JPH0878803A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPH0878803A JPH0878803A JP21117094A JP21117094A JPH0878803A JP H0878803 A JPH0878803 A JP H0878803A JP 21117094 A JP21117094 A JP 21117094A JP 21117094 A JP21117094 A JP 21117094A JP H0878803 A JPH0878803 A JP H0878803A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- hole
- printed wiring
- wiring board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、テレビやビデオなどの
各種電子機器に用いられるプリント配線板およびその製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in various electronic devices such as televisions and videos, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】近年、テレビ、ビデオなどの各種電子機
器は、多機能化あるいは操作の単純化の傾向により、電
子回路の複雑化が著しく、それら電子機器に使用される
プリント配線板は、配線収容性あるいは表面実装密度を
増大させるために、従来の片面プリント配線板では回路
処理ができなくなり、導電性ペーストを用いて表裏導通
のスルーホールを形成したプリント配線板の採用が多く
なってきている。2. Description of the Related Art In recent years, various electronic devices such as televisions, video devices, etc. have become significantly complicated in electronic circuits due to the tendency toward multi-functionality and simplification of operation, and printed wiring boards used in these electronic devices are wired. In order to increase the accommodability or the surface mounting density, the conventional single-sided printed wiring board cannot perform circuit processing, and the use of a printed wiring board in which a conductive paste is used to form through holes for front and back conduction is increasing. .
【０００３】以下に従来のプリント配線板とその製造方
法について説明する。図４は従来の、導電性ペーストを
用いて表裏導通のスルーホールを形成したプリント配線
板とその製造方法を示すものである。図４において、１
はプリント配線板、１ａは絶縁基板、１ｂは銅箔、２ａ
はエッチングレジスト、２ｂは導体パターン、３はスル
ーホール、３ａは貫通穴、３ｂは導電性ペースト、４ａ
はソルダレジスト、４ｂはオーバーコート、５ａは実装
用の導体パターン、５ｂはチップ型電子部品である。A conventional printed wiring board and a method for manufacturing the same will be described below. FIG. 4 shows a conventional printed wiring board in which front and back conduction through holes are formed using a conductive paste and a method for manufacturing the same. In FIG. 4, 1
Is a printed wiring board, 1a is an insulating substrate, 1b is a copper foil, 2a
Is an etching resist, 2b is a conductor pattern, 3 is a through hole, 3a is a through hole, 3b is a conductive paste, 4a.
Is a solder resist, 4b is an overcoat, 5a is a conductive pattern for mounting, and 5b is a chip type electronic component.
【０００４】以上のように構成されたプリント配線板と
その製造方法について、以下その動作について説明す
る。The operation of the printed wiring board having the above structure and the method of manufacturing the same will be described below.
【０００５】まず、絶縁基板１ａを構成する紙基材フェ
ノール樹脂積層板の両面に銅箔１ｂをラミネートした両
面銅張積層板にＮＣボール盤などを用いて図４（ａ）に
示すように貫通穴３ａを形成する。First, a double-sided copper clad laminate obtained by laminating copper foils 1b on both sides of a paper-based phenol resin laminate which constitutes the insulating substrate 1a is used as an NC drilling machine as shown in FIG. 4 (a). 3a is formed.
【０００６】次に、スクリーン印刷法や写真現像法など
の手段により、図４（ｂ）に示すように銅箔１ｂ上にエ
ッチングレジスト２ａを形成した後、非エッチングレジ
スト２ａ形成面の露出した銅箔１ｂをエッチング除去、
エッチングレジスト２ａを剥離して、図４（ｃ）に示す
ように絶縁基板１ａ上に導体パターン２ｂを形成する。Next, as shown in FIG. 4B, an etching resist 2a is formed on the copper foil 1b by means such as a screen printing method or a photo-developing method, and then the exposed copper surface of the non-etching resist 2a is exposed. Etching away the foil 1b,
The etching resist 2a is removed to form a conductor pattern 2b on the insulating substrate 1a as shown in FIG. 4 (c).
【０００７】次に、導体パターン２ｂが形成された絶縁
基板１ａにソルダレジスト４ａが形成された後、絶縁基
板１ａの貫通穴３ａに、図４（ｄ）に示すように先端に
導電性ペーストを付着したピンやスクリーン印刷などに
より導電性ペースト３ｂが塗布された後、所定の温度と
時間で加熱処理、スルーホール３を形成し、絶縁基板１
ａの表裏の導体パターン２ｂが導通接続されたプリント
配線板１を得ている。Next, after the solder resist 4a is formed on the insulating substrate 1a on which the conductor pattern 2b is formed, a conductive paste is applied to the tip of the through hole 3a of the insulating substrate 1a as shown in FIG. 4 (d). After the conductive paste 3b is applied by the attached pins or screen printing, the through hole 3 is formed by heat treatment at a predetermined temperature and time, and the insulating substrate 1 is formed.
The printed wiring board 1 is obtained in which the conductor patterns 2b on the front and back sides of a are electrically connected.
【０００８】また、導電性ペースト３ｂとして銀ペース
トを用いる場合、銀移行（マイグレーション）を防止す
るためにプリント配線板１の表面に露出した銀ペースト
上には絶縁樹脂からなるオーバーコート４ｂが形成され
ている。When a silver paste is used as the conductive paste 3b, an overcoat 4b made of an insulating resin is formed on the silver paste exposed on the surface of the printed wiring board 1 in order to prevent silver migration. ing.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、絶縁基板１ａの表裏の導体パターン２ｂ
を導通接続するスルーホール３には、導電性ペースト３
ｂやオーバーコート４ｂが塗布、形成されている。この
結果、図４（ｅ）に示すようにチップ型電子部品５ｂを
直接実装することは困難であり、電子部品の実装用の導
体パターン５ａを設けて実装しなければならず、配線収
容性あるいは表面実装密度を増大させることが困難であ
るという問題点を有していた。However, in the above conventional structure, the conductor pattern 2b on the front and back of the insulating substrate 1a is formed.
The conductive paste 3
b and the overcoat 4b are applied and formed. As a result, it is difficult to directly mount the chip-type electronic component 5b as shown in FIG. 4 (e), and the conductor pattern 5a for mounting the electronic component must be provided and mounted. There is a problem that it is difficult to increase the surface mounting density.
【００１０】本発明は上記従来の問題点を解決するもの
で、高配線収容性あるいは表面実装高密度化を実現する
プリント配線板およびその製造方法を提供することを目
的とする。The present invention solves the above-mentioned problems of the prior art, and an object of the present invention is to provide a printed wiring board and a method of manufacturing the same, which realizes a high wiring accommodating property or a high surface mounting density.
【００１１】[0011]
【課題を解決するための手段】この目的を達成するため
に本発明のプリント配線板は、貫通穴を有した絶縁基板
と、前記絶縁基板面にラミネートした接着シートと、前
記絶縁基板の貫通穴に充填した導電性ペーストとを備
え、前記導電性ペーストが充填された前記貫通穴上に銅
箔からなる導体パターンを設けた構成である。To achieve this object, a printed wiring board according to the present invention comprises an insulating substrate having a through hole, an adhesive sheet laminated on the surface of the insulating substrate, and a through hole of the insulating substrate. And a conductive pattern filled with the conductive paste, and a conductor pattern made of a copper foil is provided on the through hole filled with the conductive paste.
【００１２】また、その製造方法は、絶縁基板上に接着
シートをラミネートし、貫通穴を形成する第１工程と、
前記貫通穴に導電性ペーストを充填または塗布する第２
工程と、前記接着シートおよび前記貫通穴上に銅箔を形
成し、銅張絶縁基板を形成する第３工程と、前記銅張り
絶縁基板の銅箔をエッチングして、導体パターンを形成
する第４工程とを設けた構成である。Further, the manufacturing method includes a first step of laminating an adhesive sheet on an insulating substrate to form a through hole,
Second, filling or applying a conductive paste into the through hole
A step of forming a copper foil on the adhesive sheet and the through hole to form a copper-clad insulating substrate, and a fourth step of etching the copper foil of the copper-clad insulating substrate to form a conductor pattern And a process.
【００１３】[0013]
【作用】この構成によって、銅箔を接着シートや絶縁基
板に積層し、銅張絶縁基板を形成する際の加熱圧縮によ
り、貫通穴に充填あるいは塗布された導電性ペーストと
銅箔とを導通状態とすることができる。With this structure, the copper foil is laminated on the adhesive sheet or the insulating substrate, and the conductive paste filled in or applied to the through hole and the copper foil are electrically connected to each other by heat compression when forming the copper clad insulating substrate. Can be
【００１４】[0014]
（実施例１）以下、本発明の第１の実施例について、図
面を参照しながら説明する。(First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings.
【００１５】図１は本発明の第１の実施例におけるプリ
ント配線板を示した断面図、図２は本発明の第１の実施
例におけるプリント配線板の製造方法を示した工程断面
図である。図１および図２において、１１はプリント配
線板、１１ａは絶縁基板、１１ｂは銅箔、１１ｃは接着
シート、１１ｄはフィルム、１２ｂは導体パターン、１
３ａは貫通穴、１３ｂは導電性ペーストである。FIG. 1 is a sectional view showing a printed wiring board according to the first embodiment of the present invention, and FIG. 2 is a sectional view showing steps of a method for manufacturing the printed wiring board according to the first embodiment of the present invention. . 1 and 2, 11 is a printed wiring board, 11a is an insulating substrate, 11b is copper foil, 11c is an adhesive sheet, 11d is a film, 12b is a conductor pattern,
Reference numeral 3a is a through hole, and 13b is a conductive paste.
【００１６】以上のように構成されたプリント配線板と
その製造方法について、図１および図２を用いて説明す
る。The printed wiring board configured as described above and the method for manufacturing the same will be described with reference to FIGS. 1 and 2.
【００１７】まず、紙にフェノール系樹脂を含浸させ、
フェノール系樹脂を半硬化状態に重合させたプリプレグ
を所定枚数重ね合わせた後、真空熱プレス機にセット、
所定の温度圧力で成型し、図２（ａ）に示すように絶縁
基板１１ａを得る。First, paper is impregnated with phenolic resin,
After stacking a specified number of prepregs obtained by polymerizing a phenolic resin in a semi-cured state, set it in a vacuum heat press machine,
Molding is performed at a predetermined temperature and pressure to obtain an insulating substrate 11a as shown in FIG.
【００１８】次に、フェノールブチラール系樹脂から構
成される接着シート１１ｃとポリエステル樹脂から構成
されるフィルム１１ｄを重ね合わせた後、真空熱プレス
機やラミネータにセット、所定の温度圧力でラミネート
し、図２（ｂ）に示すようにフィルム１１ｄおよび接着
シート１１ｃ付の絶縁基板１１ａを得る。Next, after the adhesive sheet 11c made of phenol butyral resin and the film 11d made of polyester resin are superposed, they are set on a vacuum heat press or a laminator and laminated at a predetermined temperature and pressure. As shown in 2 (b), an insulating substrate 11a with a film 11d and an adhesive sheet 11c is obtained.
【００１９】次に、フィルム１１ｄおよび接着シート１
１ｃ付の絶縁基板１１ａにＮＣボール盤とドリルあるい
は炭酸ガスレーザー光線などの手段により図２（ｃ）に
示すように所定径の貫通穴１３ａを形成する。Next, the film 11d and the adhesive sheet 1
As shown in FIG. 2C, a through hole 13a having a predetermined diameter is formed on the insulating substrate 11a with 1c by means of an NC drilling machine and a drill or carbon dioxide laser beam.
【００２０】ついで、スクリーン印刷法などの手段を用
いてフィルム１１ｄ、接着シート１１ｃおよび絶縁基板
１１ａに形成された貫通穴１３ａに、粒状銅とエポキシ
系樹脂などから構成される導電性ペースト１３ｂを充填
あるいは塗布する。そして、図２（ｄ）に示すようにフ
ィルム１１ｄを剥離・除去する。Then, the through holes 13a formed in the film 11d, the adhesive sheet 11c and the insulating substrate 11a are filled with a conductive paste 13b composed of granular copper and an epoxy resin using a means such as a screen printing method. Alternatively, apply. Then, as shown in FIG. 2D, the film 11d is peeled and removed.
【００２１】フィルム１１ｄが剥離あるいは除去され、
導電性ペースト１３ｂが貫通穴１３ａに充填あるいは塗
布された接着シート１１ｃ付の絶縁基板１１ａの両面に
厚さ３５μｍの銅箔１１ｂを配置した後、真空熱プレス
機により圧力約２〜４×１０ 4Ｐａ、温度１５０〜１８
０℃の条件にて加圧・加温しながら絶縁基板１１ａの加
熱加圧による圧縮率が０〜１０％になるように積層し、
図２（ｅ）に示すように銅張絶縁基板を得る。The film 11d is peeled off or removed,
The conductive paste 13b is filled or coated in the through hole 13a.
On both sides of the insulating substrate 11a with the adhesive sheet 11c
After placing the copper foil 11b having a thickness of 35 μm, vacuum hot pressing
Machine pressure of about 2-4 x 10 FourPa, temperature 150-18
The insulating substrate 11a is heated while pressurizing and heating at 0 ° C.
Laminate so that the compressibility by hot pressing becomes 0 to 10%,
A copper clad insulating substrate is obtained as shown in FIG.
【００２２】次に、銅張絶縁基板の銅箔１１ｂ表面にス
クリーン印刷法や写真現像法などを用いてエッチングレ
ジストを形成した後、塩化第２銅などの溶液により非エ
ッチングレジストのレジスト形成面の露出した銅箔１１
ｂをエッチング除去する。そして、エッチングレジスト
を剥離して、図２（ｆ）に示すように、絶縁基板１１ａ
に導電性ペースト１３ｂが充填されたスルホールや導体
パターン１２ｂが形成されたプリント配線板１１を得
る。Next, an etching resist is formed on the surface of the copper foil 11b of the copper-clad insulating substrate by using a screen printing method or a photo-developing method, and then a solution of cupric chloride or the like is used to form a non-etching resist forming surface. Exposed copper foil 11
b is removed by etching. Then, the etching resist is peeled off to remove the insulating substrate 11a as shown in FIG.
A printed wiring board 11 having a through hole filled with the conductive paste 13b and a conductor pattern 12b is obtained.
【００２３】次に、はんだ付け不要部分の導体パターン
１２ｂや絶縁基板１１ａ上にソルダレジストやロードマ
ップなどが形成される。Next, a solder resist, a road map and the like are formed on the conductor pattern 12b and the insulating substrate 11a where soldering is unnecessary.
【００２４】以上のように第１の実施例によれば、両面
に接着シート１１ｃがラミネートされた絶縁基板１１ａ
の貫通穴１３ａに導電性ペースト１３ｂを充填し、接着
シート１１ｃあるいは貫通穴１３ａ表面の導電性ペース
ト１３ｂ上に銅箔で構成された導体パターン１２ｂを形
成することにより、プリント配線板１１の配線収容性を
大幅に増大させ、スルーホール上に電子部品を表面実装
することができる。As described above, according to the first embodiment, the insulating substrate 11a having the adhesive sheets 11c laminated on both sides thereof.
The through hole 13a is filled with the conductive paste 13b, and the conductor pattern 12b made of copper foil is formed on the adhesive sheet 11c or the conductive paste 13b on the surface of the through hole 13a, so that the wiring of the printed wiring board 11 is accommodated. It is possible to significantly increase the performance and surface mount electronic components on the through holes.
【００２５】（実施例２）以下、本発明の第２の実施例
について、図面を参照しながら説明する。(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.
【００２６】図３は本発明の第２の実施例におけるプリ
ント配線板の製造方法を示した工程断面図である。図３
において、１１はプリント配線板、１１ａは絶縁基板、
１１ｂは銅箔、１１ｄはフィルム、１２ｂは導体パター
ン、１３ａは貫通穴、１３ｂは導電性ペーストであり、
第１の実施例におけるものとほぼ同一である。FIG. 3 is a process sectional view showing a method of manufacturing a printed wiring board in the second embodiment of the present invention. FIG.
, 11 is a printed wiring board, 11a is an insulating substrate,
11b is a copper foil, 11d is a film, 12b is a conductor pattern, 13a is a through hole, 13b is a conductive paste,
It is almost the same as in the first embodiment.
【００２７】第１の実施例におけるものと異なるのは、
接着シート１１ｃを無くした点である。The difference from the first embodiment is that
This is the point that the adhesive sheet 11c is removed.
【００２８】以上のように構成されたプリント配線板と
その製造方法について、図３を用いて説明する。The printed wiring board having the above structure and the method for manufacturing the same will be described with reference to FIG.
【００２９】まず、ガラス布にエポキシ系樹脂を含浸さ
せ、エポキシ系樹脂を半硬化状態に重合させたプリプレ
グを所定枚数重ね合わせた後、真空熱プレス機にセッ
ト、所定の温度圧力で成型し、図３（ａ）に示すように
絶縁基板１１ａを得る。First, a glass cloth is impregnated with an epoxy resin, a predetermined number of prepregs obtained by polymerizing the epoxy resin in a semi-cured state are overlapped, set in a vacuum heat press machine, and molded at a predetermined temperature and pressure. An insulating substrate 11a is obtained as shown in FIG.
【００３０】次に、ポリエステル樹脂から構成されるフ
ィルム１１ｄを重ね合わせた後、真空熱プレス機やラミ
ネータにセット、所定の温度圧力でラミネートし、図３
（ｂ）に示すようにフィルム１１ｄ付の絶縁基板１１ａ
を得る。Next, after laminating the films 11d made of polyester resin, they are set in a vacuum heat press or a laminator and laminated at a predetermined temperature and pressure, as shown in FIG.
Insulating substrate 11a with film 11d as shown in (b)
To get
【００３１】次に、フィルム１１ｄ付の絶縁基板１１ａ
にＮＣボール盤とドリルあるいは炭酸ガスレーザー光線
などの手段により図３（ｃ）に示すように所定径の貫通
穴１３ａを形成する。Next, the insulating substrate 11a with the film 11d is attached.
Then, a through hole 13a having a predetermined diameter is formed as shown in FIG. 3C by means of an NC drilling machine and a drill or a carbon dioxide laser beam.
【００３２】ついで、スクリーン印刷法などの手段を用
いてフィルム１１ｄおよび絶縁基板１１ａに形成された
貫通穴１３ａに、粒状銅とエポキシ系樹脂などから構成
される導電性ペースト１３ｂを充填あるいは塗布する。
そして、図３（ｄ）に示すようにフィルム１１ｄを剥離
・除去する。Then, a conductive paste 13b made of granular copper and epoxy resin or the like is filled or applied into the through holes 13a formed in the film 11d and the insulating substrate 11a by means of screen printing or the like.
Then, as shown in FIG. 3D, the film 11d is peeled and removed.
【００３３】フィルム１１ｄが剥離・除去され、導電性
ペースト１３ｂが貫通穴１３ａに充填あるいは塗布され
た絶縁基板１１ａの両面に厚さ３５μｍの銅箔、１１ｂ
を配置した後、真空熱プレス機により圧力約２〜４×１
０4Ｐａ、温度１５０〜１８０℃の条件にて加圧・加温
しながら絶縁基板１１ａの加熱加圧による圧縮率が０〜
１０％になるようにエポキシ系樹脂を軟化、流動させ、
銅箔とエポキシ系樹脂および銅箔１１ｂと導電性ペース
ト１３ｂを接着・積層し、図３（ｅ）に示すように銅張
絶縁基板を得る。A copper foil having a thickness of 35 μm is formed on both surfaces of the insulating substrate 11a in which the film 11d is peeled and removed and the conductive paste 13b is filled or applied in the through holes 13a.
After arranging, the pressure is about 2-4 × 1 by a vacuum heat press machine.
The compressibility of the insulating substrate 11a by heating and pressurizing is 0 to 0 while pressurizing and heating under the conditions of 0 4 Pa and temperature of 150 to 180 ° C.
Soften and fluidize the epoxy resin to 10%,
The copper foil and the epoxy resin and the copper foil 11b and the conductive paste 13b are adhered and laminated to obtain a copper clad insulating substrate as shown in FIG. 3 (e).
【００３４】次に、銅張絶縁基板の銅箔１１ｂ表面にス
クリーン印刷法や写真現像法などを用いてエッチングレ
ジストを形成した後、塩化第２銅などの溶液により非エ
ッチングレジスト形成面の露出した銅箔１１ｂをエッチ
ング除去する。そして、エッチングレジストを剥離し
て、図３（ｆ）に示すように、絶縁基板１１ａに導電性
ペースト１３ｂが充填されたスルーホールや導体パター
ン１２ｂが形成されたプリント配線板１１を得る。Next, an etching resist is formed on the surface of the copper foil 11b of the copper clad insulating substrate by a screen printing method, a photo developing method or the like, and then a non-etching resist forming surface is exposed by a solution such as cupric chloride. The copper foil 11b is removed by etching. Then, the etching resist is peeled off to obtain the printed wiring board 11 having the through holes filled with the conductive paste 13b and the conductor pattern 12b formed in the insulating substrate 11a, as shown in FIG. 3 (f).
【００３５】次に、はんだ付け不要部分の導体パターン
１２ｂや絶縁基板１１ａ上にソルダレジストやロードマ
ップなどが形成される。Next, a solder resist, a road map and the like are formed on the conductor pattern 12b and the insulating substrate 11a where soldering is unnecessary.
【００３６】以上のように第２の実施例によれば、絶縁
基板１１ａの貫通穴１３ａに導電性ペースト１３ｂを充
填し貫通穴１３ａ表面の導電性ペースト１３ｂ上に銅箔
で構成された導体パターン１２ｂを形成することによ
り、プリント配線板１１の配線収容性を大幅に増大さ
せ、スルーホール上に電子部品を表面実装することがで
きるとともに、製造工程をも簡略化ができる。As described above, according to the second embodiment, the through hole 13a of the insulating substrate 11a is filled with the conductive paste 13b, and the conductive pattern 13b on the surface of the through hole 13a is formed of copper foil. By forming 12b, the wiring accommodating ability of the printed wiring board 11 can be greatly increased, the electronic component can be surface-mounted on the through hole, and the manufacturing process can be simplified.
【００３７】なお、第１の実施例および第２の実施例に
おいて銅箔１１ｂの厚さは、３５μｍの厚さとしたが、
その他の厚さのものでも良い。Although the thickness of the copper foil 11b is 35 μm in the first and second embodiments,
Other thicknesses may be used.
【００３８】[0038]
【発明の効果】以上のように本発明によれば、両面に接
着シートがラミネートされた絶縁基板の貫通穴に導電性
ペーストを充填し、接着シートあるいは貫通穴表面の導
電性ペースト上に銅箔で構成された導体パターンを形成
すること、あるいは絶縁基板の貫通穴に導電性ペースト
を充填し、絶縁基板あるいは貫通穴表面の導電性ペース
ト上に銅箔で構成された導体パターンを形成することに
より、プリント配線板の配線収容性を大幅に増大させる
とともに電子部品の表面実装密度を増大させることがで
きる。さらに、製造工程の簡略化をも図ることができる
優れたプリント配線板を実現できるものである。As described above, according to the present invention, the conductive paste is filled in the through holes of the insulating substrate having the adhesive sheets laminated on both sides, and the copper foil is placed on the adhesive sheet or the conductive paste on the surface of the through holes. By forming a conductor pattern composed of, or by filling the through holes of the insulating substrate with a conductive paste and forming a conductor pattern composed of a copper foil on the conductive paste on the surface of the insulating substrate or the through holes. Thus, it is possible to significantly increase the wiring accommodability of the printed wiring board and increase the surface mounting density of electronic components. Further, it is possible to realize an excellent printed wiring board that can also simplify the manufacturing process.
【図１】本発明の第１の実施例におけるプリント配線板
の断面図FIG. 1 is a sectional view of a printed wiring board according to a first embodiment of the present invention.
【図２】本発明の第１の実施例におけるプリント配線板
の製造方法を示す工程断面図FIG. 2 is a process cross-sectional view showing the method for manufacturing a printed wiring board in the first embodiment of the present invention.
【図３】本発明の第２の実施例におけるプリント配線板
の製造方法を示す工程断面図FIG. 3 is a process sectional view showing a method of manufacturing a printed wiring board according to a second embodiment of the present invention.
【図４】従来のプリント配線板の製造方法を示す断面図FIG. 4 is a sectional view showing a conventional method for manufacturing a printed wiring board.
１１ プリント配線板 １１ａ 絶縁基板 １１ｂ 銅箔 １１ｃ 接着シート １１ｄ フィルム １２ｂ 導体パターン １３ａ 貫通穴 １３ｂ 導電性ペースト 11 Printed Wiring Board 11a Insulating Substrate 11b Copper Foil 11c Adhesive Sheet 11d Film 12b Conductor Pattern 13a Through Hole 13b Conductive Paste
Claims (7)
板面にラミネートした接着シートと、前記絶縁基板の貫
通穴に充填した導電性ペーストとを備え、前記導電性ペ
ーストが充填された前記貫通穴上に銅箔からなる導体パ
ターンを設けたプリント配線板。1. An insulating substrate having a through hole, an adhesive sheet laminated on the surface of the insulating substrate, and a conductive paste filled in the through hole of the insulating substrate, wherein the conductive paste is filled in the insulating substrate. A printed wiring board with a conductor pattern made of copper foil on the through holes.
板面にラミネートした接着シートと、前記絶縁基板の貫
通穴に充填した導電性ペーストとを備え、前記接着シー
ト上に銅箔からなる導体パターンを設けたプリント配線
板。2. An insulating substrate having a through hole, an adhesive sheet laminated on the surface of the insulating substrate, and a conductive paste filled in the through hole of the insulating substrate, comprising a copper foil on the adhesive sheet. Printed wiring board with conductor pattern.
層板またはガラス布基材エポキシ樹脂積層板を用いた請
求項１または請求項２記載のプリント配線板。3. The printed wiring board according to claim 1 or 2, wherein a paper-based phenol resin laminate or a glass cloth-based epoxy resin laminate is used as the insulating substrate.
樹脂シートまたはエポキシ系樹脂シートを用いる請求項
１または請求項２記載のプリント配線板。4. The printed wiring board according to claim 1, wherein a phenol resin sheet or an epoxy resin sheet whose main component is an adhesive sheet is used.
し、貫通穴を形成する第１工程と、前記貫通穴に導電性
ペーストを充填または塗布する第２工程と、前記接着シ
ートおよび前記貫通穴上に銅箔を形成し、銅張絶縁基板
を形成する第３工程と、前記銅張り絶縁基板の銅箔をエ
ッチングして、導体パターンを形成する第４工程とを設
けたプリント配線板の製造方法。5. A first step of laminating an adhesive sheet on an insulating substrate to form a through hole, a second step of filling or applying a conductive paste into the through hole, and the adhesive sheet and the through hole. A method of manufacturing a printed wiring board, comprising: a third step of forming a copper foil on the copper foil to form a copper clad insulating substrate; and a fourth step of etching the copper foil of the copper clad insulating substrate to form a conductor pattern. .
びフィルムをラミネートし、貫通穴を形成する工程と
し、第２工程は前記貫通穴に導電性ペーストを充填また
は塗布するとともに、フィルムを剥離する工程とし、第
３工程は前記接着シートおよび前記貫通穴上に銅箔を積
層するとともに、加熱加圧して前記銅箔を前記絶縁基板
上に形成する工程とした請求項５記載のプリント配線板
の製造方法。6. The first step is a step of laminating an adhesive sheet and a film on an insulating substrate to form a through hole, and the second step is filling or applying a conductive paste into the through hole and peeling the film. 6. The printed wiring board according to claim 5, wherein the third step is a step of laminating a copper foil on the adhesive sheet and the through hole and heating and pressing the copper foil to form the copper foil on the insulating substrate. Manufacturing method.
ネートし、貫通穴を形成する工程とした請求項５記載の
プリント配線板の製造方法。7. The method of manufacturing a printed wiring board according to claim 5, wherein the first step is a step of laminating a film on an insulating substrate to form a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06211170A JP3104541B2 (en) | 1994-09-05 | 1994-09-05 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06211170A JP3104541B2 (en) | 1994-09-05 | 1994-09-05 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0878803A true JPH0878803A (en) | 1996-03-22 |
| JP3104541B2 JP3104541B2 (en) | 2000-10-30 |
Family
ID=16601576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06211170A Expired - Lifetime JP3104541B2 (en) | 1994-09-05 | 1994-09-05 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3104541B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and wiring substrate |
| WO2000013190A1 (en) * | 1998-08-28 | 2000-03-09 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| US6780493B2 (en) | 1997-07-16 | 2004-08-24 | Matsushita Electric Industrial Co., Ltd. | Wiring board and a process of producing a wiring board |
| EP1180920A3 (en) * | 2000-08-17 | 2005-12-07 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing same |
-
1994
- 1994-09-05 JP JP06211170A patent/JP3104541B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and wiring substrate |
| US6780493B2 (en) | 1997-07-16 | 2004-08-24 | Matsushita Electric Industrial Co., Ltd. | Wiring board and a process of producing a wiring board |
| WO2000013190A1 (en) * | 1998-08-28 | 2000-03-09 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| US6479763B1 (en) | 1998-08-28 | 2002-11-12 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| EP1180920A3 (en) * | 2000-08-17 | 2005-12-07 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing same |
| US6993836B2 (en) | 2000-08-17 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3104541B2 (en) | 2000-10-30 |
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