JPH0144036B2 - - Google Patents
Info
- Publication number
- JPH0144036B2 JPH0144036B2 JP58033831A JP3383183A JPH0144036B2 JP H0144036 B2 JPH0144036 B2 JP H0144036B2 JP 58033831 A JP58033831 A JP 58033831A JP 3383183 A JP3383183 A JP 3383183A JP H0144036 B2 JPH0144036 B2 JP H0144036B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- conductor
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 239000003973 paint Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【発明の詳細な説明】
この発明はアルミプリント基板などの金属プリ
ント基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a metal printed circuit board such as an aluminum printed circuit board.
第１図は従来のアルミプリント基板の一部を示
す平面図、第２図は第１図のＡ−Ａ断面図であ
る。図において１はアルミニウム薄板、２はアル
ミニウム薄板１の片面に設けられた絶縁膜、３は
絶縁膜２上に形成された銅からなる配線層、４は
配線層３のパタン部である。 FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG. In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum thin plate 1, 3 is a wiring layer made of copper formed on the insulating film 2, and 4 is a pattern portion of the wiring layer 3.
このようなアルミプリント基板は放熱性が良
く、変形加工が自由であるため、最近多く使用さ
れ始めている。しかしながら、片面にのみ配線層
３が形成されているから、配線を高密度化するこ
とができず、また両面に配線層を形成したとして
も、その両配線層を接続することができないの
で、やはり配線を高密度化することができない。
そこで、両面の配線層を接続した金属プリント基
板が考えられている。 Such aluminum printed circuit boards have good heat dissipation properties and can be easily deformed, so they have recently begun to be widely used. However, since the wiring layer 3 is formed only on one side, it is not possible to increase the wiring density, and even if wiring layers are formed on both sides, the two wiring layers cannot be connected. It is not possible to increase the wiring density.
Therefore, a metal printed circuit board in which wiring layers on both sides are connected is being considered.
第３図は両面の配線層を接続したアルミプリン
ト基板の一部を示す平面図、第４図は同じく正断
面図である。図において、５は配線層３のパタン
部、６はパタン部５に設けられた貫通穴、７は貫
通穴６内に充填された樹脂、８は樹脂７の中央部
に設けられた小穴、９は小穴８内に充填された導
電性塗料で、導電性塗料９はアルミニウム薄板１
の両面に形成されたパタン部５と接続されてい
る。 FIG. 3 is a plan view showing a part of an aluminum printed circuit board with wiring layers on both sides connected, and FIG. 4 is a front sectional view. In the figure, 5 is a pattern part of the wiring layer 3, 6 is a through hole provided in the pattern part 5, 7 is resin filled in the through hole 6, 8 is a small hole provided in the center of the resin 7, 9 is a conductive paint filled in the small hole 8, and the conductive paint 9 is the thin aluminum plate 1.
It is connected to pattern portions 5 formed on both sides of the .
このアルミプリント基板においては、アルミニ
ウム薄板１の両面に配線層３が形成されており、
しかも両面の配線層３が導電性塗料９によつて接
続されているから、配線を高密度化することがで
きる。 In this aluminum printed circuit board, wiring layers 3 are formed on both sides of an aluminum thin plate 1.
Furthermore, since the wiring layers 3 on both sides are connected by the conductive paint 9, it is possible to increase the wiring density.
この発明は、貫通穴の中央部に小穴を精度よく
かつ非常に容易に設けることができる金属プリン
ト基板の製造方法を提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a metal printed circuit board that allows a small hole to be formed precisely and very easily in the center of a through hole.
この目的を達成するため、この発明において
は、穴位置指示手段を用いてプレス装置または穴
あけ装置により金属薄板に貫通穴を設け、その貫
通穴内に樹脂を充填し、上記貫通穴を設けるため
に用いた上記穴位置指示手段を用いて穴あけ装置
により上記樹脂の中央部に小穴を設け、その小穴
内に導電体を充填するとともに、その導電体を上
記金属薄板の両面に絶縁膜を介して形成された導
体箔または配線層のパタン部に接続する。 In order to achieve this object, in the present invention, a through hole is formed in a thin metal plate by a press device or a drilling device using a hole position indicating means, and a resin is filled in the through hole, and a resin is used to form the through hole. A small hole is formed in the center of the resin by a drilling device using the hole position indicating means, and the small hole is filled with a conductor, and the conductor is formed on both sides of the metal thin plate with an insulating film interposed therebetween. Connect to the patterned part of the conductive foil or wiring layer.
つぎに、第５図によりこの発明に係るアルミプ
リント基板の製造方法を詳細に説明する。まず、
第５図ａに示すようなアルミニウム薄板１の両面
に絶縁膜２が設けられ、絶縁膜２上に銅箔１０が
形成された基板を用意する。つぎに、NC
（numerical control）作画またはフイルム原稿
で、貫通穴６の中心位置のデータを有するNCテ
ープを作る。ついで、そのNCテープを用いてプ
レス金型を作り、そのプレス金型を用いてプレス
装置で第５図ａに示す基板をプレス加工すること
により、第５図ｂに示すように、貫通穴６を設け
る。つぎに、第５図ｃに示すように、シルク印刷
またはローラ等で貫通穴６内に樹脂７を充填し、
熱乾燥または紫外線等で樹脂７を硬化させる。つ
いで、NCテープの指示に従つて穴あけをする
NCボール盤の所定位置に第５図ｃに示す基板を
固定するとともに、そのボール盤に貫通穴６の径
よりも小さい径のドリルを取付けたのち、貫通穴
６を設けるために用いたNCテープを用いて上記
ボール盤により穴あけを行なえば、第５図ｄに示
すように、樹脂７の中央部に小穴８が設けられ
る。つぎに、銅箔１０上にドライフイルムを貼
り、露光、現像したのち、銅箔１０を選択エツチ
ングして、第５図ｅに示すように、配線層３を形
成する。ついで、第５図ｆに示すように、印刷等
で小穴８内に導電性塗料９を充填するとともに、
その導電性塗料９をパタン部５に接続したのち、
熱乾燥または紫外線等で導電性塗料９を硬化させ
る。最後に、金型、ルータ等で外形加工を行な
う。 Next, a method for manufacturing an aluminum printed circuit board according to the present invention will be explained in detail with reference to FIG. first,
A substrate as shown in FIG. 5a is prepared, in which an insulating film 2 is provided on both sides of an aluminum thin plate 1, and a copper foil 10 is formed on the insulating film 2. Next, N.C.
(numerical control) Create an NC tape with data on the center position of the through hole 6 from a drawing or film manuscript. Next, a press mold is made using the NC tape, and the through hole 6 is formed as shown in FIG. 5b by pressing the board shown in FIG. will be established. Next, as shown in FIG. 5c, resin 7 is filled into the through hole 6 using silk printing or a roller.
The resin 7 is cured by heat drying or ultraviolet rays. Next, drill holes according to the instructions on the NC tape.
After fixing the board shown in Fig. 5c in a predetermined position on an NC drilling machine and attaching a drill with a diameter smaller than the diameter of the through hole 6 to the drilling machine, use the NC tape used to make the through hole 6. When the hole is drilled using the above-mentioned drill press, a small hole 8 is formed in the center of the resin 7, as shown in FIG. 5d. Next, a dry film is pasted on the copper foil 10, exposed and developed, and then the copper foil 10 is selectively etched to form the wiring layer 3 as shown in FIG. 5e. Next, as shown in FIG. 5f, the small holes 8 are filled with conductive paint 9 by printing or the like, and
After connecting the conductive paint 9 to the pattern part 5,
The conductive paint 9 is cured by heat drying or ultraviolet rays. Finally, the external shape is processed using a mold, router, etc.
この製造方法においては、貫通穴６の中心線と
小穴８の中心線とが一致することに着目して、
NCテープを用いてプレス金型を作り、そのプレ
ス金型により貫通穴６を設け、かつ同一のNCテ
ープを用いてボール盤により小穴８を設けるか
ら、貫通穴６の中央部に小穴８を精度よくかつ非
常に容易に設けることができる。また、貫通穴６
をプレス金型により設けるから、一度に全ての貫
通穴６を設けることができるので、短時間に貫通
穴６を設けることが可能である。さらに、小穴８
内に導電性塗料９を充填し、硬化して導電体を設
けるので、容易に導電体を設けることが可能であ
る。 In this manufacturing method, focusing on the fact that the center line of the through hole 6 and the center line of the small hole 8 coincide,
A press mold is made using NC tape, a through hole 6 is created using the press mold, and a small hole 8 is created using a drilling machine using the same NC tape, so the small hole 8 is accurately placed in the center of the through hole 6. And it can be installed very easily. In addition, through hole 6
Since all of the through holes 6 can be provided at once by using a press mold, it is possible to provide the through holes 6 in a short time. Furthermore, small hole 8
Since the conductive paint 9 is filled inside and cured to provide a conductor, it is possible to easily provide a conductor.
なお、上述実施例においては、プレス装置によ
り貫通穴６を設けたが、NCテープを用いてNC
ボール盤等の穴あけ装置により貫通穴６を設けて
もよい。また、上述実施例においては、穴位置指
示手段としてNCテープを用いたが、他の穴位置
指示手段を使用してもよい。さらに、上述実施例
においては、小穴８を設けたのちに配線層３を設
けたが、貫通穴６を設ける前等に配線層３を設け
てもよい。また、上述実施例においては、配線層
３を形成するのにドライフイルムを用いたが、イ
ンクを印刷したのちにエツチングを行なつてもよ
い。さらに、上述実施例においては導体箔として
銅箔１０を用いたが、他の導体箔を用いてもよ
い。また、第６図に示すように、導電性塗料９の
中央部にスルホール１１を設ければ、リード線を
有する電子素子を取付けることができ、この場合
貫通穴６、小穴８を設けるために用いたNCテー
プを用いてNCボール盤等の穴あけ装置によりス
ルホール１１を設ければ、導電性塗料９の中央部
にスルホール１１を精度よくかつ非常に容易に設
けることができる。 In the above embodiment, the through hole 6 was formed using a press machine, but the through hole 6 was formed using an NC tape.
The through holes 6 may be provided using a drilling device such as a drilling machine. Further, in the above embodiment, an NC tape is used as the hole position indicating means, but other hole position indicating means may be used. Further, in the above embodiment, the wiring layer 3 was provided after the small holes 8 were provided, but the wiring layer 3 may be provided before the through holes 6 were provided. Further, in the above embodiment, a dry film was used to form the wiring layer 3, but etching may be performed after printing the ink. Furthermore, although the copper foil 10 was used as the conductor foil in the above embodiment, other conductor foils may be used. Further, as shown in FIG. 6, if a through hole 11 is provided in the center of the conductive paint 9, an electronic element having a lead wire can be attached. If the through holes 11 are formed using a NC tape that has been prepared using a drilling device such as an NC drilling machine, the through holes 11 can be formed precisely and very easily in the center of the conductive paint 9.
また、上述実施例においては、アルミプリント
基板すなわち金属薄板がアルミニウム薄板１であ
るプリント基板について説明したが、金属薄板と
しては鉄、銅などを用いてもよく、鉄を用いた場
合には安価に金属プリント基板を製造することが
でき、銅を用いた場合には放熱性が非常に良好な
金属プリント基板を得ることが可能である。ま
た、上述実施例においては、導電体として導電性
塗料９を小穴８内に充填したが、他の導電体を小
穴８内に充填してもよい。さらに、樹脂７として
はエポキシ系樹脂等を用いることができる。さら
に、一部の小穴８にのみ導電性塗料９を充填する
ことも可能である。 Further, in the above embodiment, an aluminum printed circuit board, that is, a printed circuit board in which the metal thin plate is the aluminum thin plate 1, has been described, but the metal thin plate may be made of iron, copper, etc., and if iron is used, it is inexpensive. It is possible to manufacture a metal printed circuit board, and when copper is used, it is possible to obtain a metal printed circuit board with very good heat dissipation. Further, in the above-described embodiment, the small holes 8 are filled with the conductive paint 9 as a conductive material, but the small holes 8 may be filled with other conductive materials. Further, as the resin 7, an epoxy resin or the like can be used. Furthermore, it is also possible to fill only some of the small holes 8 with the conductive paint 9.
以上説明したように、この発明に係る金属プリ
ント基板の製造方法においては、同一の穴位置指
示手段を用いて貫通穴および小穴を設けるから、
貫通穴の中央部に小穴を精度よくかつ非常に容易
に設けることができる。このように、この発明の
効果は顕著である。 As explained above, in the method for manufacturing a metal printed circuit board according to the present invention, the through holes and the small holes are provided using the same hole position indicating means.
A small hole can be formed precisely and very easily in the center of the through hole. As described above, the effects of this invention are remarkable.
第１図は従来のアルミプリント基板の一部を示
す平面図、第２図は第１図のＡ−Ａ断面図、第３
図は両面の配線層を接続したアルミプリント基板
の一部を示す平面図、第４図は同じく正断面図、
第５図はこの発明に係るアルミプリント基板の製
造方法の説明図、第６図はこの発明に係る他のア
ルミプリント基板の製造方法の説明図である。
１……アルミニウム薄板、２……絶縁膜、３…
…配線層、５……パタン部、６……貫通穴、７…
…樹脂、８……小穴、９……導電性塗料、１０…
…銅箔、１１……スルホール。
Figure 1 is a plan view showing part of a conventional aluminum printed circuit board, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 3 is a cross-sectional view taken along line A-A in Figure 1.
The figure is a plan view showing part of an aluminum printed circuit board with wiring layers on both sides connected, and Figure 4 is a front cross-sectional view.
FIG. 5 is an explanatory diagram of a method for manufacturing an aluminum printed circuit board according to the present invention, and FIG. 6 is an explanatory diagram of another method for manufacturing an aluminum printed circuit board according to the present invention. 1... Aluminum thin plate, 2... Insulating film, 3...
...Wiring layer, 5...Pattern part, 6...Through hole, 7...
...resin, 8...small hole, 9...conductive paint, 10...
...Copper foil, 11...Through hole.
Claims (1)
あけ装置により金属薄板に貫通穴を設け、その貫
通穴内に樹脂を充填し、上記貫通穴を設けるため
に用いた上記穴位置指示手段を用いて穴あけ装置
により上記樹脂の中央部に小穴を設け、その小穴
内に導電体を充填するとともに、その導電体を上
記金属薄板の両面に絶縁膜を介して形成された導
体箔または配線層のパタン部に接続することを特
徴とする金属プリント基板の製造方法。 ２ 上記貫通穴、上記小穴を設けるために用いた
上記穴位置指示手段を用いてプレス装置または穴
あけ装置により上記導電体の中央部にスルホール
を設けることを特徴とする特許請求の範囲第１項
記載の金属プリント基板の製造方法。[Claims] 1. A through hole is formed in a thin metal plate using a press device or a drilling device using a hole position indicating means, and the through hole is filled with resin, and the hole position indicating means used to provide the through hole is provided. A small hole is formed in the center of the resin using a drilling device, and a conductor is filled in the small hole, and the conductor is formed on both sides of the thin metal plate with a conductor foil or wiring formed through an insulating film. A method for manufacturing a metal printed circuit board, characterized in that the metal printed circuit board is connected to a pattern portion of a layer. 2. Claim 1, characterized in that a through hole is provided in the center of the conductor by a press device or a punching device using the hole position indicating means used to provide the through hole and the small hole. A method for manufacturing metal printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3383183A JPS59159595A (en) | 1983-03-03 | 1983-03-03 | Metal printed board and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3383183A JPS59159595A (en) | 1983-03-03 | 1983-03-03 | Metal printed board and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159595A JPS59159595A (en) | 1984-09-10 |
| JPH0144036B2 true JPH0144036B2 (en) | 1989-09-25 |
Family
ID=12397430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3383183A Granted JPS59159595A (en) | 1983-03-03 | 1983-03-03 | Metal printed board and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159595A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7886437B2 (en) * | 2007-05-25 | 2011-02-15 | Electro Scientific Industries, Inc. | Process for forming an isolated electrically conductive contact through a metal package |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4867764A (en) * | 1971-12-21 | 1973-09-17 | ||
| JPS53111470A (en) * | 1977-03-09 | 1978-09-29 | Nippon Electric Co | Method of producing through hole printed circuit board |
| JPS5623796A (en) * | 1979-07-31 | 1981-03-06 | Matsushita Electric Works Ltd | Method of manufacturing substrate for ic |
-
1983
- 1983-03-03 JP JP3383183A patent/JPS59159595A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4867764A (en) * | 1971-12-21 | 1973-09-17 | ||
| JPS53111470A (en) * | 1977-03-09 | 1978-09-29 | Nippon Electric Co | Method of producing through hole printed circuit board |
| JPS5623796A (en) * | 1979-07-31 | 1981-03-06 | Matsushita Electric Works Ltd | Method of manufacturing substrate for ic |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59159595A (en) | 1984-09-10 |
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