JPS5932191A - Printed circuit board and method of producing same - Google Patents
Printed circuit board and method of producing sameInfo
- Publication number
- JPS5932191A JPS5932191A JP14280082A JP14280082A JPS5932191A JP S5932191 A JPS5932191 A JP S5932191A JP 14280082 A JP14280082 A JP 14280082A JP 14280082 A JP14280082 A JP 14280082A JP S5932191 A JPS5932191 A JP S5932191A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- hole
- wiring board
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、プリント配線基板及びその’Ｊ！Ｉ ？ｆｉ
方法に係り、さらに詳しくは、′＋に子部品の発熱に対
して熱放散性を改善したプリント配線基板及びその製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a printed wiring board and its 'J! I? fi
The present invention relates to a method, and more particularly, to a printed wiring board with improved heat dissipation properties against heat generated by sub-components, and a method of manufacturing the same.
従来、プリント配線基板に半導体素子又は発熱の大きな
電子部品を塔載する場合、該基板の熱伝導が想いため、
広い面積で銅箔を残したり、別途、電子部品に放熱板金
取り付けるなどの処理がなされていた。Conventionally, when mounting semiconductor elements or electronic components that generate a lot of heat on a printed wiring board, the heat conduction of the board was considered.
Processes such as leaving copper foil over a large area and attaching heat dissipating sheet metal to electronic components were done separately.
一方、電子部品の高密度実装化が進むにつれて、半導体
素子ｆ、基板に直接塔載する方法が、たとえば時計など
の市、子回路基板たどにおいて行われて来た。On the other hand, as electronic components have become more densely packaged, a method of directly mounting semiconductor elements f onto a substrate has been used for products such as watches, sub-circuit boards, and the like.
Ｉ７かしながら、有機系樹脂の基板、たとえばエボ：￥
シＱ’ｉｊ ｆｊＦＶノＩＴ Ｉｔ’１基板において
は、０−０（１１ｍｅ／ｆｂ 。I7 However, organic resin substrates, such as EVO: ¥
0-0 (11me/fb) on the 1 board.
１ｍ 、 ”（シとアルミナセラＥツク基板の０．０７
ｍｆ／砂、ｔ＊、”（Ｈに比１１ｆｑシて熱（べ導率が
小さく、使用できる素子の種類が限定されるなどの欠点
があった。1m, ” (0.07cm of aluminum plate and alumina ceramic board)
mf/sand, t*, "(11fq) compared to H (heat) had drawbacks such as low conductivity and limited types of elements that could be used.
本発明は、ト記従来方法の欠点に鑑み、これらの欠点を
改善・除去し、有機系樹脂の基板に発熱の大きな素子を
１ｊ（、接塔載１７実装する場合、該素子からの発熱を
速かに放散させることのできるプリント配線基板及びそ
の製造方法を提供することを目的とする。In view of the shortcomings of the conventional method mentioned above, the present invention improves and eliminates these shortcomings, and when mounting a large heat generating element on an organic resin substrate, the heat generated from the element is reduced. It is an object of the present invention to provide a printed wiring board that can quickly dissipate light and a method for manufacturing the same.
以下、本発明のプリント配線基板及びその製造方法を図
面に基いて具体的に説明する。EMBODIMENT OF THE INVENTION Hereinafter, the printed wiring board and its manufacturing method of this invention will be specifically demonstrated based on drawing.
？Ｒ１図は、本発明のプリント配線基板のａＣｔ断面：
図である、この図において、有機系樹脂の積層基板（１
）の表面に金属箔（２）、たとえば銅箔があるプリン１
−配線用基板に電子部品の実装用の穴（３）が設けられ
ており、この穴（３）には、該基板の厚さよりも薄い金
属板（４）が嵌め込捷れており、そして、前記金属板と
該基板の穴にはスルホールメッキが施されてい゛Ｃ１前
記金属板と該ノｉ（板の一部とがフルホールメッキによ
り一体化されている状態を示すものである。? R1 diagram is the aCt cross section of the printed wiring board of the present invention:
In this figure, a laminated substrate of organic resin (1
) with metal foil (2), for example copper foil, on the surface of pudding 1
- A hole (3) for mounting an electronic component is provided in the wiring board, and a metal plate (4) thinner than the thickness of the board is fitted into the hole (3), and , through-hole plating is applied to the holes in the metal plate and the substrate.C1 This shows a state in which the metal plate and a part of the plate are integrated by full-hole plating.
このように、プリント配線基板の電子部品の塔載部分の
底面に（工、熱伝導性のよい金属板（４）が（ｆｋ着さ
れていることにより ’ｆＧ’、子部品の発熱に対して
熱発赦性を斉しく大きくすることができ、従来のプリン
ト配線基４反の欠点を解消することができると共に、外
部からの湿寅にブトし−Ｃも電子部品を保護することが
できる。なぜなら、市；子部品はｇＪ：（仮の穴の中に
実装され、その殆んど大部分が外す息
電子部品！！′ｉ該基板の穴に実装されるため、部品の
高密度化を図ることのできる効果もある。このように、
本発明のプリント配線基板は、該基板の任意の部分に設
けられた電子部品実装用の穴とその穴の底面に嵌め込ま
れた金属板に、発熱した多爪の熱が速かに伝導し基板裏
面の導体部の広い面積を占める表面から短時間のうち放
散し蓄熱することはなくなる。In this way, a metal plate (4) with good thermal conductivity is attached to the bottom of the electronic component mounting part of the printed wiring board, which reduces the heat generated by the child components. It can simultaneously increase heat release properties, eliminate the drawbacks of conventional printed wiring boards, and protect electronic components from moisture from the outside. , City; Sub-components are mounted in temporary holes, and most of them are electronic components that must be removed!!'i Because they are mounted in holes in the board, the density of the components is increased. There are also effects that can be achieved.In this way,
In the printed wiring board of the present invention, the heat generated by the multi-jaws is quickly conducted to the hole for mounting electronic components provided in an arbitrary part of the board and the metal plate fitted into the bottom of the hole. Heat is no longer dissipated and accumulated from the surface that occupies a large area of the back conductor portion in a short period of time.
次に本発明のプリント配線基板のｆｆｔ！！遣方法を第
２図に基いでｉ説明する。Next, fft! of the printed wiring board of the present invention! ! The method will be explained based on Fig. 2.
捷ず、２ハ２図の（イ）は、プリント配線用基板、たと
えば、ガラスエポさ一シ銅箔積層基板の縦断面図である
。Figure 2(a) is a vertical sectional view of a printed wiring board, for example, a glass epoxy copper foil laminated board.
そして、ｎ１１記積層板の任意の箇所に穴（３）を明け
る。この穴（３）は、一般に切削加工又は金型打抜き加
工などにより明けられる貫通孔である。穴の大きさは、
実装される市、子部品の大きさによって決められる。Then, a hole (3) is made at an arbitrary location on the laminate plate n11. This hole (3) is a through hole that is generally made by cutting or die punching. The size of the hole is
It is determined by the size of the implemented city and child parts.
しかる後に、第２図のに）に示すように穴（３）に積層
基板よりもＪｌさの薄い金属板（４）を圧入して嵌着し
、この金属板（４）と穴（３）と基板表面と全連結する
スルホールメッキ膜（５）を施すことにより、ｍ層基板
（１１の表面の一部と、金属板（４）とをスルホール形
成と開時に一体化する。After that, as shown in Figure 2), a metal plate (4) that is thinner than the laminated board is press-fitted into the hole (3), and the metal plate (4) and the hole (3) are pressed into place. By applying a through-hole plating film (5) that is fully connected to the substrate surface, a part of the surface of the m-layer substrate (11) and the metal plate (4) are integrated at the time of through-hole formation and opening.
しかる後に、第２図の（ホ）に示すように、上記の基板
表面に感光性樹脂被膜（６）を貼着し、電子部品実装用
の穴（３）を含む所望の回路パターンを形成し、エツチ
ングにより導体回路を形成する。この場合、感光性樹脂
（６）により、ネガティブパターンを形成し、異金属メ
ッキ、たとえば半［Ｂ、ニッケル、錫、イ金メッキなど
により電子部品の実装■の穴（３）を含む回路を形成し
、該異金属メッキをエツチングレジストとして、所望の
導体回路を形成することもできる。Thereafter, as shown in FIG. 2 (e), a photosensitive resin film (6) is pasted on the surface of the above board to form a desired circuit pattern including holes (3) for mounting electronic components. , a conductor circuit is formed by etching. In this case, a negative pattern is formed using a photosensitive resin (6), and a circuit including holes (3) for mounting electronic components is formed using a different metal plating, such as half-plating, nickel, tin, or gold plating. A desired conductor circuit can also be formed by using the different metal plating as an etching resist.
なお、前記金属板（４）は、銅、鉄、ニッケル、ステン
レス、コバールなど熱伝導性の良好な金属板であればど
のような金属であってもよい。しかしながら、スルホー
ルメッキエ稈におけるアルカリ溶液又は酸溶液に対し゛
〔容易に溶解しない金属板を選ぶ必要があり、たとえば
アルミニウム板などの使用は好オ［７くない。Note that the metal plate (4) may be made of any metal as long as it has good thermal conductivity, such as copper, iron, nickel, stainless steel, and Kovar. However, it is necessary to select a metal plate that does not easily dissolve in the alkaline or acid solution used in the through-hole plating process, and the use of aluminum plates, for example, is not recommended.
以上のように本発明のプリント配線基板は製造され、こ
の基板に発熱が大きい電子部品を実装しても、熱放散性
が大きいため、該基板に蓄熱することはなく、また穴の
中に実装された電子部品は外気の湿気などに直接触れる
ことが少くなるので、保護され耐久性が向りすると共に
、電子部品の高密度化が可能と々す、実装後のプリント
配線板のコンパクト化（薄くすること）も可能となる。As described above, the printed wiring board of the present invention is manufactured, and even if electronic components that generate a large amount of heat are mounted on this board, the heat dissipation is high, so heat will not be accumulated on the board, and even if electronic components are mounted in the holes. Electronic components exposed to moisture in the outside air are less likely to come into direct contact with moisture in the outside air, making them more protected and durable.This also makes it possible to increase the density of electronic components, and to make printed wiring boards more compact after mounting. thinning) is also possible.
第１図は、本発明のプリント配線基板の縦断面図、第２
図は、本発明のプリント配線基板の製造方法の手順を示
す該基板の縦断面図である。なお、（イ）から（へ）Ｉ
ｔ、１、製造工程順に得られる基板の縦断面図を示すも
のである。
上記図面におい゛〔，１・・・ 積層基板、２・・ 金
属箔、３・・・・・’ｔＩＴ、子部品実装用の穴、４・
・・・金属板、５・・スルホールメッキである。
特許出願人の名称
揖斐用Ｖに気工業株式会社
代表者 多賀潤一部FIG. 1 is a longitudinal sectional view of the printed wiring board of the present invention, and FIG.
The figure is a longitudinal sectional view of the printed wiring board showing the steps of the method for manufacturing the printed wiring board of the present invention. Furthermore, from (a) to (to) I
t,1 shows longitudinal cross-sectional views of substrates obtained in the order of manufacturing steps. In the above drawing, ゛[, 1... Laminated board, 2... Metal foil, 3...'tIT, Hole for mounting child components, 4...
... Metal plate, 5... Through-hole plating. Name of patent applicant
Claims (1)
、＃一基板の厚さより板厚の薄い金属板を穴に挿入した
後、スルホールメッキによりｎＩＩ記金属板と基板の一
部とを一体化することを特徴とするプリント配線基板の
製造方法。 ２、プリント配線基板の穴に該基板よりも厚さの薄い金
属板が嵌着され、ｎ＋を記金属板と該基板の一部とがス
ルポールメッキにより一体化されて成るプリント配線基
板。[Claims] 1. Drill a hole in a desired shape in a part of the printed wiring board, insert a metal plate thinner than the thickness of the #1 board into the hole, and then form the metal plate No. nII by through-hole plating. A method for manufacturing a printed wiring board, characterized by integrating a part of the board with a part of the board. 2. A printed wiring board in which a metal plate thinner than the board is fitted into a hole in the printed wiring board, and the metal plate and a part of the board are integrated by Sulpol plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14280082A JPS5932191A (en) | 1982-08-18 | 1982-08-18 | Printed circuit board and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14280082A JPS5932191A (en) | 1982-08-18 | 1982-08-18 | Printed circuit board and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5932191A true JPS5932191A (en) | 1984-02-21 |
| JPH0155591B2 JPH0155591B2 (en) | 1989-11-27 |
Family
ID=15323919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14280082A Granted JPS5932191A (en) | 1982-08-18 | 1982-08-18 | Printed circuit board and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932191A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160564U (en) * | 1984-03-31 | 1985-10-25 | イビデン株式会社 | Plug-in package board |
| JPS60190053U (en) * | 1984-05-28 | 1985-12-16 | 新日本無線株式会社 | Hybrid integrated circuit device |
| JPS63111691A (en) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | Electronic parts fitting board |
| JPS6424489A (en) * | 1987-07-21 | 1989-01-26 | Mitsubishi Gas Chemical Co | Multilayered board for mounting ic chip |
| JPH03152986A (en) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | Electronic component mounting board |
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
| CN107105570A (en) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | Circuit board and its manufacture method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688398A (en) * | 1979-12-20 | 1981-07-17 | Sony Corp | Method of manufacturing hybrid integrated circuit |
-
1982
- 1982-08-18 JP JP14280082A patent/JPS5932191A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688398A (en) * | 1979-12-20 | 1981-07-17 | Sony Corp | Method of manufacturing hybrid integrated circuit |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0451503Y2 (en) * | 1984-03-31 | 1992-12-03 | ||
| JPS60160564U (en) * | 1984-03-31 | 1985-10-25 | イビデン株式会社 | Plug-in package board |
| JPS60190053U (en) * | 1984-05-28 | 1985-12-16 | 新日本無線株式会社 | Hybrid integrated circuit device |
| JPS63111691A (en) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | Electronic parts fitting board |
| JPS6424489A (en) * | 1987-07-21 | 1989-01-26 | Mitsubishi Gas Chemical Co | Multilayered board for mounting ic chip |
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| JPH03152986A (en) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | Electronic component mounting board |
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
| CN107105570A (en) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | Circuit board and its manufacture method |
| JP2017152692A (en) * | 2016-02-22 | 2017-08-31 | 太陽誘電株式会社 | Circuit board and method of manufacturing the same |
| JP2017201732A (en) * | 2016-02-22 | 2017-11-09 | 太陽誘電株式会社 | Circuit board and method of manufacturing the same |
| JP2018046297A (en) * | 2016-02-22 | 2018-03-22 | 太陽誘電株式会社 | Circuit board |
| CN107105570B (en) * | 2016-02-22 | 2019-07-23 | 太阳诱电株式会社 | Circuit board and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155591B2 (en) | 1989-11-27 |
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