対し
て，ボンディングワイヤー５９により接続している。Conductor circuits 53 and 54 are formed on the back surfaces of the insulating substrates 7 and 8. The through hole 11 is formed into a rectangular opening surface 60, 70, 80 of the insulating substrate 6, 7, 8.
Consists of. The opening surfaces 60, 70, 80 are formed such that their diameters are reduced in order, and the conductor circuits 53, 54 around them are formed.
Bonding pads 530 and 540 are provided at the tip of the. The bonding pad is connected to the electronic component 3 by a bonding wire 59.
【００１７】上記開口面８０は，電子部品位置決め用の
突出部１２を有している。突出部１２は，四角状の開口
面８０に各辺２箇所ずつ形成されている。突出部１２の
先端には，平面状の突出面１２０が形成されている。す
べての突出面１２０は，電子部品３の側面３０を隙間な
く支持する形状に成形されている。突出部１２を形成す
るに当たっては，ルーター加工により絶縁基板９に開口
面８０を形成するときに，突出部１２の形成部分を残
す。The opening surface 80 has a protrusion 12 for positioning an electronic component. The protruding portion 12 is formed on the opening surface 80 having a square shape with two sides on each side. A planar protruding surface 120 is formed at the tip of the protruding portion 12. All the projecting surfaces 120 are formed in a shape that supports the side surface 30 of the electronic component 3 without a gap. In forming the protruding portion 12, when the opening surface 80 is formed in the insulating substrate 9 by the router processing, the forming portion of the protruding portion 12 is left.
【００１８】電子部品３は，凹部１の底面に銀ペースト
４９により接着固定されている。絶縁基板８の裏面側に
は，絶縁基板７，６がそれぞれ接着層４を介して積層さ
れている。絶縁基板８の表面側には，ヒートシンク５１
を設けている。その他は，実施例１と同様である。The electronic component 3 is adhesively fixed to the bottom surface of the recess 1 with a silver paste 49. On the back surface side of the insulating substrate 8, insulating substrates 7 and 6 are laminated via an adhesive layer 4, respectively. A heat sink 51 is provided on the front surface side of the insulating substrate 8.
Is provided. Others are the same as in the first embodiment.
【００１９】本例においては，電子部品３がヒートシン
ク５１の上に直に接合されている。そのため，電子部品
３から発生する熱を外へ容易に放熱させることができ
る。また，本例の突出部１２はボンディングパッド５４
０側に形成され，ヒートシンク５１との対向面には，側
面３０と開口面８０との間に空隙部３００を有してい
る。そのため，電子部品３をヒートシンク５１に接合す
る際に銀ペースト等の接着剤がはみ出しても，上記空隙
部３００内に残留し，電子部品３の表面が汚れることが
ない。本例においても，実施例１と同様の効果を得るこ
とができる。In this example, the electronic component 3 is directly bonded onto the heat sink 51. Therefore, the heat generated from the electronic component 3 can be easily dissipated to the outside. In addition, the protruding portion 12 of this example is formed by the bonding pad 54.
A space 300 is formed between the side surface 30 and the opening surface 80 on the surface facing the heat sink 51. Therefore, even if an adhesive such as a silver paste overflows when the electronic component 3 is bonded to the heat sink 51, the adhesive remains in the void portion 300 and the surface of the electronic component 3 is not contaminated. Also in this example, the same effect as that of the first embodiment can be obtained.
【図１】実施例１の電子部品搭載用基板の斜視図。FIG. 1 is a perspective view of an electronic component mounting board according to a first embodiment.
【図２】実施例１の電子部品搭載用基板の断面図。FIG. 2 is a cross-sectional view of the electronic component mounting board according to the first embodiment.
【図３】実施例１の電子部品搭載用基板の要部拡大斜視
図。FIG. 3 is an enlarged perspective view of an essential part of the electronic component mounting board according to the first embodiment.
【図４】実施例２の電子部品搭載用基板の斜視図。FIG. 4 is a perspective view of an electronic component mounting board according to a second embodiment.
【図５】実施例２の電子部品搭載用基板の断面図。FIG. 5 is a cross-sectional view of an electronic component mounting board according to a second embodiment.
１．．．凹部， １０，１２．．．突出部， １００，１２０．．．突出面， １１．．．貫通穴， ３．．．電子部品， ６，７，８，９．．．絶縁基板， 1. ． ． Recess, 10, 12. ． ． Protrusion, 100, 120. ． ． Protruding surface, 11. ． ． Through hole, 3. ． ． Electronic parts, 6, 7, 8, 9. ． ． Insulating substrate,
Claims (1)
搭載用の凹部を有する電子部品搭載用基板において， 上記凹部には，電子部品位置決め用の突出部を設けたこ
とを特徴とする電子部品搭載用基板。1. An electronic component mounting board having an insulating substrate and a concave portion for mounting electronic components provided on the insulating substrate, wherein the concave portion is provided with a protrusion for positioning an electronic component. Substrate for component mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206062A JPH0629421A (en) | 1992-07-09 | 1992-07-09 | Electronic parts mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206062A JPH0629421A (en) | 1992-07-09 | 1992-07-09 | Electronic parts mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0629421A true JPH0629421A (en) | 1994-02-04 |
Family
ID=16517223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4206062A Pending JPH0629421A (en) | 1992-07-09 | 1992-07-09 | Electronic parts mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0629421A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001005201A1 (en) * | 1999-07-09 | 2001-01-18 | Fujitsu Limited | Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
| WO2008096450A1 (en) * | 2007-02-09 | 2008-08-14 | Panasonic Corporation | Circuit board, multilayer circuit board, and electronic device |
| CN103222347A (en) * | 2011-01-13 | 2013-07-24 | 松下电器产业株式会社 | Mounting structure for circuit component and method for mounting circuit component |
| JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
-
1992
- 1992-07-09 JP JP4206062A patent/JPH0629421A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001005201A1 (en) * | 1999-07-09 | 2001-01-18 | Fujitsu Limited | Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
| US6717824B2 (en) | 1999-07-09 | 2004-04-06 | Fujitsu Limited | Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus |
| WO2008096450A1 (en) * | 2007-02-09 | 2008-08-14 | Panasonic Corporation | Circuit board, multilayer circuit board, and electronic device |
| CN103222347A (en) * | 2011-01-13 | 2013-07-24 | 松下电器产业株式会社 | Mounting structure for circuit component and method for mounting circuit component |
| JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4819041A (en) | Surface mounted integrated circuit chip package and method for making same | |
| US4964019A (en) | Multilayer bonding and cooling of integrated circuit devices | |
| JPH03152985A (en) | Electronic component mounting board and manufacture thereof | |
| JP2784522B2 (en) | Electronic component mounting substrate and method of manufacturing the same | |
| JPH0629421A (en) | Electronic parts mounting board | |
| JPH1167963A (en) | Semiconductor device | |
| JP2845218B2 (en) | Electronic component mounting structure and method of manufacturing the same | |
| JPH02146792A (en) | Semiconductor device package structure | |
| JPH04127497A (en) | Multilayer board for mounting electronic component thereon and manufacture thereof | |
| JP2612468B2 (en) | Substrate for mounting electronic components | |
| JPH10215048A (en) | Printed wiring board and mounting structure of printed wiring board | |
| JPH11163197A (en) | Semiconductor mounting board | |
| JPH0955447A (en) | Semiconductor device | |
| JP2970075B2 (en) | Chip carrier | |
| JPH0817960A (en) | Qep structure semiconductor device | |
| JPH0645763A (en) | Printed wiring board | |
| JP2848346B2 (en) | Electronic component mounting method | |
| JP2828753B2 (en) | Hybrid integrated circuit device | |
| JP3054249B2 (en) | Lead frame assembly | |
| JPH07122701A (en) | Semiconductor device, its manufacture, and lead frame for pga | |
| JPH0613535A (en) | Electronic part mounting apparatus | |
| JPH05315778A (en) | Electronic parts mounting board provided with heat sink | |
| JPH04159799A (en) | Hybrid integrated circuit | |
| JPH07297501A (en) | Printed wiring board | |
| JPH0414852A (en) | Semiconductor device |