JPS59217385A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS59217385A JPS59217385A JP9214883A JP9214883A JPS59217385A JP S59217385 A JPS59217385 A JP S59217385A JP 9214883 A JP9214883 A JP 9214883A JP 9214883 A JP9214883 A JP 9214883A JP S59217385 A JPS59217385 A JP S59217385A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- hole
- metal plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、プリント配線基板に係り、さらに詳しくは、
電子部品の熱放散性を改善し、かつ薄型と小型化とを可
能としたプリント配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board, and more specifically,
The present invention relates to a printed wiring board that improves the heat dissipation properties of electronic components and makes it possible to make them thinner and smaller.
従来、半導体素子などのチップ素子を塔載したプリント
配線基板としては、（イ）第１図に示すように、平担な
セラミック基板又はフェノール若シくはエポキシ樹脂等
の有機樹脂系基板の回路形成上に直接チップ素子を塔載
したプリント配線基板及び（ロ）第２図に示すように、
ザグリ加工又は積層成形により素子実装部分の基板表面
に四部を設け、その凹部内にチップ素子を塔載したプリ
ント配線基板がある。Conventionally, as printed wiring boards on which chip elements such as semiconductor elements are mounted, (a) as shown in Figure 1, circuits on flat ceramic substrates or organic resin substrates such as phenol or epoxy resin have been used. A printed wiring board with chip elements directly mounted on it and (b) As shown in FIG. 2,
There is a printed wiring board in which four parts are provided on the surface of the board where the element is mounted by counterbore processing or laminated molding, and a chip element is mounted in the recessed part.
このうち、第２図に示すプリント配線基板は、第１図に
示すものに比較してチップ素子の塔載後のプリント配線
基板全体を薄くできる利点がある。Among these, the printed wiring board shown in FIG. 2 has the advantage that the entire printed wiring board after mounting chip elements can be made thinner than the printed wiring board shown in FIG. 1.
しかしながら、これら従来のプリント配線基板における
チップ素子からの発熱は、プリント配線基板及び表面導
体を通して熱放散され、その熱放散特性は基板の素材で
ある有機系樹脂又はセラミックスの種類により異なるが
、なかんずく有機系樹脂基板においては熱伝導性が一般
忙は小さく熱放散が少ない。一方、アルミナのセラミッ
クス基板においても最近の高集積半導体に対応できなく
なって来ている。However, the heat generated from the chip elements in these conventional printed wiring boards is dissipated through the printed wiring board and the surface conductor, and the heat dissipation characteristics vary depending on the type of organic resin or ceramic that is the material of the board, but in particular, Thermal conductivity of resin substrates is generally low, resulting in little heat dissipation. On the other hand, alumina ceramic substrates are no longer compatible with recent highly integrated semiconductors.
本発明は、これら上記の従来のプリント配線基板の欠点
を解消し、かつチップ素子搭載後の基板全体の薄型化又
は小型化を可能とするプリント配線基板を提供すること
を目的とするものである。It is an object of the present invention to provide a printed wiring board that eliminates the above-mentioned drawbacks of the conventional printed wiring board and allows the entire board to be made thinner or smaller after chip elements are mounted. .
以下、本発明のプリント配線基板を図面に基いて具体的
に説明する。Hereinafter, the printed wiring board of the present invention will be specifically explained based on the drawings.
第３図は、本発明のプリント配線基板の縦断面図である
。この図面において、（１）は基板であり、たとえば銅
箔が表面に貼着されている有機系樹脂の積層板又はアル
ミナなどの士うミックス基板などである。（２）は前記
基板上に設けられた表面に形成された導体回路であり、
（３）は該基板の一部に設けられた所望形状と大きさの
穴であり、チップ素子の電子部品が実装される箇所であ
る。（４）は金属板であシ、該基板の板厚よりも薄い板
厚で前記穴と同形状のものである。（５）は接着剤又は
ソルダーレジストの層であり、ソルダーレジストとして
は、マスク用インク又は感光性フィルムのいずれかが使
用できる。そして（６）は各種の半導体チップ素子ｊ
などの電子部品である。FIG. 3 is a longitudinal sectional view of the printed wiring board of the present invention. In this drawing, (1) is a substrate, such as a laminate of organic resin with copper foil adhered to the surface or a mixed substrate made of alumina or the like. (2) is a conductor circuit formed on the surface provided on the substrate,
(3) is a hole of a desired shape and size provided in a part of the substrate, and is a place where electronic components of the chip element are mounted. (4) is a metal plate, which is thinner than the thickness of the substrate and has the same shape as the hole. (5) is a layer of adhesive or solder resist, and as the solder resist, either mask ink or photosensitive film can be used. and (6) various semiconductor chip elements j
electronic components such as
次に本発明のプリント配線基板を得る手順の概要につい
て説明する。Next, an outline of the procedure for obtaining the printed wiring board of the present invention will be explained.
まず、予め表面導体回路（２）を形成した基板（１）に
、所望形状の電子部品実装用の穴（３）を設ける。この
穴（３）を設ける方法としては、打ち抜き加工又は切削
加工があり、これらのいずれかの方法により貫通穴が設
けられる。First, a hole (3) of a desired shape for mounting an electronic component is provided in a substrate (1) on which a surface conductor circuit (2) has been formed in advance. Methods for providing this hole (3) include punching or cutting, and the through hole is provided by either of these methods.
そして、上記貫通穴には、この穴の径と同じか又はこの
径よりもやや大きめの寸法に切断された同形状の金属板
（４）を画板の裏面側が水平面となるように圧入嵌着し
、この基板（１）と金属板（４）の一部とをエポキシ樹
脂又はフェノール樹脂などの熱硬化性樹脂を主成分とす
る接着剤又はマスク用インクを塗布し又は感光性フィル
ムを貼着し、該樹脂を加熱硬化させることにより前記金
属板と基板の一部とを強固に被覆接合しこれら画板を一
体化する。Then, a metal plate (4) of the same shape cut to a size that is the same as or slightly larger than the diameter of this hole is press-fitted into the above-mentioned through hole so that the back side of the drawing board becomes a horizontal surface. , This substrate (1) and a part of the metal plate (4) are coated with an adhesive or masking ink whose main component is a thermosetting resin such as epoxy resin or phenol resin, or a photosensitive film is attached. By heating and curing the resin, the metal plate and a part of the substrate are firmly coated and bonded, and the drawing plates are integrated.
このようＫして得られた本発明のプリント配線基板の電
子部品搭載用の穴にチップ素子を塔載する。A chip element is mounted in the hole for mounting an electronic component in the printed wiring board of the present invention obtained by the above process.
第４図は、本発明のプリント配線基板にチップ素子を塔
載した状態を示す縦断面図である。FIG. 4 is a longitudinal sectional view showing a state in which chip elements are mounted on the printed wiring board of the present invention.
上記第４図に示すようＫ、金属板（４）の上に塔載され
たチップ素子から発生した熱は、該金属板忙伝導し、か
つ速かに吸収され金属板の裏面より熱放散することＫな
る。また、第４図に示すようにチップ素子を塔載したプ
リント配線基板は、チップ素子が電子部品搭載用の穴の
中に装着されるため、チップ素子が実装されたプリント
配線基板全体は薄型化され、かつ集積回路素子を直接実
装することＫより小型化を実現することもできる。As shown in Fig. 4 above, the heat generated from the chip element mounted on the metal plate (4) is conducted through the metal plate, is quickly absorbed, and is dissipated from the back surface of the metal plate. This is K. In addition, as shown in Figure 4, the printed wiring board on which the chip element is mounted is mounted in a hole for mounting electronic components, so the entire printed wiring board on which the chip element is mounted becomes thinner. Moreover, it is also possible to achieve a smaller size than by directly mounting integrated circuit elements.
以上説明したように、本発明のプリント配線基板は、電
子部品の熱放散性が改善され、かつチップ素子の搭載後
においては薄型化と小型化とが可能となる利点があり、
産業上きわめて有用なものである。As explained above, the printed wiring board of the present invention has the advantage that the heat dissipation of electronic components is improved, and that it can be made thinner and smaller after mounting chip elements.
It is extremely useful in industry.
第１図及び第２図は、従来のプリント配線基板の縦断面
図、第３図及び第４図は、本発明のプリント配線基板の
縦断面図である。
上記図面において、１・・・曲・・基板、２・・・四・
・表面導体回路、３・・−・・・・・電子部品搭載用の
穴、４・・・・・・・・・金属板、５・・・・・・・・
・接着剤又はソルダーレジストの層、６・・・・・・・
・・チップ素子。
特許出願人の名称
イビデン株式会社
代表者多賀潤一部1 and 2 are longitudinal sectional views of a conventional printed wiring board, and FIGS. 3 and 4 are longitudinal sectional views of a printed wiring board of the present invention. In the above drawings, 1... track board, 2... 4...
・Surface conductor circuit, 3... Hole for mounting electronic components, 4... Metal plate, 5...
・Layer of adhesive or solder resist, 6...
...Chip element. Patent applicant name IBIDEN Co., Ltd. Representative Jun Taga
Claims (1)
明け、該基板の板厚より薄い板厚で穴と同形の金属板を
前記穴に裏面がほぼ水平となるように嵌着し、接着剤又
はソルダーレジストにまり前記基板と金属板との裏面の
一部を被覆接合しこれらを一体化して成るプリント配線
基板。1. Drill a hole of the desired shape and size in a part of the printed wiring board, and fit a metal plate of the same shape as the hole with a thickness thinner than that of the board into the hole so that the back surface is almost horizontal. A printed wiring board formed by coating and bonding a part of the back surface of the substrate and a metal plate with adhesive or solder resist to integrate them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9214883A JPS59217385A (en) | 1983-05-25 | 1983-05-25 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9214883A JPS59217385A (en) | 1983-05-25 | 1983-05-25 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59217385A true JPS59217385A (en) | 1984-12-07 |
Family
ID=14046343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9214883A Pending JPS59217385A (en) | 1983-05-25 | 1983-05-25 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59217385A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252992A (en) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | Chip carrier for electronic element |
| JPH02347A (en) * | 1989-03-24 | 1990-01-05 | Matsushita Electric Works Ltd | Ship carrier for electronic parts chip |
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482058U (en) * | 1971-05-27 | 1973-01-11 | ||
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
-
1983
- 1983-05-25 JP JP9214883A patent/JPS59217385A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482058U (en) * | 1971-05-27 | 1973-01-11 | ||
| JPS5967687A (en) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | Printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252992A (en) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | Chip carrier for electronic element |
| JPH02347A (en) * | 1989-03-24 | 1990-01-05 | Matsushita Electric Works Ltd | Ship carrier for electronic parts chip |
| JPH0470795B2 (en) * | 1989-03-24 | 1992-11-11 | Matsushita Electric Works Ltd | |
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
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