JPS62239597A - Electronic parts attaching plate - Google Patents
Electronic parts attaching plateInfo
- Publication number
- JPS62239597A JPS62239597A JP61082232A JP8223286A JPS62239597A JP S62239597 A JPS62239597 A JP S62239597A JP 61082232 A JP61082232 A JP 61082232A JP 8223286 A JP8223286 A JP 8223286A JP S62239597 A JPS62239597 A JP S62239597A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- plate
- hole
- resin
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 66
- 229920005989 resin Polymers 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000926 separation method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はＩＣ等の電子部品を取付ける電子部品取付板
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting plate for mounting electronic components such as ICs.
従来の電子部品取付板においては、樹脂、セラミック等
からなる板の表面にボンディング端子を設けている。In conventional electronic component mounting plates, bonding terminals are provided on the surface of the plate made of resin, ceramic, or the like.
しかしながら、このような電子部品取付板に取付けられ
る電子部品が熱を発する場合には、樹脂。However, if the electronic components mounted on such an electronic component mounting plate generate heat, resin.
セラミック等の放熱性が充分でないため、電子部品取付
板の温度が上昇し、電子部品取付板に取付けられた電子
部品が機能低下を起こすおそれがある。そこで、電子部
品に放熱用フィン等を設けることも行なわれているが、
この場合には電子部品が高価になるとともに、電子部品
が大型化するので、電子部品の実装密度が小さくなる。Since the heat dissipation properties of ceramics and the like are not sufficient, the temperature of the electronic component mounting plate increases, and there is a risk that the functionality of the electronic components mounted on the electronic component mounting plate may deteriorate. Therefore, heat dissipation fins etc. are provided on electronic components, but
In this case, the electronic components become expensive and large in size, which reduces the packaging density of the electronic components.
この発明は上述の問題点を解決するためになさ九たもの
で、放熱性が良好である電子部品取付板を提供すること
を目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component mounting plate with good heat dissipation.
この目的を達成するため、この発明においては、金属板
に第１の樹脂板の一面を接着し、その第１の樹脂板の他
面に第２の樹脂板を接着し、上記第１の樹脂板に第１の
電子部品用穴を設け、上記第２の樹脂板に上記第１の電
子部品用穴より大きくかつ上記第１の電子部品用穴とほ
ぼ同心の第２の電子部品用穴を設け、上記第１の樹脂板
の表面の上記第１の電子部品用穴の近傍にボンディング
端子を設け、上記ボンディング端子と接続されたスルホ
ールを設ける。In order to achieve this object, in the present invention, one side of a first resin plate is bonded to a metal plate, a second resin plate is bonded to the other side of the first resin plate, and the first resin plate is bonded to the metal plate. A first electronic component hole is provided in the plate, and a second electronic component hole is provided in the second resin plate, which is larger than the first electronic component hole and approximately concentric with the first electronic component hole. A bonding terminal is provided in the vicinity of the first electronic component hole on the surface of the first resin plate, and a through hole connected to the bonding terminal is provided.
この電子部品取付板においては、電子部品を金属板に直
接接触させて取付けることができるので、電子部品から
発せられた熱が金属板を介して放出される。In this electronic component mounting plate, since the electronic component can be mounted in direct contact with the metal plate, the heat generated from the electronic component is radiated through the metal plate.
第１図はこの発明に係る電子部品取付板を示す図、第２
図は第１図の■−■断面図である。図において、１０は
金属板、２０は一面が金属板１０に接着剤４０を介して
接着された第１の樹脂板、３０は樹脂板２０の他面に接
着剤５０を介して接着された第２の樹脂板、１２は金属
板１０に設けられた貫通穴、１４はｔ′ｒ通穴１２内に
充填された樹脂、１６は樹脂１４の中央部に設けられた
ピン用穴、２２は樹脂板２０の中央部に設けられた第１
の電子部品用穴、３２は樹脂板３０の中央部に設けられ
た第２の電子部品用穴で、Ｉｔ子部品用穴３２は電子部
品用穴２２より大きく、また電子部品用穴２２．３２は
同心である。２４は樹脂板２０の表面の電子部品用穴２
２の近傍に設けられたボンディング端子、６０はボンデ
ィング端子２４と接続されたスルホールで、スルホール
６０の中心線とピン用穴１６の中心線とが一致している
。FIG. 1 is a diagram showing an electronic component mounting plate according to the present invention, and FIG.
The figure is a sectional view taken along the line ■-■ in FIG. In the figure, 10 is a metal plate, 20 is a first resin plate whose one side is bonded to the metal plate 10 via an adhesive 40, and 30 is a first resin plate whose other side is bonded to the resin plate 20 via an adhesive 50. 2 resin plate, 12 a through hole provided in the metal plate 10, 14 resin filled in the t'r through hole 12, 16 a pin hole provided in the center of the resin 14, 22 resin The first plate provided in the center of the plate 20
The electronic component hole 32 is a second electronic component hole provided in the center of the resin plate 30, and the electronic component hole 32 is larger than the electronic component hole 22. are concentric. 24 is a hole 2 for electronic components on the surface of the resin plate 20
A bonding terminal 60 provided near the bonding terminal 2 is a through hole connected to the bonding terminal 24, and the center line of the through hole 60 and the center line of the pin hole 16 are aligned.
第３図は第１図、第２図に示した電子部品取付板に電子
部品を取付けた状態を示す断面図である。FIG. 3 is a sectional view showing a state in which electronic components are attached to the electronic component mounting plate shown in FIGS. 1 and 2. FIG.
図において、 ７０は電子部品で、電子部品７０は電子
部品用穴２２．３２内に位置しており、電子部品７０は
金属板１０に直接接触している。７２は電子部品７０の
リード線で、リード線７２はボンディング端子２４にボ
ンディングされている。７４は電子部品用穴２２．３２
と電子部品７０との間に充填された樹脂、８０は一端が
ピン用穴１６、スルホール６０内に挿入されたコネクタ
ピン、８２はスルホール６０とコネクタピン８０とを接
続するハンダである。In the figure, 70 is an electronic component, and the electronic component 70 is located in the electronic component hole 22.32, and the electronic component 70 is in direct contact with the metal plate 10. 72 is a lead wire of the electronic component 70, and the lead wire 72 is bonded to the bonding terminal 24. 74 is the hole 22.32 for electronic parts
80 is a connector pin inserted into the pin hole 16 at one end and the through hole 60 , and 82 is a solder that connects the through hole 60 and the connector pin 80 .
このように、第１図、第２図に示した電子部品取付板に
おいては、電子部品７０を金属板１０に直接接触させて
取付けることができるので、電子部品７０から発せられ
た熱が金属板１０を介して放出されるから、放熱性が非
常に良好である。In this manner, in the electronic component mounting plate shown in FIGS. 1 and 2, the electronic component 70 can be mounted in direct contact with the metal plate 10, so that the heat emitted from the electronic component 70 is transferred to the metal plate 10. 10, the heat dissipation is very good.
つぎに、第４図により第１図、第２図に示した電子部品
取付板を製造する方法について説明する。Next, a method for manufacturing the electronic component mounting plate shown in FIGS. 1 and 2 will be described with reference to FIG. 4.
まず、樹脂板２０の表面に銅箔２６を形成する（第４図
（ａ））。つぎに、銅箔２６上にメツキレシスト２８を
設ける（第４図（ｂ））。つぎに、エツチングを行なう
ことにより、ボンディング端子２４を形成する（第４図
（Ｃ））。つぎに、樹脂板２０に電子部品川穴２２を設
ける（第４図（ｄ））。一方、樹脂板３０の表面に銅箔
３４を形成する（第４図（ｅ））。つぎに、樹脂板３０
に電子部品用穴３２を設ける（第４図（ｆ））。つぎに
、第４図（ｄ）に示す樹脂板２０と第４図（ｆ）に示す
樹脂板３０とを接着剤５０を介して接着する（第４図（
ｇ））。つぎに、樹脂板２０．３０にスルホール用穴６
２を設ける（第４図（ｈ））。つぎに、無電解銅メッキ
を行なった後、電解銅メッキを行なうことにより、銅箔
３４の表面およびスルホール用穴６２の内面に銅メッキ
層６４を設ける（第４図（ｉ））。つぎに、銅箔３４お
よび銅メッキ層６４を選択的にエツチングする（第４図
（ｊ））。さらに、金属板１０に貫通穴１２を設ける（
第４図（ｋ））。つぎに、貫通穴１２内に樹脂１４を充
填する（第４図（Ｑ））。つぎに、樹脂１４の中央部に
ピン用穴１６を設ける（第４図（ｍ））。First, a copper foil 26 is formed on the surface of the resin plate 20 (FIG. 4(a)). Next, a metal resist 28 is provided on the copper foil 26 (FIG. 4(b)). Next, bonding terminals 24 are formed by etching (FIG. 4(C)). Next, electronic component holes 22 are provided in the resin plate 20 (FIG. 4(d)). On the other hand, a copper foil 34 is formed on the surface of the resin plate 30 (FIG. 4(e)). Next, the resin plate 30
A hole 32 for electronic parts is provided in (FIG. 4(f)). Next, the resin plate 20 shown in FIG. 4(d) and the resin plate 30 shown in FIG. 4(f) are bonded together via the adhesive 50 (see FIG.
g)). Next, attach the through hole hole 6 to the resin plate 20.30.
2 (Fig. 4(h)). Next, after performing electroless copper plating, electrolytic copper plating is performed to provide a copper plating layer 64 on the surface of the copper foil 34 and the inner surface of the through-hole hole 62 (FIG. 4(i)). Next, the copper foil 34 and the copper plating layer 64 are selectively etched (FIG. 4(j)). Furthermore, a through hole 12 is provided in the metal plate 10 (
Figure 4(k)). Next, the through hole 12 is filled with resin 14 (FIG. 4(Q)). Next, a pin hole 16 is provided in the center of the resin 14 (FIG. 4(m)).
つぎに、第４図（ｍ）に示す金属板１０に第４図（ｊ）
に示す樹脂板２０．３０を接着剤４０を介して接着する
（第４図（ｎ））。Next, the metal plate 10 shown in FIG. 4(m) is coated with the metal plate shown in FIG. 4(j).
The resin plates 20 and 30 shown in FIG.
第５図はこの発明に係る他の電子部品取付板を示す概略
断面図である。この電子部品取付板においては、金属板
ＩＩが樹脂板２０．３０より大きく、また金属板１１は
箱型であるから、放熱性をさらに良好にすることができ
る。FIG. 5 is a schematic sectional view showing another electronic component mounting plate according to the present invention. In this electronic component mounting plate, the metal plate II is larger than the resin plate 20, 30, and the metal plate 11 is box-shaped, so that heat dissipation can be further improved.
第６図はこの発明に係る他の電子部品取付板を示す概略
断面図である。この電子部品取付板においては、金属板
１３が樹脂板２０．３０よりも大きく、金属板１３に取
付穴１５が設けられているから、電子部品取付板を直接
シャーシ等に取付けることが可能である。FIG. 6 is a schematic sectional view showing another electronic component mounting plate according to the present invention. In this electronic component mounting plate, the metal plate 13 is larger than the resin plate 20.30, and the metal plate 13 is provided with mounting holes 15, so that the electronic component mounting plate can be directly mounted on the chassis, etc. .
第７図はこの発明に係る他の電子部品取付板を示す図、
第８図は第７図の■−■拡大断面図である。図において
、３６は樹脂板３０の表面に設けられた接続用端子、３
８は樹脂板３０の表面に設けられた配線で、配線３８は
スルホール６０と接続用端子３６とを接続している。FIG. 7 is a diagram showing another electronic component mounting plate according to the present invention;
FIG. 8 is an enlarged sectional view taken along the line -■ in FIG. 7. In the figure, 36 is a connection terminal provided on the surface of the resin plate 30;
8 is a wiring provided on the surface of the resin plate 30, and the wiring 38 connects the through hole 60 and the connection terminal 36.
第９１閾はこの発明に係る他の電子部品取付板を示す図
、第１０図は第９図のＸ−ｘ拡大断面図である。この電
子部品取付板においては、樹脂板２０．３０に複数の電
子部品用穴２２．３２が設けられているから、複数の電
子部品を取付けることが可能である。また、樹脂板２０
．３０にはスルホール６０と接続された多層の配線層２
１．３１が設けられており、スルホール６０は樹脂Ｉ４
の中央部を貫通している。The 91st threshold is a diagram showing another electronic component mounting plate according to the present invention, and FIG. 10 is an enlarged sectional view taken along the line X-x in FIG. 9. In this electronic component mounting plate, since a plurality of electronic component holes 22.32 are provided in the resin plate 20.30, it is possible to mount a plurality of electronic components. In addition, the resin plate 20
．． 30 has a multilayer wiring layer 2 connected to the through hole 60.
1.31 is provided, and the through hole 60 is made of resin I4.
It passes through the center of the
第１１図はこの発明に係る他の電子部品取付板を示す図
、第１２図は第１１図の店−■拡大断面図である。図に
おいて、１７は金属板１０に設けられた分離溝で、分離
溝１７および貫通穴１２内には接着剤４０が充填されて
いる。９０は金属板１０．樹脂板２０．３０に設けられ
た分離穴、９２は金属板１０、樹脂板２０．３０に設け
られた分Ｉ１１溝で、スルホール６０の一部は金属板１
０と接続されている。また、スルホール６０と接続用端
子３６とが樹脂板３０の表面に設けられた配線（図示省
略）により接続されている。FIG. 11 is a diagram showing another electronic component mounting plate according to the present invention, and FIG. 12 is an enlarged sectional view of FIG. 11. In the figure, reference numeral 17 denotes a separation groove provided in the metal plate 10, and the separation groove 17 and the through hole 12 are filled with an adhesive 40. 90 is a metal plate 10. The separation hole 92 provided in the resin plate 20.30 is a groove I11 provided in the metal plate 10 and the resin plate 20.30, and a part of the through hole 60 is a part of the metal plate 1.
Connected to 0. Further, the through holes 60 and the connection terminals 36 are connected by wiring (not shown) provided on the surface of the resin plate 30.
この電子部品取付板においては、スルホール６０を介し
て金属板ＩＯに大電流を流すことができるので、設計的
に非常に有利であるとともに、分離溝１７によって分離
された金属板１０の各部分の電位を異なる値にすること
ができ、しかも分離溝１７によって分離された金属板１
０の一部に多量の熱を発する電子部品が取付られたとし
ても、その電子部品から発せられる熱が金属板１０の他
の部分に伝達されることがないので、上記他の部分に取
付られた電子部品の機能が低下するのを防止することが
可能である。In this electronic component mounting plate, a large current can be passed through the metal plate IO through the through hole 60, which is very advantageous in terms of design. Metal plates 1 whose potentials can be set to different values and which are separated by separation grooves 17
Even if an electronic component that generates a large amount of heat is attached to a part of the metal plate 10, the heat generated from the electronic component will not be transmitted to other parts of the metal plate 10, so it will not be attached to the other parts. It is possible to prevent the functionality of electronic components from deteriorating.
また、金属板１０に第１３図、第１４図に示すような分
離溝１７を設け、この金属板１０に樹脂板２０．３０を
接着した後、分離穴９０、分離溝９２を設ければ、第１
１図、第１２図に示す電子部品取付板を極めて容易に製
造することが可能である。Furthermore, if separation grooves 17 as shown in FIGS. 13 and 14 are provided in the metal plate 10, and after the resin plates 20 and 30 are bonded to this metal plate 10, separation holes 90 and separation grooves 92 are provided. 1st
The electronic component mounting plate shown in FIGS. 1 and 12 can be manufactured extremely easily.
なお、上述実施例においては、金属板１０と樹脂板２０
とを接着剤４０により接着したが、金属板１０と樹脂板
２０とをボンディングシートを介して接着してもよい。In addition, in the above-mentioned embodiment, the metal plate 10 and the resin plate 20
Although the metal plate 10 and the resin plate 20 may be bonded together using a bonding sheet.
また、上述実施例においては、樹脂板２０と樹脂板３０
とを接着剤５０を介して接着したが。Further, in the above embodiment, the resin plate 20 and the resin plate 30
and were bonded together via an adhesive 50.
樹脂板２０と樹脂板３０とをプリプレーグ、ボンディン
グシートを介して接着してもよい。さらに、上述実ｈＩ
ｑ例においては、貫通穴１２内に樹脂１４を充填したが
、第１５図に示すようにしてもよい。すなわら、まず金
属板１０にｄ通穴１２を設け（第１５図（ａ））、金属
板１０の片面にブリプレーグ１８を貼着しく第１５図（
ｂ））、金属板１０にプリブレーグ１８を貼着したもの
を熱圧着することにより、プリブレーグ１８を貫通穴１
２内に充填しく第１５図（Ｃ））、貫通穴１２内に充填
されたプリブレーグ１８の中央部にピン用穴１９を設け
（第１５図（ｄ））、金属板１０に樹脂板２０．３０を
接着剤４０を介して接着する（第１５図（ｅ））。また
、金属板ＩＯとしては全ての金属からなる板たとえばア
ルミニウム板、アルミニウム合金板、銅板、鉄板等を用
いることができる。The resin plate 20 and the resin plate 30 may be bonded together via a prepreg or a bonding sheet. Furthermore, the above actual hI
In example q, the through hole 12 was filled with the resin 14, but the resin 14 may be filled as shown in FIG. 15. That is, first, a D through hole 12 is provided in the metal plate 10 (FIG. 15(a)), and a buri plate 18 is attached to one side of the metal plate 10 (FIG. 15(a)).
b)) The prebrag 18 is attached to the metal plate 10 by thermocompression bonding, and the prebrag 18 is attached to the through hole 1.
15(C)), a pin hole 19 is provided in the center of the prebrag 18 filled in the through hole 12 (FIG. 15(d)), and the resin plate 20.2 is inserted into the metal plate 10. 30 is adhered via an adhesive 40 (FIG. 15(e)). Further, as the metal plate IO, a plate made of any metal such as an aluminum plate, an aluminum alloy plate, a copper plate, an iron plate, etc. can be used.
以上説明したように、この発明に係る電子部品取付板に
おいては、電子部品から発せられた熱が金属板を介して
放出されるから、放熱性が非常に良好であり、電子部品
から発せられる熱量が多くとも、電子部品の機能が低下
することがなく、放熱用フィン等を有する高価でかつ大
型の電子部品を用いる必要がない。このように、この発
明の効果は顕著である。As explained above, in the electronic component mounting plate according to the present invention, the heat emitted from the electronic components is released through the metal plate, so the heat dissipation is very good, and the amount of heat emitted from the electronic components is Even if there is a large amount of heat dissipation, the functions of the electronic components do not deteriorate, and there is no need to use expensive and large electronic components having heat dissipation fins or the like. As described above, the effects of this invention are remarkable.
第１図はこの発明に係る電子部品取付板を示す図、第２
図は第１図の■−■断面図、第３図は第１図、第２図に
示した電子部品取付板に電子部品を取付けた状態を示す
断面図、第４図は第１図、第２図に示した電子部品取付
板の製造方法の説明図、第５図、第６図はそれぞれこの
発明に係る他の電子部品取付板を示す概略断面図、第７
図はこの発明に係る他の電子部品取付板を示す図、第８
図は第７図の■−■拡大断面図、第９図はこの発明に係
る他の電子部品取付板を示す図、第】０図は第９図のＸ
−Ｘ拡大断面図、第１１図はこの発明に係る他の電子部
品取付板を示す図、第１２図は第１１図の団−店拡大断
面図、第１３図は第１１図、第１２図に示した電子部品
取付板の製造方法の説明図、第１４図は第１３図のＸＩ
Ｖ−ＸＴＶ断面図、第１５図はこの発明に係る電子部品
取付板の製造方法の説明図である。
１０・・・金属板 ２０・・・第１の樹脂板
２２・・第１の電子部品用穴
２４・・・ボンディング端子 ３０・・・第２の樹脂板
３２・・・第２の電子部品用穴
６０・・・スルホール
代理人弁理士 中 村 純之助
ン：” １ トン１
卆２ ’７，１
砦 ３図
ゴー４１司
′）６
４″゛４ べ１
７５＠
１′６母
１ら
オ゛７ カ
才８．ン［
卆９図
卆１０セη
ｌｌ＋４！ｌ
Ｊ’１１［
ｑ２
１Ｐ１２図
ｔ？１３０
？１４図FIG. 1 is a diagram showing an electronic component mounting plate according to the present invention, and FIG.
The figure is a sectional view taken along the line ■-■ of Fig. 1, Fig. 3 is a sectional view showing a state in which electronic components are mounted on the electronic component mounting plate shown in Figs. 1 and 2, and Fig. 4 is a sectional view taken from Fig. FIG. 2 is an explanatory diagram of the manufacturing method of the electronic component mounting plate shown in FIG. 2, and FIGS.
Figure 8 shows another electronic component mounting plate according to the present invention.
The figure is an enlarged sectional view taken along the line ■-■ of FIG. 7, FIG. 9 is a diagram showing another electronic component mounting plate according to the present invention, and FIG.
-X enlarged sectional view, FIG. 11 is a diagram showing another electronic component mounting plate according to the present invention, FIG. 12 is an enlarged sectional view of the group shown in FIG. 11, and FIG. 13 is FIG. 14 is an explanatory diagram of the manufacturing method of the electronic component mounting plate shown in FIG.
The V-XTV sectional view and FIG. 15 are explanatory diagrams of the method of manufacturing an electronic component mounting plate according to the present invention. 10...Metal plate 20...First resin plate 22...First electronic component hole 24...Bonding terminal 30...Second resin plate 32...For second electronic component Hole 60... Surhole agent patent attorney Junnosuke Nakamura: 1 ton 1 volume 2 '7, 1 fort 3 figure go 41 Tsu') 6 4''゛4 be1 75 @ 1'6 mother 1 lao 7 years old8. [ Volume 9 Figure Volume 10 η ll+4! l J'11 [ q2 1P12 figure t? 130? Figure 14
Claims (1)
の樹脂板の他面に第２の樹脂板が接着され、上記第１の
樹脂板に第１の電子部品用穴が設けられ、上記第２の樹
脂板に上記第１の電子部品用穴より大きくかつ上記第１
の電子部品用穴とほぼ同心の第２の電子部品用穴が設け
られ、上記第１の樹脂板の表面の上記第１の電子部品用
穴の近傍にボンディング端子が設けられ、上記ボンディ
ング端子と接続されたスルホールが設けられたことを特
徴とする電子部品取付板。 ２、上記金属板が上記第１の樹脂板、上記第２の樹脂板
より大きいことを特徴とする特許請求の範囲第１項記載
の電子部品取付板。 ３、上記金属板が箱形であることを特徴とする特許請求
の範囲第２項記載の電子部品取付板。 ４、上記スルホールが上記第１の樹脂板、上記第２の樹
脂板に設けられ、上記金属板に中心線が上記スルホール
の中心線とほぼ一致した貫通穴が設けられ、その貫通穴
内に樹脂が充填され、その樹脂の中央部にピン用穴が設
けられていることを特徴とする特許請求の範囲第１項記
載の電子部品取付板。 ５、上記第２の樹脂板の表面に接続用端子が設けられ、
上記スルホールと上記接続用端子とが配線によって接続
されていることを特徴とする特許請求の範囲第１項記載
の電子部品取付板。 ６、上記第１の電子部品用穴、上記第２の電子部品用穴
が複数設けられていることを特徴とする特許請求の範囲
第１項記載の電子部品取付板。 ７、上記金属板が複数に分割されていることを特徴とす
る特許請求の範囲第６項記載の電子部品取付板。 ８、上記第１の樹脂板に多層の配線層が形成されている
ことを特徴とする特許請求の範囲第１項記載の電子部品
取付板。 ９、上記第２の樹脂板に多層の配線層が形成されている
ことを特徴とする特許請求の範囲第１項記載の電子部品
取付板。[Claims] 1. One side of a first resin plate is adhered to a metal plate;
A second resin plate is bonded to the other surface of the resin plate, a first electronic component hole is provided in the first resin plate, and a hole is formed in the second resin plate from the first electronic component hole. Larger and above 1st
A second electronic component hole is provided approximately concentrically with the electronic component hole, and a bonding terminal is provided in the vicinity of the first electronic component hole on the surface of the first resin plate, and a bonding terminal is provided in the vicinity of the first electronic component hole on the surface of the first resin plate. An electronic component mounting plate characterized by being provided with connected through holes. 2. The electronic component mounting plate according to claim 1, wherein the metal plate is larger than the first resin plate and the second resin plate. 3. The electronic component mounting plate according to claim 2, wherein the metal plate is box-shaped. 4. The through holes are provided in the first resin plate and the second resin plate, and the metal plate is provided with a through hole whose center line substantially coincides with the center line of the through hole, and the resin is in the through hole. 2. The electronic component mounting plate according to claim 1, wherein the electronic component mounting plate is filled with resin and has a hole for a pin in the center of the resin. 5. Connection terminals are provided on the surface of the second resin plate,
2. The electronic component mounting plate according to claim 1, wherein the through hole and the connection terminal are connected by wiring. 6. The electronic component mounting plate according to claim 1, wherein a plurality of the first electronic component holes and the second electronic component holes are provided. 7. The electronic component mounting plate according to claim 6, wherein the metal plate is divided into a plurality of parts. 8. The electronic component mounting plate according to claim 1, wherein a multilayer wiring layer is formed on the first resin plate. 9. The electronic component mounting plate according to claim 1, wherein a multilayer wiring layer is formed on the second resin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61082232A JPS62239597A (en) | 1986-04-11 | 1986-04-11 | Electronic parts attaching plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61082232A JPS62239597A (en) | 1986-04-11 | 1986-04-11 | Electronic parts attaching plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62239597A true JPS62239597A (en) | 1987-10-20 |
Family
ID=13768659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61082232A Pending JPS62239597A (en) | 1986-04-11 | 1986-04-11 | Electronic parts attaching plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62239597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366199A (en) * | 1989-08-03 | 1991-03-20 | Ibiden Co Ltd | Film carrier |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4917677A (en) * | 1972-06-05 | 1974-02-16 | ||
| JPS5356983A (en) * | 1976-11-02 | 1978-05-23 | Sharp Corp | Multilayer wiring substrate |
| JPS53117741A (en) * | 1977-03-24 | 1978-10-14 | Sharp Kk | Multilayer circuit board |
| JPS5644599A (en) * | 1979-09-20 | 1981-04-23 | Tanaka Precious Metal Ind | Igniter for electric detonator |
| JPS60113995A (en) * | 1983-11-25 | 1985-06-20 | 松下電送株式会社 | Multilayer printed circuit board |
-
1986
- 1986-04-11 JP JP61082232A patent/JPS62239597A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4917677A (en) * | 1972-06-05 | 1974-02-16 | ||
| JPS5356983A (en) * | 1976-11-02 | 1978-05-23 | Sharp Corp | Multilayer wiring substrate |
| JPS53117741A (en) * | 1977-03-24 | 1978-10-14 | Sharp Kk | Multilayer circuit board |
| JPS5644599A (en) * | 1979-09-20 | 1981-04-23 | Tanaka Precious Metal Ind | Igniter for electric detonator |
| JPS60113995A (en) * | 1983-11-25 | 1985-06-20 | 松下電送株式会社 | Multilayer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366199A (en) * | 1989-08-03 | 1991-03-20 | Ibiden Co Ltd | Film carrier |
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