JPS61268095A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a method of manufacturing a printed wiring board.

(Prior Art) Conventionally, as a printed wiring board, there is a resin printed wiring board in which a wiring layer is formed on a resin board.

However, as electronic devices become smaller, the density of component mounting on printed wiring boards has increased, and the amount of heat emitted from mounted components has increased, whereas resin printed wiring boards have poor heat dissipation. As a result, the temperature of the resin printed wiring board and its vicinity increases, causing a decline in the functionality of the mounted components, which has become a serious problem. Therefore, it has been attempted to provide heat dissipation fins or the like to the mounted components, but this has the disadvantage that the mounted components become expensive. Additionally, as the number of mounted components increases, the resin printed wiring board has low bending rigidity, which causes the printed wiring board to warp, making it impossible to insert the printed wiring board into an electronic device, or even if it can be inserted into an electronic device. Contact with adjacent printed wiring boards may seriously affect one circuit. Furthermore, since the resin printed wiring board has poor shielding effect, it is impossible to prevent noise and the like.

For this reason, in FIG. 0, in which a printed wiring board as shown in FIG. 4 is a metal plate, 7 is a through hole provided in the metal plate 4, 8
9 is a lead wire hole provided in the center of the resin 8; the resin plate 1 and the metal plate 4 are bonded together via a bonding sheet 6; The center line of the lead wire hole 9 matches the center line of the lead wire hole 9.

This printed wiring board has good heat dissipation, so it has a high degree of single-component implementation, and even if a large amount of heat is emitted from the mounted components, the functionality of the mounted components will not deteriorate.
There is no need to use expensive mounting components with heat dissipation fins, etc., and since the bending rigidity is high, even if the number of mounted components increases, the printed wiring board will not warp, so the printed wiring board can be used in electronic devices. It is easy to insert into the PCB, does not come into contact with nearby printed wiring boards, and has a good shielding effect, so it can effectively prevent noise. Therefore, it is possible to significantly expand the scope of application of the printed wiring board.

Next, a conventional method of manufacturing the printed wiring board shown in FIG. 4 will be explained with reference to FIG. First, Figure 5 (a
), a wiring layer 2 and a through hole 3 are formed in the area shown by the two-dot chain line on the resin substrate 10, and a guide hole 11 is formed.
will be established. On the other hand, as shown in FIG. 5(b), a through hole 7, a resin 8. A lead wire hole 9 is provided, and a guide hole 13 is further provided. Next, as shown in FIG. 5(c), the hot plate 1 of the multilayer press machine is
4, a large number of bonding sheets 6 are placed between the resin substrate 10 and the metal substrate 12, and about 170
The resin substrate 10 and the metal substrate 12 are bonded together via the bonding sheet 6 by thermocompression bonding at a temperature of about 5 hours. Next, a printed wiring board as shown in FIG. 5(d) is made from the resin substrate 10 and the metal substrate 12 bonded together by external mold processing using a press machine, a router, or the like.

[Problem that the invention seeks to solve]

However, in such a manufacturing method, the resin substrate 10
A multilayer press device is used when bonding the metal substrate 12 and the metal substrate 12 via the bonding sheet 6, but this multilayer press device is extremely expensive, resulting in high manufacturing costs. Furthermore, it takes about 2 hours to thermocompress the resin substrate 10 and the metal substrate 12 via the bonding sheet 6 using a multilayer press device, which increases the time required for the manufacturing process, resulting in poor productivity. In order to manufacture a printed wiring board in which the metal plate 4 is bonded only to a part of the resin board 1, it is necessary to bond a large number of metal plates 4 to the resin board 10, so in this case, the resin board 10 and the metal The work of bonding the plate 4 with the bonding sheet 6 is extremely troublesome and takes a long time.

This invention was made to solve the above-mentioned problems, and it has low manufacturing cost, good productivity, and can easily produce a printed wiring board in which a metal plate is bonded only to a part of the resin plate. An object of the present invention is to provide a method for manufacturing a printed wiring board that can be manufactured.

[Means for solving problems]

In order to achieve this object, the present invention includes a resin plate having at least one of a wiring layer, a through hole, and a lead wire hole, a through hole, a resin filled in the through hole, and a resin plate provided in the center of the resin. In the method for manufacturing a printed wiring board bonded to a metal plate having holes for lead wires, the through hole is provided, the through hole is filled with the resin, and an adhesive sheet and a cover paper are pasted. A hole for the lead wire is provided in the center of the resin of the metal substrate, the metal plate is made from the metal substrate by external mold processing, and the cover paper is peeled off from the metal plate.
The metal plate is bonded to the resin plate by pressure bonding via the adhesive sheet.

[Effect]

In this method of manufacturing a printed wiring board, there is no need to use a multilayer press device to bond the resin plate and the metal plate, and the resin plate and the metal plate can be bonded in an extremely short time. Furthermore, it is possible to adhere a metal plate of any shape to the resin plate.

〔Example〕

FIG. 1 is an explanatory diagram of a method for manufacturing a printed wiring board according to the present invention. In this manufacturing method.

First, from an NG (numerical control) drawing or film original, an NC tape with data on the center position of the lead wire hole 9 is created, and the metal substrate 12 is placed at a predetermined position on an NC drilling machine that will drill holes according to the instructions on the NC tape. The first drill is attached to an NC drilling machine, and a through hole 7 is formed in the metal substrate 12 by drilling six holes with the NC drilling machine (Fig. 1 (a)). Next, an adhesive sheet is attached to the metal substrate 12. 15 and cover paper 16 are attached (FIG. 1(b)).

Next, the through hole 7 is filled with resin 8 using a squeegee, roller, etc., and the resin 8 is cured by heat drying, ultraviolet rays, etc. (FIG. 1(c)). After fixing it in a predetermined position and attaching a second drill smaller in diameter than the first drill to the NC drilling machine, the resin 8 is drilled using the NC tape using the NC drilling machine. A hole 9 for a lead wire is provided in the center (FIG. 1(d)), and then a metal plate 4 is made from the metal substrate 12 by external mold processing using a press device, a router, etc. (FIG. 1(e)), and then Then, peel off the cover paper 16 from the metal plate 4 (FIG. 1(f)), while
A wiring layer 2 is formed on the resin substrate 10. After forming the through holes 3, the resin plate 1 is made from the resin substrate 10 by external mold processing using a press machine, router, etc., and guide holes ( After aligning the resin plate 1 (not shown), the metal plate 4 is bonded to the resin plate 1 via an adhesive sheet 15 by roller thermocompression bonding (FIG. 1(g)).

FIG. 2 is an explanatory diagram of another printed wiring board manufacturing method according to the present invention. In this manufacturing method, first, an adhesive sheet 15 and a cover paper 16 are attached to a metal substrate 12 (FIG. 2(a)). Next, an NC tape having data on the center position of the lead wire hole 9 is prepared, and the metal substrate 12 is fixed at a predetermined position on an NC drilling machine that will drill a 6' hole according to the instructions on the NC tape. A through hole 7 is provided in the metal substrate 12 by attaching a drill and drilling with an NC drilling machine (Fig. 2 (b)).
Then, the through hole 7 is filled with resin 8 using a squeegee, roller, etc., and the resin 8 is hardened (FIG. 2(C)).Next, the metal substrate 12 is fixed at the predetermined position of the NC drilling machine. At the same time, after installing a second drill with a smaller diameter than the first drill on the NC drilling machine,
A hole 9 for the lead wire is provided in the center of the resin 8 by making a six-hole hole with the above NC drilling machine using C tape (
(FIG. 2(d))) Then, the metal plate 4 is made from the metal substrate 12 by external mold processing using a press device, a router, etc. (FIG. 2(e)).Next, the cover paper 16 is peeled off from the metal plate 4. (Figure 2(f)). Next, the metal plate 4 is bonded to the resin plate 1 via the adhesive sheet 15 by roller thermocompression bonding (
Figure 2(g)).

FIG. 3 is an explanatory diagram of another printed wiring board manufacturing method according to the present invention. In this manufacturing method, an NC tape is first prepared that has data on the center position of the lead wire hole 9, and then a hole is drilled according to the instructions on the NC tape.
The metal substrate 12 is fixed at a predetermined position on the drill press, the first drill is attached to the NC drill press, and the through hole 7 is provided in the metal substrate 12 by making six holes with the NC drill press (
3(, )) Next, prepreg 18. is applied to the metal substrate 12. The adhesive sheet 15h and the cover paper 16 are attached (FIG. 3(b)), and then the first through hole 7 is filled with resin 8, and the resin 8 is hardened (FIG. 3(1)).

Next, the metal substrate 12 is fixed at the predetermined position of the NC drilling machine, and a second drill having a smaller diameter than the first drill is attached to the NC drilling machine, and then,
A hole 9 for the lead wire is provided in the center of the resin 8 by drilling with the NC drilling machine using the NC tape (FIG. 3(d)). Make plate 4 (Figure 3(e)),
next.

The cover paper 16 is peeled off from the metal plate 4 (FIG. 3(f)).

Next, after aligning the center line of the through hole 3 and the center line of the lead wire hole 9 using a guide hole (not shown), the metal plate 4 is attached to the resin plate 1 using the adhesive sheet 1.
5 and adhere by roller thermocompression (Fig. 3 (g)
).

In these printed wiring board manufacturing methods, the resin plate 1 and the metal plate 4 are bonded together by roller thermocompression bonding via the adhesive sheet 15. Since there is no need for crimping, manufacturing costs are extremely low. Moreover, if the resin plate 1 and the metal plate 4 are bonded together by roller thermocompression, the resin plate 1 and the metal plate 4 can be bonded together in a few seconds.
Productivity is improved because it can be bonded with Furthermore, since the metal plate 4 of any shape can be bonded to the resin plate 1, it is possible to easily manufacture a printed wiring board in which the metal plate 4 is bonded only to a part of the resin plate 1. Also, paying attention to the fact that the center line of the first through hole 7 and the center line of the lead wire hole 9 match, by drilling holes using the same NC tape, the first through hole 7 and the lead wire hole Since the hole 9 is provided, the hole drilling operation is very easy, and the lead wire hole 9 can be formed in the center of the through hole 7 with high accuracy. Furthermore, in the manufacturing method explained with reference to FIG. 3, even if the metal plate 4 is adhered to the surface of the resin plate 1 on which the wiring layer 2 is formed, the wiring layer 2 and the metal plate 4 are not electrically connected by the prepreg 18. can be effectively prevented.

Note that as the metal plate 4, a plate made of any metal such as an aluminum plate, an aluminum alloy plate, a copper plate, an iron plate, etc. can be used. Further, in the above embodiment, NC
Although the through hole 7 was formed using a drilling machine, other holes may be formed using a device.Alternatively, a press mold was made using NC tape, and the press mold was used to press the hole 7 using a press machine. By doing so, the through hole 7 may be provided.

Further, in the above embodiment, the NC tape was used as the hole position indicating means, but other hole position indicating means may be used. 4 was glued, but the metal plate 4 was glued on the entire surface of the resin plate 1.
The present invention can also be applied to manufacturing a printed wiring board to which is bonded.

Furthermore, in the above embodiment, the resin plate 1 and the metal plate 4 were bonded together by roller thermocompression bonding, but the resin plate 1 and the metal plate 4
In addition, in the above embodiment, the wiring layer 2 is formed in multiple layers on the resin board 1, but the wiring layer 2 is formed only on one or both sides of the resin board 1.
When the wiring layer 2 is formed only on one side of the resin plate 1, holes for lead wires are provided in the resin plate 1. Furthermore, in the embodiment described with reference to FIG. After providing the insulating layer by printing, the adhesive sheet 15 and the cover paper 16 may be attached to the surface thereof.

【Effect of the invention〕

As explained above, in the method for manufacturing a printed wiring board according to the present invention, there is no need to use an expensive multilayer press device, so the manufacturing cost is extremely low, and the resin plate and metal plate can be pressed together in a very short time. Since it can be bonded to a plastic plate, productivity is improved, and a metal plate of any shape can be bonded to a resin plate, making it extremely useful for printed wiring boards in which a metal plate is bonded only to a part of the resin plate. It can be easily manufactured. As described above, the effects of this invention are remarkable.

[Brief explanation of the drawing]

Figures 1 to 3 are explanatory diagrams of a method for manufacturing a printed wiring board according to the present invention, Figure 4 is a sectional view showing a part of the printed wiring board, and Figure 5 is a conventional method for manufacturing a printed wiring board. FIG.

Claims (3)

[Claims] (1) A resin plate having at least one of a wiring layer, a through hole, and a lead wire hole, a through hole, a resin filled in the through hole, and a metal plate having a lead wire hole provided in the center of the resin. In the method of manufacturing a printed wiring board with adhesive bonded to the metal substrate, the through hole is provided, the through hole is filled with the resin, and an adhesive sheet and a cover paper are attached to the central part of the resin. A hole for the lead wire is provided, the metal plate is made from the metal substrate by external molding, the cover paper is peeled off from the metal plate, and the metal plate is crimped to the resin plate via the adhesive sheet. 1. A method for manufacturing a printed wiring board, characterized in that the printed wiring board is bonded by bonding. (2) Provide the through hole in the metal substrate, adhere the adhesive sheet and cover paper to the metal substrate, fill the through hole with the resin, and then insert the lead wire into the center of the resin. A method of manufacturing a printed wiring board according to claim 1, characterized in that a hole is provided. (3) Attach the adhesive sheet and the cover paper to the metal substrate, provide the through hole in the metal substrate, fill the through hole with the resin, and place the lead wire in the center of the resin. A method of manufacturing a printed wiring board according to claim 1, characterized in that a hole is provided.