JPS53111470A - Method of producing through hole printed circuit board - Google Patents

Method of producing through hole printed circuit board

Info

Publication number
JPS53111470A
JPS53111470A JP2618977A JP2618977A JPS53111470A JP S53111470 A JPS53111470 A JP S53111470A JP 2618977 A JP2618977 A JP 2618977A JP 2618977 A JP2618977 A JP 2618977A JP S53111470 A JPS53111470 A JP S53111470A
Authority
JP
Japan
Prior art keywords
producing
circuit board
printed circuit
hole printed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2618977A
Other languages
Japanese (ja)
Inventor
Takao Satou
Genji Morizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2618977A priority Critical patent/JPS53111470A/en
Publication of JPS53111470A publication Critical patent/JPS53111470A/en
Pending legal-status Critical Current

Links

JP2618977A 1977-03-09 1977-03-09 Method of producing through hole printed circuit board Pending JPS53111470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2618977A JPS53111470A (en) 1977-03-09 1977-03-09 Method of producing through hole printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2618977A JPS53111470A (en) 1977-03-09 1977-03-09 Method of producing through hole printed circuit board

Publications (1)

Publication Number Publication Date
JPS53111470A true JPS53111470A (en) 1978-09-29

Family

ID=12186544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2618977A Pending JPS53111470A (en) 1977-03-09 1977-03-09 Method of producing through hole printed circuit board

Country Status (1)

Country Link
JP (1) JPS53111470A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159595A (en) * 1983-03-03 1984-09-10 オ−ケ−プリント配線株式会社 Metal printed board and method of producing same
EP0177686A2 (en) * 1984-07-18 1986-04-16 Kollmorgen Corporation Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby
EP2232965A2 (en) * 2008-01-11 2010-09-29 PPG Industries Ohio, Inc. Circuit board having an electrodeposited coating on a conductive core within a via and method of making same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159595A (en) * 1983-03-03 1984-09-10 オ−ケ−プリント配線株式会社 Metal printed board and method of producing same
JPH0144036B2 (en) * 1983-03-03 1989-09-25 Ok Print Haisen Kk
EP0177686A2 (en) * 1984-07-18 1986-04-16 Kollmorgen Corporation Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
EP0177686A3 (en) * 1984-07-18 1986-12-30 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby
EP2232965A2 (en) * 2008-01-11 2010-09-29 PPG Industries Ohio, Inc. Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
JP2011522395A (en) * 2008-01-11 2011-07-28 ピーピージー インダストリーズ オハイオ， インコーポレイテッド Circuit board having electrodeposition coating on conductive core in via and method of making the same
JP2013211585A (en) * 2008-01-11 2013-10-10 Ppg Industries Ohio Inc Circuit board having electrodeposited coating on conductive core in via and method for manufacturing the same

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