JPS627192A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field]・ This invention relates to a printed wiring board.

[Conventional technology]

Conventionally, as a printed wiring board, there is a resin printed wiring board in which a wiring layer and through holes are formed on a resin board.

[Problem to be solved by the invention] However, as electronic devices become smaller, the density of mounting components on printed wiring boards increases, and the amount of heat emitted from mounted components increases. On the other hand, resin printed wiring boards do not have sufficient heat dissipation, which causes the temperature of the resin printed wiring board and its vicinity to rise, causing a decline in the functionality of the mounted components, which has become a major problem. Therefore,
Mounting components are sometimes provided with heat dissipation fins, but this has the disadvantage that the mounting components become expensive. Additionally, as the number of mounted components increases, the resin printed wiring board has low bending rigidity, which causes the printed wiring board to warp, making it impossible to insert the printed wiring board into an electronic device, or even if it can be inserted into an electronic device. Contact with adjacent printed wiring boards may seriously affect one circuit. Furthermore, since the resin printed wiring board has poor shielding effect, it is impossible to prevent noise and the like.

This invention was made to solve the above-mentioned problems, and aims to provide a printed wiring board that has good heat dissipation, high bending rigidity, and good shielding effect.

[Means for solving problems]

In order to achieve this objective, in this invention.

A wiring layer and a through hole are provided on the resin plate, a hole for a lead wire is provided on the metal plate, and the center line of the through hole and the center line of the hole for the lead wire are substantially aligned to insulate the metal plate on the resin plate. Glue through layers.

[Effect]

In this printed wiring board, heat is released through the metal plate, the metal plate increases bending rigidity, the metal plate can shield electric and magnetic fields, and the insulating layer connects the wiring layer to the metal plate. It is possible to effectively prevent conduction between the two.

〔Example〕

FIG. 1 is a sectional view showing a part of a printed wiring board according to the present invention. In FIG. 0, 1 is a resin plate.

2 is a wiring layer formed on the resin plate 1, 3 is a through hole provided on the resin plate 1, 4 is a metal plate, 5 is an insulating layer made of a prebrag etc. provided on one side of the metal plate 4, and 6 is a metal plate. Hole for lead wire provided in 4.

7 is an insulating film provided by printing on the 6 parts of the lead wire hole of the metal plate 4. The resin plate 1 and the metal plate 4 are bonded together with an adhesive sheet 8, and the center line of the through hole 3 and the lead wire hole are bonded together. The diameter of the lead wire hole 6 is larger than the diameter of the through hole 3.

In such a printed wiring board, a metal plate 4 is bonded to the surface of the resin plate 1, and heat is released through the metal plate 4, so heat dissipation is good.
This increases bending rigidity.

Furthermore, the metal plate 4 can shield electric and magnetic fields, resulting in a good shielding effect.Also, since the resin plate 1 and the metal plate 4 are bonded via the insulating layer 5, the resin plate 1 Even if the wiring layer 2 is formed on the surface of the metal plate 4,
Electrical conduction between the wiring layer 2 and the metal plate 4 can be effectively prevented.

Next, a method for manufacturing the printed wiring board shown in FIG. 1 will be explained with reference to FIG. First, an insulating layer 5 is provided on one side of a metal substrate 9, and an adhesive sheet 8 with a cover paper 10 pasted is provided on the surface of the insulating layer 5 (FIG. 2(a)). Next, an outer mold is formed using a press machine. At the same time as processing, holes 6 for lead wires are provided by drilling holes (FIG. 2(b)). Next, the cover paper 10 is peeled off from the adhesive sheet 8 (FIG. 2(c)).

The metal plate 4 is bonded to the resin plate 1 having the wiring layer 2 and the through holes 3 using an adhesive sheet 8 (FIG. 2(d)).Finally, an insulating film 7 is provided by printing.

FIG. 3 is an explanatory diagram of another method of manufacturing a printed wiring board according to the present invention. In this manufacturing method, an insulating layer 5 is first provided on one side of a metal substrate 9, and an adhesive sheet 8 on which a cover paper IO is adhered is provided on the surface of the insulating layer 5 (third
(a)), and then holes 6 for lead wires are provided in the metal substrate 9 (FIG. 3(b)).

Next, peel off the cover paper 10 from the adhesive sheet 8 (third
(Fig. 3(c)), Next, the metal substrate 9 is adhered to the resin substrate 11 on which the wiring layer 2 and the through holes 3 are formed using the adhesive sheet 8 (Fig. 3(d)). Next, the outer mold is processed. (Figure 3(e)).

Note that as the metal plate 4, an aluminum plate, an aluminum alloy plate, a copper plate, an iron plate, etc. can be used. Further, in the above embodiment, the resin plate 1 and the metal plate 4 were bonded together using the bonding sheet 8, but the resin plate 1 and the metal plate 4 may be bonded together via a bonding sheet. In the example, a multilayer wiring layer 2 is formed on the resin board 1, but the wiring layer 2 may be formed on both sides of the resin board 1.

〔Effect of the invention〕

As explained above, the printed wiring board according to the present invention has good heat dissipation.

The mounting density of components is high, and even if a large amount of heat is emitted from the mounted components, the functionality of the mounted components will not deteriorate, and there is no need to use expensive mounted components with heat dissipation fins, etc.
In addition, due to its high bending rigidity, even if the number of mounted components increases, the printed wiring board will not warp, making it easy to insert the printed wiring board into an electronic device and avoid contact with adjacent printed wiring boards. Not at all.

Furthermore, since the shielding effect is good, it is possible to effectively prevent problems such as damage. Further, since it is possible to effectively prevent electrical conduction between the wiring layer formed on the surface of the resin plate on the metal plate side and the metal plate, reliability is high. Therefore, it is possible to significantly expand the scope of application of the printed wiring board. As described above, the effects of this invention are remarkable.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a part of a printed wiring board according to the present invention, FIG. 2 is an explanatory diagram of a method for manufacturing the printed wiring board shown in FIG. 1, and FIG. FIG. 3 is an explanatory diagram of a method for manufacturing a wiring board.

Claims (1)

[Claims] A wiring layer and a through hole are provided on the resin plate, a hole for a lead wire is provided on the metal plate, and the center line of the through hole and the center line of the hole for the lead wire are substantially aligned to insulate the metal plate on the resin plate. A printed wiring board characterized by being bonded through layers.