JPS61188999A - Heat radiating/shielding board for printed wiring board - Google Patents
Heat radiating/shielding board for printed wiring boardInfo
- Publication number
- JPS61188999A JPS61188999A JP2846085A JP2846085A JPS61188999A JP S61188999 A JPS61188999 A JP S61188999A JP 2846085 A JP2846085 A JP 2846085A JP 2846085 A JP2846085 A JP 2846085A JP S61188999 A JPS61188999 A JP S61188999A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- metal plate
- board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明はプリント配線基板に用いられる放熱。[Detailed description of the invention] [Industrial application field] This invention is a heat dissipation device used in printed wiring boards.
シールド板に関するものである。This relates to a shield plate.
従来、プリント配線基板としては、樹脂板に配線層が形
成された樹脂プリント配線基板がある。Conventionally, as a printed wiring board, there is a resin printed wiring board in which a wiring layer is formed on a resin board.
しかし、電子機器の小型化が進むにつれて、プリント配
線基板上への部品実装密度が上昇しているので、実装部
品から発せられる熱量が増大しているのに対し、樹脂プ
リント配線基板は放熱性が充分ではないため、樹脂プリ
ント配線基板およびその近傍の温度が上昇し、実装部品
の機能低下を起こして、大きな問題となっている。そこ
で、実装部品に放熱用フィン等を設けることも行なわれ
ているが、この場合には実装部品が高価になるという欠
点がある。また、樹脂プリント配線基板はシールド効果
が悪いため、ノイズ等を防止することができない。However, as electronic devices become smaller, the density of component mounting on printed wiring boards has increased, and the amount of heat emitted from mounted components has increased, whereas resin printed wiring boards have poor heat dissipation. As a result, the temperature of the resin printed wiring board and its vicinity increases, causing a decline in the functionality of the mounted components, which has become a serious problem. Therefore, it has been attempted to provide heat dissipation fins or the like to the mounted components, but this has the disadvantage that the mounted components become expensive. Further, since the resin printed wiring board has poor shielding effect, noise and the like cannot be prevented.
この発明は上述の問題点を解決するためになされたもの
で、樹脂プリント配線基板の放熱性を良好にし、かつ樹
脂プリント配線基板のシールド効果をよくすることがで
きるプリント配線基板用放熱、シールド板を提供するこ
とを目的とする。This invention was made to solve the above-mentioned problems, and is a heat dissipating and shielding plate for printed wiring boards that can improve the heat dissipation properties of resin printed wiring boards and also improve the shielding effect of resin printed wiring boards. The purpose is to provide
この目的を達成するため、この発明においては゛
樹脂板の表面に接着剤層を設け、その接着剤層に
離型紙を貼着する。In order to achieve this purpose, this invention
An adhesive layer is provided on the surface of the resin plate, and a release paper is attached to the adhesive layer.
このプリント配線基板用放熱、シールド板においては、
離型紙を剥がして接着剤層により樹脂プリント配線基板
の表面に接着すれば、金属板を介して熱が放出され、ま
た金属板により電界、磁界を遮蔽することができる。In this heat dissipation and shield board for printed wiring boards,
By peeling off the release paper and adhering it to the surface of a resin printed wiring board using an adhesive layer, heat is released through the metal plate, and the metal plate can shield electric and magnetic fields.
第１図はこの発明に係るプリント配線基板用放熱、シー
ルド板の一部を示す断面図である。図において、１は金
属板、２は金属板１の表面に設けられた接着剤層、３は
接着剤Ｍ２に貼着された離型紙である。FIG. 1 is a sectional view showing a part of a heat dissipating and shielding plate for a printed wiring board according to the present invention. In the figure, 1 is a metal plate, 2 is an adhesive layer provided on the surface of the metal plate 1, and 3 is a release paper adhered to the adhesive M2.
第２図はこの発明に係る他のプリント配線基板用放熱、
シールド板の一部を示す断面図である。FIG. 2 shows another heat dissipation for a printed wiring board according to the present invention.
It is a sectional view showing a part of a shield plate.
この放熱、シールド板においては、金属板１の表面に凹
凸４が設けられている。In this heat dissipation and shielding plate, irregularities 4 are provided on the surface of the metal plate 1.
第３図は第１図に示した放熱、シールド板を樹脂プリン
ト配線基板に接着したものの一部を示す断面図である。FIG. 3 is a sectional view showing a part of the heat dissipation/shield plate shown in FIG. 1 bonded to a resin printed wiring board.
図において、５は樹脂板、６は樹脂板５の両面に形成さ
れた配線層、７は面配線層６を接続するスルホール、８
は樹脂板５の片面に設けられた絶縁層で、絶縁層８に接
着剤層２を介して金属板１が接着されている。９は金属
板１等に設けられた穴で、穴９の中心線はスルホール７
の中心線と一致しており、穴９の直径はスルホール７の
直径よりも大きい。In the figure, 5 is a resin board, 6 is a wiring layer formed on both sides of the resin board 5, 7 is a through hole connecting the surface wiring layer 6, and 8 is a wiring layer formed on both sides of the resin board 5.
is an insulating layer provided on one side of the resin plate 5, and the metal plate 1 is bonded to the insulating layer 8 via the adhesive layer 2. 9 is a hole provided in metal plate 1, etc., and the center line of hole 9 is through hole 7.
The diameter of the hole 9 is larger than the diameter of the through hole 7.
つぎに、第３図に示したように樹脂プリント配線基板に
放熱、シールド板を接着する方法を第４図により説明す
る。まず、放熱、シールド板に穴９を設ける（第４図（
ａ））。つぎに、離型紙３を接着剤層２から剥がす（第
４図（ｂ））。ついで、第４図（ｃ）に示す樹脂プリン
ト配線基板の絶縁層８上に接着剤層２で金属板１を接着
する。この場合、穴９の中心線とスルホール７の中心線
とを一致させる。最後に、樹脂プリント配線基板と金属
板１とをローラ圧着または熱圧着する。Next, a method of bonding a heat dissipating and shielding plate to a resin printed wiring board as shown in FIG. 3 will be explained with reference to FIG. 4. First, holes 9 are provided in the heat dissipation and shield plate (see Fig. 4).
a)). Next, the release paper 3 is peeled off from the adhesive layer 2 (FIG. 4(b)). Then, the metal plate 1 is bonded with the adhesive layer 2 onto the insulating layer 8 of the resin printed wiring board shown in FIG. 4(c). In this case, the center line of the hole 9 and the center line of the through hole 7 are made to coincide. Finally, the resin printed wiring board and the metal plate 1 are bonded by roller pressure or thermocompression.
このように、樹脂プリント配線基板の表面に金属板１を
接着すれば、金属板１を介して熱が放出されるから、樹
脂プリント配線基板の放熱性が良好となる。そして、第
２図に示すように、金属板１の表面に凹凸４を設ければ
、さらに放熱性を良好にすることができる。また、金属
板１により電界、磁界を遮蔽することができるので、樹
脂プリント配線基板のシールド効果がよくなる。さらに
、離型紙３を剥がして、接着剤層２により樹脂プリント
配線基板に金属板１を接着するだけで、樹脂プリント配
線基板に金属板１を取付けることができるので、放熱性
が良好であり、しかもシールド効果がよい樹脂プリント
配線基板を極めて簡単に製造することができる。When the metal plate 1 is bonded to the surface of the resin printed wiring board in this way, heat is released through the metal plate 1, so that the resin printed wiring board has good heat dissipation. Further, as shown in FIG. 2, if unevenness 4 is provided on the surface of the metal plate 1, heat dissipation can be further improved. Further, since the metal plate 1 can shield electric fields and magnetic fields, the shielding effect of the resin printed wiring board is improved. Furthermore, the metal plate 1 can be attached to the resin printed wiring board by simply peeling off the release paper 3 and bonding the metal plate 1 to the resin printed wiring board using the adhesive layer 2, so heat dissipation is good. Moreover, a resin printed wiring board with good shielding effect can be manufactured extremely easily.
なお、金属板１としては、アルミニウム板、銅板、鉄板
、アルミニウム合金板等を用いることができる。また、
接着剤層２の接着剤としてはエポキシ樹脂接着剤等を用
いることができる。さらに、上述実施例においては、樹
脂板５の片面に絶縁層８を設け、絶縁層８上に金属板１
を接着したが、接着剤層２が絶縁性を有する場合には、
絶縁層°８を設けずに、配線層６上に直接金属板１を接
着してもよい。Note that as the metal plate 1, an aluminum plate, a copper plate, an iron plate, an aluminum alloy plate, etc. can be used. Also,
As the adhesive for the adhesive layer 2, an epoxy resin adhesive or the like can be used. Furthermore, in the above embodiment, the insulating layer 8 is provided on one side of the resin plate 5, and the metal plate 1 is provided on the insulating layer 8.
However, if the adhesive layer 2 has insulating properties,
The metal plate 1 may be bonded directly onto the wiring layer 6 without providing the insulating layer 8.
以上説明したように、この発明にかがるプリント配線基
板用放熱、シールド板においては、離型紙を剥がして樹
脂プリント配線基板に金属板を接着すれば、極めて容易
に樹脂プリント配線基板に金属板を取付けることができ
、この場合には樹脂プリント配線基板の放熱性が良好と
なるから部品実装密度が高く、実装部品から発せられる
熱量が多くとも、実装部品の機能が低下することがなく
。As explained above, in the heat dissipation and shield plate for printed wiring boards according to the present invention, if the release paper is peeled off and the metal plate is bonded to the resin printed wiring board, the metal plate can be attached to the resin printed wiring board very easily. In this case, the heat dissipation of the resin printed wiring board is good, so the component mounting density is high, and even if the amount of heat emitted from the mounted components is large, the functionality of the mounted components will not deteriorate.
放熱用フィン等を有する高価な実装部品を用いる必要が
なく、しかも樹脂プリント配線基板のシールド効果がよ
くなるため、ノイズ等を有効に防止することができる。It is not necessary to use expensive mounting components having heat dissipation fins, etc., and the shielding effect of the resin printed wiring board is improved, so that noise and the like can be effectively prevented.
このように、この発明の効果は顕著である。As described above, the effects of this invention are remarkable.
【図面の簡単な説明】
第１図、第２図はそれぞれこの発明に係るプリント配線
基板用放熱、シールド板の一部を示す断面図、第３図は
樹脂プリント配線基板に第１図に示した放熱、シールド
板を接着したものの一部を示す断面図、第４図は樹脂プ
リント配線基板に第１図に示した放熱、シールド板を接
着する方法の説明図である。
１・・・金属板 ２・・・接着剤層３・・・
離型紙[Brief Description of the Drawings] Figures 1 and 2 are cross-sectional views showing a part of the heat dissipation and shield plate for printed wiring boards according to the present invention, respectively, and Figure 3 is a cross-sectional view of the resin printed wiring board shown in Figure 1. FIG. 4 is a cross-sectional view showing a part of the heat dissipating and shielding plate bonded to the heat dissipating and shielding plate shown in FIG. 1... Metal plate 2... Adhesive layer 3...
release paper
Claims (2)
層と、その接着剤層に貼着された離型紙とを有すること
を特徴とするプリント配線基板用放熱、シールド板。(1) A heat dissipation and shielding board for a printed wiring board, comprising a metal plate, an adhesive layer provided on the surface of the metal plate, and a release paper adhered to the adhesive layer.
る特許請求の範囲第１項記載のプリント配線基板用放熱
、シールド板。(2) The heat dissipation and shielding plate for a printed wiring board as set forth in claim 1, characterized in that the surface of the metal plate is provided with irregularities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2846085A JPS61188999A (en) | 1985-02-18 | 1985-02-18 | Heat radiating/shielding board for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2846085A JPS61188999A (en) | 1985-02-18 | 1985-02-18 | Heat radiating/shielding board for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188999A true JPS61188999A (en) | 1986-08-22 |
Family
ID=12249277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2846085A Pending JPS61188999A (en) | 1985-02-18 | 1985-02-18 | Heat radiating/shielding board for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188999A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933175B2 (en) * | 2000-07-24 | 2005-08-23 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| JP2008099845A (en) * | 2006-10-19 | 2008-05-01 | Daiichi Shokai Co Ltd | Pachinko game machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
| JPS545761B2 (en) * | 1974-06-10 | 1979-03-20 | ||
| JPS5762587A (en) * | 1980-10-02 | 1982-04-15 | Sumitomo Electric Industries | Printed circuit board with heat conductive layer |
-
1985
- 1985-02-18 JP JP2846085A patent/JPS61188999A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
| JPS545761B2 (en) * | 1974-06-10 | 1979-03-20 | ||
| JPS5762587A (en) * | 1980-10-02 | 1982-04-15 | Sumitomo Electric Industries | Printed circuit board with heat conductive layer |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933175B2 (en) * | 2000-07-24 | 2005-08-23 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| US6949414B2 (en) * | 2000-07-24 | 2005-09-27 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| US6949413B2 (en) * | 2000-07-24 | 2005-09-27 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| US7045395B2 (en) * | 2000-07-24 | 2006-05-16 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| JP2008099845A (en) * | 2006-10-19 | 2008-05-01 | Daiichi Shokai Co Ltd | Pachinko game machine |
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