JPS60187093A - Metal printed board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a metal printed circuit board such as an aluminum printed circuit board and a method for manufacturing the same.

[Background of the invention]

FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG.

In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum thin plate 1, 3 is a wiring layer made of copper formed on the insulating film 2, and 4 is a button part of the wiring layer 3.

Such aluminum pudding 1-substrates have good heat dissipation properties and can be easily deformed, so they have recently begun to be widely used.

FIG. 3 is a plan view showing a state in which electronic elements are attached to the aluminum printed circuit board shown in FIGS. 1 and 2, and FIG. 4 is a front sectional view of the same. In the figure, 5 is an electronic element, 6 is a plate-shaped terminal of the electronic element 5, and the plate-shaped terminal 6 is attached to the button part 4 with solder.

As described above, in the conventional aluminum printed circuit board, although it is possible to attach the electronic element 5 having the plate-shaped terminal 6, it is not possible to attach the electronic element having the lead wire. Furthermore, it is impossible to attach electronic elements to the back surface of the aluminum printed circuit board, that is, the surface on which the wiring layer 3 is not formed.

[Purpose of the invention]

This invention was made to solve the above-mentioned problems, and provides a metal printed circuit board on which electronic elements having lead wires can be attached and electronic elements can be attached on both sides, and a method for manufacturing the same. The purpose is to

[Summary of the invention]

In order to achieve this objective, in the present invention, an insulating film is provided on at least one side of a thin metal plate, a wiring layer is formed on the insulating film, a through hole is provided in the button part of the wiring layer, and a through hole is formed in the button part of the wiring layer. The hole is filled with resin, a lead wire hole is provided in the center of the resin, and a conductor layer is provided on the parallel surfaces of the resin on which the wiring layer is provided. In addition, in order to manufacture such a metal printed circuit board, through-holes are formed in a gold JITI thin plate with conductive foil provided on at least one side through an insulating film using a press device or a hole punching device using a hole position indicating means. the through hole is filled with resin, a plating layer is provided on the surface on which the conductor foil is provided, and a hole for the lead wire is formed in the center of the resin using a hole drilling device using the hole position indicating means. .

[Embodiments of the invention]

FIG. 5 is a plan view showing a part of the aluminum printed circuit board according to the present invention, and FIG. 6 is a front cross-sectional view showing the state in which electronic elements having lead wires are attached to the aluminum printed circuit board 1 to the board shown in FIG. It is. In the figure, 7 is the button part of the wiring layer 3;
8 is a through hole provided in the button part 7, 9 is a resin filled in the through hole 8, 10 is a lead wire hole provided in the center of the resin 9, and 11 is a wiring layer 3 of the resin 9. 12 is an electronic element; 13 is a conductor layer provided on a surface parallel to the
is the lead wire of the electronic element 12, the lead wire 13 is inserted into the lead wire hole 10, and the lead wire 13 is connected to the solder 1.
4 is connected to the button part 7.

In this aluminum printed circuit board, it is possible to attach the electronic element 12 having the lead wire 13, and it is also possible to attach the electronic element 12 to both sides. Furthermore, since the conductor Nll is provided on the resin 9, the electronic element I2
When soldering the lead wire I3 to the button part 7, the soldering properties are extremely good.

In the above embodiment, an aluminum printed circuit board, that is, a printed circuit board in which the gold IR thin plate is an aluminum thin plate l, was explained, but iron, copper, duralumin, etc. may be used as the metal thin plate, and when iron is used, It is possible to produce metal printed circuit boards at low cost, and when steel is used, it is possible to obtain metal printed circuit boards with very good heat dissipation, and when duralumin is used, it is possible to obtain metal printed circuit boards with good workability. be. Furthermore, in the above-mentioned embodiment, a case was explained in which the wiring layer 3 was formed only on one side of the aluminum plate 1, but the present invention can also be applied to an aluminum printed circuit board in which the wiring Wi3 is formed on both sides of the aluminum thin plate 1. Applicable. Further, as the resin 9, an epoxy resin or the like can be used.

Next, a method for manufacturing the aluminum printed circuit board shown in FIGS. 5 and 6 will be explained in detail with reference to FIG.

First, a thin aluminum plate □ (
An insulating film 2 is provided on one side of the board 1, and a copper foil 1 is provided on the insulating film 2.
A substrate on which 5 is formed is prepared. Next, NG (number
(rical control) Create an NC tape having data on the center position of the lead wire hole 10 from the drawing or film original. Next, a press mold is made using the NC tape, and a through hole 8 is formed by pressing the substrate shown in FIG. 7(a) using a press machine using the press mold (see FIG. b)).

Next, the through hole 8 is filled with resin 9 using silk printing or a roller, and the resin 9 is cured with heat drying or ultraviolet rays (7th
Figure (C)). Next, an insulation 11!1i16 is provided on the surface of the thin aluminum plate 1 opposite to the surface on which the copper foil 15 is formed (FIG. 7(d)). Next, a plating layer 17 is provided on the entire surface of the substrate shown in FIG. 7(d) on which the copper foil 15 is provided by electroless copper plating and electrolytic copper plating (FIG. 7(e)). Next, dry film was applied, exposed, developed, and plated W! 17. The copper foil 15 is selectively etched to form the wiring layer 3 (FIG. 7(f)). Then, N.C.
Fix the board shown in Fig. 7(f) to the predetermined position of the NG drilling machine that drills six holes according to the instructions on the tape, and
After attaching a drill with a diameter smaller than the diameter of the through hole 8 to the drilling machine, use the NC tape to drill a hole with the drilling machine, and make a hole 10 for the lead wire in the center of the resin 9 (see Fig. 7). (g)). Next, the insulating film 16 is removed (FIG. 7(h)). Finally, the external shape is processed using a mold, router, etc.

In this manufacturing method, focusing on the fact that the center line of the through hole 8 and the center line of the lead wire hole IO match, a press mold is made using NC tape, and the press mold is used to form the through hole 8. Since the lead wire holes 10 are formed using the same NC tape and a drilling machine, the lead wire holes 10 can be formed in the center of the through hole 8 with high accuracy and very easily. Further, since the through holes 8 are formed using a press mold, all the through holes 8 can be formed at once, so that the through holes 8 can be formed in a short time.

In the above-mentioned embodiment, the through hole 8 was formed using a press machine, but the through hole 8 may be formed using a machine such as an NG drilling machine using NC tape. Further, in the above embodiment, an NC tape is used as the hole position indicating means, but other hole position indicating means may be used. Further, in the above embodiment, a dry film was used to form the wiring layer 3, but etching may be performed after printing the ink. Furthermore, in the above embodiment,
Although copper foil 15 was used as the conductor foil, other conductor foils may be used. Furthermore, in the above embodiment, plating [17] was provided by electroless steel plating and electrolytic copper plating.
The plating layer 17 may be provided only by electroless copper plating.

〔Effect of the invention〕

As explained above, in the metal printed circuit board according to the present invention, electronic elements having lead wires can be attached and electronic elements can be attached to both sides, so that the range of applications of the metal printed circuit board can be expanded. I can do it. Furthermore, since the resin is provided with a conductive layer,
The soldering properties when soldering the electronic device lead wires to the button part are extremely good. In addition, in the method of manufacturing a substrate for metal print 1 according to the present invention, the through hole and the lead wire hole are provided using the same hole position indicating means, so that the lead wire hole can be formed accurately and in the center of the through hole. It can be installed very easily.

As described above, the effects of this invention are remarkable.

[Brief explanation of the drawing]

Figure 1 is a plan view showing a part of a conventional aluminum printed circuit board, Figure 2 is a sectional view taken along the line A-A in Figure 1, and Figure 3 is a plan view showing part of a conventional aluminum printed circuit board. 4 is a front sectional view, FIG. 5 is a plan view showing a part of the aluminum printed circuit board according to the present invention, and FIG. 6 is the aluminum printed circuit board shown in FIG. 5. FIG. 7, a front cross-sectional view showing a state in which electronic elements are attached to a substrate, is an explanatory diagram of the method for manufacturing a metal printed circuit board according to the present invention. DESCRIPTION OF SYMBOLS 1... Aluminum thin plate 2... Insulating film 3... Wiring layer 7... Button part 8... Through hole 9... Resin 10... Lead wire hole 11... Conductor layer 15.・・・
Copper foil 17...Plated layer agent Junnosuke Nakamura Figure 1 Figure J Figure 4 Figure 5 Figure t6

Claims (2)

[Claims] (1) A thin metal plate, an insulating film provided on at least one side of the thin metal plate, a wiring layer formed on the insulating film, a through hole provided in the button part of the wiring layer, and the interior of the through hole. a lead wire hole provided in the center of the resin, and a conductor layer provided on a surface of the resin parallel to the surface on which the wiring layer is provided. Metal pudding 1~Substrate characterized by the following. (2) A through hole is formed in a thin metal plate with a conductive foil provided on at least one side through an insulating film using a press device or a hole punching device using a hole position indicating means, and resin is inserted into the through hole. A metal pudding 1 characterized in that a plated layer is provided on the surface on which the conductive foil is provided, and a hole for a lead wire is provided in the center of the resin using a hole drilling device using the hole position indicating means. A method of manufacturing one substrate.